Lenovo 4X67A81102 AMD Instinct MI210 Accelerator User Guide

Lenovo 4X67A81102 AMD Instinct MI210 Accelerator

Product Information

Specifications

• Product Name: AMD Instinct MI210 Accelerator

• Compute Workhorse: Optimized for accelerating single-precision and double-precision HPC-class systems

• Usage: Suitable for training large-scale machine intelligence workloads

• Compute Engine: Powerful compute engine

• Matrix Math FP64 Cores: New matrix math FP64 cores

• Memory Architecture: Advanced memory architecture

• Software Platform: AMD’s ROCm open software platform

• Ecosystem: AMD’s ecosystem is designed to meet the challenges of a new era of computing

• Compatibility: ThinkSystem SR670 V2 supports 8x MI210 Accelerator

• Infinity Fabric Link Bridge Cards: Connect multiple GPUs
  together with high-speed P2P connectivity

• Peer-to-Peer Bandwidth Performance: Three Infinity Fabric links with 300 GB/s of Peer-to-Peer (P2P) bandwidth performance

• Total Theoretical GPU Bandwidth: Up to 1.2 TB/s

• Part Number 1: 4X67A81102

• Part Number 2: 4X67A82325

Description

The ThinkSystem AMD Instinct MI210 Accelerator is a computing workhorse optimized for accelerating single-precision and double-precision HPC-class systems. It can also be deployed for training large-scale machine intelligence workloads. The accelerator features a powerful compute engine, new matrix math FP64 cores, and advanced memory architecture. It is designed to help data center designers meet the challenges of a new era of computing. The accelerator is part of the AMD Instinct series and is compatible with the ThinkSystem SR670 V2.

Features

• Exascale-Class Technologies for the Data Center

• Purpose-built Accelerators for HPC & AI Workloads

• Powered by the 2nd Gen AMD CDNA architecture

• Delivers HPC performance leadership in FP64

• Built to accelerate deep learning training

• Expanded range of mixed-precision capabilities based on the AMD
  Matrix Core Technology

• Delivers an outstanding 181 teraflops peak theoretical FP16 and
  BF16 performance

• Innovations Delivering Performance Leadership

• Unifies CPU and GPU accelerator

• Double-precision Matrix Core capabilities

• 3rd Gen AMD Infinity Architecture

• Ecosystem without Borders

• 2nd Generation AMD CDNA Architecture

• AMD Infinity Fabric Link Technology

• Ultra-Fast HBM2e Memory

Usage Instructions

Step 1: Installation

1. Ensure your system is compatible with the AMD Instinct MI210 Accelerator.
2. If necessary, install the ThinkSystem SR670 V2 to support the accelerator.
3. Connect the MI210 Accelerator to an available PCIe slot on your system.
4. If using multiple accelerators, connect them using Infinity Fabric Link Bridge Cards.
5. Attach the full-height (3U) adapter bracket to the MI210 Accelerator.

Step 2: Configuration

1. Install the necessary drivers and software for the AMD Instinct MI210 Accelerator.
2. Configure the accelerator settings according to your system requirements.
3. Ensure that the accelerator is properly recognized by your system.

Step 3: Usage

1. Refer to the documentation provided with the MI210 Accelerator for specific usage instructions related to your workload.
2. Utilize the powerful compute engine and advanced memory architecture of the accelerator to accelerate your HPC and AI workloads.
3. Take advantage of the mixed-precision capabilities and performance leadership offered by the AMD Instinct MI210 Accelerator.

FAQ

Q: What is the part number for the MI210 Accelerator?

• A: The part number for the MI210 Accelerator is 4X67A81102.

Q: What is the clock rate of the HBM2e memory?

• A: The clock rate of the HBM2e memory is 1.6 GHz.

Q: How much memory bandwidth does the MI210 Accelerator provide?

• A: The MI210 Accelerator provides an ultra-high 1.6 TB/s of memory bandwidth.

AMD Instinct MI210 Accelerator Product Guide

• The ThinkSystem AMD Instinct MI210 Accelerator is a computing workhorse optimized for accelerating single-precision and double-precision HPC-class systems. The accelerator can also be deployed for training large-scale machine intelligence workloads.
• The accelerator’s powerful compute engine, new matrix math FP64 cores, and advanced memory architecture, combined with AMD’s ROCm open software platform and ecosystem, provide a powerful, flexible heterogeneous compute solution that is designed to help data center designers meet the challenges of a new era of compute.

Did you know?

The ThinkSystem SR670 V2 supports 8x MI210 Accelerator and these GPUs can be connected using 2x Infinity Fabric Link Bridge Cards, connecting two sets of four GPUs. Each accelerator has three Infinity Fabric links with 300 GB/s of Peer-to-Peer (P2P) bandwidth performance. The AMD Infinity Architecture enables platform designs with direct-connect GPU hives with high-speed P2P connectivity and delivers up to 1.2 TB/s of total theoretical GPU bandwidth.

Click here to check for updates

Part number information

The following table shows the part numbers for the MI210 Accelerator.

Table 1. Ordering information

Bridge Card

The PCIe option part number includes the following:

• One MI210 Accelerator with full-height (3U) adapter bracket attached
• Documentation
• Each Infinity Fabric Link Bridge Card connects four MI210 Accelerators.

Features

• The AMD Instinct MI210 accelerator offers the following features:

Exascale-Class Technologies for the Data Center

The AMD Instinct MI210 accelerator extends AMD industry performance leadership in accelerated compute for double precision (FP64) on PCIe form factors for mainstream HPC and AI workloads in the data center. Built on AMD Exascale- class technologies with the 2nd Gen AMD CDNA architecture, the MI210 enables scientists and researchers to tackle our most pressing challenges from climate change to vaccine research. MI210 accelerators, combined with the AMD ROCm 5 software ecosystem, allow innovators to tap the power of HPC and AI data center PCIe GPUs to accelerate their time to science and discovery.

Purpose-built Accelerators for HPC & AI Workloads

Powered by the 2nd Gen AMD CDNA architecture, AMD Instinct MI210 accelerator delivers HPC performance leadership in FP64 for a broad set of HPC & AI applications. The MI210 accelerator is built to accelerate deep learning training, providing an expanded range of mixed-precision capabilities based on the AMD Matrix Core Technology, and delivers an outstanding 181 teraflops peak theoretical FP16 and BF16 performance to bring users a powerful platform to fuel the convergence of HPC and AI.

Innovations Delivering Performance Leadership

AMD innovations in architecture, packaging and integration are pushing the boundaries of computing by unifying the most important processors in the data center, the CPU, and the GPU accelerator. With our innovative double-precision Matrix Core capabilities along with the 3rd Gen AMD Infinity Architecture, AMD is delivering performance, efficiency and overall system throughput for HPC and AI using AMD EPYC CPUs and AMD Instinct MI210 accelerators.

Ecosystem without Borders

AMD ROCm is an open software platform allowing researchers to tap the power of AMD Instinct accelerators to drive scientific discoveries. The ROCm platform is built on the foundation of open portability, supporting environments across multiple accelerator vendors and architectures. With ROCm 5, AMD extends its platform powering top HPC and AI applications with AMD Instinct MI200 series accelerators, increasing accessibility of ROCm for developers and delivering outstanding performance across key workloads.

2nd Generation AMD CDNA Architecture

• The AMD Instinct MI210 accelerator brings commercial HPC & AI customers the compute engine selected for the first U.S. Exascale supercomputer. Powered by the 2nd Gen AMD CDNA architecture, the MI210 accelerator delivers outstanding performance for HPC and AI. The MI210 PCIe GPU delivers superior double and single precision performance for HPC workloads with up to 22.6 TFLOPS peak FP64|FP32 performance, enabling scientists and researchers around the globe to process HPC parallel codes more efficiently across several industries.
• AMD’s Matrix Core technology delivers a broad range of mixed precision operations bringing you the ability to work with large models and enhance memory-bound operation performance for whatever combination of AI and machine learning workloads you need to deploy. The MI210 offers optimized BF16, INT4, INT8, FP16, FP32, and FP32 Matrix capabilities bringing you supercharged compute performance to meet all your AI system requirements. The AMD Instinct MI210 accelerator handles large data efficiently for training and delivers 181 teraflops of peak FP16 and bfloat16 floating-point performance for deep learning training.

AMD Infinity Fabric Link Technology

• AMD Instinct MI210 GPUs provide advanced I/O capabilities in standard off-the-shelf servers with our AMD Infinity Fabric technology and PCIe Gen4 support. The MI210 GPU delivers 64 GB/s CPU to GPU bandwidth without the need for PCIe switches, and up to 300 GB/s of Peer-to-Peer (P2P) bandwidth performance through three Infinity Fabric links.
• The AMD Infinity Architecture enables platform designs with dual and quad, direct-connect, GPU hives with high-speed P2P connectivity and delivers up to 1.2 TB/s of total theoretical GPU bandwidth within a server design. Infinity Fabric helps unlock the promise of accelerated computing, enabling a quick and simple onramp for CPU codes to accelerated platforms.

Ultra-Fast HBM2e Memory

AMD Instinct MI210 accelerators provide up to 64GB High-bandwidth HBM2e memory with ECC support at a clock rate of 1.6 GHz. and deliver an ultra-high 1.6 TB/s of memory bandwidth to help support your largest data sets and eliminate bottlenecks moving data in and out of memory. Combine this performance with the MI210’s advanced Infinity Fabric I/O capabilities and you can push workloads closer to their full potential.

Technical specifications

The following table lists the MI210 Accelerator specifications.

Table 2. Technical specifications

number 4X67A82325)
Board Form Factor:| Full-Height, Full-Length, Dual-Slot
Thermal Solution:| Passively Cooled
Standard Max Power:| 300W TDP
OS Support:| Linux 64-bit
ROCm Software Platform:| ROCm 5.0
Programming Environment:| OpenMP, OpenCL, ISO C++ (via HIP conversion tool), CUDA (via HIP conversion tool)

Server support

The following tables list the ThinkSystem servers that are compatible.

Table 3. Server support (Part 1 of 3)

Part Number| Description| Edge| 1S Intel V2| AMD V3| Intel V3
---|---|---|---|---|---
SE350 (7Z46 / 7D1X)| SE350 V2 (7DA9)| SE360 V2 (7DAM)| SE450 (7D8T)| SE455 V3 (7DBY)| ST50 V2 (7D8K / 7D8J)| ST250 V2 (7D8G / 7D8F)| SR250 V2 (7D7R / 7D7Q)| SR635 V3 (7D9H / 7D9G)| SR655 V3 (7D9F / 7D9E)| SR645 V3 (7D9D / 7D9C)| SR665 V3 (7D9B / 7D9A)| SR675 V3 (7D9Q / 7D9R)| ST650 V3 (7D7B / 7D7A)| SR630 V3 (7D72 / 7D73)| SR650 V3 (7D75 / 7D76)| SR850 V3 (7D97 / 7D96)| SR860 V3 (7D94 / 7D93)| SR950 V3 (7DC5 / 7DC4)
4X67A81102| ThinkSystem AMD Instinct MI210 PCIe Gen4 Passive Accelerator| N| N| N| N| N| N| N| N| N| 3| N| 3| 8| N| N| 3| 2| 4| N
4X67A82325| ThinkSystem AMD Instinct MI210 4x Infinity Fabric Link Bridge Card| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N

Table 4. Server support (Part 2 of 3)

Part Number| Description| Dense V3| 2S Intel V2| AMD V1| Dense V2| 4S V2| 8S
---|---|---|---|---|---|---|---
SD665 V3 (7D9P)| SD665-N V3 (7DAZ)| SD650 V3 (7D7M)| SD650-I V3 (7D7L)| ST650 V2 (7Z75 / 7Z74)| SR630 V2 (7Z70 / 7Z71)| SR650 V2 (7Z72 / 7Z73)| SR670 V2 (7Z22 / 7Z23)| SR635 (7Y98 / 7Y99)| SR655 (7Y00 / 7Z01)| SR655 Client OS| SR645 (7D2Y / 7D2X)| SR665 (7D2W / 7D2V)| SD630 V2 (7D1K)| SD650 V2 (7D1M)| SD650-N V2 (7D1N)| SN550 V2 (7Z69)| SR850 V2 (7D31 / 7D32)| SR860 V2 (7Z59 / 7Z60)| SR950 (7X11 / 7X12)
4X67A81102| ThinkSystem AMD Instinct MI210 PCIe Gen4 Passive Accelerator| N| N| N| N| N| N| 3| 8| N| 21| N| N| 31| N| N| N| N| N| N| N
4X67A82325| ThinkSystem AMD Instinct MI210 4x Infinity Fabric Link Bridge Card| N| N| N| N| N| N| N| Y| N| N| N| N| N| N| N| N| N| N| N| N

1. Supported only with EPYC 7003 “Milan” processors. Not supported with EPYC 7002 “Rome” processors

Table 5. Server support (Part 3 of 3)

Part Number| Description| 4S V1| 1S Intel V1| 2S Intel V1| Dense V1
---|---|---|---|---|---
SR850 (7X18 / 7X19)| SR850P (7D2F / 2D2G)| SR860 (7X69 / 7X70)| ST50 (7Y48 / 7Y50)| ST250 (7Y45 / 7Y46)| SR150 (7Y54)| SR250 (7Y52 / 7Y51)| ST550 (7X09 / 7X10)| SR530 (7X07 / 7X08)| SR550 (7X03 / 7X04)| SR570 (7Y02 / 7Y03)| SR590 (7X98 / 7X99)| SR630 (7X01 / 7X02)| SR650 (7X05 / 7X06)| SR670 (7Y36 / 7Y37)| SD530 (7X21)| SD650 (7X58)| SN550 (7X16)| SN850 (7X15)
4X67A81102| ThinkSystem AMD Instinct MI210 PCIe Gen4 Passive Accelerator| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N
4X67A82325| ThinkSystem AMD Instinct MI210 4x Infinity Fabric Link Bridge Card| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N| N

Operating system support

The following table lists the supported operating systems:

• Tip: These tables are automatically generated based on data from Lenovo ServerProven.
• Table 6. Operating system support for ThinkSystem AMD Instinct MI210 PCIe Gen4 Passive Accelerator, 4X67A81102

Operating systems| SR650 V3| SR655 V3| SR665 V3| SR675 V3| SR850 V3| SR860 V3| SR650 V2| SR670 V2| SR655| SR665
---|---|---|---|---|---|---|---|---|---|---
Red Hat Enterprise Linux 7.9| N| N| N| N| N| N| Y| Y| N| N
Red Hat Enterprise Linux 8.3| N| N| N| N| N| N| Y| N| N| N
Red Hat Enterprise Linux 8.4| N| N| N| N| N| N| Y| Y| Y 1| Y 1
Red Hat Enterprise Linux 8.5| N| N| N| N| N| N| Y| Y| Y 1| Y 1
Red Hat Enterprise Linux 8.6| Y| Y| Y| Y| Y| Y| Y| Y| Y 1| Y 1
Red Hat Enterprise Linux 9.0| Y| Y| Y| Y| Y| Y| Y| Y| Y 1| Y 1
SUSE Linux Enterprise Server 15 SP3| N| N| N| N| N| N| Y| Y| Y 1| Y 1
SUSE Linux Enterprise Server 15 SP4| Y| Y| Y| Y| Y| Y| Y| Y| Y 1| Y 1
Ubuntu 18.04.5 LTS| N| N| N| N| N| N| Y| Y| N| N
Ubuntu 20.04 LTS| N| N| N| N| N| N| Y| N| N| N
Ubuntu 20.04.5 LTS| N| Y| Y| Y| Y| Y| N| N| N| N
Ubuntu 22.04 LTS| Y| Y| Y| Y| Y| Y| Y| Y| Y 1| Y 1

1. HW is not supported with EPYC 7002 processors.

Auxiliary power cables

The MI210 Accelerator option part number does not ship with auxiliary power cables.
Table 7. Auxiliary power cables for MI210 (click images to show larger versions)

Auxiliary power cables supplied with the SR655

350mm 8pin (2×4) cable Server support : SR655 (Riser 1 or Riser 2) Option: 4X97A59853,

ThinkSystem SR655 GPU Cable Kit

Feature : B5T5 SBB : SBB7A14640 Base : SC17A50848 FRU : 02JK011

250mm 8pin (2×4) cable Server support : SR655 (Riser 3)

Option : 4X97A59853,

ThinkSystem SR655 GPU Cable Kit

Feature : B5TS SBB : SBB7A10974 Base : SC17A50844 FRU : 02JK010

Auxiliary power cables needed with the SR650 V3, SR655 V3, SR665 V3, SR650 V2, SR665
360mm 8pin (2×4) cable Option *:

SR665: 4M17A80478 / 4M17A11759,

ThinkSystem SR665 GPU Thermal Option Kit v2

SR650 V2: 4H47A38666 / 4H47A80491, ThinkSystem SR650 V2 GPU Full Length Thermal Option Kit v2 SR650 V3: 4X67A82883, ThinkSystem SR650 V3 GPU Full Length Thermal Option Kit

SR655 V3: 4X67A86438, ThinkSystem SR655 V3 GPU Enablement Kit

SR665 V3: 4X67A85856, ThinkSystem SR665 V3 GPU Full Length Thermal Option Kit

Feature : BAD8

SBB : SBB7A49792 or SBB7A21691 Base : SC17A95312 or SC17A59596 FRU : 03HA297 or 02YE420

• The option part numbers are for thermal kits and include other components needed to install the GPU. See the server product guide for details.

An auxiliary power cable needed with the SR670 V2
215mm 8pin (2×4) cable

Option : 4X97A69627, ThinkSystem SR670 V2 GPU Option Power Cable Feature : BFNL

SBB : SBB7A40281 Base : SC17A10990 FRU : 02YE945

An auxiliary power cable is needed with the SR675 V3
235mm 8pin (2×4) cable

Option : 4X97A84509, ThinkSystem SR675 V3 GPU Power Cable Kit Feature : BRGU

SBB : SBB7A65297 Base : SC17B39302 FRU : 03LE555

Auxiliary power cable needed with the SR850 V3 or SR860 V3
200mm 8pin (2×4) cable Option : 4X97A88017,

ThinkSystem SR850 V3/SR860 V3 A100/A6000/MI210 GPU

Power Cable Option Kit

Feature : BTPB SBB : SBB7A72760 Base : SC17B40606 FRU : 03LF917

Regulatory approvals

The MI210 Accelerator has the following regulatory approvals:

• Electromagnetic Compliance
  • Australia and New Zealand: CISPR 32: 2015 +COR1: 2016, Class A
  • Canada ICES-003, Issue 7, Class A
  • European Countries: EN 55032: 2015 + A11: 2020 Class B, EN 55024: 2010, EN 55035: 2017
  • Japan VCCI-CISPR32:2016, VCCI 32-1: 2016 Class A
  • Korea KN32, Class A, KN35, RRA Public Notification 2019-32
  • Taiwan CNS 13438: 2016, C6357, Class A
  • USA FCC 47 CFR Part 15, Subpart B, Class A
• Product Safety Compliance
  • UL 62368-1, 2nd Edition, 2014-12
  • CSA-C22.2 No. 62368-1, 2nd Edition, 2014-12
  • EN 62368-1, 2nd Edition, 2014 + A1: 2017
  • IEC 62368-1, 2nd Edition, 2014
  • RoHS Compliance: EU RoHS Directive (EU) 2015/863 Amendment to EU RoHS 2 (Directive 2011/65/EU)
  • REACH Compliance
  • Halogen Free: IEC 61249-2-21:2003 standard

Operating environment

The MI210 Accelerator has the following operating characteristics:

• Ambient temperature
  • Operational: 5°C to 45°C
  • Storage: -40°C to 70°C
• Relative humidity:
  • Operational: 8-90%
  • Storage: 0-95%

Warranty

• One-year limited warranty. When installed in a Lenovo server, the MI210 Accelerator assumes the server’s base warranty and any warranty upgrades.

Related publications

For more information, refer to these documents:

• ThinkSystem and ThinkAgile GPU Summary : https://lenovopress.lenovo.com/lp0768-thinksystem-thinkagile-gpu-summary
• ServerProven compatibility: https://serverproven.lenovo.com/
• AMD MI210 product page: https://www.amd.com/en/products/server-accelerators/amd-instinct-mi210

Related product families

• Product families related to this document are the following: GPU adapters

Notices

• Lenovo may not offer the products, services, or features discussed in this document in all countries. Consult your local Lenovo representative for information on the products and services currently available in your area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only the Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any Lenovo intellectual property right may be used instead.
• However, it is the user’s responsibility to evaluate and verify the operation of any other product, program, or service. Lenovo may have patents or pending patent applications covering the subject matter described in this document.
• The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to:
• Lenovo (United States), Inc.
• 8001 Development Drive
• Morrisville, NC 27560
• U.S.A.
• Attention: Lenovo Director of Licensing
• LENOVO PROVIDES THIS PUBLICATION ”AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimers of express or implied warranties in certain transactions, therefore, this statement may not apply to you.
• This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. Lenovo may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.
• The products described in this document are not intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Lenovo product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Lenovo or third parties. All information contained in this document was obtained in specific environments and is presented as an illustration. The results obtained in other operating environments may vary. Lenovo may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.
• Any references in this publication to non-Lenovo websites are provided for convenience only and do not in any manner serve as an endorsement of those Websites. The materials at those Websites are not part of the materials for this Lenovo product, and use of those Websites is at your own risk. Any performance data contained herein was determined in a controlled environment. Therefore, the result obtained in other operating environments may vary significantly.
• Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems.
• Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.
• © Copyright Lenovo 2023. All rights reserved.
• This document, LP1862, was created or updated on December 6, 2023.
• Send us your comments in one of the following ways:
• Use the online Contact us review form found at: https://lenovopress.lenovo.com/LP1862
• Send your comments in an e-mail to: comments@lenovopress.com
• This document is available online at https://lenovopress.lenovo.com/LP1862.

Trademarks

• Lenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both.
• A current list of Lenovo trademarks is available on the Web at https://www.lenovo.com/us/en/legal/copytrade/.

The following terms are trademarks of Lenovo in the United States, other countries, or both:

• Lenovo®
• ServerProven®
• ThinkAgile®
• ThinkSystem®

The following terms are trademarks of other companies:

• Intel® is a trademark of Intel Corporation or its subsidiaries.
  • Linux® is the trademark of Linus Torvalds in the U.S. and other countries.
• Other company, product, or service names may be trademarks or service marks of others.

References

• Welcome | ServerProven
• Copyright and Trademark Information | Lenovo US | Lenovo US
• Welcome | ServerProven

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>