onsemi NVHL040N120SC1 Silicon Carbide SiC MOSFET Instructions
- June 15, 2024
- onsemi
Table of Contents
onsemi NVHL040N120SC1 Silicon Carbide SiC MOSFET
Product Information
Specifications
Parameter | Symbol | Value | Unit |
---|---|---|---|
Drain-to-Source Voltage | VDSS | 1200 | V |
Gate-to-Source Voltage | VGS | -15/+25 | V |
Recommended Operation Values of Gate-to-Source Voltage | VGSop | -5/+20 | V |
Continuous Drain Current | ID | 60 | A |
Power Dissipation | PD | 348 | W |
Pulsed Drain Current (Note 2) | IDM | 60 | A |
Current Capability (RG = 4.7 W) | ID | 416 | A |
Operating Junction and Storage Temperature Range | |||
Source Current (Body Diode) | IS | 34 | A |
Single Pulse Drain-to-Source Avalanche Energy (IL(pk) = 23 A, L
= 1 mH) (Note 3)| EAS| 613| MJ
Junction-to-Case Thermal Resistance| RqJC| |
Junction-to-Ambient Thermal Resistance| RqJA| |
Drain-to-Source Breakdown Voltage| V(BR)DSS| 1200| V
Zero Gate Voltage Drain Current| IDSS| |
Gate-to-Source Leakage Current| IGSS| |
Gate Threshold Voltage| VGS(th)| 1.8| V
Recommended Gate Voltage| VGOP| -5/+20| V
Drain-to-Source On Resistance| RDS(on)| 56| mW @ 20 V
Forward Transconductance| NFS| | S
Input Capacitance| CISS| | pF
Output Capacitance| COSS| |
Reverse Transfer Capacitance| CROSS| |
Total Gate Charge| QG(tot)| | C
Threshold Gate Charge| QG(th)| |
Gate-to-Source Charge| QGS| |
Gate-to-Drain Charge| QGD| |
Gate Resistance| RG| | W
Turn-On Delay Time| td(on)| |
Rise Time| tr| |
Turn-Off Delay Time| td(off)| |
Fall Time| tf| |
Turn-On Switching Loss| EON| |
Turn-Off Switching Loss| EOFF| |
Total Switching Loss| ETOT| |
Product Usage Instructions
Installation
- Ensure that the product is installed in a suitable environment with proper ventilation to prevent overheating.
- Connect the drain, source, and gate terminals of the product to the corresponding components in your circuit.
- Refer to the product datasheet for the pinout and package information.
Electrical Connections
- Make sure to provide the appropriate voltage and current to the drain and source terminals of the product.
- Connect the gate terminal to the control signal source with the recommended gate voltage.
- Ensure proper grounding of the product and other components in your circuit.
Thermal Management
- Consider the thermal resistance values specified for the product and ensure that the operating temperature of the device is within the recommended range.
- Provide adequate heat sinking or cooling mechanisms to maintain the temperature within acceptable limits.
Frequently Asked Questions (FAQ)
Q1: What is the maximum drain-to-source voltage for this product?
- A1: The maximum drain-to-source voltage is 1200V.
Q2: What is the recommended gate voltage range?
- A2: The recommended gate voltage range is -15V to +25V.
Q3: What is the maximum continuous drain current?
- A3: The maximum continuous drain current is 60A.
Q4: How many units are included in each package?
- A4: Each package contains 30 units.
Features
- Typ. RDS(on) = 40 m
- Ultra Low Gate Charge (Typ. QG(tot) = 106 nC)
- Low Effective Output Capacitance (typ. Coss = 140 pF)
- 100% UIL Tested
- AEC−Q101 Qualified and PPAP Capable
- This Device is Halide Free and RoHS Compliant with exemption 7a, Pb−Free 2LI (on second-level interconnection)
Typical Applications
- Automotive On Board Charger
- Automotive DC−DC converter for EV/HEV
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter | Symbol | Value | Unit |
---|---|---|---|
Drain−to−Source Voltage | VDSS | 1200 | V |
Gate−to−Source Voltage | VGS | −15/+25 | V |
Recommended Operation Values of Gate-to-Source Voltage | TC < 175°C | VGSop | |
−5/+20 | V | ||
Continuous Drain Current R8JC | Steady State | TC = 25°C | ID |
Power Dissipation R8JC | PD | 348 | W |
Continuous Drain Current R8JC | Steady State | TC = 100°C | ID |
Power Dissipation R8JC | PD | 174 | W |
Pulsed Drain Current (Note 2) | TA = 25°C | IDM | 240 |
Single Pulse Surge Drain Current Capability | TA = 25°C, tp = 10 µs, RG = 4.7 | ||
Q | IDSC | 416 | A |
Operating Junction and Storage Temperature Range | TJ, Tstg | − 55 to |
+175
| °C
Source Current (Body Diode)| IS| 34| A
Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 23 A, L = 1 mH) (Note
3)| EAS| 613| MJ
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter | Symbol | Value | Unit |
---|---|---|---|
Junction−to−Case (Note 1) | R8JC | 0.43 | °C/W |
Junction−to−Ambient (Note 1) | R8JA | 40 | °C/W |
- The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted.
- Repetitive rating, limited by max junction temperature.
- EAS of 613 mJ is based on starting TJ = 25°C; L = 1 mH, IAS = 35 A, VDD = 120 V, VGS = 20 V.
V (BR)DSS | R DS(on) MAX | I D MAX |
---|---|---|
1200 V | 56 mQ @ 20 V | 60 A |
N−CHANNEL MOSFET
MARKING DIAGRAM
ORDERING INFORMATION
Device | Package | Shipping |
---|---|---|
NVHL040N120SC1 | TO247−3L | 30 Units / Tube |
ELECTRICAL CHARACTERISTICS
Parameter| Symbol| Test Conditions| Min| Typ|
Max| Unit
---|---|---|---|---|---|---
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage| V(BR)DSS| VGS =0 V, ID = 1 mA| 1200| −| −|
V
---|---|---|---|---|---|---
Drain−to−Source Breakdown Voltage Temperature Coefficient| V(BR)DSS/TJ| ID = 1
mA, referenced to 25 C| −| 450| −| mV/ C
Zero Gate Voltage Drain Current| IDSS| VGS =0 V, VDS = 1200 V, TJ = 25 C| −|
−| 100| µA
VGS =0 V, VDS = 1200 V, TJ = 175 C| −| −| 250
Gate−to−Source Leakage Current| IGSS| VGS = +25/−15 V, VDS =0V| −| −| ±1| µA
ON CHARACTERISTICS
Gate Threshold Voltage | VGS(th) | VGS = VDS, ID = 10 mA | 1.8 | 2.97 | 4.3 | V |
---|---|---|---|---|---|---|
Recommended Gate Voltage | VGOP | −5 | − | +20 | V | |
Drain−to−Source On Resistance | RDS(on) | VGS = 20 V, ID = 35 A, TJ = 25 C | − | |||
39 | 56 | mQ | ||||
VGS = 20 V, ID = 35 A, TJ = 175 C | − | 67 | 100 | |||
Forward Transconductance | CFS | VDS = 20 V, ID = 35A | − | 20 | − | S |
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance | CISS | VGS = 0 V, f = 1 MHz, VDS = 800 V | − | 1781 | − | pF |
---|---|---|---|---|---|---|
Output Capacitance | COSS | − | 140 | − | ||
Reverse Transfer Capacitance | CROSS | − | 12 | − | ||
Total Gate Charge | QG(tot) | VGS = −5/20 V, VDS = 600 V, ID = 47A | − | 106 | − | C |
Threshold Gate Charge | QG(th) | − | 16 | − | ||
Gate−to−Source Charge | QGS | − | 34 | − | ||
Gate−to−Drain Charge | QGD | − | 26 | − | ||
Gate Resistance | RG | f = 1 MHz | − | 2.2 | − | Q |
SWITCHING CHARACTERISTICS
Turn-On Delay Time| td(on)| VGS = −5/20 V, VDS = 800 V, ID = 47 A, RG = 4.7 Q,
Inductive Load
| −| 18| −| ns
---|---|---|---|---|---|---
Rise Time| tr| −| 41| −|
Turn−Off Delay Time| td(off)| −| 33| −|
Fall Time| tf| −| 10.4| −|
Turn-On Switching Loss| EON| −| 1003| −| µJ
Turn-Off Switching Loss| EOFF| −| 247| −|
Total Switching Loss| ETOT| −| 1248| −|
DRAIN−SOURCE DIODE CHARACTERISTICS
Continuous Drain−to−Source Diode Forward Current| ISD| VGS = −5 V, TJ = 25 C|
−| −| 34| A
---|---|---|---|---|---|---
Pulsed Drain−to−Source Diode Forward Current (Note 2)| ISDM| VGS = −5 V, TJ =
25 C| −| −| 240| A
Forward Diode Voltage| VSD| VGS = −5 V, ISD = 17.5 A, TJ = 25 C| −| 3.8| −| V
Reverse Recovery Time| tRR| VGS = −5/20 V, ISD = 47 A,
dIS/dt = 1000 A/µs
| −| 24| −| ns
Reverse Recovery Charge| QRR| −| 125| −| C
Reverse Recovery Energy| EREC| −| 8.5| −| µJ
Peak Reverse Recovery Current| IRRM| −| 10.4| −| A
Charge Time| ta| −| 12.4| −| ns
Discharge Time| TB| −| 11.6| −| ns
- Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions unless otherwise noted.
- Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DOCUMENT NUMBER:| 98AON93302G| Electronic versions are uncontrolled
except when accessed directly from the Document Repository. Printed versions
are uncontrolled except when stamped “CONTROLLED COPY” in red.
---|---|---
DESCRIPTION:| TO − 247 − 3LD|
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