EBYTE E73-2G4M08S1EX BLE Module User Manual

: June 6, 2024
: ebyte

Table of Contents

EBYTE E73-2G4M08S1EX BLE Module
Features
Introduction
Application
Specification and parameter
Size and pin definition
Development and Application
Basic operation
FAQ
Production guidance
E73 series
Bulk packing
References
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EBYTE E73-2G4M08S1EX BLE Module

Disclaimer

The information in this document, including the URL address for reference, is subject to change without notice. The document is provided “as is” without any guarantee of responsibility, including any guarantee for marketability, suitability for a specific purpose, or non-infringement, and any guarantee for any proposal, specification or sample mentioned elsewhere. This document does not bear any responsibility, including the responsibility for infringement of any patent rights caused by the use of the information in this document. This document does not grant any license for the use of intellectual property rights in estoppel or other ways, whether express or implied.

The test data obtained in the article are all obtained by the Ebyte laboratory, and the actual results may vary slightly.
We hereby declared that all brand names, trademarks, and registered trademarks mentioned in this document are the property of their respective owners.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology Co., Ltd.

Notice:
Due to product version upgrades or other reasons, the contents of this manual may be changed. Ebyte Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual without any hint or noticet. This manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd. makes every effort to provide accurate information in this manual. However, we does not guarantee that the contents of the manual are completely free of errors. All statements, information and suggestions in this manual do not constitute any express or implied guarantee.

Features

13 x 18mm, small size;
Support Bluetooth 5.1, Bluetooth mesh, 802.15.4, Thread, Zigbee, and proprietary 2.4 GHz protocols;
The maximum transmission power of 6mW, software multi-level adjustable;
Support the global license-free ISM 2.4GHz band;
Built-in high-performance low power ARM⑧and Cortex⑧-M4 dual core processor;
Rich resources,512KB FLASH, 128KB RAM;
Support 1.7V~5.5V power supply, power supply over 3. 3Vcan guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
With the IPEX antenna interface, an external antenna is required;
Under ideal conditions, the communication distance can reach 120m.

Introduction

Brief Introduction

E73-2G4M08S1EX are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption. It adopts the originally imported RFIC nRF52833 of NORDIC, supporting Bluetooth 5.1, Bluetooth mesh, 802.15.4, Thread, Zigbee, and proprietary 2.4 GHz protocols. The chip comes with a high- performance ARM CORTEX-M4 core, making use of a 32M industrial-grade crystal oscillator, and has abundant peripheral resources such as UART, I2C, SPI, ADC, DMA, and PWM. The module led out most IO Port of nRF52833 for multilateral development. Please see the pin definition for details.
E73-2G4M08S1EX is a hardware platform without firmware, so users need to conduct a secondary development. The characteristics of the nRF52833 chip can be found in the official Datasheet. The module has maximized the RF characteristics of the chip.

Application

Smart homes and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Health care products;
Wireless voice, wireless headset;
Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter

| Performance|

Remark

---|---|---
Min| Max

Power supply（V）

|

0

|

5.5

| Voltage over 5.5V will cause

permanent damage to module

Blocking power（dBm）

|

–

|

10

| Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）| -40| +85| Industrial

Operating parameter

Main parameter

| Performance|

Remark

---|---|---
Min| Type| Max
Operating voltage（V）| 1.7| 3.3| 5.5| ≥3.3 V ensures output power

Communication level（V）

| |

3.3

| | For 5V TTL, it may be at risk of

burning down

Operating temperature（℃）| -40| –| +85| Industrial grade
Operating frequency（MHz）| 2360| –| 2500| Support ISM band

TX

current

（mA）

| TX only run current

(DC/DC, 3 V) PRF = +8 dBm

| |

17.05

| |

mA

TX only run current

(DC/DC, 3 V) PRF = +4 dBm

| |

12.68

| |

mA

TX only run current

(DC/DC, 5 V, REG0 out = 3.3 V)PRF = 0 dBm

| |

7.25

| |

mA

TX only run current

(DC/DC, 3 V)PRF = 0 dBm

| |

7.63

| |

mA

TX only run current

(DC/DC, 3 V) PRF = +8 dBm

| |

17.05

| |

mA

RX

current

（mA）

| RX only run current (DC/DC, 3 V)

1 Mbps / 1 Mbps BLE

| |

7.71

| |

mA

RX only run current (DC/DC, 3 V)

2 Mbps / 2 Mbps BLE

| |

8.27

| |

mA

TX power（dBm）| 7| 8| 9| dBm
Receiving sensitivity（dBm）| -95dBm @ BLE 1Mbps| dBm
Main parameter| Description| Remark
---|---|---

Reference distance

|

120m

| Test condition：clear and open area,antenna height: 2.5m，air data

rate: 1Mbps

Size and pin definition

EBYTE E73-2G4M08S1EX BLE Module
2

Pin No.

| ****

Item

| Corresponding,ch

ip pin item

| ****

Direction

| ****

Description

---|---|---|---|---

1

| P1.11| P1.11| Common I/O| See details about nrf52833 datasheet on Nordic

website

5

| GND| –| –| Single ground line , connect to the power reference

ground.

12

| P0.26| P0.26| Common I/O| See details about nrf52833 datasheet on Nordic

website

13| XL2| P0.01/XL2| Common I/O| Connect to 32.768 kHz crystal

14

| P0.06| P0.06| Common I/O| See details about nrf52833 datasheet on Nordic

website

15| AI3| P0.05/AIN3| Common I/O| Analog input 3

16

| P0.08| P0.08| Common I/O| See details about nrf52833 datasheet on Nordic

website

17

| P1.09| P1.09| Common I/O| See details about nrf52833 datasheet on Nordic

website

18| AI2| P0.04/AIN2| Common I/O| Analog input 2
19| VCC| –| –| Power supply

20

| P12| P0.12| Common I/O| See details about nrf52833 datasheet on Nordic

website

21| GND| –| –| Ground line, connect to the power reference ground

22

| P0.07| P0.07| Common I/O| See details about nrf52833 datasheet on Nordic

website

23| VDH| VDDH| –| High voltage power supply
24| GND| –| –| Ground line, connect to the power reference ground
25| DCH| DCCH| –| DC/DC converter output
26| RST| P0.18/RESET| Common I/O| QSPI/CSN/external reset

27

| VBS| VBUS| –| USB power supply, 5W input, used to USB3.3V

voltage regulator

28

| P15| P0.15| Common I/O| See details about nrf52833 datasheet on Nordic

website

29| D-| D-| –| USB D-
30| P17| P0.17| Common I/O| See details about nrf52833 datasheet on Nordic
| | | | website
---|---|---|---|---
31| D+| D+| –| USB D+

32

| P0.20| P0.20| Common I/O| See details about nrf52833 datasheet on Nordic

website

33

| P0.13| P0.13| Common I/O| See details about nrf52833 datasheet on Nordic

website

34| P0.22| P0.22| Common I/O| QSPI
35| P0.24| P0.24| Common I/O| –

36

| P1.00| P1.00| Common I/O| See details about nrf52833 datasheet on Nordic

website

37| SWD| SWDIO| –| Serial debug programming port clock

38

| P1.02| P1.02| Common I/O| See details about nrf52833 datasheet on Nordic

website

39| SWC| SWDCLK| –| Serial debug programming port clock
40| P1.04| P1.04| Common I/O| Low frequency I/O, standard drive
41| NF1| P0.09/NFC1| Common I/O| NFC input
42| P1.06| P1.06| Common I/O| Low frequency I/O, standard drive
43| NF2| P0.10/NFC2| Common I/O| NFC input

Development and Application

No.	Item	Notes

1

| ****

Burn Firmware

| 1.The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader.Any other serial port or JTAG、ISP、 ICP are unavailable to download.

2.The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to burn the protocol stack, and then use nRFgo studio to bum the hex of the application code; you can also use the official burning tool nRF go studio to burn the protocol stack, and then download it with IAR or KEIL.

Website of tool download:

[http://www.nordicsemi.com/eng/Products/Bluetooth-low- energy/nRF52832/(language)/eng-GB( 网址是不是不](http://www.nordicsemi.com/eng/Products/Bluetooth-low- energy/nRF52832/(language)/eng- GB(%E7%BD%91%E5%9D%80%E6%98%AF%E4%B8%8D%E6%98%AF%E4%B8%8D) 对 )

2

| Testing

Board

| ****

Testing board is not available at present.

Basic operation

Hardware design and circuit schematic diagram

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring, and other parts with large electromagnetic interference;
Bottom Layer；
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well-grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz, for example USB3.0;
The mounting structure of the antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.

FAQ

The communication range is too short

The communication distance will be affected when obstacle exists;
Data loss rate will be affected by temperature, humidity, and co-channel interference;
The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground;
Seawater has a great ability in absorbing wireless radio waves, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near a metal object or put in a metal case;
The power register was set incorrectly, the air data rate is set as too high (the higher the air data rate, the shorter the distance);
The power supply low voltage under room temperature is lower than the recommended value, the lower the voltage, the lower the transmitting power;
Due to antenna quality or poor matching between antenna and module.

The module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to permanent damage to the module.
Please check the stability of the power source, the voltage cannot fluctuate too much;
Please make sure antistatic measures are taken when installing and using, high-frequency devices that have electrostatic susceptibility;
Please ensure the humidity is within a limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperatures.

BER(Bit Error Rate) is high

There is co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line should not be too long;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.

Production guidance

Reflow soldering temperature

Profile Feature| Curve characteristics| Sn-Pb Assembly| Pb- Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）| Min preheating temp.| 100℃| 150℃
Preheat temperature max (Tsmax)| Mx preheating temp.| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average ramp-up rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temp.| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time below liquid phase line| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temp.| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average ramp-down rate| 6℃/second max| 6℃/second max
Time 25℃ to peak temperature| Time to peak temperature for 25℃| 6 minutes max| 8 minutes max

Reflow soldering curve

E73 series

Model No.

| ****

IC

| Frequency

Hz

| Tx power

dBm

| Protocol

BLE

| Size

mm

| ****

Package

| ****

Antenna

---|---|---|---|---|---|---|---
E73-2G4M04S1A| nRF52810| 2.4G| 4| 4.2/5.0| 17.528.7| SMD| PCB/IPEX
E73-2G4M04S1B| nRF52832| 2.4G| 4| 4.2/5.0| 17.528.7| SMD| PCB/IPEX

E73-2G4M08S1C

| nRF52840| ****

2.4G

| ****

8

| ****

4.2/5.0

| ****

13*18

| ****

SMD

| Ceramic

antenna

E73-2G4M04S1D| nRF51822| 2.4G| 4| 4.2| 17.528.7| SMD| PCB/IPEX
E73-2G4M04S1AX| nRF52810| 2.4G| 4| 4.2/5.0| 17.523.5| SMD| IPEX
E73-2G4M04S1BX| nRF52832| 2.4G| 4| 4.2/5.0| 17.5*23.5| SMD| IPEX

Bulk packing

EBYTE E73-2G4M08S1EX BLE Module 6

Revision history

Version	Date	Description	Issued by
1.0	2021-7-16	Initial version	Linson

About us

Sales hotline：0086-4000-330-990 Tel：0086-28-61399028
Technical support：support@cdebyte.com Website：www.ebyte.com/en
Address： Building B5, Mould Industrial Park, 199# Xi-Qu Ave, West High-tech Zone, Chengdu, 611731, Sichuan, China