QUECTEL FGS060N Wi-Fi Bluetooth and 802.15.4 Module User Guide

QUECTEL FGS060N Wi-Fi Bluetooth and 802.15.4 Module

Product Information

Specifications:

• Module Series : Wi-Fi, Bluetooth & 802.15.4
• Version : 0.1
• Date : 2023-03-06
• Status : Draft

Product Usage Instructions

Contact Information

• If you require any assistance, please contact our headquarters
• Quectel Wireless Solutions Co., Ltd.
• Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com
• Or you can contact our local offices. For more information, please visit our sales support page.
• If you need technical support or want to report documentation errors, please visit our technical supportpage. You can also email us at support@quectel.com .

Legal Notices:

• Use and Disclosure Restrictions
  Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

• Copyright:
  Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

• Third-Party Rights:
  This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

• Privacy Policy:
  To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer:

• We acknowledge no liability for any injury or damage arising from the reliance upon the information.
• We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
• While we have made every effort to ensure that the functions and features under development are safe and reliable, we cannot guarantee their absolute safety and reliability.

Safety Information:
The following safety precautions must be observed during all phases of operation, such as usage, service, or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

Driving Safety:
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

FAQ:

• Q: How can I get technical support for the FGS060N module?
  A: You can visit our technical support page at http://www.quectel.com/support/technical.htm
  or email us at support@quectel.com .

Hardware Design

• Wi-Fi, Bluetooth & 802.15.4 Module Series Version: 0.1
• Date: 2023-03-06
• Status: Draft

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

• Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
• Tel: +86 21 5108 6236
• Email: info@quectel.com

Or our local offices. For more information, please visit:

• http://www.quectel.com/support/sales.htm .
• For technical support, or to report documentation errors, please visit:  http://www.quectel.com/support/technical.htm .
• Or email us at: support@quectel.com .

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

• License Agreements
  Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

• Copyright

  • Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

• Trademarks
  Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

• Third-Party Rights

  • This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
  • We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.

• Privacy Policy

  • To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers.
  • Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

1. We acknowledge no liability for any injury or damage arising from the reliance upon the information.
2. We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
3. While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
4.  We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.

Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

• Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
• Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
• Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
• Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
• The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
• In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document defines the FGS060N and describes its air interfaces and hardware interfaces which are connected with your applications.
With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

Special Mark
Table 1: Special Mark

• Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FGS060N is in compliance with Directive 2014/53/EU.
• The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm

Product Overview

• FGS060N is a high-performance IEEE 802.11 a/b/g/n/ac/ax Wi-Fi, Bluetooth 5.2 and 802.15.4 module. It supports 2.4/5 GHz dual-band 1T1R Wi-Fi 6. Peak data rates up to 480 Mbps. It provides SDIO 3.0 interface for Wi-Fi, UART for Bluetooth and SPI for 802.15.4.
• It is an LGA module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information

• FGS060N
  • Packaging type LGA
  • Pin counts 84
  • Dimensions (13±0.1) mm × (14±0.1) mm × (2±0.08) mm
  • Weight TBD

Key Features

Table 3: Key Features

Basic Information

• Protocol and Standard
  • Wi-Fi protocols: IEEE 802.11 a/b/g/n/ac/ax
  • Bluetooth protocol: Bluetooth 5.2
  • 802.15.4
  • All hardware components are fully compliant with EU RoHS directive
• Power Supply
  • VBAT_3V3 Power Supply:
  • 3.14–3.46 V，Typ.:3.3V
  • VBAT_1V8 Power Supply:
  •  1.71–1.89 V，Typ.:1.8V
  • VDDIO Power Supply:
  •  3.14–3.46 V，Typ.:3.3V
  •  1.71–1.89 V，Typ.:1.8V
  • VDDIO_RF Power Supply:
  • 3.14–3.46 V，Typ.:3.3V
  • 1.71–1.89 V，Typ.:1.8V
  • SDIO_VDD Power Supply:
  •  3.14–3.46 V，Typ.:3.3V
  •  1.71–1.89 V，Typ.:1.8V
• Temperature Ranges
  •  Operating temperature 1: -40 to +85 °C
  •  Storage temperature: -45 to +95°C
• EVB Kit  TBD

RF Antenna Interface

• Wi-Fi Antenna Interface
  • ANT_WIFI/BT
  • 50 Ω impedance
• Hardware Interface
  • Wi-Fi Application  SDIO 3.0
  • Interface
  • Bluetooth Application Interface UART
  • 802.15.4 Application Interface SPI

1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements.

RF Performances

Wi-Fi Performances

Table 4: Wi-Fi Performances

• Operating Frequency

  • 2.4 GHz: 2.400–2.4835 GHz
  • 5 GHz: 4.900–5.895 GHz

• Modulation
  DSSS, OFDM, DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM,1024QAM

• Operating Mode

  • AP
  • STA

• Transmission Data Rate

  • 802.11b：1 Mbps,2 Mbps,5.5 Mbps,11 Mbps
  • 802.11a/g：6 Mbps,9 Mbps,12 Mbps,18 Mbps,24 Mbps,36 Mbps,48 Mbps,54 Mbps
  • 802.11n：HT20 (MCS 0~7), HT40 (MCS 0~7)
  • 802.11ac：VHT20 (MCS 0~8), VHT40 (MCS 0~9), VHT80(MCS 0~9)
  • 802.11ax：HE20 (MCS 0~11), HE40 (MCS 0~11), HE80 (MCS 0~11)

Table 5: Wi-Fi Power Consumption

Bluetooth Performances
Table 6 : Bluetooth Performances

Table 7: BLE Power Consumption in Non-signaling Modes

Application Interfaces

Pin Assignment

Figure 1: Pin Assignment (Top View)

NOTE

1. Keep all RESERVED or unused pins unconnected.
2. All GND pins should be connected to ground.

Pin Description

Table 8: I/O Parameters Definition Table 9: Pin Description

Power Supply

• The module uses multiple power supplies. There are 5 power supplies, VBAT_ 3V3,VBAT_1V8,VDDIO， VDDIO_RF，SDIOVDD. VBAT 3V3 is powered by 3.3V, the current is at least 0.5A, VBAT_ 1V8 current at least 1A, VDDIO，VDDIO_RF，SDIO_VDD These three VDDs can be powered by 1.8V or 3.3V, mainly for digital IO interface. In order to obtain better power performance, it is recommended to connect 47 μ F in parallel near the VBAT pin and 1 μ F and 100 nF filter capacitors close to the Module. In addition, it is recommended to add TVS near VBAT to improve the surge voltage withstand capacity of the module.
• In principle, the design wiring width of each VBAT power supply is as wide as possible and the length is as short as possible.
• The power-up timing of the module is shown below.

NOTE

• tPU_RESET : Valid power to PDn de-asserted.
• tRPW: PDn pulse width
• tINIT: From PDn de-assertion to device ready (SDIO bus enumeration)

Wi-Fi Application Interface
Wi-Fi application interface connection between the module and the host is illustrated in the figure below.

SDIO Interface
SDIO interface connection between the module and the host is illustrated in the following figure. To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

• Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. The impedance of SDIO signal trace is 50 Ω ±10 %.
• Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.
• SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 1 mm distance between the traces).
• The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF.

Bluetooth Application Interface
Bluetooth application interface connection between the module and the host is illustrated in the figure below.

UART Interface
The module supports an HCI (Host Controller Interface) UART. The UART is used for data transmission with the host.

802.15.4 Application Interface
802.15.4 application interface connection between the module and the host is illustrated in the figure below.

SPI Interface
The module supports an HCI (Host Controller Interface) SPI. The SPI is used for data transmission with the host. RF Antenna Interface

• The module supports pin antenna interface (ANT_WIFI/BT). The impedance of antenna port is 50 Ω.
• Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

Table 10: Antenna Design Requirements

Note: The antenna connector will be fixed in the actual use of the finished product and cannot be replaced.

Reference Design
A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a π-type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 Ω.

2 For more details about the RF performances, see Chapter 3.

RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance.
• The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

For more details about RF layout, see document [1].

RF Connector Recommendation

• If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.
• U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

Figure 16: Specifications of Mated Plugs

The following figure describes the space factor of mated connectors.

Figure 17: Space Factor of Mated Connectors (Unit: mm)

For more details, please visit http://www.hirose.com .

Electrical Characteristics & Reliability

Absolute Maximum Ratings
Table 11: Absolute Maximum Ratings (Unit: V)

Power Supply Ratings
Table 12: Module Power Supply Ratings (Unit: V)

ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 13: Electrostatics Discharge Characteristics (Unit: kV)

Digital I/O Characteristics
Table 14: VDDIO 1V8 I/O Characteristics (Unit: V)

When I/O supply voltage VDDIO=1.8V

VIH

|

High-level Input Voltage

|

0.7*VIO

|

VIO+0.4

VIL

|

Low-level Input Voltage

|

-0.4

|

0.3*VIO

VOH

|

High-level Output Voltage

|

VIO-0.4

|

–

VOL

|

Low-level Output Voltage

|

–

|

0.4

Table 15: VDDIO 3V3 I/O Characteristics (Unit: V)

When I/O supply voltage VDDIO=3.3V

VIH

|

High-level Input Voltage

|

0.7*VIO

|

VIO+0.4

VOH

|

High-level Output Voltage

|

VIO-0.4

|

–

VOL

|

Low-level Output Voltage

|

–

|

0.4

Table 16: VDDIO_RF 1V8 I/O Characteristics (Unit: V) When I/O supply voltage VDDIO_RF=1.8V

Table 17: VDDIO_RF 3V3 I/O Characteristics (Unit: V)

When I/O supply voltage VDDIO_RF=3.3V

VIH

|

High-level Input Voltage

|

0.7*VIO

|

VIO+0.4

VIL| Low-level Input Voltage| -0.4| 0.3*VIO
VOH| High-level Output Voltage| VIO-0.4| –
VOL| Low-level Output Voltage| –| 0.4

Table 18: SDIO_VDD 1V8 I/O Characteristics (Unit: V) When I/O supply voltage SDIO_VDD=1.8V

VIH

|

High-level Input Voltage

|

0.7*VIO

|

VIO+0.4

VIL

|

Low-level Input Voltage

|

-0.4

|

0.3*VIO

VOH| High-level Output Voltage| VIO-0.4| –
VOL| Low-level Output Voltage| –| 0.4

Table 19: SDIO_VDD 3V3 I/O Characteristics (Unit: V)

When I/O supply voltage SDIO_VDD=3.3V

VIH

|

High-level Input Voltage

|

0.7*VIO

|

VIO+0.4

VIL| Low-level Input Voltage| -0.4| 0.3*VIO
VOH| High-level Output Voltage| VIO-0.4| –
VOL| Low-level Output Voltage| –| 0.4

Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.

The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
• Follow the principles below when the heatsink is necessary:
  • Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  • Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  • Choose the heatsink with adequate fins to dissipate heat;
  • Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  • Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information
TBD

Storage, Manufacturing & Packaging
TBD

Appendix References

Table 20: Related Documents

Table 21: Terms and Abbreviations

FCC Certification Requirements

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
   body and must not transmit simultaneously with any other antenna or transmitter.

3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FGS060N.

4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

5. Bluetooth/Bluetooth LE/Wi-Fi 2.4G:≤0.73 dBi

6. Wi-Fi 5G:≤1.14 dBi

7. This module must not transmit simultaneously with any other antenna or transmitter

8. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

• For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093
• If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
• For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
  • A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID – Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).
  • For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“ Contains Transmitter Module FCC ID: XMR2023FGS060N.” or “Contains FCC ID: XMR2023FGS060N.” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.
• The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
• The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.

IC Certification Requirements.
This device contains licence-exempt transmitters)/receivers) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause undesired operation of the device.

To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

• Bluetooth/Bluetooth LE/Wi-Fi 2.4G:≤0.73 dBi
• Wi-Fi 5G:≤1.14 dBi

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. To comply with RSS-102 RF Exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for the transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

The user manual for LE-LAN devices shall contain instructions related to the restrictions mentioned in the above sections, namely that:

1. the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
2. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit. iii. for devices with detachable antennals), the maximum antenna gain permitted for devices in the band5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; iv. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliantwith the e.iro. elevation mask reauirement set forth in section 6.2.2.3 shall be clearly indicated.

The host product shall be properly labelled to identify the modules within the host product.

• The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
  • “Contains IC: 10224A-2023FGS060N” or “where: 10224A-2023FGS060N is the module’s certification number”.

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact us | Quectel

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