EBYTE E72-2G4M20S1F CC2652RB Multifunctional SoC Wireless Module User Manual

E72-2G4M20S1F
CC2652RB Multifunctional SoC Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd.

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Introduction

1.1 Brief Introduction
E72-2G4M05S1F is a self-developed, multi-protocol, 2.4G, SMD, wireless SoC module based on CC2652RB from TI. The transmit power is 5dBm. Built-in ARM microcontroller and high-performance wireless transceiver. With an integrated BAW (Bulk Acoustic Wave) resonator to generate a radio frequency carrier, so no external 48MHz crystal is required.

The module leads out all 10 ports of the MCU. Comes with a powerful 48 MHz Arm ® Cortex -M4F processor, an internal integrated power amplifier. powerful peripherals and up to 26 GPIOs, enabling multi-directional development.CC2652RB has the potential to become the best choice of the wireless microcontroller for smart homes, IoT transformation, and industrial automation in the future. Since this module is an SoC module, it needs to be programmed by the user before it can be used.
1.2 Features

• Powerful 48 MHz Arm ® Cortex -M4F processor;
• Rich resources, 352KB FLASH, 80KB RAM;
• 1.8-3.8V power supply, over 3.3 V can guarantee the best performance;
• Transmit power 5dBm;
• Under ideal conditions, the communication distance can reach 350m with the external antenna;
• The module contains an external 32.768K low-speed crystal oscillator;
• Industrial grade standard design, support -40 — 85 °C for working over a long time;
• 2 Pin cJTAG and JTAG debugging;
• Support OTA;
• Wireless protocol: Thread, Zigbee, Bluetooth ® 5 Low Energy;
• Receiving sensitivity: —100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded;

1.3 Application

• Building automation solutions
  -Building Security System
  – Motion Detector, electronic intelligent door lock, door and window sensor. Garage door system, gateway
  -HVAC – Thermostat, wireless, sensor, HVAC system controller, gateway
  -Fire safety system – smoke and temperature detectors, FACP
  -Video surveillance – IP webcam -Elevators and escalators
  – Elevator mains. Elevator and escalator control panel;

• Grid infrastructure -Smart meter – Water meter, gas meter, electricity meter and heat cost allocator
  Copyright (02012 – 2021. Chengdu Ebyte Electronic Technology Co..Ltd.
  -Grid communication – Wireless communication, remote sensor applications

• Industrial transport – Asset tracking

• Plant automation and control

• Medical

• Electronic Point of Sale (EPOS) – Electronic shelves

• Label (ESL)

Specification and parameter

2.1 Limit parameter

module
Blocking power ( dBm)| –| 10| Chances of burn is slim when modules are used in short distance
Operating temperature ( °C )| -40| +85| Industrial grade

2.2 Operating Parameter

Power
Consumption| TX current ( mA )| | 11| | Instantaneous power consumption @5dBm
RX current ( mA )| | 8.| |
Max TX power (dBm)| 5.| 5| |
Receiving sensitivity ( dBm )| | -102| | Bluetooth 5 Low Energy Coded
Main parameter| Description| Remark
---|---|---
Distance| 350m| Test condition: clear and open area, antenna gain: 5dBi,
antenna height: 2.5m, air data rate: 150 kbps
Distance| 100m| PCB antenna, air data rate 150kbps
Crystal frequency| 48MHz/32.768k| 48MHz/low speed 32.768k
Protocol| BLE 5.0|
| Zigbee Thread|
---|---|---
Package| SMD|
Interface| 1.1mm| Stamp hole
IC| CC2652RB1FRGZ|
FLASH| 352KB|
RAM| 80KB|
Core| Arm ® Cortex ® -M4F|
Size| 26*16mm|
Antenna| PCB / IPEX| 50f2 impedance

Size and pin definition

for details)
2| DI0_4| Input/Output| Configurable general 10 port (see CC2652RB1FRGZ manual for details)
3| DI0_5| Input/Output| Configurable general I0 port (see CC2652RB1FRGZ manual for details)
4| DI0_6| Input/Output| Configurable general I0 port (see CC2652RB1FRGZ manual for details)
5| 13107| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
---|---|---|---
6| DIO 8| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
7| DIO 12| Input/Output| Configurable general I0 port (see CC2652RB1FRGZ manual for details)
8| DIO 13| Input/Output| Configurable general I0 port (see CC2652RBIFRGZ manual for details)
9| 131014| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
10| DIO 9| Input/Output| Configurable general 10 port (see CC2652RB 1 FRGZ manual for details)
I I| 131010| Input/Output| Configurable general 10 port (see CC2652RB 1 FRGZ manual for details)
12| DIO 11| Input/Output| Configurable general 10 port (sec CC2652RBIFRGZ manual for details)
13| DIO 15| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
14| JTAG_TMSC| Input/Output| JTAG TMSC
15| JTAG TCKC| Input| JTAG TCKC
16| DIO 16| Input/Output| Configurable general 10 port (see CC2652RBIERGZ manual for details)
17| DI0_17| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
18| 1310_18| Input/Output| Configurable general 10 port (see CC2652RB1FRGZ manual for details)
19| 131019| Input/Output| Configurable general 10 port (see CC2652RB 1 FRGZ manual for details)
20| DI0_20| Input/Output| Configurable general 10 port (see CC2652RB 1 FRGZ manual for details)
21| DI0_21| Input/Output| Ground, connected to the power reference ground
22| GND| –| Ground, connected to the power reference ground
23| VCC| –| Power supply positive, I .8V – 3.6V
24| DI0_22| Input/Output| Configurable general JO port (see CC2652RB 1 FRGZ manual for details)
25| RESET_N| Input| Reset, active low (see CC2652RB IFRGZ manual for details)
26| DI0_23| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
27| DI0_24| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
28| DI0_25| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
29| DI0_26| Input/Output| Configurable general 10 port (see CC2652RB1FRGZ manual for details)
30| DI0_27| Input/Output| Configurable general 10 port (see CC2652RB1FRGZ manual for details)
31| DI0_28| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
32| DI0_29| Input/Output| Configurable general 10 port (see CC2652RB I FRGZ manual for details)
33| D1030| Input/Output| Configurable general 10 port (see CC2652RB1FRGZ manual for details)
34| X48M-N| –| 48-MHz crystal oscillator pin 1 (see CC2652RB I FRGZ manual for detai Is)
35| X48M-P| | 48-MHz crystal oscillator pin 2 (see CC2652RB I FRGZ manual for details)
36| DIO 30| Input/Output| Configurable general I0 port (see CC2652RB1FRGZ manual for details)
37| D10_30| Input/Output| Configurable general 10 port (see CC2652RBIFRGZ manual for details)
38| DLO 30| Input/Output| Configurable general I0 port (see CC2652RB1FRGZ manual for details)
39| GND| –| Ground, connected to the power reference ground
---|---|---|---

Development

1
2| Burn process| SOC module with GPIO port. The program download uses XDS 100 special downloader
Test plate| No matched test plate provide now

5 Basic operation

5.1 Hardware design

• It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded;

• Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module;

• Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;

• Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

• When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;

• The module should be as far away as possible from the power supply, transformers, high-frequency wiring, and other parts with large electromagnetic interference;

• Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well-grounded), it must be close to the digital part of the module and routed in the Bottom Layer;

• Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;

• It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;

• Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;

• Try to stay away from some physical layers such as TTL protocol at 2.4GHz, for example, USB3.0;

• The mounting structure of the antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;

• The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.
  5.2 Programming

• The core of this module is CC2630, the user can operate according to the CC2630 chip manual (see CC2630 manual for details).

• Note the chip used by the module DC/DC.

• Bum program: SOC module, with GPIO port, program download using XDS100 dedicated downloader.

• Program download interface definition:
  E72 PIN| XDS 100 PORT
  ---|---
  JTAG_TMSC| TMS
  JTAG_TCKC| TCK
  RESET_N| SRSTN
  GND| DGND
  VCC| TVD

FAQ

6.1 Communication range is too short

• The communication distance will be affected when an obstacle exists:
• Data loss rate will be affected by temperature. humidity and co-channel interference:
• The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground:
• Seawater has a great ability in absorbing wireless radio waves. so performance will be poor when testing near the sea:
• The signal will be affected when the antenna is near a metal object or put in a metal case:
• The power register was set incorrectly. the air data rate is set as too high (the higher the air data rate. the shorter the distance):
• The power supply low voltage under room temperature is lower than the recommended value. the lower the transmitting power.
• Due to antenna quality or poet matching between antenna and module.

6.2 Module is easy to damage

• Please check the power supply source, ensure that it is within the recommended supply voltage, a voltage higher than the maximum value, will permanently damage the module:
• Please check the stability of the power source, the voltage cannot fluctuate too much:
• Please make sure antistatic measures are taken when installing and using. high-frequency devices have electrostatic
• susceptibility:
• Please ensure the humidity is within a limited range. some parts are sensitive to humidity;
• Please avoid using modules under the too high or too low texture.

6.3 BER(Bit Error Rate) is high

• There is co-channel signal interference nearby. please be away from interference sources or modify frequency and channel to avoid interference:
• The poor power supply may cause messy code. Make sure that the power supply is reliable:
• The extension line and feeder quality are poor or too long, so the bit error rate is high.

Production guidance

7.1 Reflow soldering temperature

7.2 Reflow soldering curve

E72 series

Model No.| IC| Frequency| Tx power| Distance| Size| Protocol| Communication
interface
---|---|---|---|---|---|---|---
Hz| dBm| km| mm
E72-2G4M05S IA| CC2630| 2.4G| 5| 0.5| I 7.528.7| ZigBee| I/O
E72-2G4M23S IA| CC2630| 2.4G| 23| 2.| 17.533.5| ZigBee| I/O
E72-2G4M05S I B| CC2640| 2.4G| 5| 0.5| 17.528.7| BLE 4.2| I/O
E72-2G4MO2S2B| CC2640| 2.4G| 2| 0.3| I 423| BLE 4.2| TTL
E72-2G4M2OS I E| CC2652P| 2.4G| 20| 0.7| 28.7* I 7.5mm| Multi-protocol| TTL

Antenna recommendation

9.1 Recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and reasonable prices.

antenna, cost performance

BULK Packing

Revision history

About us
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High-tech District, Sichuan, China

References

• 串口服务器_数传电台_4G DTU_遥控开关_LoRa/ZigBee/WiFi/蓝牙模块-成都亿佰特电子科技有限公司官网

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