TEXAS INSTRUMENTS WL1837MODCOM8I WLAN MIMO and Bluetooth Module User Guide

User’s Guide
SWRU382–November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth® Module
Evaluation Board for TI Sitara™ Platform

The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that offers a high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI.

Sitara, WiLink are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance.

Overview

Figure 1 shows the WL1837MODCOM8I EVB.

1.1 General Features
The WL1837MODCOM8I EVB includes the following features:

• WLAN, Bluetooth, and BLE on a single module board
• 100-pin board card
• Dimensions: 76.0 mm (L) x 31.0 mm (W)
• WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
• Support for BLE dual mode
• Seamless integration with TI Sitara and other application processors
• Design for the TI AM335X general-purpose evaluation module (EVM)
• WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware compatible with prior WL127x, WL128x, and BL6450 offerings for a smooth migration to the device
• Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN
• Wi-Fi and Bluetooth single-antenna coexistence
• Built-in chip antenna
• Optional U.FL RF connector for external antenna
• Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation
• VIO in the 1.8-V domain

1.2 Key Benefits
The WL1837MOD offers the following benefits:

• Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth
• WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
• Bluetooth 4.1 + BLE (Smart Ready)
• Wi-Fi and Bluetooth single-antenna coexistence
• Low power at 30% to 50% less than the previous generation
• Available as an easy-to-use FCC-, ETSI-, and Telec-certified module
• Lower manufacturing costs save board space and minimize RF expertise.
• AM335x Linux and Android reference platforms accelerate customer development and time to market.

1.3 Applications
The WL1837MODCOM8I device is designed for the following applications:

• Portable consumer devices
• Home electronics
• Home appliances and white goods
• Industrial and home automation
• Smart gateway and metering
• Video conferencing
• Video camera and security

Board Pin Assignment

Figure 2 shows the top view of the EVB.

Figure 3 shows the bottom view of the EVB.

2.1 Pin Description
Table 1 describes the board pins.

Table 1. Pin Description

Table 1. Pin Description (continued)

2.2 Jumper Connections
The WL1837MODCOM8I EVB includes the following jumper connections:

• J1: Jumper connector for VIO power input
• J3: Jumper connector for VBAT power input
• J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth
• J6: Second RF connector for 2.4-GHz WLAN

Electrical Characteristics

For electrical characteristics, see the WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®,
Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet ( SWRS170 ).

Antenna Characteristics

4.1 VSWR
Figure 4 shows the antenna VSWR characteristics.

4.2 Efficiency
Figure 5 shows the antenna efficiency.

4.3 Radio Pattern
For information on the antenna radio pattern and other related information, see
productfinder.pulseeng.com/product/W3006.

Circuit Design

5.1 EVB Reference Schematics
Figure 6 shows the reference schematics for the EVB.

5.2 Bill of Materials (BOM)
Table 2 lists the BOM for the EVB.

Table 2. BOM

Item| Description| Part Number| Package| Reference| Qty| Mfr
---|---|---|---|---|---|---
1| TI WL1837 Wi-Fi / Bluetooth

module

| WL1837MODGI| 13.4 mm x 13.3 mm x 2.0 mm| U1| 1| Jorjin
2| XOSC 3225 / 32.768KHZ / 1.8 V /±50 ppm| 7XZ3200005| 3.2 mm × 2.5 mm ×

1.0 mm

| OSC1| 1| TXC
3| Antenna / Chip / 2.4 and 5 GHz| W3006| 10.0 mm × 3.2 mm

× 1.5 mm

| ANT1, ANT2| 2| Pulse
4| Mini RF header receptacle| U.FL-R-SMT-1(10)| 3.0 mm × 2.6 mm ×

1.25 mm

| J5, J6| 2| Hirose
5| Inductor 0402 / 1.3 nH / ±0.1 nH / SMD| LQP15MN1N3B02| 0402| L1| 1| Murata
6| Inductor 0402 / 1.8 nH / ±0.1 nH / SMD| LQP15MN1N8B02| 0402| L3| 1| Murata
7| Inductor 0402 / 2.2 nH / ±0.1 nH / SMD| LQP15MN2N2B02| 0402| L4| 1| Murata
8| Capacitor 0402 / 1 pF / 50 V / C0G

/ ±0.1 pF

| GJM1555C1H1R0BB01| 0402| C13| 1| Murata
9| Capacitor 0402 / 2.4 pF / 50 V / C0G / ±0.1 pF| GJM1555C1H2R4BB01| 0402| C14| 1| Murata
10| Capacitor 0402 / 0.1 µF / 10 V /

X7R / ±10%

| 0402B104K100CT| 0402| C3, C4| 2| Walsin
11| Capacitor 0402 / 1 µF / 6.3 V / X5R / ±10% / HF| GRM155R60J105KE19D| 0402| C1| 1| Murata
12| Capacitor 0603 / 10 µF / 6.3 V /

X5R / ±20%

| C1608X5R0J106M| 0603| C2| 1| TDK
13| Resistor 0402 / 0R / ±5%| WR04X000 PTL| 0402| R1 to R4, R6 to R19, R21 to R30, R33, C5, C6(1)| 31| Walsin
14| Resistor 0402 / 10K / ±5%| WR04X103 JTL| 0402| R20| 1| Walsin
15| Resistor 0603 / 0R / ±5%| WR06X000 PTL| 0603| R31, R32| 2| Walsin
16| PCB WG7837TEC8B D02 / Layer

4 / FR4 (4 pcs / PNL)

| | 76.0 mm × 31.0 mm

× 1.6 mm

| | 1|

(¹) C5 and C6 are mounted with a 0-Ω resistor by default.

Layout Guidelines

6.1 Board Layout
Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB.

Figure 11 and Figure 12 show instances of good layout practices.

Table 3 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12.
Table 3. Module Layout Guidelines

module is mounted.
3| Have a complete ground pour in layer 2 for thermal dissipation.
4| Ensure a solid ground plane and ground vias under the module for a stable system and thermal dissipation.
5| Increase ground pours in the first layer and have all traces from the first layer on the inner layers, if possible.
6| Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.

Figure 13 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on the trace to the antenna and 50-Ω traces for the PCB layout.

Figure 14 shows layer 1 with the trace to the antenna over ground layer 2.

Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing.

NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.

Table 4 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16.

Table 4. Antenna and RF Trace Routing Layout Guidelines

reference. At this point, the trace starts to radiate.
2| RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners.
3| RF traces must have via stitching on the ground plane beside the RF trace on both sides.
4| RF traces must have constant impedance (microstrip transmission line).
5| For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid.
6| There must be no traces or ground under the antenna section.

Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater than half the wavelength (62.5 mm at 2.4 GHz).

Follow these supply routing guidelines:

• For power supply routing, the power trace for VBAT must be at least 40-mil wide.
• The 1.8-V trace must be at least 18-mil wide.
• Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
• If possible, shield VBAT traces with ground above, below, and beside the traces. Follow these digital-signal routing guidelines:
• Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses.
• Digital clock signals (SDIO clock, PCM clock, and so on) are a source of the noise. Keep the traces of these signals as short as possible. Whenever possible, maintain clearance around these signals.

Ordering Information

Revision History

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Products|
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Audio| www.ti.com/audio
Amplifiers| amplifier.ti.com
Data Converters| dataconverter.ti.com
DLP® Products| www.dlp.com
DSP| dsp.ti.com
Clocks and Timers| www.ti.com/clocks
Interface| interface.ti.com
Logic| logic.ti.com
Power Mgmt| power.ti.com
Microcontrollers| microcontroller.ti.com
RFID| www.ti-rfid.com
OMAP Applications Processors| www.ti.com/omap
Wireless Connectivity| www.ti.com/wirelessconnectivity
Applications

Automotive and Transportation| www.ti.com/automotive
Communications and Telecom| www.ti.com/communications
Computers and Peripherals| www.ti.com/computers
Consumer Electronics| www.ti.com/consumer-apps
Energy and Lighting| www.ti.com/energy
Industrial| www.ti.com/industrial
Medical| www.ti.com/medical
Security| www.ti.com/security
Space, Avionics, and Defense| www.ti.com/space-avionics- defense
Video and Imaging| www.ti.com/video
TI E2E Community| e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated

Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
• Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
• This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Industry Canada Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.

•  CAN ICES-3(B)/ NMB-3(B)
• The device could automatically discontinue transmission in case of the absence of information to transmit or operational failure. Note that this is not intended to prohibit the transmission of control or signaling information or the use of repetitive codes where required by the technology.
• the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
• the maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit, and
• the maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non-point-to-point operation as appropriate.

In addition, high-power radars are allocated as primary users (i.e. priority users) of the bands 5250–5350 MHz and 5650–5850 MHz, and these radars could cause interference and/or damage to LE-LAN devices.

Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) This radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved by Texas Instrument. Antenna types not included in the list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this transmitter.

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

SWRU382– November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for TI Sitara™ Platform
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com

Documents / Resources

| TEXAS INSTRUMENTS WL1837MODCOM8I WLAN MIMO and Bluetooth Module [pdf] User Guide
WL18DBMOD, FI5-WL18DBMOD, FI5WL18DBMOD, WL1837MODCOM8I WLAN MIMO and Bluetooth Module, WLAN MIMO and Bluetooth Module
---|---

References

• Amplifiers | TI.com
• Data converters | TI.com
• Digital signal processors (DSPs) | TI.com
• TI E2E support forums
• Interface | TI.com
• Logic & voltage translation | TI.com
• Microcontrollers (MCUs) & processors | TI.com
• Power management | TI.com
• Product W3006
• DLP products | TI.com
• Microcontrollers (MCUs) & processors | TI.com
• Audio | TI.com
• Clocks & timing | TI.com
• Digital signal processors (DSPs) | TI.com
• Industrial design resources | TI.com
• Medical design resources | TI.com
• Digital signal processors (DSPs) product selection | TI.com
• Product cybersecurity | TI.com
• Aerospace & defense design resources | TI.com
• Videos | TI.com

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