TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub-1-GHz Wireless System-in-Package Owner’s Manual
- June 16, 2024
- Texas Instruments
Table of Contents
- Features
- Applications
- Description
- Functional Block Diagram
- Revision History
- Device Comparison
- Pin Configuration and Functions
- Specifications
- Detailed Description
- Application, Implementation, and Layout
- Environmental Requirements and SMT Specifications
- Device and Documentation Support
- Mechanical, Packaging, and Orderable Information
- IMPORTANT NOTICE AND DISCLAIMER
- Documents / Resources
CC1312PSIP
SWRS293 – MAY 2023
CC1312PSIP SimpleLink™ Sub-1-GHz Wireless System-in-Package
Features
Wireless microcontroller
-
Powerful 48-MHz Arm ® Cortex ® TI Co nfid -M4F processor
-
352KB flash program memory
-
256KB of ROM for protocols and library functions
-
8KB of cache SRAM
-
80KB of ultra-low leakage SRAM with parity for high-reliability operation
-
Dynamic multiprotocol manager (DMM) driver
-
Programmable radio includes support for 2(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
-
Supports over-the-air upgrade (OTA) Ultra-low power sensor controller
-
Autonomous MCU with 4KB of SRAM
-
Sample, store, and process sensor data
-
Fast wake-up for low-power operation
-
Software defined peripherals; capacitive touch, flow meter,
LCD Low power consumption -
MCU consumption: – 2.9 mA active mode, CoreMark ®
– 60 μA/MHz running CoreMark®
– 0.9 μA standby mode, RTC, 80KB RAM
– 0.1 μA shutdown mode, wake-up on pin -
Ultra low-power sensor controller consumption:
– 30 μA in 2-MHz mode
– 808 μA in 24-MHz mode -
Radio Consumption:
– 5.8-mA RX at 868 MHz
– 28.7-mA TX at +14 dBm at 868 MHz
Wireless protocol support -
Wi-SUN®
-
mioty®
-
Wireless M-Bus
-
SimpleLink™ TI 15.4-stack
-
6LoWPAN
-
Proprietary systems High-performance radio
-
–119 dBm for 2.5-kbps long-range mode
-
–108 dBm at 50 kbps, 802.15.4, 868 MHz
Regulatory compliance -
Pre-certified for:
– FCC CFR47 Part 15 -
Suitable for systems targeting compliance with:
– ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
– ARIB STD-T108
MCU peripherals -
Digital peripherals can be routed to 30 GPIOs
-
Four 32-bit or eight 16-bit general-purpose timers
-
12-bit ADC, 200 kSamples/s, 8 channels
-
8-bit DAC
-
Two comparators
-
Programmable current source
-
Two UART, two SSI, I
-
Real-time clock (RTC)
-
Integrated temperature and battery monitor
Security enablers -
AES 128- and 256-bit cryptographic accelerator
-
ECC and RSA public key hardware accelerator
-
SHA2 Accelerator (full suite up to SHA-512)
-
True random number generator (TRNG)
Development tools and software -
LP-CC1312PSIP Development Kit
-
SimpleLink™ CC13xx and CC26xx Software
Development Kit (SDK) -
SmartRF™ Studio for simple radio configuration
-
Sensor Controller Studio for building low-power sensing applications
-
SysConfig system configuration tool
Operating range -
1.8-V to 3.8-V single supply voltage
-
–40 to +105°C (+14 dBm PA)
All necessary components integrated -
48-MHz crystal: RF accuracy ±10 ppm
-
32-kHz crystal: RTC accuracy ±50 ppm
-
DC/DC converter components and decoupling capacitors
-
RF front-end components with 50-Ohm output
Package -
7-mm × 7-mm MOT (30 GPIOs)
-
Pin-to-pin compatible with CC2652RSIP and CC2652PSIP
-
RoHS-compliant package
IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
Applications
-
868 and 902 to 928 MHz ISM and SRD systems 1 with down to 4 kHz of receive bandwidth
-
Building automation
– Building security systems – motion detector, electronic smart lock, door and window sensor, garage door system, gateway
– HVAC – thermostat, wireless environmental sensor, HVAC system controller, gateway
– Fire safety system – smoke and heat detector, fire alarm control panel (FACP)
– Video surveillance – IP network camera
– Elevators and escalators – elevator main control panel for elevators and escalators -
Grid infrastructure
– Smart meters – water meter, gas meter, electricity meter, and heat cost allocators
– Grid communications – wireless communications – long-range sensor applications
– EV Charging infrastructure – AC charging (pile) station
– Other alternative energy – energy harvesting -
Industrial transport – asset tracking
-
Factory automation and control
-
Medical
-
Communication equipment
– Wired networking – wireless LAN or Wi-Fi access points, edge router
Description
The SimpleLink ™ CC1312PSIP device is a System-in-Package (SiP) Sub-1 GHz
wireless module supporting IEEE 802.15.4, IPv6-enabled smart objects
(6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The
CC1312PSIP microcontroller (MCU) is based on an Arm M4F main processor and
optimized for low-power wireless communication and advanced sensing in grid
infrastructure, building automation, retail automation and medical
applications. The CC1312PSIP has a low sleep current of 0.9 μA with RTC and
80KB RAM retention. In addition to the main Cortex® M4F processor, the device
also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up
capability. As an example, the sensor controller is capable of 1-Hz ADC
sampling at average 1-μA system current.
The CC1312PSIP has Low SER (Soft Error Rate) FIT (Failure-in-time) for long
operational lifetime. Always-on SRAM parity minimizes risk for corruption due
to potential radiation events. Consistent with many customers’ 10 to 15 years
or longer life cycle requirements, TI has a product life cycle policy with a
commitment to product longevity and continuity of supply including dual
sourcing of key components in the SIP. The CC1312PSIP device is part of the
SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy,
Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host
MCUs. CC1312PSIP is part of a portfolio that includes pin-compatible 2.4-GHz
SIPs for easy adaption of a wireless product to multiple communication
standards. The common SimpleLink™CC13xx and CC26xx Software Development Kit
(SDK) and SysConfig system configuration tool supports migration between
devices in the portfolio. A comprehensive number of software stacks,
application examples and SimpleLink Academy training sessions are included in
the SDK. For more information, visit wireless connectivity.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
CC1312PSIPMOT | QFM | 7.00 mm × 7.00 mm |
(1) For the most current part, package, and ordering information for all
available devices, see the Package Option Addendum in Mechanical, Packaging,
and Orderable Information, or see the TI website.
1 See RF Core for additional details on supported protocol standards,
modulation formats, and data rates.
Functional Block Diagram
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Fig](https://manuals.plus/wp-content/uploads/2024/01/TEXAS-INSTRUMENTS- CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package-Fig.png)
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Fig 1](https://manuals.plus/wp-content/uploads/2024/01/TEXAS-INSTRUMENTS- CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package-Fig-1.png)
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE | REVISION | NOTES |
---|---|---|
May-23 | * | Initial Release |
Device Comparison
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Device Comparison](https://manuals.plus/wp-content/uploads/2024/01/TEXAS- INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package-Device- Comparison.png)
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Device Comparison 1](https://manuals.plus/wp-content/uploads/2024/01/TEXAS- INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package-Device- Comparison-1.png)
Pin Configuration and Functions
7.1 Pin Diagram – MOT Package (Top View)
Figure 7-1. MOT (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View)
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- FunctionsTEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package - Functions](https://manuals.plus/wp-content/uploads/2024/01/TEXAS- INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package- Functions.png)
The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities:
- Pin 23, DIO_5
- Pin 24, DIO_6
- Pin 25, DIO_7
- Pin 34, JTAG_TMSC
- Pin 36, DIO_16
- Pin 37, DIO_17
The following I/O pins marked in Figure 7-1 in italics have analog capabilities:
- Pin 1, DIO_26
- Pin 2, DIO_27
- Pin 3, DIO_28
- Pin 7, DIO_29
- Pin 8, DIO_30
- Pin 44, DIO_23
- Pin 45, DIO_24
- Pin 48, DIO_25
7.2 Signal Descriptions – MOT Package
Table 7-1. Signal Descriptions – SIP Package
PIN| I/O| TYPE|
DESCRIPTION
---|---|---|---
NAME|
NO.
NC| 14| I/O| Digital| No Connect
DIO_1| 21| I/O| Digital| GPIO
DIO_10| 28| I/O| Digital| GPIO
DIO_11| 29| I/O| Digital| GPIO
DIO_12| 30| I/O| Digital| GPIO
DIO_13| 31| I/O| Digital| GPIO
DIO_14| 32| I/O| Digital| GPIO
DIO_15| 33| I/O| Digital| GPIO
DIO_16| 36| I/O| Digital| GPIO, JTAG_TDO, high-drive capability
DIO_17| 37| I/O| Digital| GPIO, JTAG_TDI, high-drive capability
DIO_18| 39| I/O| Digital| GPIO
DIO_19| 40| I/O| Digital| GPIO
DIO_2| 20| I/O| Digital| GPIO
DIO_20| 41| I/O| Digital| GPIO
DIO_21| 42| I/O| Digital| GPIO
DIO_22| 43| I/O| Digital| GPIO
DIO_23| 44| I/O| Digital or Analog| GPIO, analog capability
DIO_24| 45| I/O| Digital or Analog| GPIO, analog capability
DIO_25| 48| I/O| Digital or Analog| GPIO, analog capability
DIO_26| 1| I/O| Digital or Analog| GPIO, analog capability
DIO_27| 2| I/O| Digital or Analog| GPIO, analog capability
DIO_28| 3| I/O| Digital or Analog| GPIO, analog capability
DIO_29| 7| I/O| Digital or Analog| GPIO, analog capability
NC| 15| I/O| Digital| No Connect
DIO_30| 8| I/O| Digital or Analog| GPIO, analog capability
PIO_31| 38| I/O| Digital| Supports only peripheral functionality. Does not
support general purpose I/O functionality.
DIO_4| 22| I/O| Digital| GPIO
DIO_5| 23| I/O| Digital| GPIO, high-drive capability
DIO_6| 24| I/O| Digital| GPIO, high-drive capability
DIO_7| 25| I/O| Digital| GPIO, high-drive capability
DIO_8| 26| I/O| Digital| GPIO
DIO_9| 27| I/O| Digital| GPIO
GND| 5| —| —| GND
GND| 9| —| —| GND
GND| 10| —| —| GND
GND| 11| —| —| GND
GND| 12| —| —| GND
GND| 13| —| —| GND
GND| 16| —| —| GND
GND| 17| —| —| GND
GND| 19| —| —| GND
GND| 49-73| —| —| GND
7.3 Connections for Unused Pins and Modules
Table 7-2. Connections for Unused Pins
PIN| I/O| TYPE|
DESCRIPTION
---|---|---|---
NAME
|
NO.
NC| 6| —| —| No Connect
nRESET| 4| I| Digital| Reset, active low. Internal pullup resistor and
internal 100 nF to VDDS_PU
RF| 18| —| RF| 50 ohm RF port
JTAG_TCKC| 35| I| Digital| JTAG_TCKC
JTAG_TMSC| 34| I/O| Digital| JTAG_TMSC, high-drive capability
VDDS| 46| —| Power| 1.8-V to 3.8-V main SIP supply
VDDS_PU| 47| —| Power| Power to reset internal pullup resistor
Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
| MIN| MAX|
UNIT
---|---|---|---
VDDS(3)| Supply voltage| –0.3| 4.1| V
| Voltage on any digital pin(4)| –0.3| VDDS + 0.3, max 4.1| V
Vin| Voltage on ADC input| Voltage scaling enabled| –0.3| VDDS|
V
Voltage scaling disabled, internal reference| –0.3| 1.49
Voltage scaling disabled, VDDS as reference| –0.3| VDDS / 2.9
| | 10| dBm
Tstg| Storage temperature| –40| 150| °C
- Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime
- All voltage values are with respect to ground, unless otherwise noted.
- VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
- Including analog capable DIOs.
8.2 ESD Ratings
| VALUE| UNIT
---|---|---
VESD| Electrostatic discharge| Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001(1)| All pins| ±1000| V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)| All pins| ±500| V
- JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
- JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN| MAX|
UNIT
---|---|---|---
Operating ambient temperature(1) (2)| –40| 105| °C
Operating supply voltage (VDDS)| 1.8| 3.8| V
Operating supply voltage (VDDS), boost mode| VDDR = 1.95 V +14 dBm RF output
sub-1 GHz power amplifier| 2.1| 3.8| V
Rising supply voltage slew rate| 0| 100| mV/µs
Falling supply voltage slew rate| 0| 20| mV/µs
(1) Operation at or near maximum operating temperature for extended durations
will result in a reduction in lifetime.
(2) For thermal resistance characteristics refer to .
8.4 Power Supply and Modules
over operating free-air temperature range (unless otherwise noted)
PARAMETER
| | MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
VDDS Power-on-Reset (POR) threshold| | 1.1 – 1.55| V
VDDS Brown-out Detector (BOD) (1)| Rising threshold| 1.77| V
VDDS Brown-out Detector (BOD), before initial boot (2)| Rising threshold|
1.70| V
VDDS Brown-out Detector (BOD) (1)| Falling threshold| 1.75| V
(1) For boost mode (VDDR =1.95 V), TI drivers software initialization will
trim VDDS BOD limits to maximum (approximately 2.0 V)
(2) Brown-out Detector is trimmed at initial boot, value is kept until device
is reset by a POR reset or the RESET_N pin
8.5 Power Consumption – Power Modes
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.6 V with DC/DC enabled unless otherwise noted.
PARAMETER
| TEST CONDITIONS| TYP| UNIT
---|---|---|---
Core Current Consumption
Icore| Reset| Reset. RESET_N pin asserted or VDDS below power-on-reset
threshold (4)| 36| µA
Shutdown| Shutdown. No clocks running, no retention| 150| nA
Standby with cache retention| RTC running, CPU, 80KB RAM and (partial)
register retention. RCOSC_LF| 0.9| µA
RTC running, CPU, 80KB RAM and (partial) register retention XOSC_LF| 1.0
Standby with cache retention| RTC running, CPU, 80KB RAM and (partial)
register retention XOSC_LF| 2.8| µA
RTC running, CPU, 80KB RAM and (partial) register retention XOSC_LF| 2.9
Idle| Supply Systems and RAM powered RCOSC_HF| 590| µA
Icore| Active| MCU running CoreMark at 48 MHz RCOSC_HF| 2.89| mA
Peripheral Current Consumption
Iperi| Peripheral power domain| Delta current with domain enabled| 82| µA
Serial power domain| Delta current with domain enabled| 5.5
RF Core| Delta current with power domain enabled, clock enabled, RF core idle|
179
µDMA| Delta current with clock enabled, module is idle| 54
Timers| Delta current with clock enabled, module is idle(3)| 68
I2C| Delta current with clock enabled, module is idle| 8.2
I2S| Delta current with clock enabled, module is idle| 22
SSI| Delta current with clock enabled, module is idle(2)| 70
UART| Delta current with clock enabled, module is idle(1)| 141
CRYPTO (AES)| Delta current with clock enabled, module is idle| 21
PKA| Delta current with clock enabled, module is idle| 71
TRNG| Delta current with clock enabled, module is idle| 30
Sensor Controller Engine Consumption
ISCE| Active mode| 24 MHz, infinite loop| 808| µA
Low-power mode| 2 MHz, infinite loop| 30.1
- Only one UART running
- Only one SSI running
- Only one GPTimer running
- CC1312PSIP integrates a 100 kΩ pull-up resistor on nRESET
8.6 Power Consumption – Radio Modes
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.6 V with DC/DC enabled unless otherwise noted.
Using boost mode (increasing VDDR up to 1.95 V), will increase system current
by 15% (does not apply to TX +14 dBm setting where this current is already
included).
Relevant Icore and Iperi currents are included in below numbers.
PARAMETER
| TEST CONDITIONS| TYP|
UNIT
---|---|---|---
| Radio receive current, 868 MHz| | 5.8| mA
| Radio transmit current Regular PA| 0 dBm output power setting 868 MHz| 9.4|
mA
+10 dBm output power setting 868 MHz| 17.3| mA
| Radio transmit current Boost mode, regular PA| +14 dBm output power setting
868 MHz| 28.7| mA
8.7 Nonvolatile (Flash) Memory Characteristics
Over operating free-air temperature range and VDDS = 3.0 V (unless otherwise
noted)
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Flash sector size| | 8| KB
Supported flash erase cycles before failure, single-bank(1) (5)| | 30| k
Cycles
Supported flash erase cycles before failure, single sector(2)| | 60| k Cycles
Maximum number of write operations per row before sector erase(3)| | 83| Write
Operations
Flash retention| 105 °C| 11.4| Years at 105°C
Flash sector erase current| Average delta current| 10.7| mA
Flash sector erase time(4)| Zero cycles| 10| ms
30k cycles| 4000| ms
Flash write current| Average delta current, 4 bytes at a time| 6.2| mA
Flash write time(4)| 4 bytes at a time| 21.6| µs
- A full bank erase is counted as a single erase cycle on each sector.
- Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k cycles
- Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum number of write operations per row is reached.
- This number is dependent on Flash aging and increases over time and erase cycles
- Aborting flash during erase or program modes is not a safe operation.
8.8 Thermal Resistance Characteristics
THERMAL METRIC | PACKAGE | UNIT |
---|
MOT (SIP)
73 PINS
RθJA| Junction-to-ambient thermal resistance| 48.7| °C/W(1)
RθJC(top)| Junction-to-case (top) thermal resistance| 12.4| °C/W(1)
RθJB| Junction-to-board thermal resistance| 32.2| °C/W(1)
ψJT| Junction-to-top characterization parameter| 0.40| °C/W(1)
ψJB| Junction-to-board characterization parameter| 32.0| °C/W(1)
(1) °C/W = degrees Celsius per watt.
8.9 RF Frequency Bands
Over operating free-air temperature range (unless otherwise noted).
PARAMETER | MIN | TYP | MAX | UNIT |
---|---|---|---|---|
Frequency band | 863 | 930 | MHz |
8.10 861 MHz to 1054 MHz – Receive (RX)
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.0 V with DC/DC enabled and high power PA connected to VDDS unless otherwise
noted.
All measurements are performed at the antenna input with a combined RX and TX
path, except for high power PA which is measured at a dedicated antenna
connection. All measurements are performed conducted.
PARAMETER
| TEST CONDITIONS| MIN| TYP| MAX| UNIT
---|---|---|---|---|---
General Parameters
Digital channel filter programmable receive bandwidth| | 4| | 4000| kHz
Data rate step size| | 1.5| bps
Spurious emissions 25 MHz to 1 GHz| 868 MHz Conducted emissions measured
according to ETSI EN 300 220| < -57| dBm
Spurious emissions 1 GHz to 13 GHz| < -47| dBm
802.15.4, 50 kbps, ±25 kHz deviation, 2-GFSK, 100 kHz RX Bandwidth
Sensitivity| BER = 10–2, 868 MHz| –108| dBm
Saturation limit| BER = 10–2, 868 MHz| 10| dBm
Selectivity, ±200 kHz| BER = 10–2, 868 MHz(1)| 44| dB
Selectivity, ±400 kHz| BER = 10–2, 868 MHz(1)| 48| dB
Blocking, ±1 MHz| BER = 10–2, 868 MHz(1)| 57| dB
Blocking, ±2 MHz| BER = 10–2, 868 MHz(1)| 62| dB
Blocking, ±5 MHz| BER = 10–2, 868 MHz(1)| 68| dB
Blocking, ±10 MHz| BER = 10–2, 868 MHz(1)| 76| dB
Image rejection (image compensation enabled)| BER = 10–2, 868 MHz(1)| 39| dB
RSSI dynamic range| Starting from the sensitivity limit| 95| dB
RSSI accuracy| Starting from the sensitivity limit across the given dynamic
range| ±3| dB
802.15.4, 100 kbps, ±25 kHz deviation, 2-GFSK, 137 kHz RX Bandwidth
Sensitivity 100 kbps| 868 MHz, 1% PER, 127 byte payload| -101| dBm
Selectivity, ±200 kHz| 868 MHz, 1% PER, 127 byte payload. Wanted signal at -96
dBm| 38| dB
Selectivity, ±400 kHz| 868 MHz, 1% PER, 127 byte payload. Wanted signal at -96
dBm| 45| dB
Co-channel rejection| 868 MHz, 1% PER, 127 byte payload. Wanted signal at -79
dBm| -9| dB
802.15.4, 200 kbps, ±50 kHz deviation, 2-GFSK, 311 kHz RX Bandwidth
Sensitivity| BER = 10–2, 868 MHz| –103| dBm
Sensitivity| BER = 10–2, 915 MHz| –103| dBm
Selectivity, ±400 kHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above
sensitivity limit.| 41| dB
Selectivity, ±800 kHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above
sensitivity limit.| 47| dB
Blocking, ±2 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 55| dB
Blocking, ±10 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 67| dB
802.15.4, 500 kbps, ±190 kHz deviation, 2-GFSK, 655 kHz RX Bandwidth
Sensitivity 500 kbps| 916 MHz, 1% PER, 127 byte payload| -90| dBm
Selectivity, ±1 MHz| 916 MHz, 1% PER, 127 byte payload. Wanted signal at -88
dBm| 11| dB
Selectivity, ±2 MHz| 916 MHz, 1% PER, 127 byte payload. Wanted signal at -88
dBm| 43| dB
Co-channel rejection| 916 MHz, 1% PER, 127 byte payload. Wanted signal at -71
dBm| -9| dB
SimpleLink™ Long Range 2.5 kbps or 5 kbps (20 ksym/s, 2-GFSK, ±5 kHz Deviation, FEC (Half Rate), DSSS = 1:2 or 1:4, 34 kHz RX Bandwidth
Sensitivity| 2.5 kbps, BER = 10–2, 868 MHz| -119| dBm
Sensitivity| 5 kbps, BER = 10–2, 868 MHz| -117| dBm
Saturation limit| 2.5 kbps, BER = 10–2, 868 MHz| 10| dBm
Selectivity, ±100 kHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 49| dB
Selectivity, ±200 kHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 50| dB
Selectivity, ±300 kHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 51| dB
Blocking, ±1 MHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 63| dB
Blocking, ±2 MHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 68| dB
Blocking, ±5 MHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 78| dB
Blocking, ±10 MHz| 2.5 kbps, BER = 10–2, 868 MHz(1)| 87| dB
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.0 V with DC/DC enabled and high power PA connected to VDDS unless otherwise
noted.
All measurements are performed at the antenna input with a combined RX and TX
path, except for high power PA which is measured at a dedicated antenna
connection. All measurements are performed conducted.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
Image rejection (image compensation enabled)| 2.5 kbps, BER = 10–2, 868
MHz(1)| 45| dB
RSSI dynamic range| Starting from the sensitivity limit| 97| dB
RSSI accuracy| Starting from the sensitivity limit across the given dynamic
range| ±3| dB
Wireless M-Bus
Receiver sensitivity, wM-BUS C-mode, 100 kbps ±45 kHz| Receiver Bandwidth 236
kHz, BER 1%| -104| dBm
Receiver sensitivity, wM-BUS T-mode, 100 kbps ±50 kHz| Receiver Bandwidth 236
kHz, BER 1%| -103| dBm
Receiver sensitivity, wM-BUS S2-mode, 32.768 kbps ±50 kHz| Receiver Bandwidth
196 kHz, BER 1%| -109| dBm
Receiver sensitivity, wM-BUS S1-mode, 32.768 kbps ±50 kHz| Receiver Bandwidth
311 kHz, BER 1%| -107| dBm
OOK, 4.8 kbps, 39 kHz RX Bandwidth
Sensitivity| BER = 10–2, 868 MHz| -112| dBm
Sensitivity| BER = 10–2, 915 MHz| -112| dBm
Narrowband, 9.6 kbps ±2.4 kHz deviation, 2-GFSK, 868 MHz, 17.1 kHz RX Bandwidth
Sensitivity| 1% BER| -118| dBm
Adjacent Channel Rejection| 1% BER. Wanted signal 3 dB above the ETSI
reference sensitivity limit (-104.6 dBm). Interferer ±20 kHz| 39| dB
Alternate Channel Rejection| 1% BER. Wanted signal 3 dB above the ETSI
reference sensitivity limit (-104.6 dBm). Interferer ±40 kHz| 40| dB
Blocking, ±1 MHz| 1% BER. Wanted signal 3 dB above the ETSI reference
sensitivity limit (-104.6 dBm).| 65| dB
Blocking, ±2 MHz| 69| dB
Blocking, ±10 MHz| 85| dB
1 Mbps, ±350 kHz deviation, 2-GFSK, 2.2 MHz RX Bandwidth
Sensitivity| BER = 10–2, 868 MHz| -94| dBm
Sensitivity| BER = 10–2, 915 MHz| -93| dBm
Blocking, +2 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 44| dB
Blocking, -2 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 27| dB
Blocking, +10 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 59| dB
Blocking, -10 MHz| BER = 10–2, 915 MHz. Wanted signal 3 dB above sensitivity
limit.| 54| dB
Wi-SUN, 2-GFSK
Sensitivity| 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz, 68 kHz RX BW,
10% PER, 250 byte payload| -104| dBm
Selectivity, -100 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 50
kbps, ±12.5 kHz deviation, 2-GFSK, 68 kHz RX Bandwidth, 866.6 MHz, 10% PER,
250 byte payload. Wanted signal 3 dB above sensitivity level| 32| dB
Selectivity, +100 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 33| dB
Selectivity, ±100 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 30| dB
Selectivity, -200 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 36| dB
Selectivity, +200 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 38| dB
Selectivity, ±200 kHz, 50 kbps, ±12.5 kHz deviation, 2-GFSK, 866.6 MHz| 37| dB
Sensitivity| 50 kbps, ±25 kHz deviation, 2-GFSK, 98 kHz RX Bandwidth,918.2
MHz, 10% PER, 250 byte payload| -104| dBm
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled and high power PA connected to VDDS unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
Selectivity, -200 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 50 kbps,
±25 kHz deviation, 2-GFSK, 98 kHz RX Bandwidth, 918.2 MHz, 10% PER, 250 byte
payload. Wanted signal 3 dB above sensitivity level| 34| dB
Selectivity, +200 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 35| dB
Selectivity, ±200 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 34| dB
Selectivity, -400 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 40| dB
Selectivity, +400 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 40| dB
Selectivity, ±400 kHz, 50 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz| 40| dB
Sensitivity| 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz, 135 kHz RX BW,
10% PER, 250 byte payload| -102| dBm
Sensitivity| 100 kbps, ±25 kHz deviation, 2-GFSK, 918.2 MHz, 135 kHz RX BW,
10% PER, 250 byte payload| -101| dBm
Selectivity, -200 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 100
kbps, ±25 kHz deviation, 2-GFSK, 135 kHz RX Bandwidth, 866.6 MHz, 10% PER, 250
byte payload. Wanted signal 3 dB above sensitivity level| 37| dB
Selectivity, +200 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 38| dB
Selectivity, ±200 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 37| dB
Selectivity, -400 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 45| dB
Selectivity, +400 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 45| dB
Selectivity, ±400 kHz, 100 kbps, ±25 kHz deviation, 2-GFSK, 866.6 MHz| 45| dB
Sensitivity| 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz, 196 kHz RX BW,
10% PER, 250 byte payload| -100| dBm
Selectivity, -400 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 100
kbps, ±50 kHz deviation, 2-GFSK, 196 kHz RX Bandwidth, 920.9 MHz, 10% PER, 250
byte payload. Wanted signal 3 dB above sensitivity level| 40| dB
Selectivity, +400 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 40| dB
Selectivity, ±400 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 40| dB
Selectivity, -800 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 46| dB
Selectivity, +800 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 52| dB
Selectivity, ±800 kHz, 100 kbps, ±50 kHz deviation, 2-GFSK, 920.9 MHz| 48| dB
Sensitivity| 150 kbps, ±37.5 kHz deviation, 2-GFSK, 918.4 MHz, 273 kHz RX BW,
10% PER, 250 byte payload| -96| dBm
Selectivity, -400 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 918.4 MHz| 150
kbps, ±37.5 kHz deviation, 2-GFSK, 273 kHz RX Bandwidth, 918.4 MHz, 10% PER,
250 byte payload. Wanted signal 3 dB above sensitivity level| 41| dB
Selectivity, +400 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 918.4 MHz| 42|
dB
Selectivity, -800 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 918.4 MHz| 46|
dB
Selectivity, +800 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 918.4 MHz| 49|
dB
Sensitivity| | -96| dBm
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.0 V with DC/DC enabled and high power PA connected to VDDS unless otherwise
noted.
All measurements are performed at the antenna input with a combined RX and TX
path, except for high power PA which is measured at a dedicated antenna
connection. All measurements are performed conducted.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
Selectivity, -400 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 150
kbps, ±37.5 kHz deviation, 2-GFSK, 273 kHz RX Bandwidth, 920.9 MHz, 10% PER,
250 byte payload. Wanted signal 3 dB above sensitivity level| 40| dB
Selectivity, +400 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 42|
dB
Selectivity, ±400 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 40|
dB
Selectivity, -800 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 46|
dB
Selectivity, +800 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 49|
dB
Selectivity, ±800 kHz, 150 kbps, ±37.5 kHz deviation, 2-GFSK, 920.9 MHz| 46|
dB
Sensitivity| 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz, 273 kHz RX BW,
10% PER, 250 byte payload| -97| dBm
Selectivity, -400 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 200
kbps, ±50 kHz deviation, 2-GFSK, 273 kHz RX Bandwidth, 918.4 MHz, 10% PER, 250
byte payload. Wanted signal 3 dB above sensitivity level| 40| dB
Selectivity, +400 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 43| dB
Selectivity, ±400 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 41| dB
Selectivity, -800 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 46| dB
Selectivity, +800 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 50| dB
Selectivity, ±800 kHz, 200 kbps, ±50 kHz deviation, 2-GFSK, 918.4 MHz| 48| dB
Sensitivity| 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz, 273 kHz RX BW,
10% PER, 250 byte payload| -96| dBm
Selectivity, -600 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 200
kbps, ±100 kHz deviation, 2-GFSK, 273 kHz RX Bandwidth, 920.8 MHz,, 10% PER,
250 byte payload. Wanted signal 3 dB above sensitivity level| 43| dB
Selectivity, +600 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 47| dB
Selectivity, ±600 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 44| dB
Selectivity, -1200 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 51|
dB
Selectivity, +1200 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 54|
dB
Selectivity, ±1200 kHz, 200 kbps, ±100 kHz deviation, 2-GFSK, 920.8 MHz| 51|
dB
Sensitivity| 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz, 576 kHz RX BW,
10% PER, 250 byte payload| -94| dBm
Selectivity, -600 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz| 300
kbps, ±75 kHz deviation, 2-GFSK, 576 kHz RX Bandwidth, 917.6 MHz,, 10% PER,
250 byte payload. Wanted signal 3 dB above sensitivity level| 27| dB
Selectivity, +600 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz| 45| dB
Selectivity, ±600 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz| 35| dB
Selectivity, -1200 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz| 46| dB
Selectivity, +1200 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 920.8 MHz| 50| dB
Selectivity, ±1200 kHz, 300 kbps, ±75 kHz deviation, 2-GFSK, 917.6 MHz| 48| dB
WB-DSSS, 240/120/60/30 kbps (480 ksym/s, 2-GFSK, ±195 kHz Deviation, FEC (Half Rate), DSSS = 1/2/4/8, 622 kHz RX BW)
Sensitivity| 240 kbps, DSSS = 1, BER = 10–2, 915 MHz| -101| dBm
Sensitivity| 120 kbps, DSSS = 2, BER = 10–2, 915 MHz| -103| dBm
When measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS =
3.0 V with DC/DC enabled and high power PA connected to VDDS unless otherwise
noted.
All measurements are performed at the antenna input with a combined RX and TX
path, except for high power PA which is measured at a dedicated antenna
connection. All measurements are performed conducted.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
Sensitivity| 60 kbps, DSSS = 4, BER = 10–2, 915 MHz| -105| dBm
Sensitivity| 30 kbps, DSSS = 8, BER = 10–2, 915 MHz| -106| dBm
Blocking ±1 MHz| 240 kbps, DSSS = 1, BER = 10–2, 915 MHz| 49| dB
Blocking ±2 MHz| 240 kbps, DSSS = 1, BER = 10–2, 915 MHz| 53| dB
Blocking ±5 MHz| 240 kbps, DSSS = 1, BER = 10–2, 915 MHz| 58| dB
Blocking ±10 MHz| 240 kbps, DSSS = 1, BER = 10–2, 915 MHz| 67| dB
(1) Wanted signal 3 dB above the reference sensitivity limit according to ETSI EN 300 220 v. 3.1.1
8.11 861 MHz to 1054 MHz – Transmit (TX)
Measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V
with DC/DC enabled and high power PA connected to VDDS using 2-GFSK, 50 kbps,
±25 kHz deviation unless otherwise noted. All measurements are performed at
the antenna input with a combined RX and TX path, except for high power PA
which is measured at a dedicated antenna connection. All measurements are
performed conducted. (1)c
PARAMETER
| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
General parameters
Max output power, boost mode Regular PA| VDDR = 1.95 V Minimum supply voltage
(VDDS ) for boost mode is 2.1 V 915 MHz| 14| dBm
Max output power, Regular PA| 868 MHz and 915 MHz| 12.4| dBm
Output power programmable range Regular PA| 868 MHz and 915 MHz| 34| dB
Output power variation over temperature Regular PA| +10 dBm setting Over
recommended temperature operating range| ±2| dB
Output power variation over temperature Boost mode, regular PA| +14 dBm
setting Over recommended temperature operating range| ±1.5| dB
Spurious emissions and harmonics
Spurious emissions (excluding harmonics) Regular PA (2)| 30 MHz to 1 GHz| +14
dBm setting ETSI restricted bands| < -54| dBm
+14 dBm setting ETSI outside restricted bands| < -36| dBm
1 GHz to 12.75 GHz (outside ETSI restricted bands)| +14 dBm setting measured
in 1 MHz bandwidth (ETSI)| | < -30| -35| dBm
Spurious emissions out- of-band Regular PA, 915 MHz (2)| 30 MHz to 88 MHz
(within FCC restricted bands)| +14 dBm setting| < -56| dBm
88 MHz to 216 MHz (within FCC restricted bands)| +14 dBm setting| < -52| dBm
216 MHz to 960 MHz (within FCC restricted bands)| +14 dBm setting| < -50| dBm
960 MHz to 2390 MHz and above 2483.5 MHz (within FCC restricted band)| +14 dBm
setting| <-42| dBm
1 GHz to 12.75 GHz (outside FCC restricted bands)| +14 dBm setting| | < -40|
-44| dBm
Spurious emissions out- of-band Regular PA, 920.6/928 MHz (2)| Below 710 MHz
(ARIB T-108)| +14 dBm setting| < -36| dBm
710 MHz to 900 MHz (ARIB T-108)| +14 dBm setting| < -55| dBm
900 MHz to 915 MHz (ARIB T-108)| +14 dBm setting| < -55| dBm
930 MHz to 1000 MHz (ARIB T-108)| +14 dBm setting| < -55| dBm
1000 MHz to 1215 MHz (ARIB T-108)| +14 dBm setting| < -45| dBm
Above 1215 MHz (ARIB T-108)| +14 dBm setting| < -30| dBm
Harmonics Regular PA| Second harmonic| +14 dBm setting, 868 MHz| < -30| dBm
+14 dBm setting, 915 MHz| < -30
Third harmonic| +14 dBm setting, 868 MHz| < -30| dBm
+14 dBm setting, 915 MHz| < -42
Fourth harmonic| +14 dBm setting, 868 MHz| < -30| dBm
+14 dBm setting, 915 MHz| < -30
Fifth harmonic| +14 dBm setting, 868 MHz| < -30| dBm
+14 dBm setting, 915 MHz| < -42
Measured on the CC1312PSIP-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled and high power PA connected to VDDS using 2-GFSK, 50 kbps, ±25 kHz deviation unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted.(1)
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
Adjacent Channel Power
Adjacent channel power, regular 14 dBm PA| Adjacent channel, 20 kHz offset.
9.6 kbps, h=0.5| 12.5 dBm setting. 868.3 MHz. 14 kHz channel BW| -24| dBm
Alternate channel power, regular 14 dBm PA| Alternate channel, 40 kHz offset.
9.6 kbps, h=0.5| 12.5 dBm setting. 868.3 MHz. 14 kHz channel BW| -31| dBm
(1) Some combinations of frequency, data rate and modulation format requires
use of external crystal load capacitors for regulatory compliance. More
details can be found in the device errata.
(2) Suitable for systems targeting compliance with EN 300 220, EN 303 131, EN
303 204, FCC CFR47 Part 15, ARIB STD-T108.
8.12 861 MHz to 1054 MHz – PLL Phase Noise Wideband Mode
When measured on the reference design with Tc = 25 °C, VDDS = 3.0 V.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Phase noise in the 868- and 915-MHz bands 20 kHz PLL loop bandwidth| ±10 kHz
offset| –74| dBc/Hz
±100 kHz offset| –97| dBc/Hz
±200 kHz offset| –107| dBc/Hz
±400 kHz offset| –113| dBc/Hz
±1000 kHz offset| –120| dBc/Hz
±2000 kHz offset| –127| dBc/Hz
±10000 kHz offset| –141| dBc/Hz
8.13 861 MHz to 1054 MHz – PLL Phase Noise Narrowband Mode
When measured on the reference design with Tc = 25 °C, VDDS = 3.0 V.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Phase noise in the 868- and 915-MHz bands 150 kHz PLL loop band with| ±10 kHz
offset| –93| dBc/Hz
±100 kHz offset| –93| dBc/Hz
±200 kHz offset| –95| dBc/Hz
±400 kHz offset| –104| dBc/Hz
±1000 kHz offset| –121| dBc/Hz
±2000 kHz offset| –130| dBc/Hz
±10000 kHz offset| –140| dBc/Hz
8.14 Timing and Switching Characteristics
8.14.1 Reset Timing
PARAMETER| MIN| TYP| MAX|
UNIT
---|---|---|---|---
RESET_N low duration| 1| µs
8.14.2 Wakeup Timing
Measured over operating free-air temperature with VDDS = 3.0 V (unless
otherwise noted). The times listed here do not include software overhead.
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
---|---|---|---|---|---|
MCU, Reset to Active(1) | 850 – 4000 | µs | |||
MCU, Shutdown to Active(1) | 850 – 4000 | µs | |||
MCU, Standby to Active | 165 | µs | |||
MCU, Active to Standby | 39 | µs |
Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
MCU, Idle to Active| | 15| µs
(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has been in Reset or Shutdown before starting up again. The wake up time increases with a higher capacitor value.
8.14.3 Clock Specifications
8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF) and RF frequency accuracy
The module contains a 48 MHz crystal that is connected to the oscillator.
During the production test of the module, the internal capacitor array loading
the crystal is adjusted to minimize the crystal frequency error. The
production test is also minimizing the RF frequency error at room temperature
by adjusting the RF frequency word (PLL). This initial correction of the RF
frequency is used in software (if enabled) to compensate the RF frequency
based on the estimated temperature drift of the crystal. Measured on a Texas
Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise
noted.
| PARAMETER| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
| Crystal frequency| 48| MHz
| Crystal oscillator start-up time(2)| 200| µs
| 48 MHz initial frequency accuracy at 25°| -5| 2| 5| ppm
| 48 MHz frequency stability, temperature drift -40° to 105°| -16| | 18| ppm
| Crystal aging, 5 years| -2| | 2| ppm
| Crystal aging, 10 years| -4| | 2| ppm
| RF Frequency accuracy including internal software compensated temperature
drift, excluding aging, -40° to 65°. Based on estimated crystal drift across
temperature from the manufacturer’s crystal specification.| -10| | 10| ppm
- Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device.
- Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used.
8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0
V, unless otherwise noted.
| MIN| TYP| MAX|
UNIT
---|---|---|---|---
Frequency| 48| MHz
Uncalibrated frequency accuracy| ±1| %
Calibrated frequency accuracy(1)| ±0.25| %
Start-up time| 5| µs
- Accuracy relative to the calibration source (XOSC_HF)
8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0
V, unless otherwise noted.
| MIN| TYP| MAX| UNIT
---|---|---|---|---
Calibrated frequency| 2| MHz
Start-up time| 5| µs
8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF) and RTC accuracy
The module contains a 32 kHz crystal that is connected to the oscillator.
During the production test of the module, the RTC (Real Time Clock) derived
from the 32 kHz crystal oscillator is calibrated at roome tempertaure. This is
done to minimize the RTC error caused by the initial error of the 32 kHz
crystal. This initial correction of the RTC is used in software (if enabled)
to compensate the RTC based on the estimated temperature drift of the crystal.
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0
V, unless otherwise noted.
|
| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
| Crystal frequency| 32.768| kHz
| Initial frequency accuracy at 25°| -20| 20| ppm
| 32kHz crystal aging, first year| -3| 3| ppm
| Real Time Clock (RTC) accuracy using temperature compensation for the 32kHz
xtal (if enabled in software), excluding aging, -40° to 105° degrees. Based on
estimated crystal drift across temperature from the manufacturer’s crystal
specification.| -100| 50| ppm
| Real Time Clock (RTC) accuracy using temperature compensation for the 32kHz
xtal (if enabled in software), excluding aging, -40° to 65° degrees. Based on
estimated crystal drift across temperature from the manufacturer’s crystal
specification.| -50| 50| ppm
8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0
V, unless otherwise noted.
| MIN| TYP| MAX|
UNIT
---|---|---|---|---
Frequency| 32.8| kHz
Calibrated RTC
variation(1)| Calibrated periodically against XOSC_HF(2)| ±600(3)| ppm
Temperature coefficient| 50| ppm/°C
- When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This functionality is available through the TI-provided Power driver.
- TI driver software calibrates the RTC every time XOSC_HF is enabled.
- Some device’s variation can exceed 1000 ppm. Further calibration will not improve variation.
8.14.4 Synchronous Serial Interface (SSI) Characteristics
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Characteristics](https://manuals.plus/wp-content/uploads/2024/01/TEXAS- INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package- Characteristics.png) 8.14.4.1.1 Synchronous Serial Interface (SSI) Characteristics over operating free-air temperature range (unless otherwise noted)
PARAMETER NO.| PARAMETER| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
S1| tclk_per| SSIClk cycle time| 12| | 65024| System Clocks (2)
S2(1)| tclk_high| SSIClk high time| 0.5| tclk_per
S3(1)| tclk_low| SSIClk low time| 0.5| tclk_per
- Refer to SSI timing diagrams , and .
- When using the TI-provided Power driver, the SSI system clock is always 48 MHz.
8.14.5 UART
8.14.5.1 UART Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER | MIN | TYP | MAX | UNIT |
---|---|---|---|---|
UART rate | 3 | MBaud |
8.15 Peripheral Characteristics
8.15.1 ADC
8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.
(1)
Performance numbers require use of offset and gain adjustments in software by
TI-provided ADC drivers.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
| Input voltage range| | 0| | VDDS| V
| Resolution| | 12| Bits
| Sample Rate| | 200| ksps
| Offset| Internal 4.3 V equivalent reference(2)| ±2| LSB
| Gain error| Internal 4.3 V equivalent reference(2)| ±7| LSB
DNL(4)| Differential nonlinearity| | >–1| LSB
INL| Integral nonlinearity| | ±4| LSB
ENOB| Effective number of bits| Internal 4.3 V equivalent reference(2), 200
kSamples/s,
9.6 kHz input tone| 9.8| Bits
Internal 4.3 V equivalent reference(2), 200 kSamples/s,
9.6 kHz input tone, DC/DC enabled| 9.8
VDDS as reference, 200 kSamples/s, 9.6 kHz input tone| 10.1
Internal reference, voltage scaling disabled,
32 samples average, 200 kSamples/s, 300 Hz input tone| 11.1
Internal reference, voltage scaling disabled, 14-bit mode, 200 kSamples/s, 600
Hz input tone (5)| 11.3
Internal reference, voltage scaling disabled, 15-bit mode, 200 kSamples/s, 150
Hz input tone (5)| 11.6
THD| Total harmonic distortion| Internal 4.3 V equivalent reference(2), 200
kSamples/s, 9.6 kHz input tone| –65| dB
VDDS as reference, 200 kSamples/s, 9.6 kHz input tone| –70
Internal reference, voltage scaling disabled, 32 samples average, 200
kSamples/s, 300 Hz input tone| –72
SINAD, SNDR| Signal-to-noise and distortion ratio| Internal 4.3 V equivalent
reference(2), 200 kSamples/s, 9.6 kHz input tone| 60| dB
VDDS as reference, 200 kSamples/s, 9.6 kHz input tone| 63
Internal reference, voltage scaling disabled, 32 samples average, 200
kSamples/s, 300 Hz input tone| 68
SFDR| Spurious-free dynamic range| Internal 4.3 V equivalent reference(2), 200
kSamples/s, 9.6 kHz input tone| 70| dB
VDDS as reference, 200 kSamples/s, 9.6 kHz input tone| 73
Internal reference, voltage scaling disabled, 32 samples average, 200
kSamples/s, 300 Hz input tone| 75
| Conversion time| Serial conversion, time-to-output, 24 MHz clock| 50| Clock
Cycles
| Current consumption| Internal 4.3 V equivalent reference(2)| 0.40| mA
| Current consumption| VDDS as reference| 0.57| mA
| Reference voltage| Equivalent fixed internal reference (input voltage
scaling enabled). For best accuracy, the ADC conversion should be initiated
through the TI-RTOS API in order to include the gain/ offset compensation
factors stored in FCFG1| 4.3(2) (3)| V
| Reference voltage| Fixed internal reference (input voltage scaling
disabled). For best accuracy, the ADC conversion should be initiated through
the TI-RTOS API in order to include the gain/offset compensation factors
stored in FCFG1. This value is derived from the scaled value (4.3 V) as
follows: Vref = 4.3 V × 1408 / 4095| 1.48| V
| Reference voltage| VDDS as reference, input voltage scaling enabled| VDDS| V
| Reference voltage| VDDS as reference, input voltage scaling disabled| VDDS /
2.82(3)| V
Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.
(1)
Performance numbers require use of offset and gain adjustments in software by
TI-provided ADC drivers.
PARAMETER| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
| Input impedance| 200 kSamples/s, voltage scaling enabled. Capacitive input,
Input impedance depends on sampling frequency and sampling time| >1| MΩ
- Using IEEE Std 1241-2010 for terminology and test methods
- Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V
- Applied voltage must be within Absolute Maximum Ratings at all times
- No missing codes
- ADC_output = Σ(4 n samples ) >> n, n = desired extra bits
8.15.2 DAC
8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
| TEST CONDITIONS| MIN| TYP| MAX| UNIT
---|---|---|---|---|---
General Parameters
| Resolution| | 8| Bits
VDDS
| Supply voltage| Any load, any VREF, pre-charge OFF, DAC charge-pump ON| 1.8| | 3.8|
V
External Load(4), any VREF, pre-charge OFF, DAC charge-pump OFF| 2.0| | 3.8
Any load, VREF = DCOUPL, pre-charge ON| 2.6| | 3.8
FDAC| Clock frequency| Buffer ON (recommended for external load)| 16| | 250|
kHz
Buffer OFF (internal load)| 16| | 1000
| Voltage output settling time| VREF = VDDS, buffer OFF, internal load| 13| 1
/ FDAC
VREF = VDDS, buffer ON, external capacitive load = 20 pF(3)| 13.8
| External capacitive load| | | 20| 200| pF
| External resistive load| | 10| MΩ
| Short circuit current| | 400| µA
ZMAX| Max output impedance Vref = VDDS, buffer ON, CLK 250 kHz| VDDS = 3.8 V,
DAC charge-pump OFF| 50.8| kΩ
VDDS = 3.0 V, DAC charge-pump ON| 51.7
VDDS = 3.0 V, DAC charge-pump OFF| 53.2
VDDS = 2.0 V, DAC charge-pump ON| 48.7
VDDS = 2.0 V, DAC charge-pump OFF| 70.2
VDDS = 1.8 V, DAC charge-pump ON| 46.3
VDDS = 1.8 V, DAC charge-pump OFF| 88.9
Internal Load – Continuous Time Comparator / Low Power Clocked Comparator
DNL| Differential nonlinearity| VREF = VDDS, load = Continuous Time Comparator
or Low Power Clocked Comparator FDAC = 250 kHz| ±1| LSB(1)
Differential nonlinearity| VREF = VDDS, load = Continuous Time Comparator or
Low Power Clocked Comparator FDAC = 16 kHz| ±1.2
| Offset error(2) Load = Continuous Time Comparator| VREF = VDDS = 3.8 V|
±0.64| LSB(1)
VREF = VDDS= 3.0 V| ±0.81
VREF = VDDS = 1.8 V| ±1.27
VREF = DCOUPL, pre-charge ON| ±3.43
VREF = DCOUPL, pre-charge OFF| ±2.88
VREF = ADCREF| ±2.37
| Offset error(2) Load = Low Power Clocked Comparator| VREF = VDDS= 3.8 V|
±0.78| LSB(1)
VREF = VDDS = 3.0 V| ±0.77
VREF = VDDS= 1.8 V| ±3.46
VREF = DCOUPL, pre-charge ON| ±3.44
VREF = DCOUPL, pre-charge OFF| ±4.70
VREF = ADCREF| ±4.11
| Max code output voltage variation(2) Load = Continuous Time Comparator| VREF
= VDDS = 3.8 V| ±1.53| LSB(1)
VREF = VDDS = 3.0 V| ±1.71
VREF = VDDS= 1.8 V| ±2.10
VREF = DCOUPL, pre-charge ON| ±6.00
VREF = DCOUPL, pre-charge OFF| ±3.85
VREF = ADCREF| ±5.84
Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
| TEST CONDITIONS| MIN TYP MAX|
UNIT
---|---|---|---
| Max code output voltage variation(2) Load = Low Power Clocked Comparator|
VREF = VDDS= 3.8 V| ±2.92| LSB(1)
VREF =VDDS= 3.0 V| ±3.06
VREF = VDDS= 1.8 V| ±3.91
VREF = DCOUPL, pre-charge ON| ±7.84
VREF = DCOUPL, pre-charge OFF| ±4.06
VREF = ADCREF| ±6.94
| Output voltage range(2) Load = Continuous Time Comparator| VREF = VDDS = 3.8
V, code 1| 0.03| V
VREF = VDDS = 3.8 V, code 255| 3.62
VREF = VDDS= 3.0 V, code 1| 0.02
VREF = VDDS= 3.0 V, code 255| 2.86
VREF = VDDS= 1.8 V, code 1| 0.01
VREF = VDDS = 1.8 V, code 255| 1.71
VREF = DCOUPL, pre-charge OFF, code 1| 0.01
VREF = DCOUPL, pre-charge OFF, code 255| 1.21
VREF = DCOUPL, pre-charge ON, code 1| 1.27
VREF = DCOUPL, pre-charge ON, code 255| 2.46
VREF = ADCREF, code 1| 0.01
VREF = ADCREF, code 255| 1.41
| Output voltage range(2) Load = Low Power Clocked Comparator| VREF = VDDS =
3.8 V, code 1| 0.03| V
VREF = VDDS= 3.8 V, code 255| 3.61
VREF = VDDS= 3.0 V, code 1| 0.02
VREF = VDDS= 3.0 V, code 255| 2.85
VREF = VDDS = 1.8 V, code 1| 0.01
VREF = VDDS = 1.8 V, code 255| 1.71
VREF = DCOUPL, pre-charge OFF, code 1| 0.01
VREF = DCOUPL, pre-charge OFF, code 255| 1.21
VREF = DCOUPL, pre-charge ON, code 1| 1.27
VREF = DCOUPL, pre-charge ON, code 255| 2.46
VREF = ADCREF, code 1| 0.01
VREF = ADCREF, code 255| 1.41
External Load
INL
|
Integral nonlinearity
| VREF = VDDS, FDAC = 250 kHz| ±1|
LSB(1)
VREF = DCOUPL, FDAC = 250 kHz| ±2
VREF = ADCREF, FDAC = 250 kHz| ±1
DNL| Differential nonlinearity| VREF = VDDS, FDAC = 250 kHz| ±1| LSB(1)
| Offset error| VREF = VDDS= 3.8 V| ±0.40| LSB(1)
VREF = VDDS= 3.0 V| ±0.50
VREF = VDDS = 1.8 V| ±0.75
VREF = DCOUPL, pre-charge ON| ±1.55
VREF = DCOUPL, pre-charge OFF| ±1.30
VREF = ADCREF| ±1.10
| Max code output voltage variation| VREF = VDDS= 3.8 V| ±1.00| LSB(1)
VREF = VDDS= 3.0 V| ±1.00
VREF = VDDS= 1.8 V| ±1.00
VREF = DCOUPL, pre-charge ON| ±3.45
VREF = DCOUPL, pre-charge OFF| ±2.10
VREF = ADCREF| ±1.90
| Output voltage range
Load = Low Power Clocked Comparator| VREF = VDDS = 3.8 V, code 1| 0.03| V
---|---|---|---|---
- 1 LSB (VREF 3.8 V/3.0 V/1.8 V/DCOUPL/ADCREF) = 14.10 mV/11.13 mV/6.68 mV/4.67 mV/5.48 mV
- Includes comparator offset
- A load > 20 pF will increases the settling time
- Keysight 34401A Multimeter
8.15.3 Temperature and Battery Monitor
8.15.3.1 Temperature Sensor
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0
V, unless otherwise noted.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Resolution| | 2| °C
Accuracy| -40 °C to 0 °C| ±5.0| °C
Accuracy| 0 °C to 105 °C| ±3.5| °C
Supply voltage coefficient(1)| | 3.6| °C/V
- The temperature sensor is automatically compensated for VDDS variation when using the TI-provided temperature driver.
8.15.3.2 Battery Monitor
Measured on a Texas Instruments reference design with T = 25 °C, unless
otherwise noted.
PARAMETER
| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Resolution| | 25| mV
Range| | 1.8| | 3.8| V
Integral nonlinearity (max)| | 23| mV
Accuracy| VDDS = 3.0 V| 22.5| mV
Offset error| | -32| mV
Gain error| | -1| %
8.15.4 Comparators
8.15.4.1 Low-Power Clocked Comparator
T = 25 °C, V = 3.0 V, unless otherwise noted.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Input voltage range| | 0| | VDDS| V
Clock frequency| | SCLK_LF|
Internal reference voltage(1)| Using internal DAC with VDDS as reference
voltage, DAC code = 0 – 255| 0.024 – 2.865| V
Offset| Measured at VDDS / 2, includes error from internal DAC| ±5| mV
Decision time| Step from –50 mV to 50 mV| 1| Clock Cycle
(1) The comparator can use an internal 8 bits DAC as its reference. The DAC output voltage range depends on the reference voltage selected. See
8.15.4.2 Continuous Time Comparator
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Input voltage range(1)| | 0| | VDDS| V
Offset| Measured at VDDS / 2| ±5| mV
Decision time| Step from –10 mV to 10 mV| 0.70| µs
Current consumption| Internal reference| 8.0| µA
- The input voltages can be generated externally and connected throughout I/Os or an internal reference voltage can be generated using the DAC
8.15.5 Current Source
8.15.5.1 Programmable Current Source
Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
Current source programmable output range (logarithmic range)| | 0.25 – 20| µA
Resolution| | 0.25| µA
8.15.6 GPIO
8.15.6.1 GPIO DC Characteristics
Measurements CBSed to PG2.1:
PARAMETER
| TEST CONDITIONS| MIN| TYP| MAX|
UNIT
---|---|---|---|---|---
T A = 25 °C, VDDS = 1.8 V
GPIO VOH at 8 mA load| IOCURR = 2, high-drive GPIOs only| 1.56| V
GPIO VOL at 8 mA load| IOCURR = 2, high-drive GPIOs only| 0.24| V
GPIO VOH at 4 mA load| IOCURR = 1| 1.59| V
GPIO VOL at 4 mA load| IOCURR = 1| 0.21| V
GPIO pullup current| Input mode, pullup enabled, Vpad = 0 V| 73| µA
GPIO pulldown current| Input mode, pulldown enabled, Vpad = VDDS| 19| µA
GPIO low-to-high input transition, with hysteresis| IH = 1, transition voltage
for input read as 0 → 1| 1.08| V
GPIO high-to-low input transition, with hysteresis| IH = 1, transition voltage
for input read as 1 → 0| 0.73| V
GPIO input hysteresis| IH = 1, difference between 0 → 1and 1 → 0 points| 0.35|
V
T A = 25 °C, VDDS = 3.0 V
GPIO VOH at 8 mA load| IOCURR = 2, high-drive GPIOs only| 2.59| V
GPIO VOL at 8 mA load| IOCURR = 2, high-drive GPIOs only| 0.42| V
GPIO VOH at 4 mA load| IOCURR = 1| 2.63| V
GPIO VOL at 4 mA load| IOCURR = 1| 0.40| V
T A = 25 °C, VDDS = 3.8 V
GPIO pullup current| Input mode, pullup enabled, Vpad = 0 V| 282| µA
GPIO pulldown current| Input mode, pulldown enabled, Vpad = VDDS| 110| µA
GPIO low-to-high input transition, with hysteresis| IH = 1, transition voltage
for input read as 0 → 1| 1.97| V
GPIO high-to-low input transition, with hysteresis| IH = 1, transition voltage
for input read as 1 → 0| 1.55| V
GPIO input hysteresis| IH = 1, difference between 0 → 1and 1 → 0 points| 0.42|
V
T A = 25 °C
VIH| Lowest GPIO input voltage reliably interpreted as a
High| 0.8VDDS| V
VIL| Highest GPIO input voltage reliably interpreted as a
Low| 0.2VDDS| V
8.16 Typical Characteristics
All measurements in this section are done with Tc = 25 °C and VDDS = 3.0 V,
unless otherwise noted. See Recommended Operating Conditions for device
limits. Values exceeding these limits are for reference only.
8.16.1 MCU Current
8.16.2 RX Current
8.16.3 TX Current
Table 8-1. Typical TX Current and Output Power
CC1312PSIP at 915 MHz, VDDS = 3.0 V (Measured on LP-EM-CC1312PSIP)
txPower
| TX Power Setting (SmartRF Studio)| Typical Output Power [dBm]|
Typical Current Consumption [mA]
0x013F| 14| 13.8| 34.6
0x823F| 12.5| 12.2| 24.9
0x7828| 12| 11.8| 23.5
0x7A15| 11| 10.9| 21.6
0x4C0D| 10| 10.1| 20.0
0x400A| 9| 9.5| 19.1
0x449A| 8| 8.1| 17.1
0x364D| 7| 6.8| 15.3
0x2892| 6| 6.3| 14.8
0x20DC| 5| 4.9| 13.7
0x28D8| 4| 4| 12.6
0x1C46| 3| 3.7| 11.7
0x18D4| 2| 2.8| 11.5
0x16D1| 1| 0.8| 10.6
0x16D0| 0| 0.3| 10.3
0x0CCB| -3| -3.4| 8.6
0x0CC9| -5| -5.4| 7.9
0x08C7| -7| -8| 7.3
0x0AC5| -10| -11.7| 6.6
0x08C3| -15| -17.1| 5.9
0x08C2| -20| -20.9| 5.6
8.16.4 RX Performance
8.16.5 TX Performance
8.16.6 ADC Performance
Detailed Description
9.1 Overview
Section 4 shows the core modules of the CC1312PSIP device.
9.2 System CPU
-M4F system CPU, which runs the
application and the higher layers of radio protocol stacks.
The CC1312PSIP SimpleLink ™ Wireless MCU contains an Arm Cortex
The system CPU is the foundation of a high-performance, low-cost platform that
meets the system requirements of minimal memory implementation, and low-power
consumption, while delivering outstanding computational performance and
exceptional system response to interrupts.
Its features include the following:
-
ARMv7-M architecture optimized for small-footprint embedded applications
-
Arm Thumb -2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit Arm core in a compact memory size
-
Fast code execution permits increased sleep mode time
-
Deterministic, high-performance interrupt handling for time-critical applications
-
Single-cycle multiply instruction and hardware divide
-
Hardware division and fast digital-signal-processing oriented multiply accumulate
-
Saturating arithmetic for signal processing
-
IEEE 754-compliant single-precision Floating Point Unit (FPU)
-
Memory Protection Unit (MPU) for safety-critical applications
-
Full debug with data matching for watchpoint generation
– Data Watchpoint and Trace Unit (DWT)
– JTAG Debug Access Port (DAP)
– Flash Patch and Breakpoint Unit (FPB) -
Trace support reduces the number of pins required for debugging and tracing
– Instrumentation Trace Macrocell Unit (ITM)
– Trace Port Interface Unit (TPIU) with asynchronous serial wire output (SWO) -
Optimized for single-cycle flash memory access
-
Tightly connected to 8-KB 4-way random replacement cache for minimal active power consumption and wait states
-
Ultra-low-power consumption with integrated sleep modes
-
48 MHz operation
-
1.25 DMIPS per MHz
9.3 Radio (RF Core)
The RF Core is a highly flexible and future proof radio module which contains
an Arm Cortex-M0 processor that interfaces the analog RF and base-band
circuitry, handles data to and from the system CPU side, and assembles the
information bits in a given packet structure. The RF core offers a high level,
command-based API to the main CPU that configurations and data are passed
through. The Arm Cortex-M0 processor is not programmable by customers and is
interfaced through the TI-provided RF driver that is included with the
SimpleLink Software Development Kit (SDK).
The RF core can autonomously handle the time-critical aspects of the radio
protocols, thus offloading the main CPU, which reduces power and leaves more
resources for the user application. Several signals are also available to
control external circuitry such as RF switches or range extenders
autonomously.
The various physical layer radio formats are partly built as a software
defined radio where the radio behavior is either defined by radio ROM contents
or by non-ROM radio formats delivered in form of firmware patches with the
SimpleLink SDKs. This allows the radio platform to be updated for support of
future versions of standards even with over-the-air (OTA) updates while still
using the same silicon.
Note
Not all combinations of features, frequencies, data rates, and modulation
formats described in this chapter are supported. Over time, TI can enable new
physical radio formats (PHYs) for the device and provides performance numbers
for selected PHYs in the data sheet. Supported radio formats for a specific
device, including optimized settings to use with the TI RF driver, are
included in the SmartRF Studio tool with performance numbers of selected
formats found in the Specifications section.
9.3.1 Proprietary Radio Formats
The CC1312PSIP radio can support a wide range of physical radio formats
through a set of hardware peripherals combined with firmware available in the
device ROM, covering various customer needs for optimizing towards parameters
such as speed or sensitivity. This allows great flexibility in tuning the
radio both to work with legacy protocols as well as customizing the behavior
for specific application needs.
Table 9-1 gives a simplified overview of features of the various radio formats
available in ROM. Other radio formats may be available in the form of radio
firmware patches or programs through the Software Development Kit (SDK) and
may combine features in a different manner, as well as add other features.
Table 9-1. Feature Support
Feature
| Main 2-(G)FSK Mode| High Data Rates| Low Data Rates|
SimpleLink™ Long Range
---|---|---|---|---
Programmable preamble, sync word, and CRC| Yes| Yes| Yes| No
Programmable receive bandwidth| Yes| Yes| Yes (down to 4 kHz)| Yes
Data / Symbol rate(3)| 20 to 1000 kbps| ≤ 2 Msps| ≤ 100 ksps| ≤ 20 ksps
Modulation format| 2-(G)FSK| 2-(G)FSK 4-(G)FSK| 2-(G)FSK 4-(G)FSK| 2-(G)FSK
Dual Sync Word| Yes| Yes| No| No
Carrier Sense (1) (2)| Yes| No| No| No
Preamble Detection(2)| Yes| Yes| Yes| No
Data Whitening| Yes| Yes| Yes| Yes
Digital RSSI| Yes| Yes| Yes| Yes
CRC filtering| Yes| Yes| Yes| Yes
Direct-sequence spread spectrum (DSSS)| No| No| No|
1:2
1:4
1:8
Forward error correction (FEC)| No| No| No| Yes
Link Quality Indicator (LQI)| Yes| Yes| Yes| Yes
- Carrier Sense can be used to implement HW-controlled listen-before-talk (LBT) and Clear Channel Assessment (CCA) for compliance with such requirements in regulatory standards. This is available through the CMD_PROP_CS radio API.
- Carrier Sense and Preamble Detection can be used to implement sniff modes where the radio is duty cycled to save power.
- Data rates are only indicative. Data rates outside this range may also be supported. For some specific combinations of settings, a smaller range might be supported.
9.4 Memory
The up to 352-KB nonvolatile (Flash) memory provides storage for code and
data. The flash memory is in-system programmable and erasable. The last flash
memory sector must contain a Customer Configuration section (CCFG) that is
used by boot ROM and TI provided drivers to configure the device. This
configuration is done through the ccfg.c source file that is included in all
TI provided examples.
The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB
blocks and can be used for both storage of data and execution of code.
Retention of SRAM contents in Standby power mode is enabled by default and
included in Standby mode power consumption numbers. Parity checking for
detection of bit errors in memory is built-in, which reduces chip-level soft
errors and thereby increases reliability. System SRAM is always initialized to
zeroes upon code execution from boot.
To improve code execution speed and lower power when executing code from
nonvolatile memory, a 4-way nonassociative 8-KB cache is enabled by default to
cache and prefetch instructions read by the system CPU.
The cache can be used as a general-purpose RAM by enabling this feature in the
Customer Configuration Area (CCFG).
There is a 4-KB ultra-low leakage SRAM available for use with the Sensor
Controller Engine which is typically used for storing Sensor Controller
programs, data and configuration parameters. This RAM is also accessible by
the system CPU. The Sensor Controller RAM is not cleared to zeroes between
system resets.
The ROM includes a TI-RTOS kernel and low-level drivers, as well as
significant parts of selected radio stacks, which frees up flash memory for
the application. The ROM also contains a serial (SPI and UART) bootloader that
can be used for initial programming of the device.
9.5 Sensor Controller
The Sensor Controller contains circuitry that can be selectively enabled in
both Standby and Active power modes. The peripherals in this domain can be
controlled by the Sensor Controller Engine, which is a proprietary power-
optimized CPU. This CPU can read and monitor sensors or perform other tasks
autonomously; thereby significantly reducing power consumption and offloading
the system CPU.
The Sensor Controller Engine is user programmable with a simple programming
language that has syntax similar to C. This programmability allows for sensor
polling and other tasks to be specified as sequential algorithms rather than
static configuration of complex peripheral modules, timers, DMA, register
programmable state machines, or event routing.
The main advantages are:
- Flexibility – data can be read and processed in unlimited manners while still ensuring ultra-low power
- 2 MHz low-power mode enables lowest possible handling of digital sensors
- Dynamic reuse of hardware resources
- 40-bit accumulator supporting multiplication, addition and shift
- Observability and debugging options
Sensor Controller Studio is used to write, test, and debug code for the Sensor Controller. The tool produces C driver source code, which the System CPU application uses to control and exchange data with the Sensor Controller. Typical use cases may be (but are not limited to) the following:
- Read analog sensors using integrated ADC or comparators
- Interface digital sensors using GPIOs, SPI, UART, or I2 C are bit-banged)
- Capacitive sensing
- Waveform generation
- Very low-power pulse counting (flow metering) Key scan
The peripherals in the Sensor Controller include the following:
-
The low-power clocked comparator can be used to wake the system CPU from any state in which the comparator is active. A configurable internal reference DAC can be used in conjunction with the comparator.
The output of the comparator can also be used to trigger an interrupt or the ADC. -
Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher accuracy alternative to the low-power clocked comparator. The Sensor Controller takes care of baseline tracking, hysteresis, filtering, and other related functions when these modules are used for capacitive sensing.
-
The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources including timers, I/O pins, software, and comparators.
-
The analog modules can connect to up to eight different GPIOs
-
Dedicated SPI master with up to 6 MHz clock speed
The peripherals in the Sensor Controller can also be controlled from the main application processor.
9.6 Cryptography
The CC1312PSIP device comes with a wide set of modern cryptography-related
hardware accelerators, drastically reducing code footprint and execution time
for cryptographic operations. It also has the benefit of being lower power and
improves availability and responsiveness of the system because the
cryptography operations runs in a background hardware thread.
Together with a large selection of open-source cryptography libraries provided
with the Software Development Kit (SDK), this allows for secure and future
proof IoT applications to be easily built on top of the platform. The hardware
accelerator modules are:
- True Random Number Generator (TRNG) module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear-combinatorial circuit.
- Secure Hash Algorithm 2 (SHA-2) with support for SHA224, SHA256, SHA384, and SHA512
- Advanced Encryption Standard (AES) with 128 and 256 bit key lengths
- Public Key Accelerator – Hardware accelerator supporting mathematical operations needed for elliptic curves up to 512 bits and RSA key pair generation up to 1024 bits.
Through use of these modules and the TI provided cryptography drivers, the following capabilities are available for an application or stack:
-
Key Agreement Schemes
– Elliptic curve Diffie–Hellman with static or ephemeral keys (ECDH and ECDHE)
– Elliptic curve Password Authenticated Key Exchange by Juggling (ECJ-PAKE) -
Signature Generation
– Elliptic curve Diffie-Hellman Digital Signature Algorithm (ECDSA) -
Curve Support
– Short Weierstrass form (full hardware support), such as: -
NIST-P224, NIST-P256, NIST-P384, NIST-P521
-
Brainpool-256R1, Brainpool-384R1, Brainpool-512R1
-
secp256r1
– Montgomery form (hardware support for multiplication), such as: -
Curve25519
-
SHA2 based MACs
– HMAC with SHA224, SHA256, SHA384, or SHA512 -
Block cipher mode of operation
– AESCCM
– AESGCM
– AESECB
– AESCBC
– AESCBC-MAC -
True random number generation
Other capabilities, such as RSA encryption and signatures as well as Edwards type of elliptic curves such as Curve1174 or Ed25519, can also be implemented using the provided hardware accelerators but are not part of the TI SimpleLink SDK for the CC1312PSIP device.
9.7 Timers
A large selection of timers are available as part of the CC1312PSIP device.
These timers are:
-
Real-Time Clock (RTC)
A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF)
This timer is available in all power modes except Shutdown. The timer can be calibrated to compensate for frequency drift when using the LF RCOSC as the low frequency system clock. If an external LF clock with frequency different from 32.768 kHz is used, the RTC tick speed can be adjusted to compensate for this.
When using TI-RTOS, the RTC is used as the base timer in the operating system and should thus only be accessed through the kernel APIs such as the Clock module. The real time clock can also be read by the Sensor Controller Engine to timestamp sensor data and also has dedicated capture channels. By default, the RTC halts when a debugger halts the device. -
General Purpose Timers (GPTIMER)
The four flexible GPTIMERs can be used as either 4× 32 bit timers or 8× 16 bit timers, all running on up to 48 MHz. Each of the 16- or 32-bit timers support a wide range of features such as one-shot or periodic counting, pulse width modulation (PWM), time counting between edges and edge counting. The inputs and outputs of the timer are connected to the device event fabric, which allows the timers to interact with signals such as GPIO inputs, other timers, DMA and ADC. The GPTIMERs are available in Active and Idle power modes. -
Sensor Controller Timers
The Sensor Controller contains 3 timers:
AUX Timer 0 and 1 are 16-bit timers with a 2 prescaler. Timers can either increment on a clock or on each edge of a selected tick source. Both one-shot and periodical timer modes are available.
AUX Timer 2 is a 16-bit timer that can operate at 24 MHz, 2 MHz or 32 kHz independent of the Sensor Controller functionality. There are 4 capture or compare channels, which can be operated in one-shot or periodical modes. The timer can be used to generate events for the Sensor Controller Engine or the ADC, as well as for PWM output or waveform generation. -
Radio Timer
A multichannel 32-bit timer running at 4 MHz is available as part of the device radio. The radio timer is typically used as the timing base in wireless network communication using the 32-bit timing word as the network time. The radio timer is synchronized with the RTC by using a dedicated radio API when the device radio is turned on or off. This ensures that for a network stack, the radio timer seems to always be running when the radio is enabled. The radio timer is in most cases used indirectly through the trigger time fields in the radio APIs and should only be used when running the accurate 48 MHz high frequency crystal is the source of SCLK_HF. -
Watchdog timer
The watchdog timer is used to regain control if the system operates incorrectly due to software errors. It is typically used to generate an interrupt to and reset of the device for the case where periodic monitoring of the system components and tasks fails to verify proper functionality. The watchdog timer runs on a 1.5 MHz clock rate and cannot be stopped once enabled. The watchdog timer pauses to run in Standby power mode and when a debugger halts the device.
9.8 Serial Peripherals and I/O
The SSIs are synchronous serial interfaces that are compatible with SPI,
MICROWIRE, and TI’s synchronous serial interfaces. The SSIs support both SPI
master and slave up to 4 MHz. The SSI modules support configurable phase and
polarity.
The UARTs implement universal asynchronous receiver and transmitter functions.
They support flexible baudrate generation up to a maximum of 3 Mbps.
S interface is used to handle digital audio and can also be used to interface
pulse-density modulation microphones (PDM).
The I 2 The I C interface can handle 100 kHz and 400 kHz operation, and can
serve as both master and slave.
C interface is also used to communicate with devices compatible with the I 2 C
standard. The I 2 The I/O controller (IOC) controls the digital I/O pins and
contains multiplexer circuitry to allow a set of peripherals to be assigned to
I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up
capable, have a programmable pullup and pulldown function, and can generate an
interrupt on a negative or positive edge (configurable). When configured as an
output, pins can function as either push-pull or open-drain. Five GPIOs have
high-drive capabilities, which are marked in bold in Section 7. All digital
peripherals can be connected to any digital pin on the device.
For more information, see the CC13x2, CC26x2 SimpleLink™ Wireless MCU
Technical Reference Manual.
9.9 Battery and Temperature Monitor
A combined temperature and battery voltage monitor is available in the
CC1312PSIP device. The battery and temperature monitor allows an application
to continuously monitor on-chip temperature and supply voltage and respond to
changes in environmental conditions as needed. The module contains window
comparators to interrupt the system CPU when temperature or supply voltage go
outside defined windows. These events can also be used to wake up the device
from Standby mode through the Always-On (AON) event fabric.
9.10 µDMA
The device includes a direct memory access (µDMA) controller. The µDMA
controller provides a way to offload data-transfer tasks from the system CPU,
thus allowing for more efficient use of the processor and the available bus
bandwidth. The µDMA controller can perform a transfer between memory and
peripherals. The µDMA controller has dedicated channels for each supported on-
chip module and can be programmed to automatically perform transfers between
peripherals and memory when the peripheral is ready to transfer more data.
Some features of the µDMA controller include the following (this is not an
exhaustive list):
- Highly flexible and configurable channel operation of up to 32 channels
- Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral
- Data sizes of 8, 16, and 32 bits
- Ping-pong mode for continuous streaming of data
9.11 Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or
JTAG (IEEE 1149.1) interface.
The device boots by default into cJTAG mode and must be reconfigured to use
4-pin JTAG.
9.12 Power Management
To minimize power consumption, the CC1312PSIP supports a number of power modes
and power management features (see Table 9-2).
Table 9-2. Power Modes
MODE | SOFTWARE CONFIGURABLE POWER MODES | RESET PIN HELD |
---|---|---|
ACTIVE | IDLE | STANDBY |
CPU | Active | Off |
Flash | On | Available |
SRAM | On | On |
Radio | Available | Available |
Supply System | On | On |
Register and CPU retention | Full | Full |
SRAM retention | Full | Full |
48 MHz high-speed clock (SCLK_HF) | XOSC_HF or RCOSC_HF | XOSC_HF or RCOSC_HF |
Off | Off | Off |
2 MHz medium-speed clock (SCLK_MF) | RCOSC_MF | RCOSC_MF |
32 kHz low-speed clock (SCLK_LF) | XOSC_LF or RCOSC_LF | XOSC_LF or RCOSC_LF |
XOSC_LF or RCOSC_LF | Off | Off |
Peripherals | Available | Available |
Sensor Controller | Available | Available |
Wake-up on RTC | Available | Available |
Wake-up on pin edge | Available | Available |
Wake-up on reset pin | On | On |
Brownout detector (BOD) | On | On |
Power-on reset (POR) | On | On |
Watchdog timer (WDT) | Available | Available |
In Active mode, the application system CPU is actively executing code. Active
mode provides normal operation of the processor and all of the peripherals
that are currently enabled. The system clock can be any available clock source
(see Table 9-2).
In Idle mode, all active peripherals can be clocked, but the Application CPU
core and memory are not clocked and no code is executed. Any interrupt event
brings the processor back into active mode.
In Standby mode, only the always-on (AON) domain is active. An external wake-
up event, RTC event, or Sensor Controller event is required to bring the
device back to active mode. MCU peripherals with retention do not need to be
reconfigured when waking up again, and the CPU continues execution from where
it went into standby mode. All GPIOs are latched in standby mode.
In Shutdown mode, the device is entirely turned off (including the AON domain
and Sensor Controller), and the I/Os are latched with the value they had
before entering shutdown mode. A change of state on any I/O pin defined as a
wake from shutdown pin wakes up the device and functions as a reset trigger.
The CPU can differentiate between reset in this way and reset-by-reset pin or
power-on reset by reading the reset status register. The only state retained
in this mode is the latched I/O state and the flash memory contents.
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the system CPU. This means that the system CPU does not have to wake up, for example to perform an ADC sampling or poll a digital sensor over SPI, thus saving both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio tool enables the user to program the Sensor Controller, control its peripherals, and wake up the system CPU as needed. All Sensor Controller peripherals can also be controlled by the system CPU.
Note
The power, RF and clock management for the CC1312PSIP device require specific
configuration and handling by software for optimized performance. This
configuration and handling is implemented in the TI-provided drivers that are
part of the CC1312PSIP software development kit (SDK). Therefore, TI highly
recommends using this software framework for all application development on
the device. The complete SDK with TI-RTOS (optional), device drivers, and
examples are offered free of charge in source code.
9.13 Clock Systems
The CC1312PSIP device has several internal system clocks.
The 48 MHz SCLK_HF is used as the main system (MCU and peripherals) clock.
This can be driven by the internal 48 MHz RC Oscillator (RCOSC_HF) or in-
package 48 MHz crystal (XOSC_HF). Note that the radio operation runs off the
included, in-package 48 MHz crystal within the module. The crystal frequency
is calibrated in production at room temperature to reduce the initial
frequency error to a minimum. This is done by setting the internal capacitor
array to the value that gives closest to 48 MHz.
SCLK_LF is the 32.768 kHz internal low-frequency system clock. It can be used
by the Sensor Controller for ultra-low-power operation and is also used for
the RTC and to synchronize the radio timer before or after Standby power mode.
SCLK_LF can be driven by the internal 32.8 kHz RC Oscillator (RCOSC_LF) or the
included, in-package 32.768 kHz crystal within the module.
When using a crystal or the internal RC oscillator, the device can output the
32 kHz SCLK_LF signal to other devices, thereby reducing the overall system
cost.
9.14 Network Processor
Depending on the product configuration, the CC1312PSIP device can function as
a wireless network processor (WNP – a device running the wireless protocol
stack with the application running on a separate host MCU), or as a system-on-
chip (SoC) with the application and protocol stack running on the system CPU
inside the device.
In the first case, the external host MCU communicates with the device using
SPI or UART. In the second case, the application must be written according to
the application framework supplied with the wireless protocol stack.
9.15 Device Certification and Qualification
The module from TI is certified for FCC and IC/ISED. TI Customers that build
products based on the TI module can save in testing cost and time per product
family.
Note
The FCC and IC IDs must be located in both the user manual and on the
packaging. Due to the small size of the module (7 mm x 7 mm), placing the IDs
and markings in a type size large enough to be legible without the aid of
magnification is impractical.
Table 9-3. List of Certifications
Regulatory Body | Specification | ID (IF APPLICABLE) |
---|---|---|
FCC (USA) | 15.247 Operation within the 902–928 MHz band | ZAT-1312PSIP-1 |
IC/ISED (Canada) | RSS-247 Operation within the 902–928 MHz band | 451H- |
1312PSIP1
ETSI/CE (Europe) & RER (UK)| EN 300 220, 863 -870 MHz band| –
EN 303 204, 870–876 MHz band
EN 303 659, 865-868 MHz and 915-919.4MHz
9.15.1 FCC Certification and Statement
CAUTION
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. End users must follow the specific operating
instructions for satisfying RF exposure limits. This transmitter must not be
co-located or operating with any other antenna or transmitter.
The CC1312PSIPMOT module from TI is certified for FCC as a single-modular
transmitter. The module is an FCC-certified radio module that carries a
modular grant.
You are cautioned that changes or modifications not expressly approved by the
party responsible for compliance could void the user’s authority to operate
the equipment.
This device is planned to comply with Part 15 of the FCC Rules. Operation is
subject to the following two conditions:
- This device may not cause harmful interference.
- This device must accept any interference received, including interference that may cause undesired operation of the device.
9.15.2 IC/ISED Certification and Statement
CAUTION
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must
not be co-located or operating in conjunction with any other antenna or
transmitter.
The CC1312PSIPMOT module from TI is certified for IC as a single-modular
transmitter. The CC1312PSIPMOT module from TI is meets IC modular approval and
labeling requirements. The IC follows the same testing and rules as the FCC
regarding certified modules in authorized equipment.
This device complies with Industry Canada licence-exempt RSS standards.
Operation is subject to the following two conditions:
- This device may not cause interference.
- This device must accept any interference, including interference that may cause undesired operation of the device.
9.16 Module Markings
Figure 9-1 shows the top-side marking for the CC1312PSIP module.
Table 9-4 lists the CC1312PSIP module markings.
Table 9-4. Module Descriptions
MARKING | DESCRIPTION |
---|---|
CC1312 | Generic Part Number |
P | Model |
SIP | SIP = Module type, X = pre-release |
NNN NNNN | LTC (Lot Trace Code) |
9.17 End Product Labeling
The CC1312PSIPMOT module complies with the FCC single modular FCC grant, FCC
ID: ZAT-1312PSIP-1.
The host system using this module must display a visible label indicating the
following text:
Contains FCC ID: ZAT-1312PSIP-1
The CC1312PSIPMOT module complies with the IC single modular IC grant, IC:
451H-1312PSIP1. The host system using this module must display a visible label
indicating the following text:
Contains IC: 451H-1312PSIP1
For more information on end product labeling and a sample label, please see
section 4 of the OEM Integrators Guide
9.18 Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user
regarding how to install or remove this RF module in the user’s manual of the
end product which integrates this module. The end user manual must include all
required regulatory information and warnings as shown in this manual.
Application, Implementation, and Layout
Note
Information in the following Applications section is not part of the TI
component specification, and TI does not warrant its accuracy or completeness.
TI’s customers are responsible for determining suitability of components for
their purposes. Customers should validate and test their design implementation
to confirm system functionality.
10.1 Application Information
10.1.1 Typical Application Circuit
Figure 10-1 shows the typical application schematic using the CC1312PSIP
module. For the full reference schematic, download the LP-EM-CC1312PSIP Design
Files.
Note
The following guidelines are recommended for implementation of the RF design:
- Ensure an RF path is designed with a characteristic impedance of 50 Ω.
- Tuning of the antenna impedance matching network is recommended after manufacturing of the PCB to account for PCB parasitics. Please refer to CC13xx/CC26xx Hardware Configuration and PCB Design Considerations; section 5.1 for further information.
Table 10-1 provides the bill of materials for a typical application using the
CC1312PSIP module in Figure 10-1.
It is always recommended to insert a pi-filter (Z9, Z10 and Z11) between the
RF pad and the antenna / SMA connector. When matching towards an antenna, this
will minimize the mismatch losses of the antenna. A low-pass match or high-
pass matching network can typically be chosen.
For the CC1312PSIP, it is recommended to use a low-pass antenna match since
this will both match the antenna but will also act as a low-pass filter
function as well. As can be seen in Figure 10-1, Z10 and Z11 form a low-pass
antenna match on the LP-EM-CC1312PSIP that has an integrated PCB antenna.
In the event that no matching components are required for the antenna or
direct connection to a SMA, it is recommended to use Z10: 5.6 nH and Z11: 1.8
pF as a low-pass filter.
For full operation reference design, see the LP-EM-CC1312PSIP Design Files.
Table 10-1. Bill of Materials
QTY| PART REFERENCE| VALUE| MANUFACTURER| PART NUMBER|
DESCRIPTION
---|---|---|---|---|---
1| C57| 100pF| Murata| GRM0335C1H101GA01D| Capacitor, Ceramic C0G/NP0, 100pF,
50V, -2%/+2%, -55DEGC/+125DEGC, 0201, SMD
1| U1| CC1312PSIP| Texas Instruments| CC1312PSIP| IC, CC1312PSIP, LGA73, SMD
1| Z10| 8.2nH| Murata| LQP03TN8N2J02D| Inductor, RF, Chip, Non-magnetic core,
8.2nH, -5%/+5%, 0.25A, -55DEGC/ +125DEGC, 0201, SMD
1| Z11| 1.8pF| Murata| GRM0335C1H1R8BA01J| Capacitor, Ceramic C0G/NP0, 1.8pF,
50V, -0.1pF/+0.1pF, -55DEGC/ +125DEGC, 0201, SMD
10.2 Device Connection and Layout Fundamentals
10.2.1 Reset
In order to meet the module power-on-reset requirements, VDDS (Pin 46) and
VDDS_PU (Pin 47) should be connected together. If the reset signal is not
based upon a power-on-reset and is instead derived from an external MCU, then
VDDS_PU (Pin 47) should be No Connect (NC).
10.2.2 Unused Pins
All unused pins can be left unconnected without the concern of having leakage
current. Please refer to #unique_98 for more details.
10.3 PCB Layout Guidelines
This section details the PCB guidelines to speed up the PCB design using the
CC1312PSIP module. The integrator of the modules must comply with the PCB
layout recommendations described in the following subsections to minimize the
risk with regulatory certifications for the FCC, IC/ISED, ETSI/CE. Moreover,
TI recommends customers to follow the guidelines described in this section to
achieve similar performance to that obtained with the TI reference design.
10.3.1 General Layout Recommendations
Ensure that the following general layout recommendations are followed:
- Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
- Do not run signal traces underneath the module on a layer where the module is mounted.
10.3.2 RF Layout Recommendations
It is critical that the RF section be laid out correctly to ensure optimal
module performance. A poor layout can cause low-output power and sensitivity
degradation. Figure 10-2 shows the RF placement and routing of the module with
the 2.4-GHz inverted F antenna.
Follow these RF layout recommendations for the module:
- RF traces must have a chararcterisitc impedance of 50-Ω.
- There must be no traces or ground under the antenna section.
- RF traces must have via stitching on the ground plane beside the RF trace on both sides.
- RF traces must be as short as possible.
- The module must be as close to the PCB edge in consideration of the product enclosure and type of antenna being used.
10.3.2.1 Antenna Placement and Routing
The antenna is the element used to convert the guided waves on the PCB traces
to the free space electromagnetic radiation. The placement and layout of the
antenna are the keys to increased range and data rates. Table 10-2 provides a
summary of the antenna guidelines to follow with the CC1312PSIPmodule.
Table 10-2. Antenna Guidelines
SR NO. | GUIDELINES |
---|---|
1 | Place the antenna on an edge of the PCB. |
2 | Ensure that no signals are routed across the antenna elements on any PCB |
layer.
3| Most antennas, including the PCB antenna used on the LaunchPad™, require
ground clearance on all the layers of the PCB. Ensure that the ground is
cleared on inner layers as well.
4| Ensure that there is provision to place matching components for the
antenna. These must be tuned for best return loss when the complete board is
assembled. Any plastics or casing must also be mounted while tuning the
antenna because this can impact the impedance.
5| Ensure that the antenna characteristic impedance is 50-Ω as the module is
designed for a 50-Ω system.
6| In case of printed antenna, ensure that the simulation is performed
considering the soldermask thickness.
7| For good RF performance ensrue that the Voltge Standing Wave Ration (VSWR)
is less than 2 across the frequency band of interest.
9| The feed point of the antenna is required to be grounded. This is only for
the antenna type used on theLP-EM-CC1312PSIP LaunPad™. See the specific
antenna data sheets for the recommendations.
Table 10-3 lists the recommended antennas to use with the CC1312PSIPmodule.
Other antennas may be available for use with the CC1312PSIPmodule. Please
refer to to the for a list of approved antennas (and antenna types) that can
be used with the CC1312PSIP module.
Table 10-3. Recommended Antennas
CHOICE | ANTENNA | MANUFACTURER | NOTES |
---|---|---|---|
1 | Integrated PCB antenna on the LP-EM- CC1312PSIP | Texas Instruments | +2.7 |
dBi gain at 915 MHz, see the LP-EM-CC1312PSIP refference design
2| External whip antenna| Nearson, S463AM-915| +2.0 dBi gain at 915 MHz,
https://www.nearson.com/assets/pdfs/Antenna/S463XX-915.pdf,
3| External whip antenna| Pulse, W5017| +0.9 dBi gain at 915 MHz
4| Chip antenna| Johanson Technology, 0900AT43A0070| -0.5 dBi gain
at 915 MHz
5| Chip antenna| Johanson Technology, 0915AT43A0026| +1.4 dBi gain at 915 MHz
6| Helical wire antenna| Pulse, W3113| +0.8 dBi gain at 915 MHz
10.3.2.2 Transmission Line Considerations
The RF signal from the module is routed to the antenna using a Coplanar
Waveguide with ground (CPW-G) structure. CPW-G structure offers the maximum
amount of isolation and the best possible shielding to the RF lines. In
addition to the ground on the L1 layer, placing GND vias along the line also
provides additional shielding.
Figure 10-3 shows a cross section of the coplanar waveguide with the critical
dimensions.
Figure 10-4 shows the top view of the coplanar waveguide with GND and via
stitching.
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Layout Recommendations 1](https://manuals.plus/wp-content/uploads/2024/01 /TEXAS-INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package- Layout-Recommendations-1.png)
The recommended values for a 4-layer PCB board is provided in Table 10-4.
Table 10-4. Recommended PCB Values for 4-Layer
Board (L1 to L2 = 0.175 mm)
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Layout Recommendations 2](https://manuals.plus/wp-content/uploads/2024/01
/TEXAS-INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package-
Layout-Recommendations-2.png) 10.4 Reference Designs
The following reference designs should be followed closely when implementing designs using the CC1312PSIP device.
Special attention must be paid to RF component placement, decoupling capacitors and DCDC regulator components, as well as ground connections for all of these.
LP-EM-CC1312PSIP
Design Files| The LP-EM-CC1312PSIP reference design provides schematic, layout
and production files for the characterization board used for deriving the
performance number found in this document.
---|---
Sub-1 GHz and 2.4 GHz Antenna Kit for
LaunchPad™ Development Kit and SensorTag| The antenna kit allows real-life
testing to identify the optimal antenna for your application. The antenna kit
includes 16 antennas for frequencies from 169 MHz to 2.4 GHz, including:
• PCB antennas
• Helical antennas
• Chip antennas
• Dual-band antennas for 868 MHz and 915 MHz combined with 2.4 GHz The antenna
kit includes a JSC cable to connect to the Wireless MCU LaunchPad Development
Kits and SensorTags.
Environmental Requirements and SMT Specifications
11.1 PCB Bending
The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per
inch.
11.2 Handling Environment
11.2.1 Terminals
The product is mounted with motherboard through land-grid array (LGA). To
prevent poor soldering, do not make skin contact with the LGA portion.
11.2.2 Falling
The mounted components will be damaged if the product falls or is dropped.
Such damage may cause the product to malfunction.
11.3 Storage Condition
11.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with
humidity under 85% RH. The calculated shelf life for the dry-packed product
will be 24 months from the date the bag is sealed.
11.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
11.4 PCB Assembly Guide
The wireless MCU modules are packaged in a substrate base Leadless Quad
Flatpack (QFM) package. The modules are designed with pull back leads for easy
PCB layout and board mounting.
11.4.1 PCB Land Pattern & Thermal Vias
We recommended a solder mask defined land pattern to provide a consistent
soldering pad dimension in order to obtain better solder balancing and solder
joint reliability. PCB land pattern are 1:1 to module soldering pad dimension.
Thermal vias on PCB connected to other metal plane are for thermal dissipation
purpose. It is critical to have sufficient thermal vias to avoid device
thermal shutdown. Recommended vias size are 0.2mm and position not directly
under solder paste to avoid solder dripping into the vias.
11.4.2 SMT Assembly Recommendations
The module surface mount assembly operations include:
- Screen printing the solder paste on the PCB
- Monitor the solder paste volume (uniformity)
- Package placement using standard SMT placement equipment
- X-ray pre-reflow check – paste bridging
- Reflow
- X-ray post-reflow check – solder bridging and voids
11.4.3 PCB Surface Finish Requirements
A uniform PCB plating thickness is key for high assembly yield. For an
electroless nickel immersion gold finish, the gold thickness should range from
0.05 µm to 0.20 µm to avoid solder joint embrittlement. Using a PCB with
Organic Solderability Preservative (OSP) coating finish is also recommended as
an alternative to Ni-Au.
11.4.4 Solder Stencil
Solder paste deposition using a stencil-printing process involves the transfer
of the solder paste through predefined apertures with the application of
pressure. Stencil parameters such as aperture area ratio and the fabrication
process have a significant impact on paste deposition. Inspection of the
stencil prior to placement of package is highly recommended to improve board
assembly yields.
11.4.5 Package Placement
Packages can be placed using standard pick and place equipment with an
accuracy of ±0.05 mm. Component pick and place systems are composed of a
vision system that recognizes and positions the component and a mechanical
system that physically performs the pick and place operation. Two commonly
used types of vision systems are:
- A vision system that locates a package silhouette
- A vision system that locates individual pads on the interconnect pattern
The second type renders more accurate placements but tends to be more
expensive and time consuming. Both methods are acceptable since the parts
align due to a self-centering features of the solder joint during solder
reflow. It is recommended to avoid solder bridging to 2 mils into the solder
paste or with minimum force to avoid causing any possible damage to the
thinner packages.
11.4.6 Solder Joint Inspection
After surface mount assembly, transmission X-ray should be used for sample
monitoring of the solder attachment process. This identifies defects such as
solder bridging, shorts, opens, and voids. It is also recommended to use side
view inspection in addition to X-rays to determine if there are “Hour Glass”
shaped solder and package tilting existing. The “Hour Glass” solder shape is
not a reliable joint. 90° mirror projection can be used for side view
inspection.
11.4.7 Rework and Replacement
TI recommends removal of modules by rework station applying a profile similar
to the mounting process. Using a heat gun can sometimes cause damage to the
module by overheating.
11.4.8 Solder Joint Voiding
TI recommends to control solder joint voiding to be less than 30% (per
IPC-7093). Solder joint voids could be reduced by baking of components and
PCB, minimized solder paste exposure duration, and reflow profile
optimization.
11.5 Baking Conditions
Products require baking before mounting if:
- Humidity indicator cards read > 30%
- Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12 to 24 hours
Baking times: 1 time
11.6 Soldering and Reflow Condition
- Heating method: Conventional convection or IR convection
- Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method
- Solder paste composition: SAC305
- Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 11-1)
- Temperature profile: Reflow soldering will be done according to the temperature profile (see Figure 11-1)
- Peak temperature: 260°CFigure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint)
Table 11-1. Temperature Profile
Profile Elements | Convection or IR (1) |
---|---|
Peak temperature range | 235 to 240°C typical (260°C maximum) |
Pre-heat / soaking (150 to 200°C) | 60 to 120 seconds |
Time above melting point | 60 to 90 seconds |
Time with 5°C to peak | 30 seconds maximum |
Ramp up | < 3°C / second |
Ramp down | < -6°C / second |
(1) For details, refer to the solder paste manufacturer’s recommendation.
Note
TI does not recommend the use of conformal coating or similar material on the
SimpleLink™ module.
This coating can lead to localized stress on the solder connections inside the
module and impact the module reliability. Use caution during the module
assembly process to the final PCB to avoid the presence of foreign material
inside the module.
Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed as follows.
12.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes
to all part numbers and/or datecode.
Each device has one of three prefixes/identifications: X, P, or null (no
prefix) (for example, XCC1312PSIP is in preview; therefore, an X
prefix/identification isassigned).
Device development evolutionary flow:
X Experimental device that is not necessarily representative of the final
device’s electrical specifications and may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not
necessarily meet final electrical specifications.
null Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty
applies.
Predictions show that prototype devices (X or P) have a greater failure rate
than the standard production devices. Texas Instruments recommends that these
devices not be used in any production system because their expected end-use
failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name.
This suffix indicates the package type (for example, RGZ).
For orderable part numbers of CC1312PSIP devices in the RGZ (7-mm x 7-mm)
package type, see the Package Option Addendum of this document, the Device
Information in Section 3, the TI website (www.ti.com), or
contact your TI sales representative.
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Layout Recommendations 3](https://manuals.plus/wp-content/uploads/2024/01 /TEXAS-INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package- Layout-Recommendations-3.png)
12.2 Tools and Software
The CC1312PSIP device is supported by a variety of software and hardware
development tools.
Development Kit
Software
SimpleLink™ CC13xx and CC26xx Software| The SimpleLink CC13xx-CC26xx Software
Development Kit (SDK) provides a complete
package for the development of wireless applications on the CC13x2 / CC26x2
family
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Development Kit (SDK)| of devices. The SDK includes a comprehensive software
package for the CC1312PSIP device, including the following protocol stacks:
• Wi-SUN®
• TI 15.4-Stack – an IEEE 802.15.4-based star networking solution for Sub-1
GHz and 2.4 GHz
• Prop RF API – a flexible set of building blocks for developing proprietary
RF software stacks The SimpleLink CC13xx-CC26xx SDK is part of TI’s SimpleLink
MCU platform, offering a single development environment that delivers flexible
hardware, software and tool options for customers developing wired and
wireless applications.
For more information about the SimpleLink MCU Platform, visit
https://www.ti.com/simplelink.
Development Tools
Code Composer
Studio™
Integrated
Development
Environment
(IDE)| Code Composer Studio is an
integrated development environment (IDE) that supports TI’s Microcontroller
and Embedded Processors portfolio. Code Composer Studio comprises a suite of
tools used to develop and debug embedded applications. It includes an
optimizing C/C++ compiler, source code editor, project build environment,
debugger, profiler, and many other features. The intuitive IDE provides a
single user interface taking you through each step of the application
development flow. Familiar tools and interfaces allow users to get started
faster than ever before. Code Composer Studio combines the advantages of the
Eclipse® software framework with advanced embedded debug capabilities from TI
resulting in a compelling feature-rich development environment for embedded
developers.
CCS has support for all SimpleLink Wireless MCUs and includes support for
EnergyTrace™ software (application energy usage profiling). A real-time object
viewer plugin is available for TI-RTOS, part of the SimpleLink SDK.
Code Composer Studio is provided free of charge when used in conjunction with
the XDS debuggers included on a LaunchPad Development Kit.
---|---
Code Composer
Studio™ Cloud
IDE| Code
Composer Studio (CCS) Cloud is a web-based IDE that allows you to create, edit
and build CCS and Energia™ projects. After you have successfully built your
project, you can download and run on your connected LaunchPad. Basic
debugging, including features like setting breakpoints and viewing variable
values is now supported with CCS Cloud.
IAR Embedded Workbench®
for Arm®| IAR Embedded
Workbench® is a set of development tools for building and debugging embedded
system applications using assembler, C and C++. It provides a completely
integrated development environment that includes a project manager, editor,
and build tools. IAR has support for all SimpleLink Wireless MCUs. It offers
broad debugger support, including XDS110, IAR I-jet™ and Segger J-Link™. A
real-time object viewer plugin is available for TI-RTOS, part of the
SimpleLink SDK. IAR is also supported out-of-the-box on most software examples
provided as part of the SimpleLink SDK.
A 30-day evaluation or a 32 KB size-limited version is available through
iar.com.
SmartRF™
Studio| SmartRF™ Studio is a
Windows® application that can be used to evaluate and configure SimpleLink
Wireless MCUs from Texas Instruments. The application will help designers of
RF systems to easily evaluate the radio at an early stage in the design
process. It is especially useful for generation of configuration register
values and for practical testing and debugging of the RF system. SmartRF
Studio can be used either as a standalone application or together with
applicable evaluation boards or debug probes for the RF device. Features of
the SmartRF Studio include:
• Link tests – send and receive packets between nodes
12.2.1 SimpleLink™ Microcontroller Platform
The SimpleLink microcontroller platform sets a new standard for developers
with the broadest portfolio of wired and wireless Arm
MCUs (System-on-Chip) in a single software development environment. Delivering
flexible hardware, software and tool options for your IoT applications. Invest
once in the SimpleLink software development kit and use throughout your entire
portfolio. Learn more on ti.com/simplelink.
12.3 Documentation Support
To receive notification of documentation updates on data sheets, errata,
application notes and similar, navigate to the device product folder on
ti.com/product/CC1312PSIP. In the upper
right corner, click on Alert me to register and receive a weekly digest of any
product information that has changed. For change details, review the revision
history included in any revised document.
The current documentation that describes the MCU, related peripherals, and
other technical collateral is listed as follows.
TI Resource Explorer
TI Resource Explorer
Software examples, libraries, executables, and documentation are available for
your device and development board.
Errata
CC1312PSIP Silicon Errata
The silicon errata describes the known exceptions to the functional specifications for each silicon revision of the device and description on how to recognize a device revision.
Application Reports
All application reports for the CC1312PSIP device are found on the device
product folder at:
ti.com/product/CC1312PSIP/technicaldocuments.
Technical Reference Manual (TRM)
CC13x2, CC26x2 SimpleLink™ Wireless MCU
TRM
The TRM provides a detailed description of all modules and peripherals available in the device family.
12.4 Support Resources
support forums are an engineer’s go-to source for fast,
verified answers and design help — straight from the experts. Search existing
answers or ask your own question to get the quick design help you need. ™
Linked content is provided AS IS” by the respective contributors. They do not
constitute TI specifications and do not necessarily reflect TI’s views; see
TI’s Terms of Use. 12.5 Trademarks are trademarks of Texas Instruments. I-jet
SimpleLink ™ , LaunchPad ™ , Code Composer Studio ™ , EnergyTrace ™ , and TI
E2E ™ is a trademark of IAR Systems AB. J-Link ™ is a trademark of SEGGER
Microcontroller Systeme GmbH. Arm ™ are registered trademarks of Arm Limited
(or its subsidiaries) n the US and/or elsewhere. CoreMark ® and Cortex ® tr
ictio n s is a registered trademark of Embedded Microprocessor Benchmark
Consortium Corporation. Arm Thumb ® is a registered trademark of Arm Limited
(or its subsidiaries). Eclipse ® is a registered trademark of Eclipse
Foundation. IAR Embedded Workbench ® is a registered trademark of IAR Systems
AB. Windows ® is a registered trademark of Microsoft Corporation. All
trademarks are the property of their respective owners. ®
12.6 Electrostatic Discharge Caution
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends
that all integrated circuits be handled with appropriate precautions. Failure
to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device
failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its
published specifications.
12.7 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information.
This information is the most current data available for the designated
devices. This data is subject to change without notice and revision of this
document. For browser-based versions of this data sheet, refer to the left-
hand navigation.
Note
The total height of the module is 1.51 mm.
The weight of the CC1312PSIP module is typically 0.19 g.
![TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub 1 GHz Wireless System in Package
- Layout Recommendations 4](https://manuals.plus/wp-content/uploads/2024/01 /TEXAS-INSTRUMENTS-CC1312PSIP-SimpleLink-Sub-1-GHz-Wireless-System-in-Package- Layout-Recommendations-4.png)
NOTES:
-
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
-
This drawing is subject to change without notice.
EXAMPLE BOARD LAYOUT QFM – 1.51 mm max height
MOT0048A -
This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 ( www.ti.com/lit/slua271 ).
-
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
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FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT
LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI
products. You are solely responsible for (1) selecting the appropriate TI
products for your application, (2) designing, validating and testing your
application, and (3) ensuring your application meets applicable standards, and
any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission
to use these resources only for development of an application that uses the TI
products described in the resource. Other reproduction and display of these
resources is prohibited. No license is granted to any other TI intellectual
property right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its representatives
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your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable
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TI’s applicable warranties or warranty disclaimers for TI products.
TI objects to and rejects any additional or different terms you may have
proposed.
IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box
655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: CC1312PSIP
Submit Document
Feedback
www.ti.com
Documents / Resources
|
TEXAS INSTRUMENTS CC1312PSIP SimpleLink Sub-1-GHz Wireless System-in-
Package
[pdf] Owner's Manual
CC1312PSIP SimpleLink Sub-1-GHz Wireless System-in-Package, CC1312PSIP,
SimpleLink Sub-1-GHz Wireless System-in-Package, Sub-1-GHz Wireless System-in-
Package, Wireless System-in-Package, System-in-Package
---|---
References
- dev.ti.com/tirex/
- IAR
- CC1312PSIP data sheet, product information and support | TI.com
- Wireless connectivity | TI.com
- IAR
- ti.com/lit/pdf/swra640
- Soft error rate FAQs | Quality, reliability, and packaging FAQs | Quality & reliability | TI.com
- CC-ANTENNA-DK2 Development kit | TI.com
- Wireless connectivity | TI.com
- TI E2E support forums
- Communications equipment design resources | TI.com
- Wired networking design resources | TI.com
- Building automation design resources | TI.com
- Building automation design resources | TI.com
- Retail automation & payment design resources | TI.com
- Factory automation & control design resources | TI.com
- Grid infrastructure design resources | TI.com
- Energy infrastructure design resources | TI.com
- Industrial transport (non-car & non-light truck) design resources | TI.com
- Medical design resources | TI.com
- Medical design resources | TI.com
- Documentation feedback
- Texas Instruments | Terms and conditions | Terms of sale | TI.com
- ti.com/lit/pdf/SWRA747
- ti.com/lit/pdf/SWRS293
- Embedded development | TI.com
- MIOTY Application software & framework | TI.com
- CC1312PSIP data sheet, product information and support | TI.com
- CC1312PSIP data sheet, product information and support | TI.com
- CC1312PSIP data sheet, product information and support | TI.com
- CC2652PSIP data sheet, product information and support | TI.com
- CC2652RSIP data sheet, product information and support | TI.com
- Wireless connectivity | TI.com
- Door & window sensor design resources | TI.com
- Building security gateway design resources | TI.com