Shenzhen HET-BA1611 Bluetooth Module User Manual
- June 5, 2024
- Shenzhen
Table of Contents
- Shenzhen HET-BA1611 Bluetooth Module
- Brief Introduction
- Product Features
- Interface Definition
- Electrical Parameters
- Antenna
- Product Structure Size
- HET UART pass through Firmware functions Operating Instructions
- Furnace temperature of re-reflow
- Module Package Information
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Shenzhen HET-BA1611 Bluetooth Module
Brief Introduction
HET-BA1611 Bluetooth low energy module, using BA1611 as the core processor. This module follows Bluetooth 5.0 protocol, Runs in 2.4 GHz ISM band, GFSK modulation(Gaussian Frequency Shift Keying), 40 channel 2 MHz channel gap, three fixed radio channel, 37 automatic adaptive frequency hopping data channel, 2 MHz gap better prevent adjacent channel interference. The internal PA can deliver a maximum of 9.5dBm, Receiving sensitivity is typically -90dBm. This module is designed to quickly connect electronic products and smart mobile devices, there is a demand can be widely used in various electronic devices, such as instrumentation, logistics tracking, healthcare, smart home, motion measurement, automotive electronics, toys and other leisure. Users can use this module, the shortest development cycle to integrate existing programs or products to the fastest speed to market
Product Features
- Power supply: 3.3V
- Power Dissipation
- Transmit Mode 28mA (9.5dBm Transmit Power Setting)
- Receive Mode 12mA (-90dBm Sensitivity)
- Sleeping Mode 4uA
- Peripherals:
- 15 x GPIOs
- 9 x AIOs
- 2 x UARTs
- 12bit ADC
- 1 x I2C
- 8 x PWM modules
- Debug UART
- Emission Power 9dBm(Max.)
- Receiver Sensitivity -90dBm
- Working Frequency 2400～2483.5MHz
- Working Environment Temperature -20～85℃
Interface Definition
Pin Assignments
Pin Description
| PIN No. | PIN NAME | PIN TYPE | DESCRIPTION |
|---|---|---|---|
| 1 | ANT2 | External antenna | Antenna port for Bluetooth(reserved) |
| 2 | GND | Ground | Connect to GND |
| 3 | GPIO4 | GPIO | General digital programmable I/O |
| 4 | GPIO0 | GPIO | General digital programmable I/O |
| 5 | GPIO2 | GPIO | General digital programmable I/O |
| 6 | GPIO3 | GPIO | General digital programmable I/O |
| 7 | OD_GPIO0 | GPIO | General digital programmable I/O, open drain |
| 8 | OD_GPIO1 | GPIO | General digital programmable I/O, open drain |
| 9 | OD_GPIO2 | GPIO | General digital programmable I/O, open drain |
| 10 | GND | Ground | Connect to GND |
| 11 | 3V3 | VCC | Power supply for module |
| --- | --- | --- | --- |
| 12 | UART_ TX2 | UART_TXD | UART_TXD for user |
| 13 | UART_ RX2 | UART_RXD | UART_RXD for user |
| 14 | UART_TX1 | UART_RX | Debug /download UART |
| 15 | GPIO9 | GPIO | General digital programmable I/O |
| 16 | UART_RX1 | UART_TX | Debug /download UART |
| 17 | GND | Ground | Connect to GND |
| 18 | 3V3 | VCC | Power supply for module |
| 19 | GPIO10 | GPIO | General digital programmable I/O |
| 20 | GPIO11 | GPIO | General digital programmable I/O |
| 21 | GPIO12 | GPIO | General digital programmable I/O |
| 22 | GPIO13 | GPIO | General digital programmable I/O |
| 23 | GPIO14 | GPIO | General digital programmable I/O |
| 24 | REGEN | INPUT | POWER CONTROL |
| 25 | GND | Ground | Connect to GND |
| 26 | GPIO15 | GPIO | General digital programmable I/O |
| 27 | GPIO20 | GPIO | General digital programmable I/O |
| 28 | GPIO21 | GPIO | General digital programmable I/O |
| 29 | RST | RESET | RESET INPUT |
Electrical Parameters
Maximum Rating Parameter
Pressure beyond the “maximum evaluation value” data will cause permanent damage to the device unrecoverable. The following assessment is limited to the pressure, to go beyond the operations specifications paragraph indicated functional operation will not apply to the following data. Under absolute maximum evaluation value status will have an impact on long‐term use of equipment performance reliability.
| Item | Min | Type | Max | Unit |
|---|---|---|---|---|
| Storage temperature | -40 | – | 150 | ℃ |
| I/O supply voltage(VCCIO) | -0.3 | – | 3.6 | V |
| Analog/RF supply voltage | -0.3 | – | 32.0 | V |
| RF input Level | 20 | dBm |
Recommended Operation Conditions.
| Item | Min | Type | Max | Unit |
|---|---|---|---|---|
| Operating temperature range | -20 | 25 | 85 | ℃ |
| Power supply | 2.0 | 3.0 | 3.6 | V |
| I/O supply voltage (VCCIO | 1.8 | 3.0 | 3.6 | V |
Typical current consumption
| Parameter | Current(avg. 3V input) | Units |
|---|---|---|
| Tx current@9.5dBm | 28 | mA |
| Rx current@1Mbps(9.5dBm) | 12 | mA |
| Sleep | 4 | uA |
| Deep-sleep | 0.6 | uA |
Antenna
PCB IFA antenna is implemented for this Bluetooth module, when place this module on the carrier board, please make sure there are enough clearance between the antenna trace and the other PCB copper or components.
Product Structure Size
HET UART pass through Firmware functions Operating Instructions
Transparent Mode and Command Mode
Module can operate in transparent mode and command mode. After the module
automatically broadcasts started, open a specific APP phone will be scanned
and docking, after a successful agreement can be monitored by BLE.
Pass through mode: In this mode, users do not concern complex Bluetooth
protocol application, you can complete the development of products in a short
time BLE. MCU specific meaning users can be two‐way communication, user data
through a common serial and mobile equipment module is defined by the upper
application on their own. Mobile devices can be APP module write operation,
the written data will be sent to the user’s CPU via the serial port. After the
module receives data packets from the user CPU serial port, it will be
automatically forwarded to the mobile device. The development of this mode,
the user must be responsible for the main MCU code design, and intelligent
mobile device side APP code design.
Command Mode： In this mode, the user can through specific serial AT
commands, for some communication parameters module management control. For
detail please refer “H&T BLE Modules Programming Guide”
Switch between two modes
Module in command mode, to ensure IO9 is low, when IO9 is set high, the module works in transparent mode.
Sleep and Wake
MCU before sending serial data to the module must first be pulled down IO3 pin to wake up module. When the user MCU monitors the module PIO21be pulled down, the confirmation module has been successfully woken up, than the data can be sent at this time. MCU during data transmission, IO3 must remain low, after data transmission is completed need to IO3 pin pulled up, it goes to sleep again, and reduce power consumption. Once the module receives data from another end BLE device before will be automatically forwarded to the MCU IO15 pin is pulled low to inform the MCU receive data. During data transmission IO15 pin remains low. After all serial data transmission is completed, IO15 pin will be pulled up.
Furnace temperature of re-reflow
Module Package Information
This module can be packaged with tape or tray after production, since this is
ESD sensitive device, precautions should be used when handling the device in
order to prevent permanent damage. Below is the dimension of the packaging
tape and reel: 
Below is the tape packaging process: 
FCC Warning
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation. Any Changes or
modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.
- This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
- This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment.
- This equipment should be installed and operated with minimum distance 20cm from your body.
Host product manufacturers that they need to provide a physical or e-label stating, “Contains FCC ID:2ANR8-HET-BA1611” with their finished product. Only those antennas with same type and lesser gain filed under this FCC ID can be used with this device. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The final host integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-way authentication between module and the host system. The final host manual shall include the following regulatory statement:This equipment has been tested and found to comply with the limits for a This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.