ROHM RB-D62Q2524GD40 Semiconductor User Manual

ROHM RB-D62Q2524GD40 Semiconductor

Dear customer
ROHM Co., Ltd. (“ROHM”), on the 1st day of April, 2024, has absorbed into merger with 100%-owned subsidiary of LAPIS Technology Co., Ltd.

Therefore, all references to “LAPIS Technology Co., Ltd.”, “LAPIS Technology” and/or “LAPIS” in this document shall be replaced with “ROHM Co., Ltd.”
Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.
Thank you for your understanding.

Notes

1. The information contained herein is subject to change without notice.

2. When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS Technology disclaims any and all liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury, fire or the other damage from break down or malfunction of LAPIS Technology Products, please take safety at your own risk measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures.
   You are responsible for evaluating the safety of the final products or systems manufactured by you.

3. Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. And the peripheral conditions must be taken into account when designing circuits for mass production. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related information.

4. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party with respect to LAPIS Technology Products or the information contained in this document (including but not limited to, the Product data, drawings, charts, programs, algorithms, and application examples、etc.). Therefore LAPIS
   Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.

5. The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems, gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and must obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems, etc. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.

6. The Products specified in this document are not designed to be radiation tolerant.

7. LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.

8. Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive.
   LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.

9. When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export
   Administration Regulations and the Foreign Exchange and Foreign Trade Act..

10. Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology’s Products.

11. This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.
    ( Note ) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.

Preface
This manual describes about the ML62Q2524 Reference Board: RB-D62Q2524GD40.
Refer to following documents when necessary.

• ML62Q2500 Group User’s Manual
  Provides the detailed information about the microcontroller ML62Q2500 Group.

• EASE1000 V2 User’s Manual
  Provides the information on how to use the On-chip emulator EASE1000 V2.

Overview

Features

The RB-D62Q2524GD40 can be used for learning ‘how to use’ the ML62Q2524, on which the user needs to provide additional external components if necessary. By using the RB-D62Q2524GD40 together with the LAPIS Technology’s on-chip emulator EASE1000 V2 and the provided software development environment, the user can develop software, debug and program the Flash. Also, by connecting an external power supply to RB-D62Q2524GD40, it can be used independently without connecting a EASE1000 V2.
Before using RB-D62Q2524GD40, be sure to understand and keep in mind the following information.

• The board is provided with ML62Q2524 40pin WQFN.
• Mounted with the linked connector to EASE1000 V2.
• Through-holes for connecting the pins of LSI to external pheripheral boards.
• Power supply is selectable; supplied from the on-chip emulator EASE1000 V2 or CN1_3pin.
• Mounted with Crystal (32.768KHz)
• Mounted with LED (P20,P21,P22).
• Foot pattern with components for Successive Approximation Type A/D Converter is available (P30,P31,P32,P33).

Hardware specifications

Table 1 shows the hardware specifications of RB-D62Q2524GD40.
Table 1 Hardware specifications

Other

Mounted components

| PWR: Jumper for selecting the power supply input (3pin pin-header and short pin)
J1: Jumper for selecting TEST1_N pin (3pin pin-header and short pin)
J2: Jumper for selecting P00/TEST0 pin (3pin pin-header and short pin)
P20-P22: LEDs
R1-R3: Resistors for LEDs by P20 to P22
J3-J5: Jumper Chip for connecting LEDs
X1, C3, C4: Crystal Oscillator (32.768kHz) and capacitors
CNE: Connector for EASE1000 V2(14pin connector)
C1, C3: Capacitors for VDD and VDDL
R4: Pull-up resistor for RESET_N

Pads (or/and) Through holes for mounting components

| CN1-CN2: Connectors for user application system  (24pin, 2.54mm pitch, φ0.9mm )
C2: Capacitors for VDD
C6-C10, J8: Capacitors and jumper chip for Successive Approximation Type A/D

Converter

J6-J7: CN1 connection jumper chip
Power check pin| VDD, VSS, UVDD: φ0.8mm
Operating voltage| +1.8V to +5.5V
Board size| 55.88 mm x 93.98 mm

For more information about the connection of the mounted components, see the schematic.

Outline Diagram
Fig. 1 shows the RB-D62Q2524GD40.

Function

Power Circuit
The input toVDD can be selected from 3.3VOUT of EASE1000 V2 or CN1_3pin by PWR jumper.

Note The power supply ON/OFF procedure in case of setting PWR jumper to the USR-side when using EASE1000 V2.

The procedure of power supply ON

1. The USB cable of EASE1000 V2 is connected.
2. The power supply of user’s target system is turned on.

The procedure of power supply OFF

1. The power supply of user’s target system is turned off
2. The USB cable of EASE1000 V2 is removed

Connection for EASE1000 V2 (CNE)
EASE1000 V2 can be used if J1 and J2 jumper are set to “CNE”.

[Note]
P00/TEST0 pin:
P00/TEST0 pin of ML62Q2524 is initially set as a pull-up input mode
When using EASE1000 V2, do not set it as an output mode by using an application program, otherwise EASE1000 V2 cannot communicate with the ML62Q2524.

LED (P20, P21, P22)
The P20-P22 pins are ports that can directly drive LED. The Ports are connected to the LEDs through jumper-chip. Remove the jumper-chip when not using the LEDs.

XT0/PIO0，XT1/PIO1
RB-D62Q2524GD40 can be mounted with cylinder type or SMD type crystal oscillator.

P30, P31, P32, P33
When the P30 pin is used as VREF function of the successive approximation type A/D converter, C6, C7 can implement a bypass capacitor. In addition, VDD can be connected by mounting the J8 jumper chip.
When P31, P32, P33 pin is used as AIN8, AIN9, AIN10 function of the successive approximation type A/D converter, the C8 and C9, C10 can implement a by-pass capacitor.

Fig. 6 shows the connection diagram.

User Interface

CN1, CN2
Table 2 shows the pin list of the RB-D62Q2524GD40 user interface connection CN1 and CN2.
Table 2 CN1, CN2

CN1

Pin No.

| Connection destination| CN2

Pin No.

| Connection destination
---|---|---|---
Device| Pin No.| Name| Device| Pin No.| Name
1| J6| 1| XT0| 1| ML62Q2524| 25| P17
2| J7| 1| XT1| 2| ML62Q2524| 26| P20
3| PWR| USR| VDD| 3| ML62Q2524| 27| P21
4| –| –| VSS| 4| ML62Q2524| 28| P22
5| –| –| N.C.| 5| ML62Q2524| 29| P23
6| ML62Q2524| 6| RESET_N| 6| ML62Q2524| 30| P24
7| –| –| N.C.| 7| ML62Q2524| 31| P25
8| J2| USR| P00/TEST0| 8| ML62Q2524| 32| P26
9| ML62Q2524| 9| P02| 9| ML62Q2524| 33| P27
10| ML62Q2524| 10| P03| 10| –| –| N.C.
11| –| –| N.C.| 11| –| –| N.C.
12| –| –| N.C.| 12| –| –| N.C.
13| ML62Q2524| 13| P54| 13| ML62Q2524| 37| P30
14| ML62Q2524| 14| P55| 14| ML62Q2524| 38| P31
15| –| –| N.C.| 15| ML62Q2524| 39| P32
16| –| –| N.C.| 16| ML62Q2524| 40| P33
17| ML62Q2524| 17| P04| 17| ML62Q2524| 41| P34
18| ML62Q2524| 18| P05| 18| ML62Q2524| 42| P35
19| ML62Q2524| 19| P06| 19| ML62Q2524| 43| P36
20| ML62Q2524| 20| P07| 20| –| –| N.C.
21| ML62Q2524| 21| P10| 21| ML62Q2524| 45| P70
22| ML62Q2524| 22| P11| 22| ML62Q2524| 46| P71
23| ML62Q2524| 23| P12| 23| ML62Q2524| 47| P72
24| ML62Q2524| 24| P13| 24| ML62Q2524| 48| P73

N.C.  Not Connected

CNE
Table 3 shows the pin list of the RB-D62Q2524GD40 user interface connection CNE.
Table 3 CNE

Pin Name

1| VTref| –| –| VDD
2| GND| –| –| VSS
3| VPP| –| –| N.C.
4| GND| –| –| VSS
5| RST_OUT/SCK| J1| CNE| TEST1_N
6| GND| –| –| VSS
7| SDATA| J2| CNE-| P00/TEST0
8| GND| –| –| VSS
9| VDDL| –| –| N.C.
10| GND| –| –| VSS
11| N.C.| –| –| N.C.
12| GND| –| –| VSS
13| 3.3VOUT| PWR| CNE| VDD
14| N.C.| –| –| N.C.

N.C.  Not Connected

Precaution for usage

1. The RB-D62Q2524GD40 is an unfinished product and intended for research and development and for expert use in the research and development facility only. The RB-D62Q2524GD40 is not intended to be used for volume production or parts thereof.
2. Since the content specified herein is subject to change for improvement without notice, confirm the latest content when using the board.
3. See the other documents, the ML62Q2500 group user’s manual and EASE1000 V2 user’s manual when using the RB-D62Q2524GD40.
4. Confirm the final electrical characteristics by using the mass production parts on your mass production boards.
5. LAPIS supports replacing the board for an initial failure soon after the shipment. However LAPIS doesn’t support reparing the board.
6. RB-D62Q2524GD40 have signal patterns on the underside, it might work abnormally if using on conductive materials. Use it on insulating materials or having any preventable parts.

PCB specification, BOM list and Schematic

PCB specification
Fig. 7 shows the PCB dimensional outline diagram and layout of components.

PCB part number: RB-D62Q2524GD40
Dimension: 55.88mm x 93.98mm

BOM list
Table 4 BOM list

1.0μF/25V X7R

| 2| TDK Corporation
3| –| C2, C6, C7, C8, C9, C10| Unmounted| 6| –
4| GRM1885C1H220JA01| C4, C5| Ceramic                Capacitor

22pF/50V C0G

| 2| Murata Manufacturing

Co., Ltd.

5| A1-24PA-2.54DSA(71)| CN1, CN2| Unmounted| 2| Hirose Electric Co., Ltd.
6| HIF3FC-14PA-2.54DSA(71)| CNE| 14pin Header Connector| 1| Hirose Electric Co., Ltd.
7| –| CNEM| Unmounted| 1| –
8| A2-3PA-2.54DSA| J1, J2, PWR| 3pin Header Connector| 3| Hirose Electric Co., Ltd.
9| MCR03ERTJ000| J3, J4, J5| Resistor 0Ω| 3| Rohm Co., Ltd.
10| –| J6, J7, J8| Unmounted| 3| –
11| SML-H12P8T| P20, P21, P22| LED Green| 3| Rohm Co., Ltd.
12| MCR03EZPJ271| R1, R2, R3| Resistor 270Ω ±5%| 3| Rohm Co., Ltd.
13| MCR03EZPJ103| R4| Resistor 10kΩ ±5%| 1| Rohm Co., Ltd.
14| ML62Q2524-NNNGD| U1| 16-bit Microcontroller| 1| LAPIS Technology Co., Ltd.
15| –| UVDD, VDD, VSS| Unmounted| 3| –
16| –| VSSPAD| Unmounted| 1| –
17| VT-200-F 12.5pF| XT1| X’tal 32.768kHz 12.5pF| 1| Seiko Instruments Inc.
18| HIF3GA-2.54SP| –| Short pin| 3| Hirose Electric Co., Ltd.

Note

• The diameter of through hole of CN1 and CN2 is 0.9 mm.
  Using CN1 and CN2, the diameter of connector pin should use the connector below 0.9mm, such as 0.5mm.

• The parts may be changed into another parts with equivalent part special quality.

Schematic
The next page shows the schematic of RB-D62Q2524GD40.

Revision History

2022

| –| –| First edition.

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