2023HCM111Z Bluetooth Module Series

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Product Information

Specifications

• Product Name: HCM111Z Hardware Design Bluetooth Module
  Series

• Version: 1.0.0

• Date: 2023-06-15

• Status: Preliminary

Product Usage Instructions

Legal Notices

Users are required to adhere to the following legal notices:

• Use and Disclosure Restrictions: Information provided should be
  kept confidential.

• License Agreements: Documents and information should be used as
  expressly provided.

• Copyright: Respect the copyright of the provided
  documents.

• Trademarks: Do not use any trademark without permission.

• Third-Party Rights: Respect third-party materials’ restrictions
  and obligations.

• Privacy Policy: Data uploaded to servers must comply with
  privacy policies.

• Disclaimer: No liability for injury or damage due to reliance
  on information.

Safety Information

For safe usage, follow these safety precautions:

• Full attention while driving to reduce the risk of
  accidents.

• Avoid using mobile phones while driving as it can cause
  distraction and accidents.

• Comply with laws restricting the use of wireless devices while
  driving.

FAQ (Frequently Asked Questions)

Q: How can I get technical support for the Bluetooth Module

Series?

A: You can visit http://www.quectel.com/support/technical.htm or
email support@quectel.com for technical assistance.

Q: Where can I find information on sales and local

offices?

A: For sales information and local offices, visit
http://www.quectel.com/support/sales.htm or contact Quectel
Wireless Solutions Co., Ltd. at the provided address and phone
number.

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HCM111Z Hardware Design
Bluetooth Module Series Version: 1.0.0 Date: 2023-06-15 Status: Preliminary

Bluetooth Module Series
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

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Bluetooth Module Series
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Bluetooth Module Series
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular or mobile terminal incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety precautions by incorporating them into all product manuals. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular or mobile terminal before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. If emergency assistance is needed, use emergency call if the device supports it. To make or receive a call, the cellular or mobile terminal must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method since network connection cannot be guaranteed under all circumstances.
The cellular or mobile terminal contains a transceiver. When it is ON, it receives and transmits radio signals. RF interference can occur if it is used close to TV sets, radios, computers, or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

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Bluetooth Module Series

About the Document

Revision History

Version Date

–

2023-06-15

1.0.0

2023-06-15

Author
Janson CHEN/ Vic CHENG Janson CHEN/ Vic CHENG

Description Creation of the document Preliminary

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Bluetooth Module Series

Contents
Safety Information …………………………………………………………………………………………………………………… 3
About the Document………………………………………………………………………………………………………………… 4
Contents …………………………………………………………………………………………………………………………………. 5
Table Index ……………………………………………………………………………………………………………………………… 7
Figure Index …………………………………………………………………………………………………………………………….. 8
1 Introduction …………………………………………………………………………………………………………………………. 9 1.1. Special Marks ………………………………………………………………………………………………………………. 9
2 Product Overview………………………………………………………………………………………………………………..10 2.1. Key Features ………………………………………………………………………………………………………………11
3 Application Interfaces …………………………………………………………………………………………………………. 12 3.1. Pin Assignment…………………………………………………………………………………………………………….12 3.2. Pin Description…………………………………………………………………………………………………………….13 3.3. GPIO Multiplexing………………………………………………………………………………………………………..16 3.4. Application Interfaces……………………………………………………………………………………………………18 3.4.1. UART………………………………………………………………………………………………………………..18 3.4.2. SWD Interface …………………………………………………………………………………………………… 19 3.4.3. I2C Interfaces ……………………………………………………………………………………………………. 20 3.4.4. ADC Interfaces …………………………………………………………………………………………………..20 3.4.5. PWM Interfaces…………………………………………………………………………………………………..21 3.4.6. I2S Interface*……………………………………………………………………………………………………..21 3.4.7. SPI ………………………………………………………………………………………………………………….. 22
4 Operating Characteristics…………………………………………………………………………………………………….23 4.1. Power Supply …………………………………………………………………………………………………………….. 23 4.1.1. Reference Design for Power Supply ……………………………………………………………………… 23 4.2. Turn On………………………………………………………………………………………………………………………24 4.3. Reset ………………………………………………………………………………………………………………………… 24 4.4. Download Mode ………………………………………………………………………………………………………….. 25
5 RF Performances…………………………………………………………………………………………………………………26 5.1. Bluetooth Performances ……………………………………………………………………………………………….26 5.2. Antenna/Antenna Interfaces…………………………………………………………………………………………..27 5.2.1. Pin Antenna Interface (ANT_BT) …………………………………………………………………………..27 5.2.1.1. Reference Design………………………………………………………………………………………27 5.2.1.2. Antenna Design Requirements …………………………………………………………………….28 5.2.1.3. RF Routing Guidelines………………………………………………………………………………..28 5.2.2. PCB Antenna……………………………………………………………………………………………………..30 5.2.3. Coaxial RF Connector ………………………………………………………………………………………….32 5.2.3.1. Receptacle Specifications…………………………………………………………………………….32

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5.2.3.2. Antenna Connector Installation…………………………………………………………………….33 5.2.3.3. Assemble Coaxial Cable Plug Manually ……………………………………………………….. 34 5.2.3.4. Assemble Coaxial Cable Plug with Jig…………………………………………………………..35 5.2.3.5. Recommended Mated Plug and Cable Manufacturer ………………………………………35
6 Electrical Characteristics & Reliability…………………………………………………………………………………..36 6.1. Absolute Maximum Ratings …………………………………………………………………………………………..36 6.2. Power Supply Ratings…………………………………………………………………………………………………..36 6.3. Bluetooth Power Consumption……………………………………………………………………………………….37 6.4. Digital I/O Characteristics……………………………………………………………………………………………….37 6.5. ESD Protection …………………………………………………………………………………………………………… 38
7 Mechanical Information ………………………………………………………………………………………………………. 39 7.1. Mechanical Dimensions ………………………………………………………………………………………………… 39 7.2. Recommended Footprint ………………………………………………………………………………………………41 7.3. Top and Bottom Views …………………………………………………………………………………………………. 42
8 Storage and Packaging…………………………………………………………………………………………………………44 8.1. Storage Conditions ………………………………………………………………………………………………………44 8.2. Manufacturing and Soldering …………………………………………………………………………………………45 8.3. Packaging Specifications ………………………………………………………………………………………………. 47 8.3.1. Carrier Tape ………………………………………………………………………………………………………47 8.3.2. Plastic Reel………………………………………………………………………………………………………..48 8.3.3. Mounting Direction………………………………………………………………………………………………48 8.3.4. Packaging Process …………………………………………………………………………………………….. 49
9 Appendix References…………………………………………………………………………………………………………..50

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Table Index
Table 1 : Special Marks……………………………………………………………………………………………………………….9 Table 2 : Basic Information ………………………………………………………………………………………………………..10 Table 3 : Key Features………………………………………………………………………………………………………………11 Table 4 : I/O Parameter Description …………………………………………………………………………………………….13 Table 5 : Pin Description ……………………………………………………………………………………………………………13 Table 6 : GPIO Multiplexing ……………………………………………………………………………………………………….16 Table 7 : Pin Definition of UARTs………………………………………………………………………………………………..18 Table 8 : Pin Definition of SWD Interface ……………………………………………………………………………………..19 Table 9 : Pin Definition of I2C Interfaces ………………………………………………………………………………………20 Table 10 : Pin Definition of ADC Interfaces …………………………………………………………………………………..20 Table 11 ADC Features …………………………………………………………………………………………………………21 Table 12 Pin Definition of PWM Interfaces………………………………………………………………………………..21 Table 13 Pin Definition of I2S Interface…………………………………………………………………………………….21 Table 14 Pin Definition of SPI …………………………………………………………………………………………………22 Table 15 : Pin Definition of Power Supply and GND Pins………………………………………………………………..23 Table 16 : Pin Definition of RESET_P………………………………………………………………………………………….24 Table 17 : Bluetooth Performances……………………………………………………………………………………………..26 Table 18 : ANT_BT Pin Description……………………………………………………………………………………………..27 Table 19 : Antenna Design Requirements…………………………………………………………………………………….28 Table 19 PCB antenna parameters………………………………………………………………………………………….30 Table 20 : Major Specifications of the RF Connector (Receptacle)……………………………………………………32 Table 21 : Absolute Maximum Ratings (Unit: V)…………………………………………………………………………….36 Table 22 : Module Power Supply Ratings (Unit: V)…………………………………………………………………………36 Table 23 : Power Consumption in Low Power Modes …………………………………………………………………….37 Table 24 : VBAT I/O Characteristics (Unit: V)………………………………………………………………………………..37 Table 25 : ESD Characteristics (Unit: kV)……………………………………………………………………………………..38 Table 26 : Recommended Thermal Profile Parameters…………………………………………………………………..46 Table 27 : Carrier Tape Dimension Table (Unit: mm) ……………………………………………………………………..47 Table 28 : Plastic Reel Dimension Table (Unit: mm) ………………………………………………………………………48 Table 29 : Reference Documents………………………………………………………………………………………………..50 Table 30 : Terms and Abbreviations…………………………………………………………………………………………….50

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Figure Index
Figure 2 : Pin Assignment (Top View) …………………………………………………………………………………………. 12 Figure 3 : UART0 Connection …………………………………………………………………………………………………….18 Figure 4 : Debug UART Reference Circuit ……………………………………………………………………………………19 Figure 5 : SWD Interface Connection…………………………………………………………………………………………..19 Figure 6 : SPI Connection ………………………………………………………………………………………………………….22 Figure 7 : VBAT Reference Circuit ………………………………………………………………………………………………23 Figure 8 : Turn-on Timing…………………………………………………………………………………………………………..24 Figure 9 : Reference Circuit of RESET with A Button …………………………………………………………………….. 25 Figure 10 : Reset Timing……………………………………………………………………………………………………………25 Figure 11 : Reference Design of RF Antenna Interface ………………………………………………………………….. 27 Figure 12 : Microstrip Design on a 2-layer PCB……………………………………………………………………………..28 Figure 13 : Coplanar Waveguide Design on a 2-layer PCB ……………………………………………………………..29 Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) …………………29 Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) …………………29 Figure 16 : Keepout Area on Motherboard ……………………………………………………………………………………31 Figure 17 : Prohibited Area for Routing ……………………………………………………………………………………….. 31 Figure 18 : Dimensions of the Receptacle (Unit: mm) ……………………………………………………………………. 32 Figure 19 : Dimensions of Mated Plugs (Ø 0.81 Coaxial Cables) (Unit: mm)………………………………………33 Figure 20 : Space Factor of Mated Connectors (Ø 0.81 mm Coaxial Cables) (Unit: mm) ……………………..33 Figure 21 : Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm) ……………………..34 Figure 22 : Plug in a Coaxial Cable Plug………………………………………………………………………………………34 Figure 23 : Pull out a Coaxial Cable Plug …………………………………………………………………………………….. 35 Figure 24 : Install the Coaxial Cable Plug with Jig………………………………………………………………………….35 Figure 25 : Top and Side Dimensions ………………………………………………………………………………………….39 Figure 26 : Bottom Dimensions (Bottom View) ………………………………………………………………………………40 Figure 27 : Recommended Footprint……………………………………………………………………………………………41 Figure 28 : Top and Bottom Views (Pin Antenna Interface)……………………………………………………………..42 Figure 29 : Top and Bottom Views (Coaxial RF Connector) …………………………………………………………….42 Figure 30 : Top and Bottom Views (PCB Antenna) ………………………………………………………………………..43 Figure 31 : Recommended Reflow Soldering Thermal Profile …………………………………………………………. 45 Figure 32 : Tape Specifications…………………………………………………………………………………………………..47 Figure 33 : Plastic Reel Dimension Drawing …………………………………………………………………………………48 Figure 34 : Mounting Direction …………………………………………………………………………………………………… 48 Figure 35 : Packaging Process …………………………………………………………………………………………………..49

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Bluetooth Module Series

1 Introduction
QuecOpen® is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:
Realize embedded applications’ quick development and shorten product R&D cycle Simplify circuit and hardware structure design to reduce engineering costs Miniaturize products Reduce product power consumption Apply OTA technology Enhance product competitiveness and price-performance ratio
This document defines HCM111Z in QuecOpen® solution and describes its hardware interfaces and air interfaces, which are connected with your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, as well as other related information of the module.

1.1. Special Marks

Table 1: Special Marks

Mark * […]

Definition
Unless otherwise specified, when an asterisk () is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk () after a model indicates that the sample of the model is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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Bluetooth Module Series

2 Product Overview
HCM111Z is a low-power and high performance MCU Bluetooth module compliant with BLE 5.0 protocol. The module, featuring built-in PMU, channel filter, digital demodulator for improving sensitivity and same-frequency interference suppression, supports multiple interfaces such as UART, SWD, I2C, ADC and GPIO for various applications.
It is an SMD module with compact packaging. The general features of the module are as follows:
Embedded 32-bit ARM Corte-M3 processor with a frequency of up to 48 MHz 48 KB SRAM memory and 512 KB Flash Supporting OTA (Over-The-Air Upgrade) Supporting secondary development

Table 2: Basic Information
HCM111Z Packaging type Pin counts Dimensions Weight

LCC 23 (15 ±0.2) mm × (12 ±0.2) mm × (2.25 ±0.2) mm Approx. 0.62 g

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2.1. Key Features

Bluetooth Module Series

Table 3: Key Features

Basic Information

Bluetooth protocol: BLE 5.3 Protocols and Standards All hardware components are fully compliant with EU RoHS directive

Power Supply Temperature Ranges EVB Kit

VBAT Power Supply: 1.8­4.3 V Typ.: 3.3 V Operating temperature 1: -40 to +85 °C Storage temperature: -45 to +95 °C
HCM111Z-TE-B 2

Antenna/Antenna Interface

Antenna/Antenna

Interfaces 3

Pin antenna interface (ANT_BT) PCB antenna Coaxial RF connector 50 characteristic impedance

Application Interface 4

Application Interfaces

UART, SWD, I2C, ADC, PWM, SPI, I2S, Audio

1 Within the operating temperature range, the module’s related performance meets Bluetooth specifications. 2 For more details about the EVB, see document [1].
3 The module is provided in one of the three antenna/antenna interface designs. For more details, contact Quectel
Technical Support. 4 For more details about the interfaces, see Chapter 3.3 and Chapter 3.4.

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3 Application Interfaces
3.1. Pin Assignment

Figure 2: Pin Assignment (Top View)
NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. 3. The module provides 11 GPIO interfaces by default. In the case of multiplexing it supports up to 13
GPIO interfaces, 2 UARTs, 1 SWD interface, 2 I2C interfaces, 4 ADC interfaces, 6 PWM interfaces, 1 I2S* interface and 1 SPI. For more details, see Chapter 3.3 and Chapter 3.4.

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3.2. Pin Description

Bluetooth Module Series

Table 4: I/O Parameter Description

Type AI AO AIO DI DO DIO PI

Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input

DC characteristics include power domain and rated current, etc.

Table 5: Pin Description

Power Supply

Pin Name

Pin No. I/O

VBAT

2

PI

GND Reset Pin Name RESET_P UART Pin Name

1, 3, 9

Pin No. I/O

16

DI

Pin No. I/O

Description

DC Characteristics

Power supply for the module

Vmin = 1.8 V
Vnom = 3.3 V Vmax = 4.3 V

Comment
The power supply must be provided with sufficient current of more than 100mA.

Description Reset the module

DC Characteristics
VBAT

Comment
Hardware reset. Active high.

Description

DC Comment
Characteristics

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UART0_TXD 19 UART0_RXD 18

DO UART0 transmit DI UART0 receive

VBAT

GPIO Interface s

Pin Name

Pin No. I/O

Description

GPIO1

4

DIO

DC Characteristics

Comment

GPIO2

5

DIO

GPIO3

7

DIO

GPIO4

8

DIO

GPIO5 GPIO6 GPIO7

10

DIO

General-purpose

11

DIO

VBAT

input/output

12

DIO

Interrupt wakeup.

GPIO8

15

DIO

GPIO9

20

DIO

GPIO10

21

DIO

GPIO11

22

DIO

Analog Audio Interface

Pin Name

Pin No. I/O

MIC_IN

6

AI

SPK1_P

13

AO

SPK1_N

14

AO

LED Interface

Pin Name

Pin No. I/O

LED

17

DO

Description
Microphone input Analog audio differential output 1 (+) Analog audio differential output 1 (-)
Description
LED output

DC Characteristics
DC Characteristics VBAT

Comment Comment

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RF antenna interface

Pin Name ANT_BT

Pin No. I/O

23

AIO

Description Bluetooth antenna interface

DC Characteristics

Comment 50 characteristic impedance.

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3.3. GPIO Multiplexing
The module provides 11 GPIO interfaces by default, and can support up to 13 GPIO interfaces in the case of multiplexing. Pins are defined as follows:

Table 6: GPIO Multiplexing

Pin Pin Name
No.

GPIO1

4

Multiplexing Function 0 (GPIO No.)

Multiplexing Function 1

Multiplexing Function 2

Multiplexing Function 3

GPIO1

I2C1_SDA PWM5

UART0_TXD

Multiplexing Multiplexing Multiplexing Multiplexing Multiplexing Function 4 Function 5 Function 6 Function 7 Function 8

UART1_TXD –

SW_DIO

I2S_DIN

SPI_MOSI

GPIO2

5

GPIO2

I2C1_SCL PWM4

UART0_RXD UART1_RXD –

SW_CLK

I2S_DOUT SPI_MISO

GPIO3

7

GPIO3

I2C1_SCL PWM0

UART0_RXD UART1_RXD –

CLK_OUT I2S_DOUT SPI_MISO

GPIO4

8

GPIO4

I2C1_SDA PWM1

UART0_TXD UART1_TXD –

ANT_CTL0 I2S_DIN

SPI_MOSI

GPIO5

10 GPIO5

I2C0_SDA PWM1

UART0_TXD UART1_TXD –

ANT_CTL0 I2S_WS

SPI_CS

GPIO6

11 GPIO6

I2C0_SDA PWM5

UART0_TXD UART1_TXD –

–

I2S_WS

SPI_CS

GPIO7

12 GPIO7

I2C0_SCL PWM0

UART0_RXD UART1_RXD –

CLK_OUT I2S_CLK

SPI_CLK

GPIO8

15 GPIO8

I2C0_SCL PWM4

UART0_RXD UART1_RXD ADC0

ANT_CTL0 I2S_CLK

SPI_CLK

GPIO9

20 GPIO9

I2C1_SCL PWM0

UART0_RXD UART1_RXD ADC2

CLK_OUT I2S_DOUT SPI_MISO

GPIO10

21

GPIO10

I2C0_SDA PWM5

UART0_TXD UART1_TXD ADC1

ANT_CTL0 I2S_WS

SPI_CS

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GPIO11

22 GPIO11

UART0_

TXD

19 GPIO12

UART0_ 18 GPIO13
RXD

I2C1_SDA I2C1_SDA

PWM1 PWM3

I2C1_SCL PWM2

UART0_TXD UART1_TXD ADC3

–

UART1_TXD –

–

UART1_RXD –

Bluetooth Module Series

ANT_CTL1 I2S_DIN ANT_CTL1 I2S_DIN

SPI_MOSI –

ANT_CTL0 I2S_DOUT –

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3.4. Application Interfaces
3.4.1. UART
The module supports up to 2 UARTs. One is default configuration, see Table 7, and another is multiplexed from GPIO interfaces, see Table 6.

Table 7: Pin Definition of UARTs

Pin Name UART0_TXD

Multiplexing Function
–

Pin No. I/O

19

DO

UART0_RXD –

18

DI

GPIO1

UART1_TXD 4

DO

Description

Comment

UART0 transmit

UART0 receive UART1 transmit

Only used under AT solution for debugging.

UART0 can be used for AT command communication, data transmission and firmware upgrade. It supports self-configurable baud rate with default baud rate of 115200 bps. When used for firmware upgrade, the UART0 (UART0_ RXD/UART0_TXD) can only choose the pin 18 and pin 19.

The UART0 connection between the module and MCU is illustrated below.

Figure 3: UART0 Connection
The UART1 can be used as debug UART for outputting partial logs with debugging tools and supports 921600 bps baud rate by default. The following is a reference design for debug UART.

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Figure 4: Debug UART Reference Circuit

3.4.2. SWD Interface

Table 8: Pin Definition of SWD Interface

Pin Name GPIO1 GPIO2

Pin No. 4 5

Multiplexing Function I/O

SW_DIO

DIO

SW_CLK

DI

Description Serial data input and output Serial clock input

The module supports 1 SWD interface multiplexed with GPIOs. The SWD interface supports online program writing.
The common connection of SWD interface is shown below.

Figure 5: SWD Interface Connection HCM111Z_Hardware_Design

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3.4.3. I2C Interfaces
In the case of multiplexing, the module supports up to 2 I2C interfaces supporting master and slave modes, and the main features are as follows:
Support AMBA 2.0 APB bus Support standard mode (100 Kbps) and fast mode (400 Kbps) protocols Support programmable master-slave mode Support 7-bit and 10-bit addressing mode Support automatic clock extension Support programmable clock and data timing Support DMA Support universal call addresses

Table 9: Pin Definition of I2C Interfaces

Multiplexing

Pin Name Pin No.

I/O

Function

GPIO3

7

I2C1_SCL

OD

GPIO4

8

I2C1_SDA

OD

GPIO5

10

I2C0_SDA

OD

GPIO7

12

I2C0_SCL

OD

Description

Comment

I2C serial clock I2C serial data I2C serial data I2C serial clock

See Table 6 for other GPIO pins multiplexed as I2C interfaces.

3.4.4. ADC Interfaces
In the case of multiplexing, the module supports up to 4 ADC interfaces with an internal LDO voltage of 2.9 V. To improve ADC accuracy, surround ADC trace with ground.

Table 10: Pin Definition of ADC Interfaces

Pin Name Pin No. Multiplexing

I/O

Function

GPIO8

15

ADC0

AI

GPIO9

20

ADC2

AI

GPIO10

21

ADC1

AI

GPIO11

22

ADC3

AI

Description General-purpose ADC interface General-purpose ADC interface General-purpose ADC interface General-purpose ADC interface

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Table 11ADC Features

Parameter

Min.

ADC Voltage Range

0

ADC Resolution Rate

–

Bluetooth Module Series

Typ.

Max.

Unit

2.9

3.3

V

10

–

bit

3.4.5. PWM Interfaces
The module supports up to 6 PWM interfaces multiplexed with GPIOs, and the pin definitions are shown in the table below.

Table 12Pin Definition of PWM Interfaces

Pin Name GPIO9

Multiplexing

Pin No.

I/O

Function

20

PWM0

DO

GPIO11

22

PWM1

DO

UART0_RXD 18

PWM2

DO

UART0_TXD 19

PWM3

DO

GPIO8

15

PWM4

DO

GPIO10

21

PWM5

DO

Description PWM0 output PWM1 output PWM2 output PWM3 output PWM4 output PWM5 output

Comment
See Table 6 for other GPIO pins multiplexed as PWM interfaces.

3.4.6. I2S Interface*
The module supports 1 I2S interface multiplexed with GPIOs for digital audio data transmission between internal devices of the system, such as codecs, DSP, digital input/output interfaces, ADC, DAC, and digital filters.

Table 13Pin Definition of I2S Interface

Pin Name GPIO11

Pin No. 22

Multiplexing Function
I2S_DIN

I/O

Description

DI

I2S data input

GPIO9

20

I2S_DOUT

DO I2S data output

Comment
See Table 6 for other GPIO pins multiplexed as I2S interface.

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GPIO8

15

GPIO10

21

I2S_CLK I2S_WS

Bluetooth Module Series

OD

I2S clock

DIO I2S word select

3.4.7. SPI
The module supports 1 SPI multiplexed with GPIOs supporting master mode and slave mode. The maximum clock frequency can reach 20 MHz in the slave mode and 40 MHz in the holotype.

Table 14Pin Definition of SPI

Multiplexing

Pin Name Pin No.

I/O

Function

Description

Comment

GPIO3

7

SPI_MISO

DIO SPI master-in slave-out

GPIO4

8

GPIO6

11

SPI_MOSI SPI_CS

DIO SPI master-out slave-in See Table 6 for other

GPIO pins multiplexed

DIO SPI chip select

as SPI.

GPIO7

12

SPI_CLK

DIO SPI clock

The common connection of SPI is shown below.

Figure 6: SPI Connection

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4 Operating Characteristics

4.1. Power Supply
Power supply pin and ground pins of the module are defined in the following table.

Table 15: Pin Definition of Power Supply and GND Pins

Pin Name Pin No. I/O

VBAT

2

PI

GND

1, 3, 9

Description

Min.

Power supply for the module 1.8

Typ. Max. Unit

3.3

4.3

V

4.1.1. Reference Design for Power Supply
The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 100mA output current. For better power supply performance, it is recommended to parallel a 22 F decoupling capacitor, and two filter capacitors (1 F and 100 nF) near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.
VBAT reference circuit is shown below:

Figure 7: VBAT Reference Circuit HCM111Z_Hardware_Design

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4.2. Turn On
The module can automatically start up after the VBAT is powered on. The turn- on timing is shown below:

Bluetooth Module Series

Figure 8: Turn-on Timing

4.3. Reset
Pull the RESET_P up for at least 50 ms and then release it to reset the module.

Table 16: Pin Definition of RESET_P

Pin Name RESET_P

Pin No.

I/O

19

DI

Description Reset the module

Comment Hardware reset. Active high.

The reference design for resetting the module is shown below. Pull up the button directly to realize the resetting of the module. And the button needs to be connected to a large capacitor (about 10 F) in parallel. At the same time, a TVS should be placed near the button for ESD protection.

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Bluetooth Module Series
Figure 9: Reference Circuit of RESET with A Button The module reset timing is illustrated in the following figure.
Figure 10: Reset Timing
4.4. Download Mode
Keep the RESET_P at high level during resetting or power-up will enter download mode. In the download mode, the firmware can be download through the UART0 (pin 18 and 19).

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5 RF Performances

5.1. Bluetooth Performances

Table 17: Bluetooth Performances Operating Frequency 2.400­2.4835 GHz Modulation GFSK Operating Mode BLE
Condition
BLE (1 Mbps) BLE (2 Mbps)

Typ.; Unit: dBm; Tolerance: TBD

Transmitting Power

Receiving Sensitivity

8 dBm

-95 dBm ±2 dB

8 dBm

-90 dBm ±2 dB

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5.2. Antenna/Antenna Interfaces
Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
The module is provided in one of the three antenna/antenna interface designs: pin antenna interface (ANT_BT), PCB antenna and coaxial RF connector. The coaxial RF connector is not available when the module is designed with ANT_BT antenna interface or PCB antenna. The impedance of antenna port is 50 .

5.2.1. Pin Antenna Interface (ANT_BT) 5

Table 18: ANT_BT Pin Description

Pin Name ANT_BT

Pin No. 23

I/O

Description

Comment

AIO Bluetooth antenna interface 50 characteristic impedance.

5.2.1.1. Reference Design
A reference circuit for the RF antenna interface is provided below. For better RF performance, it is necessary to reserve a -type matching circuit and add an ESD protection component. Matching components such as R1, C1, C2, and D1 should be placed as close to the antenna as possible. C1, C2, and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and it is recommended to use a 0 for R1.

Figure 11: Reference Design of RF Antenna Interface

5 The module is provided in one of the three antenna/antenna interface designs. For more details, contact Quectel Technical Support.

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5.2.1.2. Antenna Design Requirements

Table 19: Antenna Design Requirements

Parameter Frequency Range (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max. input power (W) Input impedance () Polarization type

Requirement 2.400­2.4835 < 1 2 (Typ.) -3.7 (Typ.) 50 50 Vertical

Bluetooth Module Series

5.2.1.3. RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

Figure 12: Microstrip Design on a 2-layer PCB

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Bluetooth Module Series Figure 13: Coplanar Waveguide Design on a 2-layer PCB Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 . GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to the ground. The distance between the RF pins and the RF connector should be as short as possible and all
right-angle traces should be changed to curved ones. The recommended trace angle is 135°. There should be clearance under the signal pin of the antenna connector or solder joint.

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Bluetooth Module Series
The reference ground of RF traces should be complete. In addition, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be at least twice the width of RF signal traces (2 × W).
Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
For more details about RF layout, see document [2].

5.2.2. PCB Antenna 6

Table 19PCB antenna parameters

Parameter Frequency rangeGHz Impedance VSWR GaindBi Efficiency

Requirement 2.400­2.500 50 4.2 – 3.7 (Max) 18.8 %

When designed with PCB antenna, the module should be placed on the edge of the motherboard. The PCB antenna should be at least 16 mm away from the metal components, connectors, vias, traces, and copper pour area on the motherboard. On the motherboard, all PCB layers under the PCB antenna should be designed as a keepout area.

6 The module is provided in one of the three antenna/antenna interface designs. For more details, contact Quectel Technical Support.

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Bluetooth Module Series

Figure 16: Keepout Area on Motherboard
During PCB design, do not route traces across the RF test point at the bottom of the module to ensure the module performance.

Figure 17: Prohibited Area for Routing

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Bluetooth Module Series
5.2.3. Coaxial RF Connector 7
5.2.3.1. Receptacle Specifications The module provides 4th generation coaxial RF connector and the mechanical dimensions of the receptacle mounted on the module are as follows.

Figure 18: Dimensions of the Receptacle (Unit: mm)

Table 20: Major Specifications of the RF Connector (Receptacle)

Item Nominal Frequency Range Nominal Impedance Temperature Rating
Voltage Standing Wave Ratio (VSWR)

Specification
DC to 6 GHz
50
-40 °C to +85 °C Meet the requirements of: Max. 1.3 (DC­3 GHz) Max. 1.45 (3­6 GHz)

7 The module is provided in one of the three antenna/antenna interface designs. For more details, contact Quectel Technical Support.

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5.2.3.2. Antenna Connector Installation The receptacle mounted on the module accepts two types of mated plugs that will meet a maximum height of 1.2 mm using a Ø 0.81 mm coaxial cable or a maximum height of 1.45 mm utilizing a Ø 1.13 mm coaxial cable.
The following figure shows the dimensions of mated plugs using Ø 0.81 mm coaxial cables.

Figure 19: Dimensions of Mated Plugs (Ø 0.81 Coaxial Cables) (Unit: mm)
The following figure illustrates the connection between the receptacle on the module and the mated plug using a Ø 0.81 mm coaxial cable.

Figure 20: Space Factor of Mated Connectors (Ø 0.81 mm Coaxial Cables) (Unit: mm)

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Bluetooth Module Series The following figure illustrates the connection between the receptacle mounted on the module and the mated plug using a Ø 1.13 mm coaxial cable.
Figure 21: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm) 5.2.3.3. Assemble Coaxial Cable Plug Manually The pictures for plugging in a coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

Figure 22: Plug in a Coaxial Cable Plug
The pictures of pulling out the coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

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Bluetooth Module Series

Figure 23: Pull out a Coaxial Cable Plug
5.2.3.4. Assemble Coaxial Cable Plug with Jig The pictures of installing the coaxial cable plug with a jig is shown below, = 90° is acceptable, while 90° is not.

Figure 24: Install the Coaxial Cable Plug with Jig

5.2.3.5. Recommended Mated Plug and Cable Manufacturer Mated plugs and cables by IPEX are recommended. For more details, visit https://www.i-pex.com.

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Bluetooth Module Series

6 Electrical Characteristics & Reliability

6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table.

Table 21: Absolute Maximum Ratings (Unit: V)

Parameter

Min.

VBAT

-0.3

Voltage at Digital Pins

-0.3

Voltage at ADC[0:3]

0

Max. 4.3 3.3 3.3

6.2. Power Supply Ratings

Table 22: Module Power Supply Ratings (Unit: V)

Parameter Description

VBAT

Power supply for the module

Condition
The actual input voltages must be kept between the minimum and maximum values.

Min. 1.8

Typ. 3.3

Max. 4.3

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6.3. Bluetooth Power Consumption

Table 23: Power Consumption in Low Power Modes

Mode Sleep Shutdown BLE 1 Mbps @ Tx 10 dBm BLE 2 Mbps @ Tx 10 dBm

Typ. 6.2 3.1 –

Max. 21.9 14.4

Bluetooth Module Series
Unit A A mA mA

6.4. Digital I/O Characteristics

Table 24: VBAT I/O Characteristics (Unit: V)

Parameter VIH VIL VOH VOL

Description High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage

Min. 0.7 × VBAT -0.3 0.9 × VBAT 0

Max. VBAT 0.3 × VBAT VBAT 0.1 × VBAT

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6.5. ESD Protection
Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 25: ESD Characteristics (Unit: kV)

Model Human Body Model (HBM) Charged Device Model (CDM)

Test Result ±4 ±0.5

Standard ANSI/ESDA/JEDEC JS-001-2017 ANSI/ESDA/JEDEC JS-002-2018

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Bluetooth Module Series
7 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
7.1. Mechanical Dimensions

Figure 25: Top and Side Dimensions

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Bluetooth Module Series

Figure 26: Bottom Dimensions (Bottom View)
NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.

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7.2. Recommended Footprint

Bluetooth Module Series

Figure 27: Recommended Footprint
NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

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7.3. Top and Bottom Views

Bluetooth Module Series

Figure 28: Top and Bottom Views (Pin Antenna Interface)

Figure 29: Top and Bottom Views (Coaxial RF Connector)

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Bluetooth Module Series

Figure 30: Top and Bottom Views (PCB Antenna)
NOTE 1. Images above are for illustrative purposes only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel. 2. The coaxial RF connector is not available when the module is designed with pin antenna interface
(ANT_BT) or PCB antenna.

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Bluetooth Module Series

8 Storage and Packaging
8.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35­60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 8 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the third requirement mentioned above; Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours; Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

8 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

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NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti- static gloves, when touching the modules.
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15­0.18 mm. For more details, see document [3].
The recommended peak reflow temperature should be 235­246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Figure 31: Recommended Reflow Soldering Thermal Profile

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Bluetooth Module Series

Table 26: Recommended Thermal Profile Parameters

Factor Soak Zone Ramp-to-soak slope Soak time (between A and B: 150 °C and 200 °C) Reflow Zone Ramp-up slope Reflow time (D: over 217 °C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle

Recommended Value
0­3 °C/s 70­120 s
0­3 °C/s 40­70 s 235­246 °C -3­0 °C/s
1

NOTE
1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

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8.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:
8.3.1. Carrier Tape
Dimension details are as follow:

Figure 32: Tape Specifications

Table 27: Carrier Tape Dimension Table (Unit: mm)

W

P

T

A0

B0

K0

K1

32

24

0.4

12.4

15.4

2.75

4.5

F

E

14.2

1.75

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8.3.2. Plastic Reel

Bluetooth Module Series

Figure 33: Plastic Reel Dimension Drawing

Table 28: Plastic Reel Dimension Table (Unit: mm)

øD1

øD2

W

330

100

32.5

8.3.3. Mounting Direction

Figure 34: Mounting Direction HCM111Z_Hardware_Design

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8.3.4. Packaging Process

Bluetooth Module Series
Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.

Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

Place the vacuum-packed plastic reel into the pizza box.

Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.
Figure 35: Packaging Process
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9 Appendix References

Table 29: Reference Documents
Document Name [1] Quectel_HCM111Z_TE-B_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note

Table 30: Terms and Abbreviations

Abbreviation ADC AMBA APB ARM BLE CDM DAC DMA DSP ESD EVB GFSK GND

Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Advanced RISC Machine Bluetooth Low Energy Charged Device Model Digital-to-Analog Converter Direct Memory Access Digital Signal Processor Electrostatic Discharge Evaluation Board Gauss frequency Shift Keying Ground

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GPIO HBM I/O I2C I2S LCC LDO LED Mbps MCU OTA PCB PWM RF RoHS SPI SRAM SWD TBD TVS UART VIH VIL Vmax Vmin

Bluetooth Module Series
General-Purpose Input/Output Human Body Model Input/Output Inter-Integrated Circuit Inter-IC Sound Leadless Chip Carrier (package) Low-dropout Regulator Light Emitting Diode Million Bits Per Second Microcontroller Unit Over-The-Air Printed Circuit Board Pulse Width Modulation Radio Frequency Restriction of Hazardous Substances Serial Peripheral Interface Static Random-Access Memory Serial Wire Debug To Be Determined Transient Voltage Suppressor Universal Asynchronous Receiver/Transmitter High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage

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Vnom

Nominal Voltage Value

VOH

High-level Output Voltage

VOL

Low-level Output Voltage

VSWR

Voltage Standing Wave Ratio

Modifications:

Any changes or modifications not expressly approved by Quectel or the party responsible for

compliance could void the user’s authority to operate the equipment and invalidate the regulatory approval. Host manufacturer must follow KDB Publication 996369 D04 Modulen Integration Guide.

Host manufacturer is responsible for regression tests to show compliance to the applicable standards

due to the following actions:

1. any modification done to the module.

2. Integration of the module into a host device

Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host

not covered by the modular transmitter grant of certification.

Final host product is required to show compliance to Part 15 Subpart B with the modular transmitter

installed Product Marketing NameQuectel HCM111Z

FCC Certification Requirements.

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a

mobile device.

This device has been tested in accordance with FCC Part 15.247. For more detailed test mode configuration, OEM can contact manufacture for specific instruction.

And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna

installation and operating configurations of this transmitter, including any applicable source-based

timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion

Requirements of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter.

3. A label with the following statements must be attached to the host end product:

This device contains FCC ID: XMR2023HCM111Z

4. Antenna Requirements:

· The following antennae were approved with the modules:

Operating

Frequency

Antenna Gain (dBi)

Band

(MHz)

Bluetooth

2400~2483.5

-3.70 dBi

· The product is provided with an approved antenna. Use only supplied or approved antenna by Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for

the product.

· Host device must comply with FCC Part 15 antenna requirements

· The OEM must design the host so that the antenna will be installed as an integrated antenna for the host containing the HCM111Z and the end user shall not be able to access, remove or replace the

antenna.

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements and conditions

that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is

required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

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Bluetooth Module Series
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID – Section 2.926 (see 2.2 Certification (labeling

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requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2023HCM111Z” or “Contains FCC ID: XMR2023HCM111Z” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN “This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.” or “Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.” Déclaration sur l’exposition aux rayonnements RF L’autre utilisé pour l’émetteur doit être installé pour fournir une distance de séparation d’au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A- 2023HCM111Z” or “where: 10224A-2023HCM111Z is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte. L’étiquette de certification d’Innovation, Sciences et Développement économique Canada d’un module doit être clairement visible en tout temps lorsqu’il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d’Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d’un libellé semblable exprimant la même signification, comme suit: “Contient IC: 10224A-2023HCM111Z ” ou “où: 10224A- 2023HCM111Z est le numéro de certification du module”.

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References

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