QUECTEL FC06E Series Wi-Fi and Bluetooth Module User Manual

QUECTEL FC06E Series Wi-Fi and Bluetooth Module

Product Information

Specifications

• Product Name: FC06E Wi-Fi&Bluetooth Module

Frequently Asked Questions (FAQ)

• Q: How can I obtain technical support for the FC06E module?
  • A: For technical support, visit our website at http://www.quectel.com/support/technical.htm or email us at support@quectel.com.
• Q: Can I use the FC06E module while driving?
  • A: No, it is not recommended to use the FC06E module while driving as it can cause distraction and increase the risk of an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Legal Notices

Third-Party Rights

This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

Privacy Policy

To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers, or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose, or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

• Quectel Wireless Solutions Co., Ltd.
• Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com
  • Or our local offices. For more information, please visit:
  • http://www.quectel.com/support/sales.htm.
• For technical support, or to report documentation errors, please visit:
  • http://www.quectel.com/support/technical.htm.
  • Or email us at: support@quectel.com.

Legal Notices

We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

License Agreements

Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

Copyright

Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

Trademarks

Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

Third-Party Rights

This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.

Privacy Policy

To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

• We acknowledge no liability for any injury or damage arising from the reliance upon the information.
• We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
• While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
• We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.

Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

• Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
• Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
• Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
• Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
• The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
• In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document defines the FC06E and describes its air interfaces and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

Special Mark

Table 1: Special Mark

Product Overview

General Description

The module is a Wi-Fi and Bluetooth module with low power consumption. It is a single-die Wi-Fi and Bluetooth* combo solution supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz and 5 GHz Wi-Fi standards and Bluetooth 5.2 standard, which enables seamless integration of Wi-Fi and Bluetooth low energy technologies. FC06E can provide Wi-Fi functions with a low-power PCIe Gen 3 interface and Bluetooth functions with a UART and a PCM interface.

Key Features

Table 2: Key Features

Functional Diagram

The following illustrates the main functional components of the module’s block diagram

• Power supply
• Wi-Fi application interfaces
• Bluetooth application interfaces*
• Coexistence interfaces
• Other interfaces
• RF antenna interfaces

1 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.

EVB Kit

To help you develop applications with the module, Quectel supplies an evaluation board ((FC06E-M.2) with accessories to control or test the module. For more details, see document [1].

Application Interfaces

Pin Assignment

NOTE

1. Keep all RESERVED and unused pins unconnected.
2. All GND pins should be connected to ground.

Pin Description

Table 3: I/O Parameters Definition

Table 4: Pin Description

Power Supply

The following table shows the power supply pins and ground pins of the module.

Table 5: Definition of Power Supply and GND Pins

The following figure shows the recommended power-up and power-down timing of the module. All input supplies must be ON and available before WLAN/BT_EN is asserted. There is no requirement for the timing between input power supplies.

Wi-Fi Application Interfaces

• The following figure shows the Wi-Fi application interface connection between the module and the host.

WLAN_EN

• WLAN_EN is used to control the Wi-Fi function of the module which will be enabled when WLAN_EN is at high level.

Table 6: Pin Definition of WLAN_EN

Active high.

 |  |  |  | Keep it connected.

PCIe Interface

The module provides a PCIe interface with key features listed as below:

• PCI Express Base Specification Revision 3.0 compliant.
• Data rate at 8 Gbps per lane.
• Used as the Wi-Fi application interface connected to the host.

Table 7: Pin Definition of PCIe Interface

PCIe Gen 3 compliant.

---|---|---|---|---
PCIE_TX_M| 6| AO| PCIe transmit (-)|
PCIE_TX_P| 7| AO| PCIe transmit (+)|
PCIE_RX_M| 9| AI| PCIe receive (-)|
PCIE_RX_P| 10| AI| PCIe receive (+)|
PCIE_CLKREQ_N| 12| DO| PCIe clock request| 1.8 V power domain.

Active low.

PCIE_WAKE_N

|

16

|

DO

|

PCIe wake up

| Pull each of them up to

1.8 V with external 10 kΩ resistors.

PCIE_RST_N| 13| DI| PCIe reset| 1.8 V power domain.
Active low.

The following figure shows the PCIe interface connection between the module and the host.

To ensure the signal integrity of PCIe interface, C1 and C2 should be placed close to the module, and C3 and C4 should be placed close to the host. The extra stubs of traces must be as short as possible. The following principles of PCIe interface design should be complied with to meet PCIe Gen 3 specifications.

• It is important to route PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M as differential pairs with ground surrounded. And the differential impedance should be 85 Ω ±10 %.
• The maximum trace length of each differential pair (PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M) should be less than 200 mm, and trace length matching within each differential pair should be less than 0.5 mm.
• Space between PCIe signals and all other signals should be four times the trace width.
• Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below.

**Bluetooth Application Interfaces***

• The following figure shows the Bluetooth application interface connection between the module and the host.

NOTE: GPIO1 of the host connected to BT_WAKE_HOST must be interruptible.

BT_EN

• BT_EN is used to control the Bluetooth function of the module.
• Bluetooth function will be enabled when BT_EN is at high level. If Bluetooth function is not needed, pull BT_EN down with a 10 kΩ resistor.

Table 8: Pin Definition of BT_EN

Active high.
If unused, pull it down with a 10 KΩ resistor.

UART Interface

The module supports an HCI UART as defined in Bluetooth Core Specification Version 4.0. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 3.2 Mbps baud rates.
The following table shows the pin definition of UART interface.

Table 9: Pin Definition of UART Interface

The module provides a 1.8 V UART interface. A voltage-level translator should be used if the application is equipped with a 3.3 V UART interface. A voltage- level translator TXS0104EPWR provided by Texas Instruments is recommended. The following figure shows a reference design.

BT_WAKE_HOST and HOST_WAKE_BT

• BT_WAKE_HOST and HOST_WAKE_BT are used to wake up the host and the module respectively.
• If you use Quectel 5G RG520x series as the host, these two pins can be left open because the wakeup function can be achieved through Bluetooth UART.

Table 10: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT

HOST_WAKE_BT

| ****

26

| ****

DI

| ****

Host wakes up Bluetooth

| If unused, keep them open.

PCM Interface

• The PCM interface is used for Bluetooth audio. The following table shows the pin definition of PCM interface.

Table 11: Pin Definition of PCM Interface

Pin Name| Pin No.| I/O| Description Comment
---|---|---|---
PCM_DIN| 62| DI| PCM data input
PCM_SYNC| 60| DI| PCM data frame sync                   1.8 V power domain.
PCM_CLK| 63| DI| PCM clock                    If unused, keep them open.
PCM_DOUT| 61| DO| PCM data output

The following figure shows the PCM interface connection between the module and the host.

Coexistence Interfaces

• The module supports 2.4 GHz LTE & Wi-Fi coexistence and 5 GHz LTE & Wi-Fi coexistence.
• The following table shows the pin definition of coexistence interfaces.

Table 12: Pin Definition of Coexistence Interfaces

Other Interfaces

WLAN_SLP_CLK

The WLAN_SLP_CLK is 32.768 kHz sleep clock which is used in low power modes, such as power saving mode and sleep mode. It serves as a timer in various power saving schemes, and can maintain basic logic operations when the module is in sleep mode.

Table 13: Pin Definition of WLAN_SLP_CLK

Pin Name| Pin No.| I/O| Description Comment
---|---|---|---
WLAN_SLP_CLK| 20| DI| 32.768 kHz sleep clock                 1.8 V power domain.
If unused, keep it open.

Figure and table below show the reference input clock requirements of WLAN_SLP_CLK.

Table 14: Parameters of WLAN_SLP_CLK

SW_CTRL

• SW_CTRL can be used to control external RF power supply chip.
• The following table shows the pin definition of SW_CTRL.

Table 15: Pin Definition of SW_CTRL

RF Antenna Interfaces

Table 16: Pin Definition of RF Antenna Interfaces

Operating Frequencies

Table 17: Operating Frequencies (Unit: GHz)

RF Antenna Reference Design

FC06E provides three RF antenna interfaces for antenna connection. The following reference design shows an example with ANT_WIFI0. For other RF antenna interfaces, the reference design is the same. It is recommended to reserve a π-type matching circuit for better RF performance, and the π-type matching components (C1, C2, R1) should be placed as close to the antenna as possible. C1 and C2 are not mounted by default.

RF Routing Guidelines

For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

For more details about RF layout, see document [2].

Antenna Design Requirements

• The following table shows the requirements for antennas.

Table 18: Antenna Requirements

RF Connector Recommendation

• If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose.
• U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

Figure 16: Specifications of Mated Plugs

The following figure describes the space factor of the mated connectors.

For more details, please visit: http://www.hirose.com.

Electrical Characteristics & Reliability

Absolute Maximum Ratings

The following table shows the absolute maximum ratings.

Table 19: Absolute Maximum Ratings (Unit: V)

NOTE: VDDX is the external supply voltage for the corresponding power input pins.

Power Supply Ratings

Table 20: Module Power Supply Ratings (Unit: V)

Digital I/O Characteristics

Table 21: Digital I/O Characteristics (Unit: V)

Operating and Storage Temperatures

Table 22: Operating and Storage Temperatures (Unit: °C)

• 2 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications.

Power Consumption

• The following tables show the power consumption of the module in different modes.

Power Consumption in Low Power Modes

Table 23: Power Consumption of the Module (Low Power Modes, Unit: mA)

Power Consumption

Table 24: Power Consumption (Unit: mA)

• 3 In OFF state, the Wi-Fi driver is uninstalled and WLAN_EN is pulled down.

RF Performances

• The following tables summarize the Wi-Fi transmitting and receiving performances of the module.

Wi-Fi RF Performances

Table 25: Wi-Fi Tx Power at 2.4 GHz (Unit: dBm)

Table 26: Wi-Fi Tx Power at 5 GHz (Unit: dBm)

Table 27: Wi-Fi Rx Sensitivity at 2.4 GHz (Unit: dBm)

Table 28: Wi-Fi Rx Sensitivity at 5 GHz (Unit: dBm)

**Bluetooth RF Performances***

Table 29: Bluetooth Tx Power and Rx Sensitivity (Unit: dBm)

ESD Protection

Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 30: Electrostatic Discharge Characteristics (Temperature: 25–30 °C, Humidity: 40 ±5 %)

Thermal Dissipation

The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and functions (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.

The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
• Follow the principles below when the heatsink is necessary:
  • Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  • Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  • Choose the heatsink with adequate fins to dissipate heat;
  • Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  • Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE: The package warpage level of the module conforms to JEITA ED-7306 standard.

Recommended Footprint

NOTE

• Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

Top and Bottom Views

NOTE: Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing and Packaging

Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 4 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   • The module is not stored in Recommended Storage Condition;
   • Violation of the third requirement mentioned above;
   • Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   • Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
   • The module should be baked for 8 hours at 120 ±5 °C;
   • The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.

4 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see document [3].

The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 31: Recommended Thermal Profile Parameters

NOTE

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

Carrier Tape

Dimension details are as follow:

Table 32: Carrier Tape Dimension Table (Unit: mm)

Plastic Reel

Table 33: Plastic Reel Dimension Table (Unit: mm)

Packaging Process

• Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.
• Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.
• Place the vacuum-packed plastic reel into the pizza box.
• Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules.

Appendix References

Table 34: Related Documents

Table 35: Terms and Abbreviations

Important Information

Important Notice to OEM integrators

Product Marketing Name: Quectel FC06E

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note

Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product LabelingWhen the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FC06E” The FCC ID can be used only when all FCC mpliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.
4. The max allowed antenna gain is 1 dBi for external monopole antenna.

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

FCC Statement

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference
2. This device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

This device is intended only for OEM integrators under the following conditions:

(For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement

• This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
• This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

IC Statement

IRSS-GEN

“This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference
2. This device must accept any interference, including interference that may cause undesired operation of the device.”

The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:

0 “Contains IC: 10224A-2023FC06E” or “where: 10224A-2023FC06E is the module’s certification number”.

1. the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
2. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;
3. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
4. Omnidirectional antenna is recommended

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact us | Quectel

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>