LEEDARSON LA02303B Bluetooth Smart Module User Manual

LA02303B
Bluetooth SMART (BLE) Module

Key features

• Support Bluetooth v5.1 core specification, support 2Mbps LE and LE long Range
• Embedded a 32-bit ARM Cortex-M4F with float-point unit, with clock up to 90MHz
• Data Memory: 256KB internal ROM, 192KB internal RAM, 1MB internal Flash
• Frequency of system crystal oscillator: 40MHz\32.768KHz
• Power supply voltage: 2.0V～3.6V
• Operating temperature: -40℃～100℃
• Operating frequency: 2400～2483.5MHz
• TX output power:8dBm (Typical)
• BLE Receiving sensitivity:
  • 95dBm @1Mbps; -92dBm @2Mbps; -98dBm @500Kbps; -103dBm @125Kbps
• Dimension: 16mm23.7mm2.5mm
• Interface:
  • Vertical Mount (Plug-In) 6 PWMs (GPIOs), 1 Available UART, 1 ADC (GPIO), 1 debug UART
  • Horizontal (SMD) 6 PWMs (GPIOs), 1 Available UART, 3 ADCs (GPIOs), 1 debug UART, 1 GPIO
• Built-in PCB trace antenna
• Integrates the Afero Secure Connectivity Stack
• Supports Afero Easy Onboarding
• Supports Afero Secure Over the Air updates

Introduction

Overview

The LA02303B is a Leedarson-developed universal Bluetooth SMART (BLE) module. It uses the Realtek Inc. RTL8762DKF System in Package that integrates an embedded 1MB flash.

Figure 1.1 Module

It also integrates antenna on PCB which is designed for a variety of IOT products such as Door locker, Power Drivers, Sensors, Plugs, Lighting, Switches, etc.

Figure 1.2 Product Application

Block Diagram

A general block diagram of the module is shown as below.

Figure 1.3 LA02303B Block Diagram

Ordering Information

Table 1.1 Ordering Information

antenna

Electrical Characteristics

Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any conditions above those indicated in the operation listing of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 2.1 Absolute Maximum Ratings

General Operating Conditions

This table specifies the general operating temperature range and supply voltage range for all supplies, the minimum and maximum values of all other tables are specified over this operating
range, unless otherwise noted.

Table 2.2 General Operating Conditions

Note:

1. It refers in particular to the surface temperature on components of LA02303B when the module is working. If the surface temperature of  components is above 100℃, the RF parameters will be worse;
2. It is measured when the module runs the RF test Firmware @25℃ ambient temperature, it is provided here for reference only.

DC Specifications

Unless otherwise indicated, typical conditions are: VCC=3.3V. TA=25℃.

Table 2.3 DC Specifications

Symbol| Parameter(condition)| Min.| Typ.| Max.| Units
---|---|---|---|---|---
VIH| Input high voltage| 0.65xVCC| –| VCC| V
VIL| Input low voltage| GND| –| 0.28xVCC| V
VOH| Output high voltage| 0.9xVCC| –| –| V
VOL| Output low voltage| –| –| 0.1xVCC| V
IOH| Output high current| –| 8| –| mA
IOL| Output low current| –| 8| –| mA
RPU| Pull-up resistance| –| 20| 100| kΩ
RPD| Pull-down resistance| –| 20| 100| kΩ
ITX Peak| Pout=7dBm| –| 17.7| –| mA
IRX| Rx average current| –| 5.8| –| mA
Note:
The current is measured with the module running the RF test Firmware, it is provided here for reference only.

RF Specifications

Unless otherwise indicated, typical conditions are VCC=3.3V TA=25℃.

Table 2.4 BLE Specifications

Antenna Specifications

Table 2.5 Antenna Specifications

Remark: Different products have different configurations, which will result in different antenna performances. The above parameters are based on the module being mounted on the evaluation board, horizontally or vertically, shown as followed:

Pin Definition

 Default and Multiplexing Pin Definition

Figure 3.1 Module Pin Out
Table 3.1 Pin Definition

The Pin (1-18) is used for Plug-in application. The Pin on Bottom layer used for SMD application. Pin 1 is adjacent to Pin 2.

No.| Pin of IC| Definition| Pin Function Description| Default
Pull State| Direction
---|---|---|---|---|---
| 29_PO_0| PWM1/IO0| PWM Channel 1 output /GPIO 0| Puil 9c,vn| I/O
2| 49| GND| Ground of Module| | –
3| 28_P0_1| PWM2/IO1| PWM Channel 2 output / GPIO I| Pull Down| I/O
4| 43_P3_1| RXO| FACTORY_UART_RX data in| Pull Up| I
S| 27_P0_2| PWM3/102| PWM Channel 3 output / GPIO 2| Pull Down| I/O
6| 44_P3_0| TV)| FACTORY_UART_TX data out| Pull Up| 0
7| 25_P0_4| PWM4/1O3| PWM Channel 4 output /GPIO 3| Pull Down| I/O
8| 16_RST_N| RESET_N| Reset, Low Active| Pull Up| I
9| 20_P4_0| PWM5/1O4| PWM Channel S output / GPIO 4| Pull Down| I/O
10| 23_P0_5| FACTORY| FACTORY MODE enable, low active| Pull Down| I
11| 19_P4_1| PWM6/IO5| PWM Channel 6 output/GPIO 5| Pull Down| I/O
12| 2_P2_2| ADCO/106| Analog-to-Digital Converter 0/GPIO 6| Pull Down| I/O
13| 49| GND| Ground of Module| –| –
14| 17_1)4_3| TX1/SDA/
IR_RX| HOST_UART_RX (data out from RTL8762D)/12C data| Pull Up| 0
15| –| VCC| Power Supply| | I
16| 18_P4_2| RX1/SCL/
IR_TX| HOST_UART_TX (data in to RTL87620 )/12C clock| Pull Down| I
17| 23_P0_5| FACTORY| FACTORY MODE enable, low active| Pull Down| I
18| 18_P4_2| RX1/SCL/
IR_TX| HOST_UART_TX (data in to RTL8762D )/12C clock| Pull Down| 1
19| 16_RST_N| RESET_N| Reset, Low Active| Pull Up|
20| 17 P4 3| TX1/SDA/
IR_RX| HOST_UART_RX (data out from RTL8762D)/12C data| Pull Up| 0
21| 44_P3_0| TX°| FACTORY_UART_TX data out| Pull Up| 0
22| 22_P0_6| 108| GPIO 8| Pull Down| I/O
23| 43_P3_1| RX0| FACTORY_UART_RX data in| Pull Up| I
24| 49| GND| Ground of Module| –| –
25| | NC| | –| –
26| 2_P2_2| ADCO/1O6| Analog-to-Digital Converter 0/GPIO 6| Pull Down| I/O
27| –| NC| | |
28| 4 P2 4| ADC1/109| Analog-to-Digital Converter 1/GPIO 9| Pull Down| I/O
29| 26 PO 3| 107| GPIO 7| Pull Up| I/O
30| 5 P2 5| ADC2/1010| Analog-to-Digital Converter 2/GPIO 10| Pull Down| I/O
31| 49| GND| Ground of Module| –| –
32| 49| GND| Ground of Module| –| –

Trap Pins

Table 3.2 Trap Pins Definition

will enter download mode.
| | | If used as ADC, There are two modes for module:
26| 2 P2 2| | Bypass mode (range: 0-0.9V):
| | There must not be any voltage drop placed on ADC pin before module is powered, because current input that| ADC maximum input voltage cannot exceed 0.W in this mode, and AUXADC full-scale voltage is about 0.9V. If the input voltage
|
28| 4 P2 4| over lmA will damage ADC channel connect to this pin. (Digital function will| exceeds the ADC range, IC will be damaged.
| | | Divide mode (range: 0-3.3V):
|
not be affected).|
| | | In this mode, AUXADC full-scale is
| | | 3.3V in this mode. When the input
30| 5 P2 5| | voltage is 3.3-3.6V, the ADC value may be out of range, causing measurement error.
| | The module has RC circuit connect to the Reset pin, there is no need to add|
19| 16 RST N
| | –
| | RC externally, and otherwise it will cause abnormal operation.|
| | If used as 12C SDA, an external pull up|
20| 17 P4 3| resistor is suggested to be reserved.| –
| | If used as I2C SCL, an external pull up|
18| 18 P4 2| resistor is suggested to be reserved.| –

Design Guidelines

Power Supply

The LA02303B requires a single nominal supply level of 3.3V. All the necessary decoupling and filtering components are included in the module. To secure the best RF performance, the power supply for the module is recommended to have the output current higher than 30mA and have the ripple voltage less than 100mV

Module Placement

Figure 4.1 Antenna Area

Figure 4.2 Horizontal Mounting

• The copper clearance area under the antenna must be void of traces or components;
• It should be clear of any metal, no metal structures, no metal compositions like metallic paint etc.;
• The ground length should be 30mm at least.

Reference examples are shown as below:

Figure 4.3 Reference Examples for Horizontal Mounting

Figure 4.4 Vertical Mounting

• Space around the module should be clear of metal, there should be no metal and no metal compositions. (no copper clearance on the application board);
• For better performance, keep metal away from the module as far as possible, especially heavy metal components;
• The best position we suggest is at the edge of the application board, which provides more distance from the metal.

Reference examples are shown as below:

Figure 4.5 Reference Examples for Vertical Mounting

Regardless of which mounting method you choose, keep at least 1.5mm distance between module and plastic part, especially between the antenna and plastic housing.

Figure 4.6 Distance between Module and Plastic

Remark: due to the size and the shape of the application board could have impact on antenna patterns and efficiency, and different components make different coupling, different end products would have different antenna performance.

Package Specifications

Dimension

Figure 5.1 Module Dimensions

PCB Pads Information

Figure 5.2 Pad Size

Plug-in Land Pattern Example

Figure 5.3 Plug-in PCB Land Pattern

Note:

• Black printing is PCB slot, the size tolerance should be +0.1/-0mm, the thickness of the PCB should be 1.2mm or 1.6mm;
• The red solder pad is to drag solder water across, it is not the solder pad for the module. During wave soldering it is used to drag the solder paste water across, so that it will not be soldered together with the module’s solder pads;
• It is suggested to add silk printing between the pads to avoid them welded together;
• It is suggested to put metallized through holes between the module pad and PCB slots to improve connectivity. See the recommended lay-out in Figure 5.4.

Figure 5.4 Plug-in PCB View

SMD Land Pattern Example

Figure 5.5 SMD Land Pattern

Note:

• Antenna area refer to 4.2 Module Placement for antenna integration guidelines for optimal performance;
• The area marked by the R2 circle should be copper keep-out.

Production Guide

Handing Precaution

• The modules packed with the anti-moisture bag shall be stored in the environment with ambient temperature under 40℃ and ambient humidity less than 90%RH;
• The module is suggested to be applied to end product in 12 months after the production date;
• With respect to the storage condition for the module after it’s unpacked, the ambient temperature shall be controlled at 25±5℃and humidity shall be less than 10%RH;
• All the surface mounting processes (reflow process including rework process) must be completed in 168 hours after the bag is opened (including any other processes);
• All the operators shall use ESD protective floor mats, wrist straps, ESD protective footwear, air ionizers etc..,
• While operating, water and dirt should not make any contact with the modules.

Soldering Recommendation

Refer to below information for SMT temperature settings, which has been used at the module production site. It is provided here for reference only. Note that the reflow times should not be more than 2 times.

Figure 6.1 SMT Temperature Setting Curve

Package Information

Tape and Reel

All dimensions are given in mm unless otherwise indicated.

Figure 7.1 Carrier Tape Dimensions

Figure 7.2 Reel Dimensions

Package and Weight

• Each reel contains 700 pcs, weight of single module is 1.47g±15 %( 1.25g-1.69g).8 Declaration

FCC Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: 2AB2Q-LA02303B” any similar wording that expresses the same meaning may be used.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

The device must be professionally installed. The intended use is generally not for the general public. It is generally for industry/commercial use. The connector is within the transmitter enclosure and can only be accessed by disassembly of the transmitter that is not normally required. The user has no access to the connector. Installation must be controlled. Installation requires special training This module has been assessed against the following FCC rule parts: CFR 47 FCC Part 15 C (15.247, DTS) and CFR 47 FCC Part 15 E (NII). It is applicable to the modular transmitter.

Canada Statement
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.

Please notice that if the ISED certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains IC: 10256A-LA02303B” any similar wording that expresses the same meaning may be used. The device meets the exemption from the routine evaluation limits in section 2.5 of RSS 102 and compliance with RSS-102 RF exposure, users can obtain Canadian information on RF exposure and compliance.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. entre le radiateur et votre corps.

Notice to OEM integrator
Must use the device only in host devices that meet the FCC/ISED RF exposure category of mobile, which means the device is installed and used at distances of at least 20cm from persons. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
The end user manual shall include FCC Part 15 /ISED RSS GEN compliance statements related to the transmitter as show in this manual(FCC/IC Canada statement). Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B, ICES 003. Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for the transmitter when the module is installed in the host. The use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. This module is stand- alone modular. If the end product will involve the multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. Any company of the host device which install this modular should perform the test of radiated & conducted emission and spurious emission etc. according to FCC Part 15C: 15.247 and 15.209 & 15.207, 15B class B requirement, only if the test result comply with FCC part 15C: 15.247 and 15.209 & 15.207, 15B class B requirement. Then the host can be sold legally. This modular transmitter is only FCC authorized for the specific rule parts (47CFR Part 15.247 and 15.407) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for the transmitter when the module is installed in the host. Must have on the host device a label showing Contains FCC ID: 2AB2Q-LA02303B or IC: 10256ALA02303B Both FCC ID and IC ID are not to be placed on the host at the same time and only hosts going into the US can use the FCC ID and only hosts going into Canada can use the IC ID. Antenna: PCB Antenna & 4 dBi

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References

• IoT Devices and Solutions Manufacturer | ODM Partner | LEEDARSON

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