QUECTEL FCS850R Wi-Fi and Bluetooth Module User Guide

QUECTEL FCS850R Wi-Fi and Bluetooth Module

Product Information

Specifications

• Product Name: FCS850R
• Hardware Design: Wi-Fi&Bluetooth Module Series
• Version: 1.0.0
• Date: 2023-03-01
• Status: Preliminary

Contact Information

• If you require any assistance, please contact our headquarters
• Quectel Wireless Solutions Co., Ltd.
• Building 5, Shanghai Business Park Phase III (Area B), No.1016
• Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com
• For more information, please visit: http://www.quectel.com/support/sales.htm.
• For technical support or to report documentation errors, please
• visit: http://www.quectel.com/support/technical.htm.
• Email: support@quectel.com

Legal Notices

Use and Disclosure Restrictions
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

Copyright
FCS850R_Hardware_Design

Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

Third-Party Rights
This document may refer to hardware, software, and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers, or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose, or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

1. We acknowledge no liability for any injury or damage arising from the reliance upon the information.
2. We shall bear no liability resulting from any inaccuracies or omissions or from the use of the information contained herein.
3. While we have made every effort to ensure that the functions and features under development are

Safety Information

• The following safety precautions must be observed during all phases of operation, such as usage, service, or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
• Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Product Usage Instructions

Section 1: Getting Started
To start using the FCS850R Wi-Fi & Bluetooth Module Series, follow these steps

1. Ensure that you have received all the necessary components, including the module, cables, and any additional accessories.
2. Refer to the hardware design documentation for instructions on how to connect the module to your device.
3. Power on your device and ensure that the module is properly powered and connected.

Section 2: Module Configuration
To configure the FCS850R module, please follow these steps

1. Access the module’s configuration interface via a web browser or dedicated software.
2. Follow the provided user manual or documentation to set up the desired Wi-Fi and Bluetooth settings.
3. Save and apply the configuration changes.

Section 3: Troubleshooting
If you encounter any issues with the FCS850R module, please refer to the troubleshooting section of the user manual. Some common troubleshooting steps include

• Check the power and connectivity of the module.
• Verify that the module is compatible with your device.
• Reset the module to its default settings if necessary.
• Contact technical support or refer to the online documentation for further assistance.

Section 4: Maintenance and Care
To ensure the optimal performance and longevity of the FCS850R module, please follow these maintenance guidelines

• Keep the module clean and free from dust or debris.
• Avoid exposing the module to extreme temperatures or humidity.
• Regularly check for firmware updates and apply them as recommended by the manufacturer.
• Handle the module with care to prevent physical damage.

Section 5: Additional Resources
For additional resources and support for the FCS850R Wi-Fi & Bluetooth Module Series, please visit the official Quectel website or contact their customer support.

Frequently Asked Questions (FAQ)

• Q: Where can I find the user manual for the FCS850R module?
  A: The user manual for the FCS850R module can be found on the official Quectel website under the product documentation section.

• Q: How do I update the firmware of the FCS850R module?
  A: To update the firmware of the FCS850R module, please refer to the firmware update instructions provided in the user manual or contact technical support for assistance.

• Q: Can I use the FCS850R module with any device?
  A: The compatibility of the FCS850R module may vary depending on the device. Please refer to the product specifications or consult with technical support to ensure compatibility with your specific device.

• Q: What should I do if the FCS850R module is not functioning properly?
  A: If you are experiencing issues with the FCS850R module, please refer to the troubleshooting section of the user manual or contact technical support for further assistance.

Hardware Design

• Wi-Fi& Bluetooth Module Series
• Version: 1.0.0
• Date: 2023-03-01
• Status: Preliminary

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

• Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com

Or our local offices. For more information, please visit:

• http://www.quectel.com/support/sales.htm .
• For technical support, or to report documentation errors, please visit:
• http://www.quectel.com/support/technical.htm .
• Or email us at: support@quectel.com .

Legal Notices

We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

• License Agreements
  Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

• Copyright
  Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

• Trademarks
  Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

• Third-Party Rights

  • This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
  • We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.

• Privacy Policy

  • To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers.
  • Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

1. We acknowledge no liability for any injury or damage arising from the reliance upon the information.
2. We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
3. While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
4. We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.

Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

• Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
• Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
• Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
• Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
• The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
• In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

• This document defines the FCS850R and describes its air interfaces and hardware interfaces which are connected with your applications. The document for FCS850R and FCS850R-B is generic.
• With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

Special Mark
Table 1: Special Mark

Product Overview

FCS850R is a low-energy、high-performance IEEE 802.11 a/b/g/n/ac Wi-Fi and Bluetooth 5.0 module. It supports 2.4 GHz band and 2T2R with maximum data rates up to 866.7 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UART、PCM for Bluetooth functions.

It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information

FCS850R

• Packaging type LCC
• Pin counts 50
• Dimensions (13.0 ±0.15) mm × (15.0 ±0.15) mm × (2.3 ±0.2) mm
• Weight TBD
• sub-model FCS850R

Key Features
Table 3: Key Features

1. To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements.
2. FCS850R is a two-antenna module, ANT WIFI1/BT is also used as Wi-Fi1 and Bluetooth antenna interface, ANT BT pin is suspended.

RF Performances

Wi-Fi Performances
Table 4: Wi-Fi Performances

Bluetooth Performances
Table 5: Bluetooth Performances

Application Interfaces

Pin Assignment

Figure 1: Pin Assignment (Top View)

NOTE

1. Keep all RESERVED or unused pins unconnected.
2. The FCS850R is a two-antenna module ,keep pin 12 (ANT_BT) unconnected.

Pin Description
Table 6: I/O Parameters Definition

DC characteristics include power domain and rate current.

Table 7: Pin Description

Power Supply

• The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient more than 1.5 A. For better power supply performance, it is recommended to parallel a 47 μF decoupling capacitor, and 1 μF and 100 nF filter capacitors near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module.
• In principle, the longer the VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:

• 3 For two antenna modules (FCS850R), keep ANT_BT open.

• The power-up timing of the module is shown below.

Wi-Fi Application Interface
The module provides SDIO interface for communication with the host to realize the functional application of Wi-Fi.

SDIO Interface
SDIO interface connection between the module and the host is illustrated in the following figure. To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

• Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. The impedance of SDIO signal trace is 50 Ω ±10 %.
• Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.
•  SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 1 mm distance between the traces). The length of signal line inside the module is as follows:
  • SDIO CLK：12.9mm、SDIO CMD：14.5mm、SDIO DATA0：9.9mm、SDIO DATA1：11.7mm、
  • SDIO DATA2 ： 9.3mm 、SDIO DATA3: 9.8mm, pay attention to the SDIO wiring length during design.

According to the transmission rate, the length of signal line has the following requirements:

1. For SDR104 mode, the recommended signal line length is less than 50 mm,.
2. For other modes, such as DDR50, SDR50, etc., the recommended signal line length is less than 150 mm.
3. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF.
4. Keep SDIO wiring parallel on the same floor as much as possible. Ensure that SDIO wiring is surrounded by ground holes and does not cross each other.

Bluetooth Application Interface
Bluetooth application interface connection between the module and the host is illustrated in the figure below. PCM Interface
The module provides a PCM interface for Bluetooth voice applications and supports the following features：

• Supports Master and Slave mode
• Programmable long/short Frame Sync
• Supports 8-bit A-law/u-law, and 13/16-bit linear pCM formats
• Supports sign-extension
• PCM Master Clock Output: 64, 128, 256, or 512kHz
• Supports SCO/ESCO link

PCM interface timing as below: Table 1：PCM Interface Clock Specifications

Table 2 ：PCM Interface Timing

High

| –| –| 75| ns
TBCLKD_OUT| Delay Time from BCLK High to Valid DAC

Data

| –| –| 125| ns
TSETUPIN| Set-up Time for ADC Data Valid to BCLK Low| 10| –| –| ns
THOLDIN| Hold Time for BCLK Low to ADC Data Invalid| 125| –| | ns

UART interface
The module supports Bluetooth HCI (Host Controller Interface) UART, supports hardware flow control (RTS/CTS), and can be used for data transmission with the host. The default baud rate is 115200, which can support up to 4 Mbps baud rate

Table 3：UART interface timing parameters

Support transmission rate

（bps）

|

• 1.2 K、9.6 K、14.4 K、19.2 K、28.8K、38.4 K、57.6 K、76.8K、115.2 K、
• 128 K、153.6K、230.4 K、460.8 K、500 K、921.6 K、1 M、1.5 M、2 M、
• 2.5 M、3 M、4 M

---|---

RF Antenna Interface

• Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only.
• Analysis, evaluation and determination are still necessary when designing target products.

Table 8: Antenna Design Requirements

Reference Design

• A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a π-type matching circuit and add ESD protection components for better RF performance.
• Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 Ω.
• The following reference design is based on ANT_WIFI0 as an example, the reference design of other RF antenna interfaces is the same.

For more details about the RF performances, see Chapter 3.

RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures .

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
•  There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

RF Connector Recommendation

• If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.
• U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
• The following figure describes the space factor of mated connectors.

For more details, please visit http://www.hirose.com .

Electrical Characteristics & Reliability

Absolute Maximum Ratings
Table 9: Absolute Maximum Ratings (Unit: V)

Power Supply Ratings
Table 10: Module Power Supply Ratings (Unit: V)

ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Digital I/O Characteristics
Table 11: VDDIO I/O Characteristics (Unit: V)

1.8 V voltage range

Parameter| Description| Min.| Max.| Parameter
VIH| High-level Input Voltage| 1.7| 3.6| V
---|---|---|---|---
VIL| Low-level Input Voltage| -0.3| 0.8| V
VOH| High-level Output Voltage| 1.62| 1.8| V
VOL| Low-level Output Voltage| 0| 0.18| V
3.3 V voltage range

Parameter| Description| Min.| Max.| Parameter
VIH| High-level Input Voltage| 2.0| 3.6| V
---|---|---|---|---
VIL| Low-level Input Voltage| -0.3| 0.9| V
VOH| High-level Output Voltage| 2.97| 3.3| V
VOL| Low-level Output Voltage| 0| 0.33| V

Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.

The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
•  Follow the principles below when the heatsink is necessary:
  • Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  • Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  • Choose the heatsink with adequate fins to dissipate heat;
  • Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  • Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE
The package warpage level of the module conforms to JEITA ED-7306 standard.

Recommended Footprint

NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

Top and Bottom Views NOTE
Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing & Packaging

Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 5 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
5. The module is not stored in Recommended Storage Condition;
6. Violation of the third requirement mentioned above;
7. Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
8. Before module repairing.
9. If needed, the pre-baking should follow the requirements below:
10. The module should be baked for 8 hours at 120 ±5 °C;
11. The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.

5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

Manufacturing and Soldering

• Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see document [2].
• The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 12: Recommended Thermal Profile Parameters

NOTE

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

Packaging Specifications

• This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
• The module adopts carrier tape packaging and details are as follow:

Carrier Tape

Dimension details are as follow:

Table 13: Carrier Tape Dimension Table (Unit: mm)

Plastic Reel

Table 14: Plastic Reel Dimension Table (Unit: mm)

Mounting Direction

Packaging Process

• Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.
• Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.
• Place the vacuum-packed plastic reel into the pizza box.
• Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.

Figure 25: Packaging Process

Appendix References

Table 15: Related Documents

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (XMR2023FCS850R) procedure followed by a Class II permissive change application.

End Product Labeling

• When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FCS850R”
  “Contains IC: 10224A-2023FCS850R “

• The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3.  Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna type| 2.4GHz band Peak       Gain (dBi)| 5.2GHz band Peak       Gain (dBi)| 5.3GHz band Peak       Gain (dBi)| 5.5GHz band Peak       Gain (dBi)| 5.8GHz band Peak       Gain (dBi)
---|---|---|---|---|---
Dipole| 0.73| 1.14| 1.00| 0.60| 0.95

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.

• This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.
• Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules

• This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and 15.407 requirements for Modular Approval.
• The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

IC

Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.

Radiation Exposure Statement

• This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
• RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz)
• The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.
• The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
• The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and
• The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.

This device is intended only for OEM integrators under the following conditions: (For module device use

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC:10224A-2023FCS850R”.

Manual Information To the End User

• The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
• The end user manual shall include all required regulatory information/warning as show in this manual.

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact us | Quectel

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