FEASYCOM FSC-BW236 Bluetooth and Wi-Fi Combo Module User Manual

FSC-BW236 Datasheet
Bluetooth and Wi-Fi combo module Version 1.5
Shenzhen Feasycom Technology Co., Ltd

FSC-BW236 Datasheet
Copyright © 2013-2020 Feasycom Technology. All Rights Reserved.
Feasycom Technology reserves the right to make corrections, modifications, and other changes to its products, documentation, and services at any time. Customers should obtain the newest relevant information before placing orders. To minimize customer product risks, customers should provide adequate design and operating safeguards. Without written permission from Feasycom Technology, reproduction, transfer, distribution, or storage of part or all of the contents in this document in any form is prohibited.
Contact Us
Shenzhen Feasycom Technology Co., LTD
Email: [email protected]
Address: Room 2004,20th Floor, Huichao Technology Building, Jinhai Road,
Xixiang, Baoan District, Shenzhen,518100, China.
Tel: 86-755-27924639, 86-755-

INTRODUCTION

Overview
FSC-BW236 is a highly integrated single-chip low-power dual bands (2.4GHz and 5GHz) Wireless LAN (WLAN) and Bluetooth Low Energy (v5.0) communication controller. It consists of a high-performance MCU (ARM v8m, Cortex-M4F instruction compatible) named KM4, a low power MCU (v8m, Cortex-M0 instruction compatible) named KM0, WLAN (802.11a/ac/b/g/n) MAC, a 1T1R capable WLAN baseband, RF, Bluetooth, and peripherals.
FSC-BW236 is an appropriate product for designers who want to add wireless capability to their products. Support for external antennas and increase wireless coverage.

Features

• COMS MAC, Baseband PHY, and RF in a single-Chip for 802.11 a/b/g/n compatible WLAN
• Support BLE 5.0
• UART programming and data interface (baud rate can up to 6000000bps)
• I2C/AIO/PIO/PWM control interfaces
• Postage stamp-sized form factor
• WiFi Maximum data rate 54Mbps in 802.11g , 150Mbps in 802.11a/ac
• WiFi: Light Weight TCP/IP protocol
• Support External Antenna-Postage stamp or Ipex
• RoHS compliant
• Support external flash chip with larger capacity (built-in Flash needs to be removed)

Application

• Wireless POS
• Measurement and monitoring systems
• Industrial sensors and controls
• Asset Tracking
• Wireless printer

Module picture as below showing

HARDWARE SPECIFICATION

2.1 Block Diagram and PIN Diagram

2.2 PIN Definition Descriptions
Table 2: Pin definition

Pin

| Pin Name| Type| Pin Descriptions|

Notes

---|---|---|---|---
1| UART TX| 0| UART Data output| Note 1
2| UART RX| I| UART Data input| Note 1
3| UART CTS/P104| I/O| UART Clear to Send (active low)Alternative Function 1: Programmable input/output line| Note 1
4| UART RTS/P108| I/O| UART Request to Send (active low)Alternative Function 1: Programmable input/output line| Note 1
5| SPI CLK| SPI CLK Alternative Function 1: Programmable input/output line
6| SPI CS/USB RREF| SPI CS Alternative Function 1: Programmable input/output line Alternative Function 2: USB PREF
( External reference resistor for USB analog, pull down to the ground through the resistor — 12K0 1%)
7| SPI MISO/USB DP| SPI MISO
Alternative Function 1: Programmable input/output line Alternative Function 2: USB_DP
8| SPI MOSI/USB DN| | SPI MOSI Alternative Function 1: Programmable Alternative Function 2:USB_DN input/output line
---|---|---|---
9| UART LOG_OUT| 0| Debug Interface (Data OUT)
10| CART LOG_IN| I| Debug Interface (Data IN)
11| RESET/CHIP_EN| I| External reset input: Active Set this pin low reset the (With Internal pull-up 100K LOW, module. resistor.)
12| VDD 3V3| Vdd| Power supply voltage 3.3V
13| GND| Vss| Power Ground
14| NC| | NC
15| P103/SWD10| I/O| Debugging through the data Alternative Function 1: Programmable line(Default) input/output line
16| PIO2/SWCLK| I/O| Debugging through the CLK Alternative Function: Programmable line(Default) input/output line
17| SPI_CLK| I/O| SPI_CLK(Communication interface with external SPI Flash chip)
18| SPI_DATAO| I/O| SPI_DATAO(Communication interface with external SPI Flash chip)
19| SPI_DATA1| I/O| SPI_DATA1 (Communication interface with external SPI Flash chip)
20| SPI_CS| I/O| SPI_CS(Communication interface with external SPI Flash chip)
21| GND| Vss| Power Ground
22| GND| Vss| Power Ground
23| NC| | NC
24| NC| | NC
25| PIO2/SWCLK| I/O| Debugging through the CLK Alternative Function: Programmable line(Default) input/output line
26| P103/STUDIO| I/O| Debugging through the data Alternative Function 1:Programmable line(Default) input/output line

27| UART CTS/P104| I/O| UART Clear to Send (active Alternative Function 1:Programmable low) input/output line| Note 1
28| NC| | NC|
29| P106/12C_SCL| I/O| Programmable input/output line| Note 2
30| PI07/12C_SDA| I/O| Programmable input/output line| Note2
31| UART RTS/P108| I/O| UART Request to Send (active Alternative Function: Programmable low) input/output line| Note 1
32| P109| I/O| BT LED(Default) /Status or Programmable input/output line| Note 3
33| PI010| I/O| WIFI LED (Default) / Status or Programmable input/output line| Note4
34| NC| | NC|
35| GND| Vss| RF Ground|
36| EXT ANT| 0| RF signal output| NoteS

Module Pin Notes:

resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module.
Note 3| BT LED(Default) /Status – LED Power On Light Slow Shinning; Connected: Steady Lighting. Status Disconnected: Low Level; Connected: High Level
Note 4| WIFI LED(Default) /Status — LED Power On: Light Slow Shinning ; Connected: Steady Lighting.
Status Disconnected: Low Level; Connected: High Level.
Note 5| By default, this PIN is an empty foot. This PIN can connect to an external antenna to improve the
Bluetooth/WIFI signal coverage. If you need to use an external antenna, by modifying the module on the 0R resistance to block out the onboard antenna; Or contact Feasycom for modification.

PHYSICAL INTERFACE

3.1 Power Supply
The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be the 20s or less. It is essential that the power rail recovers quickly.
3.2 Reset
The module may be reset from several sources: Power-on Reset (POR), Low level on the reset Pin (nRST), Watchdog time-out reset (WDT), Low voltage reset (LVR) or Software Reset(SYSRESETREQ, CPU Reset, CHIPRST). The RESET pin is an active-low reset and is internally filtered using the internal low-frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESET being active. It is recommended that RESET be applied for a period greater than 5ms. At reset the digital I/O pins are set to inputs for bi- directional pins and outputs are tri-state. The PIOs have weak pull-ups.
3.3 General Purpose Digital IO

• GPO and GPI function
• Support interrupt detection with configurable polarity per GPIO
• Internal weak pull up and pull low per GPIO
• Multiplexed with other specific digital functions

3.4 RF Interface
For This Module, the default mode for the antenna is internal, it also has the interface for an external antenna, or uses an IPEX interface to connect an external antenna. If you need to use an external antenna, by modifying the module on the 0R resistance to block out the onboard antenna. Or indicate your request when placing an order.
The user can connect a 50-ohm antenna directly to the RF port.
Bluetooth basic parameter

• 2402­2480 MHz Bluetooth 5.0 Mode (BLE); 1 Mbps over the air data rate.
• TX output power of +8dBm.
• Receiver to achieve maximum sensitivity -85dBm @ 1 Mbps BLE.

3.5 Serial Interfaces
3.5.1 UART

• Support 1 HS-UART UART(RS232 Standard)
• Serial Data Format Transmit and Receive data FIFO
• Programmable asynchronous clock support
• Autoflow Control Programmable
• Receive data FIFO trigger level
• UART signal level ranges 3.3V

Table 3: Possible UART Settings When connecting the module to a host, please make sure to follow.

3.5.2 I2C Interface

I2C is a two-wire, bi-directional serial bus that provides a simple and efficient method of data exchange between devices. The I2C standard is a true multi-master bus including collision detection and arbitration that prevents data corruption if two or more masters attempt to control the bus simultaneously.
Data is transferred between a Master and a Slave synchronously to SCL on the SDA line on a byte-by-byte basis. Each data byte is 8-bit long. There is one SCL clock pulse for each data bit with the MSB being transmitted first. An acknowledge bit follows each transferred byte. Each bit is sampled during the high period of SCL; therefore, the SDA line may be changed only during the low period of SCL and must be held stable during the high period of SCL. A transition on the SDA line, while SCL is high, is interpreted as a command (START or STOP). Please refer to the following figure for more details about I2C Bus Timing.

• Three speeds: Standard mode(0 to 100Kb/S);
• Fast mode(<400 Kb/S); High-speed mode(<3.4Mb/S)
• Master or slave I2C operation 7- or 10-bit addressing
• Transmit and receive buffers

The device’s on-chip I2C logic provides the serial interface that meets the I2C bus standard mode specification. The I2C port handles byte transfers autonomously. The I2C H/W interfaces to the I2C bus via two pins: SDA and SCL. Pull up resistor is needed for I2C operation as these are open-drain pins. When the I/O pins are used as I2C port, the user must set the pins function to I2C in advance.
3.6 PWM Generator and Capture Timer (PWM)
FSC-BW236 has an 8 PWM generator. The PWM generator has a 16-bit PWM counter and comparator, and the PWM generator supports two standard PWM output modes: Independent output mode and Complementary output mode with an 8-bit Dead-time generator. Each mode can be used as a timer and issues interrupt independently. In addition, It also has an 8-bit Prescaler and clock divider with 5 divided frequencies (1, 1/2, 1/4, 1/8, 1/16) to support a wide range of clock frequency of the PWM counter. The PWM output control unit, it supports the polarity output function.
The PWM generator also supports the input capture function. It supports latch PWM counter value to the corresponding register when the input channel has a rising transition, falling transition or both transition happens.

3.7 SPI

• Support Motorola SPI Serial interface operation
• Support master or slave operation mode
• Provide two SPI ports: configured as master with Max. baud rate: 25MHz.
• Support DMA interface for DMA transfer
• Independent masking of interrupts FIFO depth ­
• The transmit and receive FIFO buffers 64 words deep.
• The FIFO width is fixed at 16 bits.
• Hardware/software slave-select ­ Dedicated hardware slave-select lines can be used or software control can be used to target the serial-slave device
• Programmable features:
  –Clock bit-rate ­ Dynamic control of the serial bit rate of the data transfer; used in the only serial-master mode of operation.
  –Data item size (4 to 16 bits) ­ Item size of each data transfer is under the control of the programmer
  –Configurable clock polarity and phase
  –Programmable delay on the sample time of the received serial data bit (red), when configured in Master Mode; enables programmable control of routing delays resulting in higher serial data-bit rates.

3.8 USB

• Support USB 2.0
• Support HS/FS/LS mode
• Internal DMA support, DMA works based on register settings
• 1.5KByte bulk-in buffer and 1.5KByte bulk-out buffer

3.9 IR (Infra Ray)

• Support carrier frequency from 25KHz to 500KHz
• Support Duty from 1/2 to 1/5
• Support IR diode input
• Support IR receiver module input 32*4 bytes
• Tx FIFO 32*4 bytes Rx FIFO
• Tx carrier frequency can be configured
• Tx carrier duty cycle can be configured

ELECTRICAL CHARACTERISTICS

4.1 Absolute Maximum Ratings
Absolute maximum ratings for supply voltage and voltages on digital and analog pins of the module are listed below. Exceeding these values causes permanent damage. The average PIO pin output current is defined as the average current value flowing through any one of the corresponding pins for a 100mS period. The total average PIO pin output current is defined as the average current value flowing through all of the corresponding pins for a 100mS period. The maximum output current is defined as the value of the peak current flowing through any one of the corresponding pins.

Table 4: Absolute Maximum Rating

Recommended Operating Conditions

Table 5: Recommended Operating Conditions

4.3 Input/output Terminal Characteristics
Table 6: DC Characteristics (VDD – VSS = 3 ~ 3.6 V, TA = 25C)
4.4 Power State and Power Sequence
Table 7: Timing specification of power sequence

Note: VDDx is the supply power of VDD_3V3
4.5 Power on or Resuming from Deep sleep Sequence
Note: VDDx is the supply power of VDD_3V3
4.6 Shutdown Sequence
Note: VDDx is the supply power of VDD_3V3

4.7 I2C Dynamic Characteristics
Table 8: I2C Dynamic Characteristics
Note:

1. Guaranteed by design, not tested in production.
2. HCLK must be higher than 2 MHz to achieve the maximum standard mode I2C frequency. It must be higher than 8 MHz to achieve the maximum fast mode I2C frequency.
3. I2C controller must be retriggered immediately at slave mode after receiving the STOP condition.
4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL.
5. The maximum hold time of the Start condition has only to be met if the interface does not stretch the low period of the SCL signal.

4.8 Power consumptions
Table 9: Power consumptions(TBD)

MSL & ESD

Table 10: MSL and ESD

RECOMMENDED TEMPERATURE REFLOW PROFILE

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, please check the below and follow the instructions specified by IPC/JEDEC J-STD-033.
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed below, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re- packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in an ambient environment of 30°C/60%RH.
Table 11: Recommended baking times and temperatures

Feasycom surface-mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
The soldering profile depends on various parameters necessitating a setup for each application. The data here is given only for guidance on solder reflow.
Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 ­ 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat
uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.
Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with an elevation of temperature and liquefaction of flux,
each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 seconds for this zone.
Equilibrium Zone 2 (C) ( optional) — In order to resolve the upright component issue, it is recommended to keep the temperature at 210 ­ 217 for about 20 to 30 seconds.
Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for another lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 seconds when the temperature is above 217 C.
Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint. The typical cooling rate should be 4 C.

MECHANICAL DETAILS

7.1 Mechanical Details

• Dimension: 13mm(W) x 26.9mm(L) x 2.0mm(H) Tolerance: ±0.1mm
• Module size: 13mm X 26.9mm Tolerance: ±0.2mm
• Pad size: 1mmX0.8mm Tolerance: ±0.2mm
• Pad pitch: 1.5mm Tolerance: ±0.1mm

HARDWARE INTEGRATION SUGGESTIONS

8.1 Soldering Recommendations
FSC-BW236 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, the heat transfer efficiency of the oven, and the particular type of solder paste used. Consult the datasheet of a particular solder paste for profile configurations. Feasycom will give the following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide.
8.2 Layout Guidelines(Internal Antenna)
It is strongly recommended to use good layout practices to ensure the proper operation of the module. Placing copper or any metal near the antenna deteriorates its operation by having an effect on the matching properties. The metal shield around the antenna will prevent the radiation and thus the metal case should not be used with the module. Use grounding vias separated max 3 mm apart at the edge of grounding areas to prevent RF from penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges. The motherboard should have no bare conductors or vias in this restricted area because it is not covered by a stop mask print. Also, no copper (planes, traces or vias) is allowed in this area, because of mismatching the onboard antenna.
Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. The following list is aimed to avoid EMC problems caused by the RF part of the module. Use good consideration to avoid problems arising from digital signals in the design.
Ensure that signal lines have return paths as short as possible. For example, if a signal goes to an inner layer through a via, always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next to the signal line).
8.3 Layout Guidelines(External Antenna)
Placement and PCB layout are critical to optimizing the performance of a module without onboard antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference with the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss.
As indicated in below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 12: Placement of the Module on a System Board

Figure 13 : Leave 5mm Clearance Space from the Antenna
General design recommendations are:

• The length of the trace or connection line should be kept as short as possible.

• Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness.

• Routing the RF close to digital sections of the system board should be avoided.

• To reduce signal reflections, sharp angles in the routing of the microstrip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan-style 90-degree routing.

• Figure 14: Recommended Trace Connects Antenna and the Module

• Routing of the RF connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes.

Warning:
Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

FCC Statement:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
–Reorient or relocate the receiving antenna.
–Increase the separation between the equipment and receiver.
–Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
–Consult the dealer or an experienced radio/TV technician for help
Modification statement:
Shenzhen Feasycom Technology Co., LTD has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
Interference statement:
This device complies with Part 15 of the FCC Rules and Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Explanation:
This module meets all the requirements of FCC part 15-247 and FCC Part 15.407
RF exposure compliance statement:
This device has been evaluated to meet the general RF exposure requirement. The antenna should be installed and operated with a minimum distance of 20cm between the radiator and your body. Antenna gain must be below 0 dB.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the above, separate approval is required to satisfy the SAR requirements of FCC Part 2.1093.
If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
Labeling Requirements for the Host device shall be properly labeled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise, the host device must be labeled to display the FCC ID of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Bluetooth and Wi-Fi combo module
Model No.: FSC-BW236
FCC ID: 2AMWOFSC-BW236
The host OEM user manual must also contain clear instructions on how end-users can find and/or access the module and the FCC ID.
Bluetooth and Wi-Fi combo module
Model No.: FSC-BW236
FCC ID: 2AMWOFSC-BW236
OEM Statement
a. The module manufacturer must show how compliance can be demonstrated only for specific hosts or hosts
b. The module manufacturer must limit the applicable operating conditions in which transmitter will be used, and
c. The module manufacturer must disclose that only the module grantee can make the evaluation that the module is compliant with the host. When the module grantee either refuses to make this evaluation, or does not think it is necessary, the module certification is rendered invalid for use in the host, and the host manufacturer has no choice other than to use a different module, or take responsibility (§2.929)and obtain a new FCC ID for the product.
d. The module manufacturer must provide the host manufacturer with the following requirements:
e. The host manufacturer is responsible for additional testing to verify compliance as composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions).
KDB996369 D03
2.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.
Explanation: This module meets all the requirements of FCC part 15 -247
2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to- point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
Explanation: The EUT uses an unchangeable PCB antenna with a maximum gain of 0dbi. There is no restriction on the installation method.
2.4 Limited module procedures
If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment in which the limited module is used. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.
Explanation: This module is a limited module
2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication
996369 D02 FAQ ­ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and
f) Production test procedures for ensuring compliance.
Explanation: YES. this module without trance antenna designs, use a fixed-length PCB antenna
2.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable ­ xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to provide to end-users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility for the module through a change in FCC ID (new application).
Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This module is designed to comply with the FCC statement, fcc id is: 2AMWOFSC-BW236
2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omnidirectional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors.
Explanation: This module use a PCB antenna. Antenna Gain:0dBi
2.8Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices ­ KDB Publication 784748.
Explanation: On the metal shielding shell, there is space for printing basic information such as the name and model of the product, and the id : 2AMWOFSC-BW236 is included.
2.9 Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulate or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements.
Explanation: Data transfer module demo board can control the EUT work in RF test mode at a specified test channel.
2.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Explanation: The module is without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC part15 subpart B. The host should be evaluated by the FCC subpart B.

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References

• Feasycom | Simplifying and Empowering IoT Connectivity with Bluetooth, Wi-Fi, UWB, 4G, and RFID

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