EBYTE E73-2G4M08S1CX Bluetooth LE Module User Manual

EBYTE E73-2G4M08S1CX Bluetooth LE Module User Manual

E73-2G4M08S1CX

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Features

• 13 x 18mm, small size;
• Support BLE4.2 and BLE5.0;
• Maximum transmission power of 6mW, software multi-level adjustable;
• Support the global license- free ISM 2.4GHz band;
• Built-in high performance low power ARM⑧and Cortex⑧-M4 dual core processor;
• Rich resources, 1024KB FLASH, 256KB RAM;
• Support 1.7V~5.5V power supply, power supply over 3. 3Vcan guarantee the best performance;
• Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
• With IPEX antenna interface, an external antenna is required;
• Under ideal conditions, the communication distance can reach 120m.

1. Introduction

1.1 Brief Introduction

E73-2G4M08S1CX are wireless Bluetooth modules designed by
Chengdu Ebyte which feature small size, low power consumption. It adopt the originally imported RFIC nRF52840 of NORDIC, supporting BLE 4.2 and BLE 5.0. The chip has high-performance ARM CORTEX-M4F kemel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA, PWM etc. The module led out most IO Port of nRF 52840 for multilateral development. Please see the pin definition for details.

E73-2G4M08S1CX is hardware platform without firmware, so users need to conduct a secondary development.The characteristics of the nRF52840 chip can be found in the official Datasheet. The module has maximized the RF characteristics of the chip.

1.2 Application

• Smart homes and industrial sensors;
• Security system, positioning system;
• Wireless remote control, drone;
• Wireless game remote control;
• Health care products;
• Wireless voice, wireless headset;
• Automotive industry applications.

2. Specification and parameter

2.1 Limit parameter

2.2 Operating parameter

3. Size and pin definition

4. Development and Application

5. Basic operation

5.1 Hardware design and circuit schematic diagram

• It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded;

• Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module;

• Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;

• Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

• When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;

• The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference;

• Bottom Layer；

• Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;

• Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;

• Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
  can be done;

• If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);

• Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

• The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;

• The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.

6. FAQ

6.1 Communication range is too short

• The communication distance will be affected when obstacle exists;
• Data lose rate will be affected by temperature, humidity and co-channel interference;
• The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
• Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
• The signal will be affected when the antenna is near metal object or put in a metal case;
• Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
• The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the lower the transmitting power;
• Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

• Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
• Please check the stability of power source, the voltage cannot fluctuate too much;
• Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility;
• Please ensure the humidity is within limited range, some parts are sensitive to humidity;
• Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

• There are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
• The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line should not be too long;
• Poor power supply may cause messy code. Make sure that the power supply is reliable;
• The extension line and feeder quality are poor or too long, so the bit error rate is high.

7. Production guidance

7.1 Reflow soldering temperature

7.2 Reflow soldering curve

8. E73 series

9. Bulk packing

Revision history

About us

Technical support: support@cdebyte.com
Documents and RF Setting download link: www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: info@cdebyte.com
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Phone: +86 028-61399028
Web: www.ebyte.com
Address: B5 Mould Park, 199# Xiqu Ave, High-tech District, Sichuan, China

Chengdu Ebyte Electronic Technology Co.,Ltd.

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References

• 串口服务器_数传电台_4G DTU_遥控开关_LoRa/ZigBee/WiFi/蓝牙模块-成都亿佰特电子科技有限公司官网
• nRF52832 - Versatile Bluetooth 5.2 SoC - nordicsemi.com

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