FEASYCOM FSC-BT631D Bluetooth Module Owner’s Manual

FEASYCOM FSC-BT631D Bluetooth Module

Specifications:

• Bluetooth Chip: nRF5340
• Bluetooth Standard: CSR8811 Bluetooth v5.2 specification (Bluetooth dual-mode)
• Frequency Band: 2.4 GHz
• Transmit Power: Class 1 Bluetooth power level supported
• Receiver: High-sensitivity Bluetooth receiver
• Size: Not specified
• Operating Temperature: Not specified
• Storage Temperature: Not specified
• Supply Voltage: Not specified
• Humidity: Not specified
• Interface: USB, I2C, NFC, I2S, UART
• Lead-Free
• Warranty: Not specified
• ESD grade: Not specified

Product Usage Instructions

Overview:
The FSC-BT631D is a Bluetooth module that supports Bluetooth Low Energy and Bluetooth v5.2 specifications. It is suitable for a wide range of applications including USB Audio Transmitters, Audio Transmitters, LE Audio, True wireless earbuds, Headphones, microphones, speakers, Professional lighting, Industrial use, Advanced wearables, Medical devices, Smart home applications, and Asset tracking.

Hardware Specification:
The FSC-BT631D module comes with various pins for different functionalities such as I/O, power, and ground. Refer to the PIN Diagram for detailed pin descriptions and alternative functions.

PIN Definition Descriptions:

• P0.27 – Programmable I/O
• P0.25 – Programmable I/O
• P0.24 – Programmable I/O
• P0.22 – Programmable I/O
• P0.23 – Programmable I/O
• P1.07 – Programmable I/O
• P1.06 – Programmable I/O
• P0.26 – Programmable I/O
• GND – Power Ground

FAQ:

• Q: What is the operating temperature range of the FSC-BT631D module?
  A: The operating temperature range of the FSC-BT631D module is not specified in the datasheet.

• Q: What are the main applications of the FSC-BT631D module?
  A: The main applications include USB Audio Transmitter, Audio Transmitter, LE Audio, True wireless earbuds, Headphones, microphones, speakers, Professional lighting, Industrial use, Advanced wearables, Medical devices, Smart home applications, and Asset tracking.

INTRODUCTION

Overview

FSC-BT631D is composed of nRF5340 and CSR8811 dual Bluetooth,supporting BLE, mesh, BR,EDR
By default, FSC-BT631D module is equipped with powerful and easy-to-use Feasycom firmware. It’s easy to use and completely encapsulated. Feasycom firmware enables users to access Bluetooth functionality with simple ASCII commands delivered to the module over serial interface – it’s just like a Bluetooth m odem.
Therefore, FSC-BT631D provides an ideal solution for developers who want to integrate Bluetooth wireless technology into their design.

Features

nRF5340

• Bluetooth Low Energy
  • Bluetooth 5.3
  • LE Audio
  • Direction Finding
  • 2 Mbps, Advertising Extensions and Long Range
• Bluetooth mesh
• Full-speed USB
• Secure Key Storage
• Low Complexity Communications Codec (LC3)
• I²S and PDM audio interfaces
• capable of all angle-of-arrival (AoA) and angle-of-departure (AoD) roles in Bluetooth Direction Finding
• Ultra-low-power radio

CSR8811

• Bluetooth v5.2 specification(Bluetooth dual-mode)
• Support for Bluetooth basic rate/EDR and Bluetooth Smart connections
• Full-speed Bluetooth operation with full piconet and scatternet support
• Class 1 Bluetooth power level supported
• High-sensitivity Bluetooth receiver
• Wideband speech
• On-chip SBC encoding
• On-chip balun
• Support for IEEE 802®.11 coexistence

Application

• USB Audio Transmitter
• Audio Transmitter
• LE Audio
• True wireless earbuds
• Headphones, microphones, and speakers
• Professional lighting
• Industrial
• Advanced wearables Medical
• Smart home
• Asset tracking and RTLS

General Specification

HARDWARE SPECIFICATION

PIN Definition Descriptions

Alternative function: I2C_SDA

11| P1.03| I/O| Programmable I/O
| | | Alternative function: I2C_SCL
12| P0.03| I/O| Programmable I/O
| | | Alternative function: NFC2
13| P0.02| I/O| Programmable I/O
| | | Alternative function: NFC1
14| P0.15/I2S_DOUT| I/O| Programmable I/O
| | | Alternative function: I2S_DOUT
15| P0.14/I2S_BCLK| I/O| Programmable I/O
| | | Alternative function: I2S_BCLK
16| P0.13/I2S_DIN| I/O| Programmable I/O
| | | Alternative function: I2S_DIN
17| P0.16/I2S_WS| I/O| Programmable I/O
| | | Alternative function: I2S_WS
18| P1.01| I/O| Programmable I/O
19| VDD| VDD| 3V3
20| GND| Vss| Power Ground
21| P1.00| I/O| Programmable I/O
22| GND| Vss| Power Ground
23| RESET| I| RESET
24| VBUS| I| USB Power(4.75~5.25V)
25| GND| Vss| Power Ground
26| USB_DP| | USB Full Speed device D+
27| USB_DN| | USB Full Speed device D-
28| SWDCLK| I/O| DEBUG
29| SWDIO| I/O| DEBUG
30| P1.11/UART_RTS| I/O| Programmable I/O

Alternative function:UART_RTS

31| P1.09/UART_TX| I/O| Programmable I/O Alternative function:UART_TX
32| P1.08/UART_RX| I/O| Programmable I/O Alternative function:UART_RX
33| P1.10/UART_CTS| I/O| Programmable I/O

Alternative function:UART_CTS

| | |
---|---|---|---
34| GND| Vss| Power Ground
35| ANT| RF| Bluetooth transmit/receive.
36| GND| Vss| Power Ground

PHYSICAL INTERFACE

UART Interface

FSC-BT631D UART interface is a standard 4-wire interface with RX, TX, CTS, and RTS. Supports H4 HCI interface or raw UART to application. The default baud rate is 115.2 kbaud. In order to support high and low speed baud rate, FSC- BT631D provides multiple UART clocks.
The UART signal level ranges from 1.8V to 3.3V. The host provides the power source with the targeted power level to the UART interface via the VIO_HOST pin .

MSL & ESD

ESD – Human-body model (HBM) rating, JESD22-A114-F (Total samples from one wafer lot)|

Pass ±2000 V, all pins

ESD – Charge-device model (CDM) rating, JESD22-C101-D (Total samples from one wafer lot)|

Pass ±400 V, all pins

RECOMMENDED TEMPERATURE REFLOW PROFILE

• Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, please check the below and follow the instructions specified by IPC/JEDEC J-STD-033.
  Note : The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in below , the modules must be removed from the shipping tray.

• Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment of 30°C/60%RH.

Notice:
Feasycom module must use a Step-Stencil, suggestion using the stencil thickness about 0.16- 0.2mm,it could be modify with the product.

MSL

| 125°C Baking Temp.| 90°C/≤ 5%RH Baking Temp.| 40°C/ ≤ 5%RH Baking Temp.
---|---|---|---

Saturated     @ 30°C/85%

| Floor Life Limit

+ 72 hours @ 30°C/60%

|

Saturated     @ 30°C/85%

| Floor Life Limit

+ 72 hours @ 30°C/60%

|

Saturated     @ 30°C/85%

| Floor Life Limit

+ 72 hours @ 30°C/60%

3| 9 hours| 7 hours| 33 hours| 23 hours| 13 days| 9 days

• Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to J-STD-020D1 standards for reflow temperatures.

The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow .

• Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.
• Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone.
• Equilibrium Zone 2 (C) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 for about 20 to 30 second.
• Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead- free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C.
• Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint. Typical cooling rate should be 4 C.

MECHANICAL DETAILS

Mechanical Details

• Dimension: 12mm(W) x 15mm(L) x 2.2mm(H) Tolerance: ±0.2mm
• Module size: 12mm X 15mm Tolerance: ±0.2mm
• Pad size: 1.7mmX0.5mm Tolerance: ±0.2mm
• Pad pitch: 0.9mm Tolerance: ±0.1mm
• (Residual plate edge error: < 0.5mm)

HARDWARE INTEGRATION SUGGESTIONS

Soldering Recommendations

FSC-BT631D is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide.

Layout Guidelines(Internal Antenna)

It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges.
The mother board should have no bare conductors or vias in this restricted area, because it is not covered by stop mask print. Also no copper (planes, traces or vias) are allowed in this area, because of mismatching the on-board antenna.

• Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines.
• Following list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising from digital signals in the design.
• Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a via, always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next to the signal line).

Layout Guidelines(External Antenna)

• Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss.
• As indicated in below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB

Antenna Connection and Grounding Plane Design

General design recommendations are:

• The length of the trace or connection line should be kept as short as possible.
• Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness.
• Routing the RF close to digital sections of the system board should be avoided.
• To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided.

Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing.

• Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances.
  Therefore, the impedance of this part of the trace cannot be controlled.

• Use as many vias as possible to connect the ground planes

PRODUCT PACKAGING INFORMATION

Default Packing

Packing box(Optional)

• If other packing is required, please confirm with the customer
• Packing: 1000pcs per carton (Minimum packing quantity)
• The outer packing size is for reference only, please refer to the actual size

FCC

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01

List of applicable FCC rules
FCC Part 15.247

Specific operational use conditions
This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer’s instruction manual.

Limited module procedures
Not applicable

Trace antenna designs
It is “not applicable” as trace antenna which is not used on the module.

RF exposure considerations
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
The host product manufacturer would provide the above information to end users in their end-product manuals.

Antennas
Ceramic antenna; 3.61dBi; 2.402 GHz～2.480GHz
Metal antenna; -8.35dBi; 2.402 GHz～2.480GHz

Label and compliance information
The end product must carry a physical label or shall use e-labeling followed by KDB784748D01 and KDB 784748 stating “Contains Transmitter Module FCC ID: 2AMWOFSC-BT631D”.

Information on test modes and additional testing requirements
For more information on testing, please contact the manufacturer.

Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity

FCC Statements

(OEM) The integrator has to ensure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating.
Furthermore, the module should be transmitting and the evaluation should confirm that the module’s intentional emissions (15C) are compliant (fundamental/out-of-band). Finally, the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101.
The integrator is reminded to ensure that these installation instructions will not be made available to the end-user of the final host device.
The final host device, into which this RF Module is integrated” has to be labelled with an auxiliary label stating the FCC ID of the RF Module, such as “Contains FCC ID: 2AMWOFSC-BT631D
“This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

1. this device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause undesired operation.”

“Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.”
The Integrator will be responsible for satisfying SAR/ RF Exposure requirements when the module is integrated into the host device.

Module statement

The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below.

1. The radio elements have the radio frequency circuitry shielded.
2. The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
3. The module contains power supply regulations on the module.
4. The module contains a permanently attached antenna.
5. The module demonstrates compliance in a stand-alone configuration.
6. The module is labelled with its permanently affixed FCC ID label.
7. The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
8. The module complies with RF exposure requirements.

NOTE : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used by the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

www.feasycom.com

References

• Feasycom | Simplifying and Empowering IoT Connectivity with Bluetooth, Wi-Fi, UWB, 4G, and RFID
• Feasycom | Simplifying and Empowering IoT Connectivity with Bluetooth, Wi-Fi, UWB, 4G, and RFID

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