QUECTEL FCS850R-B Wi-Fi Modules Instruction Manual

FCS850R-B
Hardware Design
Wi-Fi &Bluetooth Module Series
Version: 1.0.0
Date: 2023-03-01
Status: Preliminary

FCS850R-B Wi-Fi Modules

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Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

| Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
---|---
| Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
| Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
| Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
| The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
| In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document defines the FCS850R-B and describes its air interfaces and hardware interfaces which are connected with your applications. The document for FCS850R and FCS850R-B is generic.
With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
1.1. Special Mark
Table 1: Special Mark

feature, interface, pin name, AT command or parameter indicates that the function, feature, interface, pin, AT command or parameter is under development, so it is not supported temporarily; The asterisk
(*) after the module sub-model indicates that there is no sample for the sub- model..

Product Overview

FCS850R-B is a low-energy. high-performance IEEE 802.11 a/b/g/n/ac Wi-Fi and Bluetooth 5.0 module. It supports
2.4 GHz band and 2T2R with maximum data rates up to 866.7 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UART. PCM for Bluetooth functions.
It is an SMD module with compact packaging. Related information is listed in the table below:
Table 2: Basic Information

FCS850R-B

Packaging type| LCC
Pin counts| 50
Dimensions| (13.0 £0.15) mm x (15.0 +0.15) mm x (2.3 +0.2) mm
Weight| TBD
sub-model| FCS850R-B

2.1. Key Features
Table 3: Key Features

Basic Information

Protocol and Standard| • Wi-Fi protocols: IEEE 802.11 a/b/g/n/ac
• Bluetooth protocol: Bluetooth 5.0
• All hardware components are fully compliant with EU RoHS directive
Power Supply| VBAT Power Supply:
•  31-36V
•  Typ:33V
VDDIO Power Supply:
•  17-36V
•  Typ:1.8/33V
Temperature Ranges| • Operating temperature: 0 to +70 °C’
•  Storage temperature: -55 to +125 °C
EVB Kit| FC850R-B-M.2
RF Antenna Interface ****
Wi-Fi Antenna Interface| • ANT_WIFIO
• ANT_WIFI1/BT
• 50 Q impedance
BT Antenna Interface| • ANT_WIFI1/BT or ANT_BT?
• 50 Q impedance
Hardware Interface
Wi-Fi Application Interface| SDIO 3.0
Bluetooth Application Interface| UART. PCM

1.  To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements.
2. FCS850R-B is a three-antenna module, and the Bluetooth antenna interface is ANT_BT. ANT_WIFI1/BT is only used as Wi-Fi1 antenna interface.

RF Performances

3.1. Wi-Fi Performances
Table 4: Wi-Fi Performances
Operating Frequency
2.4 GHz: 2.400-2.4835 GHz
5 GHz: 5.150-5.850 GHz
Modulation
DBPSK. DQPSK. CCK
. BPSK. QPSK. 16QAM. 64QAM. 256QAM
Operating Mode

•  AP
•  STA

Transmission Data Rate

• 802.11b: 1 Mbps. 2 Mbps. 5.5 Mbps. 11 Mbps
• 802.11a/g: 6 Mbps. 9 Mbps. 12 Mbps. 18 Mbps. 24 Mbps. 36 Mbps. 48 Mbps. 54 Mbps
• 802.11n: HT20 (MCS 0~7) . HT40 (MCS 0~7)
• 802.11ac: VHT20 (MCS0~8) . VHT40 (MCS 0~9) . VHT80 (MCS 0~9)

3.2. Bluetooth Performances
Table 5: Bluetooth Performances
Operating Frequency
2.400-2.4835 GHz
Modulation
GFSK. m/4-DQPSK. 8-DPSK
Operating Mode

• (Classic Bluetooth (BR + EDR)
•  Low power Bluetooth (BLE)

Application Interfaces

4.1. Pin Assignment

NOTE

1. Keep all RESERVED or unused pins unconnected.

4.2. Pin Description
Table 6: /0 Parameters Definition

DC characteristics include power domain and rate current.
Table 7: Pin Description
Power Supply

Pin Name| Pin No.| I/O| Description| DC Characteristics| Comment
---|---|---|---|---|---
VBAT| 36| PI| Power supply for the module| Vmin=3.1V
Vnom=33V
Vmax =3.6 V| It must be provided with sufficient current more than 1.5A.
VDDIO| 34| PI| Power supply for the module’s I/O pins| Vmin=1.7V
Vnom = 1.8/3.3V
Vmax =3.6 V| It must be provided with sufficient current more than 50 mA.
The voltage of VDDIO determines
the voltage range of 1/0.
GND| 1. 3~8. 10. 11. 23, 32, 39. 46. 48

Wi-Fi Application Interface

Pin Name| Pin No.| IO| Description| DC Characteristics| Comment
---|---|---|---|---|---
WLAN_EN| 15| DI| WLAN enable control /GPIO15| VDDIO| Active high.
WLAN_WAKE_HOST| 16/24| DO| Wi-Fi wakes up host
SDIO_CMD| 17| DIO| SDIO command| Requires differential impedance of 50 Ω.
SDIO 3.0 compliant.
SDIO_CLK| 18| DI| SDIO clock
SDIO_DATA3| 19| DIO| SDIO data bit 3
SDIO_DATA2| 20| DIO| SDIO data bit 2
SDIO_DATAO| 21| DIO| SDIO data bit 0
SDIO_DATA1| 22| DIO| SDIO data bit 1
SDIO_RST| 44| DI| SDIO Reset| Active low.

Bluetooth Application Interface

Pin Name| Pin No.| I/0| Description| DC Characteristics| Comment
---|---|---|---|---|---
PCM_SYNC| 27| DI| PCM data frame sync| VDD IO| If unused, keep these pins open.
PCM_DIN| 28| DI| PCM data input
PCM_DOUT| 29| DO| PCM data output
PCM_CLK| 30| DI| PCM clock
BT EN| 38| DI| BT enable control| Active high.
BT_TXD| 40| DO| BT UART transmit| It is recommend to adda0 Ω series
resistor
BT_RXD| 41| DI| BT UART receive
BT_RTS| 42| DO| BT UART clear to send
BT_CTS| 43| DI| BT UART clear to send
HOST_WAKE_BT| 49| DI| HOST wake up BT| Active high.
BT_WAKE_HOST| 50| DO| BT wake up HOST

RF Antenna Interface

Pin Name| Pin No.| I/0| Description| DC Characteristics| Comment
---|---|---|---|---|---
ANT_WIFI1/BT| 2| AIO| Wi-Fi1/Bluetooth antenna interface| | 50 Ω impedance.
ANT_WIFIO| 9| AIO| Wi-Fi 0 antenna interface| | 50 Ω impedance.
ANT BT³| 12| AIO| Bluetooth antenna interface| | 50 Ω impedance.

Other Interfaces

Pin Name| Pin No.| I/0| Description| DC Characteristics| Comment
---|---|---|---|---|---
WLAN_SLP_CLK| 31| DI| 32.768kHz WLAN sleep clock| VDDIO| If unused, keep it open.

Other Interfaces

Pin Name| Pin No.| I/0| Description| DC Characteristics| Comment
---|---|---|---|---|---
RESERVED1| 13| DIO|  GPIO6| VDDIO| If unused, keep it open.
RESERVED2| 14| DIO|  GPIOS| It needs to be suspended or pulled down during power-on.
RESERVED3| 25| DIO|  GPIO7| If unused, keep it open.
RESERVED4| 45| DIO|  GPIO4

NC Pins

4.3. Power Supply
The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient more than 1.5 A. For better power supply performance, it is recommended to parallel a 47 μF decoupling capacitor, and 1 μF and 100 nF filter capacitors near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:
3 For two antenna modules (FCS850R), keep ANT_BT open.

The power-up timing of the module is shown below.

4.4. Wi-Fi Application Interface
The module provides SDIO interface for communication with the host to realize the functional application of Wi-Fi.

4.4.1. SDIO Interface
SDIO interface connection between the module and the host is illustrated in the following figure.

To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

• Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. The impedance of SDIO signal trace is 50 Q +10 %.
• Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.
• SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 1 mm distance between the traces). The length of signal line inside the module is as follows:
  SDIO_CLK: 12.9mm. SDIOCMD: 14.5mm. SDIO DATAO: 9.9mm. SDIODATA1: 11.7mm.
  SDIO DATA2: 9.3mm. SDIO_ DATA3: 9.8mm, pay attention to the SDIO wiring length during design.
  According to the transmission rate, the length of signal line has the following requirements:

1. For SDR104 mode, the recommended signal line length is less than 50 mm,.
2. For other modes, such as DDR50, SDR50, etc., the recommended signal line length is less than 150 mm.

• The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF.
• Keep SDIO wiring parallel on the same floor as much as possible. Ensure that SDIO wiring is surrounded by ground holes and does not cross each other.

4.5. Bluetooth Application Interface
Bluetooth application interface connection between the module and the host is illustrated in the figure below.

4.5.1. PCM Interface
The module provides a PCM interface for Bluetooth voice applications and supports the following features:

• Supports Master and Slave mode
• Programmable long/short Frame Sync
• Supports 8-bit A-law/u-law, and 13/16-bit linear pCM formats
• Supports sign-extension
• PCM Master Clock Output: 64, 128, 256, or 512kHz
• Supports SCO/ESCO link

PCM interface timing as below:

Table 1: PCM Interface Clock Specifications

Table 2: PCM Interface Timing

4.5.2. UART interface
The module supports Bluetooth HCI (Host Controller Interface) UART, supports hardware flow control (RTS/CTS), and can be used for data transmission with the host. The default baud rate is 115200, which can support up to 4 Mbps baud rate

Table 3: UART interface timing parameters

K. 76.8K. 115.2K.
128 K. 153.6K. 230.4 K. 460.8 K. 500 K. 921.6K.
1 M. 1.5M. 2 M.
25M. 3M. 4M

4.6. RF Antenna Interface
Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only.
Analysis, evaluation and determination are still necessary when designing target products.

Table 8: Antenna Design Requirements

5150~5850
Cable Insertion Loss (dB)| <1
VSWR| ≤2
Gain (dBi)| 1 (Typ)
Max Input Power (W)| 50
Input Impedance (Q)| 50
Polarization Type| Vertical

4.6.1.Reference Design
A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a T-type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 Ω.
The following reference design is based on ANT_WIFIO as an example, the reference design of other RF antenna interfaces is the same.

4.6.2.RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 x W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

4.6.3. RF Connector Recommendation
If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.

U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

(2.3mm Nom.)
Applicable
cable| Dia. 0.81mm
Coaxial cable| Dia 1.13mm and
Dia 2. 1.32mm
Coaxial cable| Dia. 0.81mm
Coaxial cable| Dia. 1mm
Coaxial cable| Dia. 1.37mm
Coaxial cable
‘Weight (mg)| 53.7| 59.1| 34.8| 45.5| 71.7
RoHS| YES

Figure 14: Specifications of Mated Plugs

The following figure describes the space factor of mated connectors.

For more details, please visit http://www.hirose.com.

Electrical Characteristics & Reliability

5.1. Absolute Maximum Ratings
Table 9: Absolute Maximum Ratings (Unit: V)

5.2. Power Supply Ratings
Table 10: Module Power Supply Ratings (Unit: V)

5.3. ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

5.4. Digital /0 Characteristics
Table 11: VDDIO I/O Characteristics (Unit: V)

1.8 V voltage range

Parameter| Description| Min.| Max.| Parameter
VIH| High-level Input Voltage| 1.7| 3.6| V
VIL| Low-level Input Voltage| -0.3| 0.8| V
VOH| High-level Output Voltage| 1.62| 1.8| V
VOL| Low-level Output Voltage| 0| 0.18| V
3.3 V voltage range
Parameter| Description| Min.| Max.| Parameter
VIH| High-level Input Voltage| 2.0| 3.6| V
VIL| Low-level Input Voltage| -0.3| 0.9| V
VOH| High-level Output Voltage| 2.97| 3.3| V
VOL| Low-level Output Voltage| 0| 0.33| V

5.5. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
• Follow the principles below when the heatsink is necessary:
  – Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  – Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  – Choose the heatsink with adequate fins to dissipate heat;
  – Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  – Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are +0.2 mm unless otherwise specified.

6.1. Mechanical Dimensions

NOTE
The package warpage level of the module conforms to JEITA ED-7306 standard.

6.2. Recommended Footprint

NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

6.3. Top and Bottom Views

NOTE
Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing & Packaging

7.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 +5 °C and the relative humidity should be 35-60 %.

2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.

3. Floor life: 168 hours ° in a factory where the temperature is 23 +5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   •  The module is not stored in Recommended Storage Condition;
   •  Violation of the third requirement mentioned above;
   •  Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   •  Before module repairing.

5. If needed, the pre-baking should follow the requirements below:

5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to /PC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.

2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
   If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.

3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

7.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15-0.18 mm. For more details, see document [2].
The recommended peak reflow temperature should be 235-246 °C, with 246 °C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 12: Recommended Thermal Profile Parameters

NOTE

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

7.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape
Dimension details are as follow:

Table 13: Carrier Tape Dimension Table (Unit: mm)

7.3.2.Plastic Reel

Table 14: Plastic Reel Dimension Table (Unit: mm)

7.3.3.Mounting Direction

7.3.4.Packaging Process

Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.

Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

Place the vacuum-packed plastic reel into the pizza box.

Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.

Figure 26: Packaging Process

Appendix References

Table 15: Related Documents
Document Name
[1] Quectel UMTS&LTE_EVB_User_Guide
[2] Quectel_RF_Layout_Application_Note
[3] Quectel_Module_SMT_Application_Note

Table 16: Terms and Abbreviations

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show  compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band
   emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
   The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class Il permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (XMR2023FCS850RB) procedure followed by a Class Il permissive change application.

End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FCS850RB” “Contains IC: 10224A-23FCS850RB “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna type| 2.4GHz band Peak Gain (dBi)| 5.2GHz band Peak Gain (dBi)| 5.3GHz band Peak Gain (dBi)| 5.5GHz band Peak Gain (dBi)| 5.8GHz band Peak Gain (dBi)
---|---|---|---|---|---
Dipole| 0.73| 1.14| 1.00| 0.60| 0.95

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by tumning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and 15.407 requirements for Modular Approval.
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.

Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz)
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.
The device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
The maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall comply with the e.i.r.p. limit; and
The maximum antenna gain permitted for devices in the band 5725-5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to- point operation as appropriate.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
   As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC:10224A-23FCS850RB”.

Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

FCS850R-B_Hardware_Design
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact us | Quectel

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