QUECTEL FLM040D Series Wi-Fi and Bluetooth Module User Manual

FLM040D
HardwareDesign

FLM040D Series Wi-Fi and Bluetooth Module

Wi-Fi & Bluetooth Module Series

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available™ basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
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Trademarks

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Third-Party Rights
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Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular or mobile terminal incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety precautions by incorporating them into all product manuals.
Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular or mobile terminal before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. If emergency assistance is needed, use emergency call if the device supports it. To make or receive a call, the cellular or mobile terminal must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method since network connection cannot be guaranteed under all circumstances.
The cellular or mobile terminal contains a transceiver. When it is ON, it receives and transmits radio signals. RF interference can occur if it is used close to TV sets, radios, computers, or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

QuecOpen® is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:

• Realize embedded applications’ quick development and shorten product R&D cycle
• Simplify circuit and hardware structure design to reduce engineering costs
• Miniaturize products
• Reduce product power consumption
• Apply OTA technology
• Enhance product competitiveness and price-performance ratio

This document defines FLM040D in QuecOpen® solution and describes its air interfaces and hardware interfaces, which are connected with your applications. It is used in these fields: Smart Home, Smart Devices, Smart Building, Home Automation, Smart Hospitality.
With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
Hereby, Quectel Wireless Solutions Co., Ltd.declares that the radio equipment type FLMO040D is in compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body.
Table 1: Special Marks
Mark Definition
Unless otherwise specified, when an asterisk () is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk () after a model indicates that the sample of the model is currently unavailable.
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. For
[…] example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATAO, SDIO_DATAL, SDIO_DATA?2, and SDIO_DATA3.

Product Overview

2.1. General Description
FLMO040D is a high-performance MCU Wi-Fi and Bluetooth module for smart-home and industrial IoT terminals supporting IEEE 802.11b/g/n and Bluetooth 5.2 standards. The module, featuring a built-in high-performance chip antenna, provides ADC and multiple PWM interfaces for various applications.
FLMO040D is a wave-soldering module with compact package. It includes:

• A 32-bit MCU running up to 120 MHz
• Built-in 256 KB RAM and 4 MB Flash
• Supporting secondary development

Table 2: Basic Information
FLM040D

2.2. Key Features
Table 3: Key Features
Basic Information

Protocols and Standards

• Wi-Fi Protocols: IEEE 802.11 b/g/n
• Bluetooth protocol: Bluetooth 5.2
• All hardware components are fully compliant with EU RoHS directive

VBAT Power Supply:
Power Supply

• 3036V
• Typ.:33V

Temperature Ranges

• Operating temperature ‘: -40 to +105 °C
• Storage temperature: -45 to +115 °C

EVBKit FLMO040D TE-B 2
RF Antenna Interface
Antenna Interface .

• Chip antenna
• 50 Qimpedance

Application Interface³
Application Interfaces PWM, ADC

1. Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications
2. For more details about the EVB, see document [1].
3. For more details about the interfaces, see Chapter 3.3 and Chapter 3.4.

pplication Interfaces

3.1. Pin Assignment

1. The module supports PWM x 6 and ADC x 2 multiplexed with up to 6 GPIO pins. For more details, see Chapter 3.3 and Chapter 3.4.
2. The TP1-6 are all test points.
3. All GND pins should be connected to ground.

3.2. Pin Description
Table 4: O Parameter Description

Table 5: Pin Description
PowerSupply

Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
---|---|---|---|---|---
V13:\ I| 6| 1’1| Power supply for the module| Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V| It must be provided with sufficient current more than 0.3 A.
GND| 8| | | |

GPIO Interfaces

Pin Name| Pin Ni 0.| 1’0| Description| DC Characteristics| Comment
---|---|---|---|---|---
GP109| 1| 1)10| | VBAT| Interrupt wakeup.
GP108| | 1)10
GP106| | 1)10| General-purpose
GP107| | 1)10| input/output
GPIO24| | 1) (
GPIO26| 7| I) H|

Control Signal

Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
---|---|---|---|---|---
CEN| TP4| | Enable the module (default)| | I lardware enable;
Internally pulled up to 3.3 V; \ctive high.
DI| Resets the module| VBAT| I lardware reset;
Internally pulled up to 3.3 V; Active low.
UARTs| | |
Pin Name| Pin No| I/O| Description| DC Characteristics| Comment
MAIN TXD—| TP3| DO| Main UART transmit| VBAT|
MAIN RXD—| TP2| 1)1| Main UART receive|
DBG TXD –| TP1| 1)0| Debug U:\R R I transmit| VBAT| Pull it down to GND with a 4.7 kfl resistor for RF non-signaling test.
Other Signals|
Pin Name| Pin no| I/O| Description| DC Characteristics| Comment
CSN| TP5| RI| Dedicated GPIO| Vl3AT| Connect it to GND as UART GND.
GND| TP6| | | |

3.3. GPIO Multiplexing
The module provides 6 GPIO interfaces by default. Pins are defined as follows:
Table 7: GPIO Multiplexing

Pin Name| Pin No.| Alternate Function 0 (GPIO No.)| Alternate Function 1| Alternate Function 2| Alternate Function 3
---|---|---|---|---|---
GPIO9| 1| GPIO9| BT PRIORITY| PWM3| –
GPIO8| 2| GPIO8| BLAC TINT| PWM2| –
GPIO6| 3| GPIO6| 13M CLK OUT| PWMO| –
GPIO7| 4| GPIO7| WITIACTIVE| PWM1| –
GP1024| 5| GPIO24| ADC2| 32KCLK OUT| PWM4
GPIO26| 7| GPIO26| ADC 1| IRDA| PWM5

All GPIOs can be configured as interrupt source to interrupt the system in active mode or to wake it up from low power mode.

3.4. Application Interfaces
3.4.1.UARTs
The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. It provides the main UART and the debug UART supporting DBG_TXD only.
Table 8: Pin Definition of UART

esistor for RF non-signaling test.

The main UART can be used for AT command communication and data transmission. It sends and receives instruction data during downloading and debugging. The default baud rate is 115200 bps, and the maximum baud rate can reach 6 Mbps. The main UART is also available for firmware upgrade and supports a default baud rate of 921600 bps.
The main UART connection between DCE and DTE is illustrated below.
The debug UART supports 115200 bps baud rate by default, and is used for outputting partial logs with debugging
tools. The module enters RF non-signaling mode when pull DBG_TXD down to GND with a 4.7 kQ resistor.

**3.4.2.PWM Interfaces*
The module supports 6 PWM channels by default. Pin description of PWM interfaces are as follows.
Table 9: Pin Definition of PWM Interfaces**

**3.4.3. ADC Interfaces*
The module supports 2 ADC interfaces by default, whose voltage range is 0-2.4 V. To improve ADC accuracy, surround ADC trace with ground.
Table 10: Pin Definition of ADC Interfaces**

Table 11: ADC Features

3.5. RF Antenna Interface
The module provides a built-in high-performance chip antenna.
3.5.1. Operating Frequencies
The operating frequencies of the module are listed below:
Table 12: Operating Frequencies (Unit: GHz)

3.5.2. Chip Antenna
Table 13: Chip Antenna Specifications

When using the chip antenna on the module, the module should be placed at the side of the motherboard. The distance between the chip antenna and connectors, vias, traces pin headers, ethernet port and any other metal components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard under the chip antenna should be designed as a keepout area.

Operating Characteristics

4.1. Power Supply
Power supply pin and ground pins of the module are defined in the following table.
Table 14: Pin Definition of Power Supply and GND Pins

4.1.1.Reference Design for Power Supply
The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 0.3 A output current. For better power supply performance, it is recommended to parallel a 22 pF decoupling capacitor, and two filter capacitors (1 pF and 100 nF) near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:

4.2. Turn On
After the module VBAT is powered on, keep the CEN pin at high level to realize the automatic startup of the module.
Table 15: Pin Definition of CEN

V; Active high.

The turn-on timing is shown below:

4.3. Reset
Drive CEN low for at least 100 ms and then release it to reset the module.
Table 16: Pin Definition of CEN

Internally pulled up to 3.3 V;
Active low.

The reference design for resetting the module are shown below. An open collector driving circuit can be used to control the CEN pin. Another way to control the CEN is by using a button directly. When pressing the button, an electrostatic strike may generate from finger. Therefore, a TVS component shall be placed near the button for ESD protection. The module reset timing is illustrated in the following figure. 4.4. Download Mode
Keep the input signal of CEN at low level during resetting or power-up and the module will enter download mode.
In the download mode, the firmware can be download through the main UART. During the hardware design, the CEN pin of the module is connected to the RTS of the serial port chip, or the GPIO is controlled according to the following waveform, otherwise the download will fail.

RF Performances

5.1. Wi-Fi Performances
Table 17: Wi-Fi Performances
Operating Frequency
2.4 GHz: 2.400-2.4835 GHz
Modulation
BPSK, QPSK, CCK, 16QAM, 64QAM
Operating Mode

• AP
• STA

Transmission Data Rate

• 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
• 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps
• 802.11n: HT20 (MCS 0-7)

5.2. Bluetooth Performances
Table 18: Bluetooth Performances
Operating Frequency
2.400~2.4835 GHz
Modulation
GFSK
Operating Mode
BLE

Electrical Characteristics & Reliability

6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table.
Table 19: Absolute Maximum Ratings (Unit: V)

62. Power Supply Ratings
Table 20: Module Power Supply Ratings (Unit: V)

Parameter| Description| Condition| Min.| Typ.| Max.
---|---|---|---|---|---
VBAT| Power supply for
the module| The actual input voltages must be kept between the minimum and maximum
values.| 3| 3.3| 3.6

6.3.Wi-FiPower Consumption
Table21: Power Consumptionin Low Power Modes

Table 22 :Power Consumptionin Non-signaling Modes (Unit:mA)

6.4. Digital I/O Characteristics
Table 23: VBAT I/O Characteristics (Unit:V)

6.5. ESD Protection
Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; dd ESD protection components to the ESD sensitive interfaces and points in  the product design.
Table 24: ESD Characteristics (Unit: kV)

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are +0.2 mm unless otherwise specified.
7.1. Mechanical Dimensions NOTE
The package warpage level of the module conforms to the JEIT A ED-7306 standard.
7.2. Recommended Footprint NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.
7.3. Top and Bottom Views

NOTE
Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage and Packaging

8.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements  are shown below.

1. Recommended Storage Condition: the temperature should be 23 +5 °C and the relative humidity should be 35-60 %.

2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.

3.  Floor life: 168 hours ‘ ina factory where the temperature is 23 +5 °C and relative humidity is below 60 %.
   Afier the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   The module is not stored in Recommended Storage Condition;
   Violation of the third requirement mentioned above:
   Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   Before module repairing.

5. If needed, the pre-baking should follow the requirements below:
   The module should be baked for 8 hours at 120 +5 °C;
   The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.

NOTE
* This floor life is only applicable when the environment conforms to /PCJEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, of are not sure to contorm to /PCJEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see /PCJEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

8.2. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only.
The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:
8.2.1. Carrier Tape
Carrier tape dimensions are detailed below:

Table 25: Carrier Tape Dimension Table (Unit:mm)

8.2.2. Plastic Reel

Table 26: Plastic Reel Dimension Table (Unit:mm)

8.2.3. Packaging Process
Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. | plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and | desiccant bag into a vacuum bag, then vacuumize it.

Place the vacuum-packed plastic reel inside the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.

Appendix References

Table 27: Reference Documents
Document Name
[1] Quectel_FLM040D_TE-B_User_Guide
Table 28: Terms and Abbreviations

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part
   15 Subpart B , the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (ic. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part
   15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
   The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note

notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC 1D (XMR2023FLM040D) procedure followed by a Class II permissive change application.

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. [f not, a second label must be placed on the outside of the final device that contains the following text:
“Contains FCC ID:
XMR2023FLM040D”
“Contains IC: 10224A-2023FLM040D
The FCC ID/IC 1D can be used only when all FCC/AC compliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with this module.

Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna type| 2.4 GHz band Peak
Gain (dBi)| 5.2GHz band Peak
Gain (dBi)| 5.3GHz band Peak
Gain (dBi)| 5.5 GHz band Peak
Gain (dBi)| 5.8GHz band Peak
Gain (dBi)
---|---|---|---|---|---
PIFA| 2.01| /| /| /| /

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

**Federal Communication Commission Interference Statement

**

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with 15.247 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
This device is intended only for OEM integrators under the following conditions:
(For module device use)

• The antenna must be installed such that 20 cm is maintained between the antenna and users, and
• The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.

Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

This device is intended only for OEM integrators under the following

conditions: (For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be  labeled in a visible area with the following: “Contains IC:10224A-2023FLM040D”.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

References

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