QUECTEL HLM311Z Bluetooth Module User Manual

QUECTEL HLM311Z Bluetooth Module

Product Information

Specifications

• Product: HLM311Z Hardware Design
• Bluetooth Module Series Version: 1.0.0
• Status: Preliminary

FAQ

• Q: What should I do if I encounter technical issues with the Bluetooth Module Series?
  • A: For technical support or reporting documentation errors, please visit http://www.quectel.com/support/technical.htm or email support@quectel.com for assistance.
• Q: How can I obtain more information or contact local offices for support?
  • A: For more information and contacting local offices, visit http://www.quectel.com/support/sales.htm or reach out to Quectel Wireless Solutions Co., Ltd. headquarters in Shanghai.

Information

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

• Quectel Wireless Solutions Co., Ltd.
• Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com
• Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
• For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.

Legal Notices

We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

License Agreements

Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

Copyright

Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with the abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

Trademarks

Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

Third-Party Rights

This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.

Privacy Policy

To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

• We acknowledge no liability for any injury or damage arising from the reliance upon the information.
• We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
• While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
• We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.

Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

• Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
• Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
• Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
• Terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
• The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
• In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document defines HLM311Z and describes its hardware interfaces and air interfaces, which are connected with your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, as well as other related information of the module.

Special Marks

Table 1: Special Marks

Product Overview

HLM311Z is a power-optimized system-on-chip (SoC) solution compliant with BLE 5.0 protocol. The module, featuring built-in PMU, channel filter, digital demodulator for improving sensitivity and same-frequency interference suppression, supports UART for Bluetooth applications.
It is a 4-pin DIP module with compact packaging. The general features of the module are as follows:

• Embedded 32-bit ARM Corte-M3 processor with a frequency of up to 48 MHz
• 48 KB SRAM memory and 512 KB Flash
• Supporting OTA (Over-The-Air Upgrade)
• Supporting secondary development

Table 2: Basic Information

Key Features

Table 3: Key Features

Functional Diagram

The main components of the block diagram are explained below.

• Main chip
• Radio frequency
• Peripheral interfaces

Application Interfaces

Pin/Test Point Assignment

NOTE

• The pins RESET_P, GPIO, SW_CLK, SW_DIO are all test points for debugging.

Pin/Test Point Description

Table 4: I/O Parameter Description

Type / Description

• DI / Digital Input
• DO / Digital Output
• DIO / Digital Input/Output
• PI / Power Input

DC characteristics include power domain and rated current.

Table 5: Pin Description

Table 6: Test Point Description

Application Interface

UART

The module supports 1 UART with self-configurable baud rate. It can be used for AT communication and data transmission at baud rate of 38400 bps, and used for firmware upgrading at baud rate of 115200 bps.

Table 7: Pin Definition of UART

The UART connection between the module and MCU is illustrated below

The UART can be used as debug UART for outputting partial logs with debugging tools and supports 115200 bps baud rate by default. The following is a reference design for debug UART.

Operating Characteristics

Power Supply

Power supply pin and ground pins of the module are defined in the following table.

Table 8: Pin Definition of Power Supply and GND Pins

Reference Design for Power Supply

The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 100 mA output current. For better power supply performance, it is recommended to parallel a 22 μF decoupling capacitor, and two filter capacitors (1 μF and 100 nF) near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:

Turn On

The module can automatically start up after the VBAT is powered on. The turn- on timing is shown below:

Reset

Pull the RESET_P up for at least 50 ms and then release it to reset the module. The module reset timing is illustrated in the following figure.

Download Mode

• Keep the RESET_P at high level during resetting or power-up and the module will enter download mode.
• In the download mode, the firmware can be download through the UART.

RF Performances

Bluetooth Performances

Table 9: Bluetooth Performances

PCB Antenna

The module is provided with PCB antenna. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

When designed with PCB antenna, the module should be placed on the edge of the motherboard. The PCB antenna should be at least 16 mm away from the metal components, connectors, vias, traces, and copper pour area on the motherboard. On the motherboard, all PCB layers under the PCB antenna should be designed as a keepout area

Electrical Characteristics & Reliability

Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital pins of the module are listed in the following table.

Table 10: Absolute Maximum Ratings (Unit: V)

Power Supply Ratings

Table 11: Module Power Supply Ratings (Unit: V)

Bluetooth Power Consumption

Table 12: Power Consumption in Low Power Modes

Digital I/O Characteristics

Table 13: VBAT I/O Characteristics (Unit: V)

ESD Protection

Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 14: ESD Characteristics (Unit: kV)

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE

• The package warpage level of the module conforms to the JEITA ED-7306 standard.

Top and Bottom Views

NOTE

• Images above are for illustrative purposes only and may differ from the actual module.
• For authentic appearance and label, please refer to the module received from Quectel.

Storage and Packaging

Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 2 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   • The module is not stored in Recommended Storage Condition;
   • Violation of the third requirement mentioned above;
   • Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   • Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
   • The module should be baked for 8 hours at 120 ±5 °C;
   • The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.

2. This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD 033. Do not unpack the modules in large quantities until they are ready for soldering.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see document [1].

The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 15: Recommended Thermal Profile Parameters

NOTE

1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [1].

Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:

Carrier Tape

Dimension details are as follow:

Table 16: Carrier Tape Dimension Table (Unit: mm)

Plastic Reel

Table 17: Plastic Reel Dimension Table (Unit: mm)

Mounting Direction

Packaging Process

Appendix References

Table 18: Reference Documents

• Document Name
  • [1] Quectel_Module_SMT_Application_Note

Table 19: Terms and Abbreviations

FCC STATEMENT

Modifications

Any changes or modifications not expressly approved by Quectel or the party responsible for compliance could void the user’s authority to operate the equipment and invalidate the regulatory approval. Host manufacturer must follow KDB Publication 996369 D04 Modulen Integration Guide. Host manufacturer is responsible for regression tests to show compliance to the applicable standards due to the following actions:

1. any modification done to the module.
2. Integration of the module into a host device
   • Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
   • Final host product is required to show compliance to Part 15 Subpart B with the modular transmitter installed

Product Marketing Name: Quectel HLM311Z

FCC Certification Requirements

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source- based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product:
   • This device contains FCC ID: XMR2023HLM311Z
4. Antenna Requirements:
   • The following antennae were approved with the modules:
     Operating Band| Frequency (MHz)| Antenna Gain (dBi)
     ---|---|---
     Bluetooth| 2400~2483.5| 0.47 dBi
   • The product is provided with an approved antenna. Use only supplied or approved antenna by Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for the product.
   • Host device must comply with FCC Part 15 antenna requirements
   • The OEM must design the host so that the antenna will be installed as an integrated antenna for the host containing the HLM311Z and the end user shall not be able to access, remove or replace the antenna.
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID – Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2023HLM311Z” or “Contains FCC ID: XMR2023HLM311Z” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference
2. This device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter-certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

IC Statement

IRSS-GEN

“This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference
2. This device must accept any interference, including interference that may cause undesired operation of the device.

The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:

• “Contains IC: 10224A-2023HLM311Z” or “where: 10224A-2023HLM311Z is the module’s certification number”.

http://www.quectel.com/support/technical.htm

References

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