EBYTE E30-900M30S SI4463 900MHz 1W SPI Wireless Module User Manual

MBYTE E30 900M30S
SI4463 900MHz 1W SPI Wireless Module

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Brief Introduction

E30-900M30S is a hardware module (SPI) based on the 514463 RF chip imported from Silicon Labs. It is a half-duplex, SMD integrated transceiver with transparent transmission available. With working frequency band 855-925MHz, transmitting power I w, it is suitable for a variety of environments. The original imported 514463 RF chip from Silicon Labs(USA) features high receiving sensitivity and strong anti-interference. supporting the development of low power consumption as well. It has been widely used in various industries and has the characteristics of stable performance, long transmission distance, strong ability of penetration and diffraction, etc.

1.2 Features

• The measured communication distance is up to 5.6km;
• Maximum transmission power: I W;
• 855-925MHz ultra-wide frequency band;
• Airdate rate: I k —25kbps;
• With a 3.3-5.5V power supply, over 5 V guarantees the best performance;
• Industrial grade standard design, support -40 — 85 °C for working over a long time;

1.3 Application

• Home security alarm and remote keyless entry;
• Smart home and industrial sensors, etc.;
• Wireless alarm security system;
• Building automation solutions;
• Wireless industrial-grade remote control;
• Intelligent agriculture and oilfield solutions;
• Health care products;
• Advanced Meter Reading Architecture(AMI);
• Automotive industry applications.

Specification and Parameter

2.1 Limit Parameter

module
Blocking power (dBm)| –| 10| Chances of burn are slim when modules are used in short distance
Operating temperature ( °C )| -40| +85| Industrial grade

2.2 Operating Parameter

down
Operating temperature (°C)| -40| | +85| Industrial grade
Operating frequency (MHz)| 855| | 925| –
Power
Consumer – on| TX current (mA)| 550| 650| 700| Instant power consumption
RX current ( mA )| –| -y
__ )| | –
Sleep current (1.1A )| –| 2| –| –
Max TX power (dBm)| 29| 30| 31.| –
Receiving sensitivity ( dBm)| -120| -121| …121| Air data rate is kbps
Main parameter| Description| Remark
---|---|---
Reference distance| 5.6Km| Test condition: clear and open area, antenna gain: 5dBi, antenna height: 2.5m, air data rate: kbps
Modulation| GFSK| –
Communication Interface| SPI| Max. rate 10Mbps
Package| SMD| –
Interface method| Stamp Hole| –
Size| 38.5*24mm| –
Antenna| IPEX/STAMP| 50-ohm impedance

Size and Pin definition

details)
7| 103| Output| Configurable universal GPIO port (see SI4463manual for details)
8| IO 0| Output| Configurable universal GPIO port (see SI4463manual for details)
9| VCC| | Power supply, 3.3-5.5V, 5V is recommended (It is also recommended to add
external ceramic filter capacitor)
10| VCC| | Power supply, 3.3-5.5V, 5V is recommended (It is also recommended to add
external ceramic filter capacitor)
11| GND| | Ground wire, connected to the power reference ground
12| GND| | Ground wire, connected to the power reference ground
13| I0_1| Output| Configurable universal GPIO port (see SI4463manual for details)
14| IRAQ| Output| SPI interrupt request
15| S DN| | Shutdown Input Pin. It is low level when working
(See SI4463 manual for more details)
---|---|---|---
16| MISO| Output| SPI master output slave input
17| MOS I| Input| SPI master input slave output
18| SCK| Input| Serial Clock Input
19| Nigel| Input| SPI Chip select for starting SPI communication
20| GND| | Ground wire, connected to the power reference ground
21| ANT| Input/Output| Antena
22| GND| | Ground wire, connected to the power reference ground

Recommended circuit diagram

Hardware design

• It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded;
• Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module; •Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
• Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
• When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;
• The module should be as far away as possible from the power supply, transformers, high-frequency wiring, and other parts with large electromagnetic interference;
• Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well-grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
• Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
• It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
• Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
• If the communication line uses a 5V level, a 1 k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
• Try to stay away from some physical layers such as TTL protocol at 400MHz;
• The mounting structure of the antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward.
• When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside; When the antenna is installed inside a metal case, it will cause the transmission distance to be greatly weakened.

FAQ

6.1 Communication range is too short

• The communication distance will be affected when an obstacle exists:

• Data loss rate will be affected by temperature, humidity, and co-channel interference:

• The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground: *Seawater has peat ability in absorbing wireless radio waves. so performance will be poor when testing near the sea:

• The signal will be seriously affected when the antenna is near a metal object or put in a metal case:

• Power register was set incorrectly or air data rate is set as too high Ithe higher the air data rate, the shorter the distance:

• The power supply low voltage under room temperature is lower than our recommendation. the lower the voltage, the lower the transmitting power.

• Due to antenna quality or poor matching between antenna and nodule.
  6.2Module is easy to damage

• Please check the 11w power supply. ensure it works incorrect voltage:

• Please check the stability of the power source. the voltage cannot fluctuate too much:

• Please make sure anti-static operation when installing and using, high-frequency devices have electrostatic susceptibility:

• Please ensure the humidity is within a limited range. some parts are sensitive to humidity:

• Please avoid using modules under too high or too low temperatures.
  6.3 BER(Bit Error Rate) is high

• There is co-channel signal interference nearby. please be away from interference sources or modify frequency and channel to avoid interference:

• The poor power supply may cause messy code. Make sure that the power supply is reliable:

• The extension line and feeder quality are poor or too long. so the bit error rate is high.

Production guidance

This product is an SMD module. When soldering the module. the soldering personnel must work in accordance with the anti-static operation specification: This product is an electrostatic-sensitive product. If the module is not welded according to the specification, the module may be permanently damaged.

E30 series

Model No.| IC| Frequency
Hz| Tx
power
dBm| Distance
km| Air data rate
bps| Package| Size
mm| Antenna
---|---|---|---|---|---|---|---|---
E30-170T20D| SI4463| 170M| 20| 2.0| Ik-25k| DIP| 21 36| SMA-K
E30-170T27D| SI4463| 170M| 27| 5.0| Ik-25k| DIP| 24 43| SMA-K
E30-433T20S3| SI4438| 433M| 20| 3.| Ik-25k| SMD| 16 26| IPEX/STAMP
E30-433T20S| SI4438| 433M| 20| 3.| Ik-25k| SMD| 17 30| IPEX/STAMP
E30-433T20D| SI4438| 433M| 20| 3.| Ik-25k| DIP| 21 36| SMA-K
E30-490T20S| SI4438| 490M| 20| 3.| Ik-25k| SMD| 17 30| IPEX/STAMP
E30-490T20D| SI4438| 490M| 20| 3.| Ik-25k| DIP| 21 36| SMA-K
E30-780T20S| SI4463| 780M| 20| 3.| Ik-25k| SMD| 17 30| IPEX/STAMP
E30-868T20D| SI4463| 868M| 20| 3.| Ik-25k| DIP| 21 36| SMA-K
E30-868T20S| SI4463| 868M| 20| 3.| Ik-25k| SMD| 17 30| IPEX/STAMP
E30-915T20D| SI4463| 915M| 20| 3.| Ik-25k| DIP| 21 36| SMA-K
E30-915T20S| SI4463| 915M| 20| 3.| Ik-25k| SMD| 17 30| IPEX/STAMP

Antenna recommendation

The antenna plays an important role in the communication process. A good antenna can largely improve the communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and reasonable price.

Model No.| Type| Frequency
Hz| Interface| Gain
dBi| Hight
mm| Cable
mm| Function feature
---|---|---|---|---|---|---|---
TX868-JZLW-I5| Rubber| 868M| IPEX 1| 3.0| 165| 13.| Rubber cabinet antenna,
omnidirectional antenna
TX915-JZLW-I5| Rubber| 915M| IPEX I| 3.0| 165| 13.| Rubber cabinet antenna,
omnidirectional antenna
TX915-FPC-4510| FPC| 915M| IPEX 1| 2.0| 130| 10| Flexible antenna

Package method for bulk order

Revision history

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