onsemi NVHL040N120SC1 Silicon Carbide SiC MOSFET Instructions

June 15, 2024
onsemi

onsemi NVHL040N120SC1 Silicon Carbide SiC MOSFET

Product Information

Specifications

Parameter Symbol Value Unit
Drain-to-Source Voltage VDSS 1200 V
Gate-to-Source Voltage VGS -15/+25 V
Recommended Operation Values of Gate-to-Source Voltage VGSop -5/+20 V
Continuous Drain Current ID 60 A
Power Dissipation PD 348 W
Pulsed Drain Current (Note 2) IDM 60 A
Current Capability (RG = 4.7 W) ID 416 A
Operating Junction and Storage Temperature Range
Source Current (Body Diode) IS 34 A

Single Pulse Drain-to-Source Avalanche Energy (IL(pk) = 23 A, L
= 1 mH) (Note 3)| EAS| 613| MJ
Junction-to-Case Thermal Resistance| RqJC| |
Junction-to-Ambient Thermal Resistance| RqJA| |
Drain-to-Source Breakdown Voltage| V(BR)DSS| 1200| V
Zero Gate Voltage Drain Current| IDSS| |
Gate-to-Source Leakage Current| IGSS| |
Gate Threshold Voltage| VGS(th)| 1.8| V
Recommended Gate Voltage| VGOP| -5/+20| V
Drain-to-Source On Resistance| RDS(on)| 56| mW @ 20 V
Forward Transconductance| NFS| | S
Input Capacitance| CISS| | pF
Output Capacitance| COSS| |
Reverse Transfer Capacitance| CROSS| |
Total Gate Charge| QG(tot)| | C
Threshold Gate Charge| QG(th)| |
Gate-to-Source Charge| QGS| |
Gate-to-Drain Charge| QGD| |
Gate Resistance| RG| | W
Turn-On Delay Time| td(on)| |
Rise Time| tr| |
Turn-Off Delay Time| td(off)| |
Fall Time| tf| |
Turn-On Switching Loss| EON| |
Turn-Off Switching Loss| EOFF| |
Total Switching Loss| ETOT| |

Product Usage Instructions

Installation

  • Ensure that the product is installed in a suitable environment with proper ventilation to prevent overheating.
  • Connect the drain, source, and gate terminals of the product to the corresponding components in your circuit.
  • Refer to the product datasheet for the pinout and package information.

Electrical Connections

  • Make sure to provide the appropriate voltage and current to the drain and source terminals of the product.
  • Connect the gate terminal to the control signal source with the recommended gate voltage.
  • Ensure proper grounding of the product and other components in your circuit.

Thermal Management

  • Consider the thermal resistance values specified for the product and ensure that the operating temperature of the device is within the recommended range.
  • Provide adequate heat sinking or cooling mechanisms to maintain the temperature within acceptable limits.

Frequently Asked Questions (FAQ)

Q1: What is the maximum drain-to-source voltage for this product?

  • A1: The maximum drain-to-source voltage is 1200V.

Q2: What is the recommended gate voltage range?

  • A2: The recommended gate voltage range is -15V to +25V.

Q3: What is the maximum continuous drain current?

  • A3: The maximum continuous drain current is 60A.

Q4: How many units are included in each package?

  • A4: Each package contains 30 units.

Features

  • Typ. RDS(on) = 40 m
  • Ultra Low Gate Charge (Typ. QG(tot) = 106 nC)
  • Low Effective Output Capacitance (typ. Coss = 140 pF)
  • 100% UIL Tested
  • AEC−Q101 Qualified and PPAP Capable
  • This Device is Halide Free and RoHS Compliant with exemption 7a, Pb−Free 2LI (on second-level interconnection)

Typical Applications

  • Automotive On Board Charger
  • Automotive DC−DC converter for EV/HEV

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Parameter Symbol Value Unit
Drain−to−Source Voltage VDSS 1200 V
Gate−to−Source Voltage VGS −15/+25 V
Recommended Operation Values of Gate-to-Source Voltage TC < 175°C VGSop
−5/+20 V
Continuous Drain Current R8JC Steady State TC = 25°C ID
Power Dissipation R8JC PD 348 W
Continuous Drain Current R8JC Steady State TC = 100°C ID
Power Dissipation R8JC PD 174 W
Pulsed Drain Current (Note 2) TA = 25°C IDM 240
Single Pulse Surge Drain Current Capability TA = 25°C, tp = 10 µs, RG = 4.7
Q IDSC 416 A
Operating Junction and Storage Temperature Range TJ, Tstg − 55 to

+175

| °C
Source Current (Body Diode)| IS| 34| A
Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 23 A, L = 1 mH) (Note 3)| EAS| 613| MJ

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter Symbol Value Unit
Junction−to−Case (Note 1) R8JC 0.43 °C/W
Junction−to−Ambient (Note 1) R8JA 40 °C/W
  1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted.
  2. Repetitive rating, limited by max junction temperature.
  3. EAS of 613 mJ is based on starting TJ = 25°C; L = 1 mH, IAS = 35 A, VDD = 120 V, VGS = 20 V.
V (BR)DSS R DS(on) MAX I D MAX
1200 V 56 mQ @ 20 V 60 A

N−CHANNEL MOSFET

MARKING DIAGRAM

ORDERING INFORMATION

Device Package Shipping
NVHL040N120SC1 TO247−3L 30 Units / Tube

ELECTRICAL CHARACTERISTICS

Parameter| Symbol| Test Conditions| Min| Typ| Max| Unit
---|---|---|---|---|---|---

OFF CHARACTERISTICS

Drain−to−Source Breakdown Voltage| V(BR)DSS| VGS =0 V, ID = 1 mA| 1200| −| −| V
---|---|---|---|---|---|---
Drain−to−Source Breakdown Voltage Temperature Coefficient| V(BR)DSS/TJ| ID = 1 mA, referenced to 25 C| −| 450| −| mV/ C
Zero Gate Voltage Drain Current| IDSS| VGS =0 V, VDS = 1200 V, TJ = 25 C| −| −| 100| µA
VGS =0 V, VDS = 1200 V, TJ = 175 C| −| −| 250
Gate−to−Source Leakage Current| IGSS| VGS = +25/−15 V, VDS =0V| −| −| ±1| µA

ON CHARACTERISTICS

Gate Threshold Voltage VGS(th) VGS = VDS, ID = 10 mA 1.8 2.97 4.3 V
Recommended Gate Voltage VGOP −5 +20 V
Drain−to−Source On Resistance RDS(on) VGS = 20 V, ID = 35 A, TJ = 25 C
39 56 mQ
VGS = 20 V, ID = 35 A, TJ = 175 C 67 100
Forward Transconductance CFS VDS = 20 V, ID = 35A 20 S

CHARGES, CAPACITANCES & GATE RESISTANCE

Input Capacitance CISS VGS = 0 V, f = 1 MHz, VDS = 800 V 1781 pF
Output Capacitance COSS 140
Reverse Transfer Capacitance CROSS 12
Total Gate Charge QG(tot) VGS = −5/20 V, VDS = 600 V, ID = 47A 106 C
Threshold Gate Charge QG(th) 16
Gate−to−Source Charge QGS 34
Gate−to−Drain Charge QGD 26
Gate Resistance RG f = 1 MHz 2.2 Q

SWITCHING CHARACTERISTICS

Turn-On Delay Time| td(on)| VGS = −5/20 V, VDS = 800 V, ID = 47 A, RG = 4.7 Q,

Inductive Load

| −| 18| −| ns
---|---|---|---|---|---|---
Rise Time| tr| −| 41| −|
Turn−Off Delay Time| td(off)| −| 33| −|
Fall Time| tf| −| 10.4| −|
Turn-On Switching Loss| EON| −| 1003| −| µJ
Turn-Off Switching Loss| EOFF| −| 247| −|
Total Switching Loss| ETOT| −| 1248| −|

DRAIN−SOURCE DIODE CHARACTERISTICS

Continuous Drain−to−Source Diode Forward Current| ISD| VGS = −5 V, TJ = 25 C| −| −| 34| A
---|---|---|---|---|---|---
Pulsed Drain−to−Source Diode Forward Current (Note 2)| ISDM| VGS = −5 V, TJ = 25 C| −| −| 240| A
Forward Diode Voltage| VSD| VGS = −5 V, ISD = 17.5 A, TJ = 25 C| −| 3.8| −| V
Reverse Recovery Time| tRR| VGS = −5/20 V, ISD = 47 A,

dIS/dt = 1000 A/µs

| −| 24| −| ns
Reverse Recovery Charge| QRR| −| 125| −| C
Reverse Recovery Energy| EREC| −| 8.5| −| µJ
Peak Reverse Recovery Current| IRRM| −| 10.4| −| A
Charge Time| ta| −| 12.4| −| ns
Discharge Time| TB| −| 11.6| −| ns

  • Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions unless otherwise noted.
  • Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

TYPICAL CHARACTERISTICS

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

DOCUMENT NUMBER:| 98AON93302G| Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
---|---|---
DESCRIPTION:| TO 247 3LD|

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