GT-tronics QC35xFNA Dual mode Bluetooth Module User Guide

QC35xFNx QC55xFNx Dual-mode Bluetooth Module
GT-tronics QCC Bluetooth Module

Features

• Bluetooth v5.2 Class 1/2 module (Classic + LE with 2Mbps)
• Dual core 32 bit application processor and 120MHz Kalimba DSP
• Built-in 16/32/64Mbit flash on module
• Extremely low current consumption
• Integrated Li-ion battery charger
• 5V/3V/Battery power supply and configurable 1.8/3.3V I/O operation
• LED drivers, I2C, UART and PIO interfaces
• BLE GATT and HID profile support
• A2DP, AVRCP, HSP, HFP, SPP profile support
• Qualcomm TrueWireless Mirroring for stereo earbud application
• HFP-AG / A2DP Source transmitter (Tx) application firmware available
• USB Full Speed Device (USB-FS 12 Mbps)
• High quality 24-bit stereo audio codec and up to 96KHz resolution
• I2S/PCM/SPDIF digital audio interface (I2S/PCM input only for QC356FNA)
• Differential analog and digital MEMS microphones interfaces (analog output is mono only for QC356FNA)
• Ready for LE Audio
• Support firmware update via USB and OTA
• Always-on voice wake-word and button activated digital assistants (license may be required)
• SBC, AAC, aptX Classic, aptX HD and aptX Adaptive BT codec (license may be required)
• 1 or 2 mic Qualcomm CVC noise suppression and echo cancellation (license may be required)
• Feed forward, feedback and hybrid Active Noise Cancellation ANC (license required)
• RoHS / REACH compliant
• BQB qualified and FCC/IC-ISED/CE/RCM/JR-MIC certification available upon request
• Optional RF shield can (QC35xFNB-S / QC55xFNB-S)
• Dimension:
  o 18.0 x 13.0 x 2.3 mm (QC35xFNA / QC35xFNB / QC55xFNB)
  o 18.0 x 13.0 x 2.8 mm (QC35xFNB-S / QC55xFNB-S)

Applications

Description

QC35xFNx and QC55xFNx are Bluetooth Class1 (max 13dBm) dual mode module. It is based on the most advanced QCC305x and QCC515x chipset and the latest ADK. It supports Bluetooth v5.2 standard with LE audio capability. Dual- core application processors with 32/80MHz operation and dual 32-bit 120MHz Kymera DSP Co-Processor enable not only the existing Bluetooth multi-media function such as stereo audio (A2DP audio) communications but also  extended features for the future.
The highly integrated hardware includes high quality stereo DAC, and battery charger, thus saving costs of external components. The host interfaces include USB, I2S, SPI and UART, that are programmable for data communication,  module control or firmware upgrade.

The powerful and flexible design allows the module to support HSP/HFP/A2DP/AVRCP SPP, PBAP and most Bluetooth Classic profiles, at the same handling LE profiles for applications like battery reporting, remote control and HID.  Furthermore, the SBC, AAC, aptX Classic, aptX HD, aptX Adaptive and aptX Voice audio streaming are also supported. The module is also made ready for the LE Audio, the next generation of Bluetooth Audio.

The complete module design relieves host system developers from handling complex Bluetooth operations and compatibility issues. With integrated on-chip balun and on-board band pass filter, it provides a clean 50 ohm antenna interface to serve the needs of various antenna designs, matching and testing in host system development.

Block Diagram

Physical Layout

Recommended PCB Footprint

Pins Configurations

PIN

| QC35xFNA| QC35xFNB
QC55xFNB| TYPE|

FUNCTIONS

---|---|---|---|---
1| GND| GND| GND| Ground
2| MIC2_P_LIN_RP| MIC2_P_LIN_RP| Analog| Right Mic/line in audio positive input
3| MIC2_N_LIN_RN| MIC2_N_LIN_RN| Analog| Right Mic/line in audio negative input
4| MIC1_P_LIN_LP| MIC1_P_LIN_LP| Analog| Left Mic/line in audio positive input
5| MIC1_N_LIN_LN| MIC1_N_LIN_LN| Analog| Left Mic/line in audio negative input
6| MIC_BIAS| MIC_BIAS| Analog| Microphone bias output
7| SPKL_P| SPKL_P| Analog| Differential positive left speaker output
8| SPKL_N| SPKL_N| Analog| Differential negative left speaker output
9 (1)| SPKR_P| SPKR_P| Analog| Differential positive right speaker output
10(1)| SPKR_N| SPKR_N| Analog| Differential negative right speaker output
11| GND| GND| GND| Ground
12| VOUT_1v8| VOUT_1v8| Power| 1.8v switching regulator output
13 (1)| NC| PIO43| Bi-directional| Programmable Input/Output line
14 (1)| NC| PIO40| Bi-directional| Programmable Input/Output line
15| GND| GND| GND| Ground
16| PIO5| PIO5| Bi-directional| Programmable Input/Output line
17| PIO7| PIO7| Bi-directional| Programmable Input/Output line
18| PIO4| PIO4| Bi-directional| Programmable Input/Output line
19| PIO8| PIO8| Bi-directional| Programmable Input/Output line
20| PIO6| PIO6| Bi-directional| Programmable Input/Output line
21| GND| GND| GND| Ground
22(1)| NC| PIO3| Bi-directional| Programmable Input/Output line
23(1)| NC| LED5| Open Drain| LED driver
24| LED4| LED4| Open Drain| LED driver
25(1)| NC| LED2| Open Drain| LED driver
26| LED1| LED1| Open Drain| LED driver
27(1)| NC| LED0| Open Drain| LED driver
28| PIO16| PIO16| Bi-directional| Programmable Input/Output line
29(1)| NC| PIO15| Bi-directional| Programmable Input/Output line
30(1)| NC| PIO21| Bi-directional| Programmable Input/Output line
31(1)| NC| PIO41| Bi-directional| Programmable Input/Output line
32(1)| NC| PIO42| Bi-directional| Programmable Input/Output line
33| GND| GND| GND| Ground
34| VCHG| VCHG| Analog| 5v Charger input.
35(1)| NC| CHG_EXT| Analog| External battery charger control.
36(1)| NC| VCHG_SENSE| Analog| Battery charger sense input.
37| VBAT| VBAT| Power| Battery input
38| GND| GND| GND| Ground
39| SYS_CTRL| SYS_CTRL| CMOS Input| System power on enable
40| USB_DP| USB_DP| Analog| USB data +ve
41| USB_DN| USB_DN| Analog| USB data –ve
42| VPAD1| VPAD1| Power| Power supply for PIO1..PIO8
43| VPAD2| VPAD2| Power| Power supply for PIO15..PIO21 and PIO40..PIO44
44| GND| GND| GND| Ground
45| PIO17| PIO17| Bi-directional| Programmable Input/Output line
46| PIO18| PIO18| Bi-directional| Programmable Input/Output line
47| PIO19| PIO19| Bi-directional| Programmable Input/Output line
48(1)| NC| PIO20| Bi-directional| Programmable Input/Output line
49| GND| GND| GND| Ground
50| BT_RF| BT_RF| Analog| RF Antenna port
51| GND| GND| GND| Ground
52(1)| NC| PIO44| Bi-directional| Programmable Input/Output line
53(1)| NC| PIO2| Bi-directional| Programmable Input/Output line
---|---|---|---|---
54| PIO1| PIO1| Bi-directional| Programmable Input/Output line

Notes :
(1) : All these pins are NC pins and have no function for QC35xFNA version.

General Electrical Specification

Absolute Maximum Ratings

Ratings| Min.| Max.
Storage Temperature| -40 ℃| +85 ℃
Supply Voltage at VCHG| -0.4 V| 7.0 V
Supply Voltage at VBAT and SYS_CTRL| -0.4 V| 4.8 V
Supply Voltage at VPAD| -0.4V| 3.80V
Recommended Operating Condition
Operating Condition| Min.| Max.
Operating Temperature range| -10 ℃| +60 ℃
Supply Voltage at VCHG| 4.75 V| 5.75 V
Supply Voltage at VBAT and SYS_CTRL| 2.8 V| 4.25 V
Supply Voltage at VPAD| 1.70 V| 3.60 V

Parameters

| Description| Min.| Typ.| Max.|

Units

---|---|---|---|---|---
Current Consumption – A2DP

Streaming

| Typical| –| 5| –| mA
Battery Charge Current – Internal

mode

| | –| –| 200| mA
Battery Charge Current – External

mode (FNB version only)

| | –| –| 1800| mA
ADC Input Range| | –| –| 2.4| Vpp
Audio Characteristics

Parameter| Description| Min.| Typ.| Max.| Units
Analog Output – THD+N| Class AB 1| –| -89.6| –| dB
Class D 1| –| -90.6| –| dB
Analog Output – SNR Signal-to-Noise A-weighted| Class AB 1| –| 101.2| –| dBA
Class D 1| –| 99.9| –| dBA
Analog Output – Dynamic Range A-weighted| Class AB 1| –| 102.1| –| dB
Class D 1| –| 100.1| –| dB
Analog Output – Power| Class AB 1| –| 30| –| mW
Class D 1| –| 30| –| mW
Analog Input – THD+N| single-ended 2| –| -85.5| –| dB
differential 2| –| -93.4| –| dB
Analog Input – SNR
Signal-to-Noise A-weighted| single-ended 2| –| 101.2| –| dB
differential 2| –| 99.2| –| dB
Analog Input – Dynamic Range A-weighted| single-ended 2| –| 101.4| –| dB
differential 2| –| 100.6| –| dB
ADC Sample Rates| 24bit 3| 8| –| 96| kHz
DAC Sample Rates| 24bit 4| 8| –| 192| kHz

Notes:

1. Load 32Ω, input frequency 1kHz, B/W 20Hz to 20kHz
2. Input frequency 1kHz, B/W 20Hz to 20kHz
3. Available sample rates 8, 16, 32, 44.1, 48, 96
4. Available sample rates 8, 16, 32, 44.1, 48, 96, 192

Radio Characteristics

General Radio Characteristics

Operating Frequency| 2400 to 2483.5 MHz
RF Output Power| 0 – 13 dBm
RX Sensitivity| -96dBm (Typ)
Receiving Signal Range| 30 m (Typ)
Lower quad band| 2 MHz
Upper quad band| 3.5 MHz
Carrier frequency| 2402 to 2480 MHz, 1 MHz step, 79 channels
Modulation Method| GFSK (1 Mbps)

Pie/4 DQPSK (2 Mbps) 8DQPSK (3Mbps)

Hopping| 1600 hops/s, 1 MHz channel space
Maximum data rate| GFSK| Asynchronous: 732.2 kbps / 57.6 kbps Synchronous: 433.9 kbps / 433.9 kbps
Pie/4 DQPSK| Asynchronous: 1448.5 kbps / 115.2 kbps Synchronous: 869.7 kbps / 869.7 kbps
8DQPSK| Asynchronous: 2178.1 kbps / 177.2 kbps Synchronous: 1306.9 kbps / 1306.9 kbps
Basic Rate, VBAT = 3.7V Temperature =+25°C

| Frequency (GHz)| Min| Typ| Max| Bluetooth

Specification

| Unit
Sensitivity at 0.1% BER| 2.402| –| -95.5| -93.5| <= – 70| dBm
2.441| –| -96| -94| dBm
2.480| –| -96| -94| dBm
Maximum received signal at 0.1% BER| >= -9| > – 20| dBm
RF transmit power 1| | 11.5| +13| –| -6 to +20 2| dBm
Initial carrier frequency tolerance| | -75| 10| +75| ±75| kHz
20dBm bandwidth for modulated carrier| | –| 925| 1000| < 1000| kHz
Drift (single slot packet)| Single Slot| –| 10| 25| <25| kHz
Three Slot| –| 10| 40| kHz
Five Slot| –| 10| 40| kHz
Drift Rate| | –| 5| 20| <20| kHz/50µs
△f1avg “Maximum Modulation”| | 140| 165| 175| 140<△f1avg <175| kHz
△f2maz “Minimum Modulation”| | 115| 147| –| >=115| kHz
C/I co-channel| –| –| –| <= 11| dB
Adjacent channel selectivity C/I F=F0 +1 MHz 3 5| –| -9| 0| <= 0| dB
Adjacent channel selectivity C/I F=F0 – 1MHz 3 5| –| -11| 0| <= 0| dB
Adjacent channel selectivity C/I F=F0 +2 MHz 3 5| –| -39| -30| <= – 30| dB
Adjacent channel selectivity C/I F<F0 – 3MHz 3 5| –| -61| -40| <= – 40| dB
Adjacent channel selectivity C/I F=F0 +3 MHz 3 5| –| -47| -40| <= – 40| dB
Adjacent channel selectivity C/I F>F0 +3 MHz 3 5| –| -60| -40| <= – 40| dB
Adjacent channel selectivity C/I F=Fimage 3 5| –| -33| -9| <= -9| dB
Adjacent channel transmit power F=F0±2MHz 4 5| –| –| –| <= – 20| dBc
Adjacent channel transmit power F=F0±3MHz 4 5| –| –| –| <= – 40| dBc
Enhanced Rate, VBAT = 3.7V Temperature =+25°C

| Frequency (GHz)| Min| Typ| Max| Bluetooth Specification| Unit
Sensitivity at 0.01% BER Pie/4 DQPSK| 2.402| –| -95.0| -93.0| <= – 70| dBm
2.441| –| -95.0| -93.0| dBm
2.480| –| -95.0| -93.0| dBm
Sensitivity at 0.01% BER 8DQPSK| 2.402| –| -88.5| -86.5| <= – 70| dBm dBm

dBm

2.441| –| -88.5| -86.5
2.480| –| -88.5| -86.5
Maximum received signal at 0.1% BER| >= -9| > – 20| dBm
RF transmit power 1| | 8.5| +10.0| –| -6 to +20 2| dBm
Pie/4 DQPSK|
Adjacent channel selectivity C/I F=F0 +1 MHz 4 5| –| -10| 0| <= 0| dB
Adjacent channel selectivity C/I F=F0 – 1MHz 4 5| –| -11| 0| <= 0| dB
Adjacent channel selectivity C/I F=F0 +2 MHz 4 5| –| -41| -30| <= – 30| dB
Adjacent channel selectivity C/I F<F0 – 3MHz 4 5| –| -61| -40| <= – 40| dB
Adjacent channel selectivity C/I F=F0 +3 MHz 4 5| –| -48| -40| <= – 40| dB
Adjacent channel selectivity C/I F>F0 +3 MHz 4 5| –| -61| -40| <= – 40| dB
Adjacent channel selectivity C/I F=Fimage 4 5| –| -35| -7| <= -9| dB
Pie/4 DQPSK|
Adjacent channel selectivity C/I F=F0 +1 MHz 4 5| –| -5| 5| <= 5| dB
Adjacent channel selectivity C/I F=F0 – 1MHz 4 5| –| -7| 5| <= 5| dB
Adjacent channel selectivity C/I F=F0 +2 MHz 4 5| –| -38| -25| <= – 25| dB
Adjacent channel selectivity C/I F<F0 – 3MHz 4 5| –| -55| -33| <= – 33| dB
Adjacent channel selectivity C/I F=F0 +3 MHz 4 5| –| -41| -33| <= – 33| dB
Adjacent channel selectivity C/I F>F0 +3 MHz 4 5| –| -55| -33| <= – 33| dB
Adjacent channel selectivity C/I F=Fimage 4 5| –| -29| 0| <= 0| dB

Notes:

1. Default firmware is set to target 13dBm. Output power is measured at the RF chip pin. Specified Min value is based on statistical variance and represents the absolute limit rather than expected performance.
2. Class 1/2 RF transmit power range in the Bluetooth specification
3. Up to three exceptions are allowed in the Bluetooth specification
4. Up to five spurious response frequencies are allowed in the Bluetooth specification
5. Measured at F0 = 2441MHz

Bluetooth Low Energy, Temperature =+25°C

| Frequency (GHz)| Min| Typ| Max| Bluetooth Specification| Unit
Sensitivity at 30.8% PER 1Mb/s 3| 2.402| –| -99.0| -97.0| <= – 70| dBm
2.440| –| -99.0| -97.0| dBm
2.480| –| -99.0| -97.0| dBm
Sensitivity at 30.8% PER 2Mb/s 3| 2.402| –| -88.5| -86.5| <= – 70| dBm dBm
dBm
2.440| –| -88.5| -86.5
2.480| –| -88.5| -86.5
Maximum received signal at 30.8% PER| >= -9| > – 20| dBm
RF transmit power 1| | 8.5| +10.0| –| -20 to +10 2| dBm
Maximum carrier frequency offset| 1MB/s| –| 4| 150| <= 150| kHz
2MB/s| –| 4| 150| kHz
Maximum drift rate| 1MB/s| –| 4| 20| <= 20| kHz/50
µs
1MB/s| –| 5| 20
Carrier drift| 1MB/s| –| 7| 50| <= 50| kHz
2MB/s| –| 6| 50

Notes:

1. Output power is measured at the RF chip pin. Specified Min value is based on statistical variance and represents absolute limit rather than expected performance.
2. Transmit power range in the Bluetooth specification.
3. Measured using test packets with 37 octet payload.

Packing Information

Model

| A| B| C| Units| Quantity per Carton|

GW/NW

---|---|---|---|---|---|---
QC35xFNA| 8| 34| 14| cm| 660 pcs| 2.1 / 1.6 kg
QC35xFNA-S| 8| 34| 14| cm| 660 pcs| 2.3 / 1.8 kg
QC35xFNB| 8| 34| 14| cm| 660 pcs| 2.1 / 1.6 kg
QC35xFNB-S| 8| 34| 14| cm| 660 pcs| 2.3 / 1.8 kg
QC55xFNA| 8| 34| 14| cm| 660 pcs| 2.1 / 1.6 kg
QC55xFNA-S| 8| 34| 14| cm| 660 pcs| 2.3 / 1.8 kg

• +/- 1cm / 0.1kg, or 10% whichever is greater for all packaging measurements.

Precautions

• Storage Condition
  This product should be stored without opening the packing, and under temperature 0-60 °C and humidity 30-70% RH. It should be used within 15 months after reception.

• ElectroStatic Discharge (ESD)
  This product is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST61340-5, JESD625-A or equivalent standards.

• Module Reflow Installation
  For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.

Ordering Information

Part Number| FW Code Available|

Description

---|---|---
QC350FNA| ****

Please check with your sales representative

| QCC3050 64Mbit (external antenna)
QC356FNA| QCC3056 16Mbit (external antenna)
QC356FNA-M3| QCC3056 32Mbit (external antenna)
QC350FNB| QCC3050 64Mbit with extended I/Os (external antenna)
QC350FNB-S| QCC3050 64Mbit with extended I/Os and shield can (external antenna)
QC356FNB| QCC3056 16Mbit with extended I/Os (external antenna)
QC356FNB-S| QCC3056 16Mbit with extended I/Os and shield can (external antenna)
QC356FNB-M3| QCC3056 32Mbit with extended I/Os (external antenna)
QC356FNB-SM3| QCC3056 32Mbit with extended I/Os and shield can (external antenna)
QC551FNB| QCC5151 32Mbit with extended I/Os (external antenna)
QC551FNB-S| QCC5151 32Mbit with extended I/Os and shield can (external antenna)
QC551FNB-M6| QCC5151 64Mbit with extended I/Os (external antenna)
QC551FNB-SM6| QCC5151 64Mbit with extended I/Os and shield can (external antenna)

Revision History

configuration
04| 2021-09-20| Minor corrections
05| 2021-12-08| Updated block diagram, electrical specifications, radio characteristics, ordering and packaging info
06| 2021-12-14| Updated ordering info

Bluetooth module installed note:

1. Take and use the module, please insure the electrostatic protective measures
2. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250+5°C for the motherboard.

About the module packaging, storage and use of matters needing attention are as follows:

1. The module of the reel and storage life of vacuum packing: Shelf life: 8 months, storage environment conditions: temperature in: < 40 °C, relative humidity: < 90% r.h.

2. The module vacuum packing once opened, time limit of the assembly.
   a) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40%(pink), or greater than 40% (red) the module has been moisture absorption.
   b) factory environmental temperature humidity control: ≤ -30°C ≤ 60% r.h.
   c) once opened, the workshop the preservation of life for 168 hours.

3. Once opened, such as when not used up within 188 hours:
   a) The module must be again to remove the module moisture absorption.
   b) The baking temperature: 125 C 8 hours.
   c) After baking, put the right amount of desiccant to seal packages.
   Compliance of this device in all final host configurations is the responsibility of the Grantee. OEM integrators and end-users must be provided with specific operating instructions for satisfying RF exposure compliance. OEM  integrators are instructed to ensure that the end user has no manual instructions to remove or install the device.

Installation is limited to the host system evaluated in this filing. Additional host systems will require reassessment of radiated spurious emissions due to the lack of shielding on the module. SAR evaluation is valid for minimum 5mm distance to human bodies

FCC MODULAR APPROVAL INFORMATION EXAMPLES for Manual
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a  residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is  no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is  encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

OEM INTEGRATION INSTRUCTIONS:
This device is intended only for OEM integrators under the following conditions:
The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used  with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported.
As long as these 3 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). The end-product may need Verification testing, Declaration of Conformity testing, a Permissive Class II Change or new Certification. Please involve a FCC certification specialist in order to determine what will be exactly applicable for the end- product.
Validity of using the module certification:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer  onsidered valid  and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate  FCC authorization. In such cases, please involve a FCC certification specialist in order to determine if a Permissive Class II Change or new Certification is required.
Upgrade Firmware:
The software provided for firmware upgrade will not be capable to affect any RF parameters as certified for the FCC for this module, in order to prevent compliance issues.
End product labeling:
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID:B4O-QC35XFNX”.
Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

FCC MODULAR APPROVAL INFORMATION EXAMPLES for Manual
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a  residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is  no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

WARNING
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
“CAUTION : Exposure to Radio Frequency Radiation.
Antenna shall be mounted in such a manner to minimize the potential for human contact during normal operation. The antenna should not be contacted during operation to avoid the possibility of exceeding the FCC radio frequency exposure limit.

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