Microsemi AN4535 Programming Antifuse Devices User Guide

June 9, 2024
Microsemi

Microsemi AN4535 Programming Antifuse Devices

Introduction

This document provides an overview of the various programming options available for the Microchip SoC Products Group antifuse families. It provides helpful information related to programming failures and measures that you can take to increase programming yield along with actions that you must consider in the event of programming failures. A summary of SoC Products Group Return Material Authorization (RMA) policies and procedures is also included.

General Antifuse Programming Information

The following section provides information about general antifuse programming.

Programming Features of SoC Products Group Devices
The SoC Products Group provides the following types of Field-Programmable Gate Arrays (FPGAs):

  • Antifuse
  • Flash

Note: Some programming methods are common to both, whereas some are exclusive to Flash. This document describes the programming solutions supported for antifuse devices only.

Antifuse Technology
The antifuse architecture is One Time Programmable (OTP) by design. Antifuse devices are not in-system programmable. For details on the antifuse architectures, see Antifuse FPGAs. Antifuse technology is nonvolatile, therefore, it is live at power-up and inherently very secure. For more information on security types and implementation, see Implementation of Security in Microsemi Antifuse FPGAs Application Note. Antifuse devices are mainly programmed using single-site or multi-site programmers. Volume- programming services, either from SoC Products Group or from other vendors, are also used.

Types of Programming for Antifuse Devices
Depending on the number of devices you wish to program and the type of device, you can choose from the following programming methods:

  • Device programmers
    • Single-site programmers
    • Multi-site programmers, batch programmers or gang programmers
  • Volume programming services
    •  SoC Products Group in-house programming (IHP)
    •  Programming centers

Types of Programming for Antifuse Devices
The following section provides information about the types of programming for antifuse devices.

Device Programmers
Device programmers are used to program a device before it is mounted on the system board. It can either be programmed before being soldered (usually done in production) or programmed before putting it into a socket (used for prototyping). The advantage of using device programmers is that no programming hardware is required on your system board. Therefore, no additional components or board space is required.

If you intend to program devices frequently with different programs or if you program relatively small volumes of devices, buying a single-site device programmer is the simplest solution. For some military or space designs, you might also want to use programming onsite to maintain control of the devices at all times.
Adapter modules are purchased with the programmers to support the FPGA packages you intend to use. When you receive the FPGA, place it in the adapter module and run the programming software from a PC. SoC Products Group supplies the programming software for all the SoC Products Group programmers. The software enables you to select your device, programming files, program, and verify the device.

Single-Site Programmers
A single-site programmer programs one device at a time. SoC Products Group offers Silicon Sculptor 3 and Silicon Sculptor 4 as single-site programmers.

Advantages

  • Lower cost than multi-site programmers
  • No additional overhead for programming on the system board
  • Allows local control of programming and data files for maximum security
  • Allows on-demand programming onsite

Limitations:
Only programs one device at a time

Multi-Site Programmers
Often referred to as a batch or gang programmers, multi-site programmers can program multiple devices at the same time using the same programming file. This is often used for large volume programming and by programming houses. The sites often have independent processors and memory enabling the sites to operate concurrently, meaning each site might start programming the same file independently enabling the operator to change one device while the other sites continue programming, which increases throughput. You must buy multiple adapter modules for the same package when using a multi-site programmer. You can connect multiple Silicon Sculptor 3 or Silicon Sculptor 4 programmers via a powered USB hub to a single PC (you can connect up to 12 programmers to a single PC) for concurrent programming. All the adapter modules on such a concurrent chain must be identical.

Advantages

  • Provides the capability of programming multiple devices at the same time
  • No additional overhead for programming on the system board
  • Allows local control of programming and data files for maximum security

Limitations:
More expensive than a single-site programmer

Volume Programming Services
When you are ready to run your design in production, you can buy large volumes of parts and have them programmed before you receive them.
Advantages: This is much easier than having a large programming capability in- house, as programming centers have multiple programmers running in parallel and can deliver programmed parts more cost effectively.
Limitations: Programming files must be sent to the programming service provider. Non Disclosure Agreements
(NDAs) can be signed to help ensure that your data is protected.
Note:  Any programs that do not allow files to be sent off-site, cannot use this approach.

SoC Products Group In-House Programming (IHP)
When you purchase your SoC Products Group devices in volume, you can request IHP as part of your purchase. If you choose this option, there is a small charge for each device that you want programmed. Each device is marked to distinguish it from blank parts. When you have your programming files ready, send them to SoC Products Group. You receive sample parts that are programmed with your design. After approving the First Articles, SoC Products Group proceeds with programming the remainder of the order. To request SoC Products Group IHP, contact your local SoC Products Group representative.

Distributor Programming Centers
Many distributors provide programming for their customers. This can be an advantage when looking at yield and RMA requirements for antifuse devices. Consult with your preferred distributor about this option.

Independent Programming Centers
There are many programming centers that specialize only in programming and are not directly affiliated with SoC Products Group or our distributors. These programming centers must follow the guidelines for programming SoC Products Group devices and must be using certified programmers to program the SoC Products Group devices.

Note:  SoC Products Group does not have recommendations for external programming centers.

Programming Solutions
Details about the available programmers can be found in the programmer user’s guides listed in the 3. References section.
All of the antifuse programmers require adapter modules, which are designed to support device packages. The modules are listed on the SoC Products Group website.
They are not listed in this application note, as this list is updated frequently with the new package options and any upgrades required to improve programming yield or support new families.
For additional details such as Supported Programmers and FPGAs, ordering information, see Microchip FPGA Programming Options.

Antifuse Programming Guidelines

The following section provides information about the antifuse programming guidelines.

Preprogramming Setup
Before programming, several steps are required to ensure an optimal programming yield:

  1. Use Proper Handling and Electrostatic Discharge (ESD) Precautions. SoC Products Group FPGAs are sensitive electronic devices that are susceptible to damage from ESD and other types of mishandling. These devices are Complementary Metal Oxide Semiconductor (CMOS) devices and require proper grounding and ESD handling procedures. Although, these FPGAs have static discharge protection built in, you must always follow ESD handling procedures when handling them.
    Always keep the FPGA devices in their insulative carrying cases or trays until they are used, and keep the surrounding environment clean and free of dust and debris. Periodically, check the Adapter Module sockets to verify that they are free of dirt or other debris that can prevent good electrical pin connections between the device and socket.

  2. The Ceramic Quad Flat Package (CQFP) devices are burned-in, tested, packaged, and shipped in Non-Conductive Tie Bar packages. Through-hole sockets are used to test and burn-in the devices. These sockets are also used on the programming adapter modules. You must not remove the tie bar prior to programming these devices. After programming, you must remove the tie bar and trim and form the leads of the device. For more information, see Assembly Instructions for CQFP Packages SMT on PCB Application Note.
    When loading the devices in the Adapter Module socket, ensure to orient them so that pin 1 is oriented according to the indication on the Adapter Module.
    Note:  Damage can occur if the FPGA is loaded incorrectly.
    Loading CQFP devices in the Adapter Module socket needs special attention. Use the following table to determine whether to insert your device into the Adapter Module with the logo facing up or down.

Table 2-1. Orientation****

Package Adapter Modules Logo Face
CQ84 SM84CQ-ACTEL

SMSX-84CQ-ACTEL

| Down
CQ132| SM132CQ-ACTEL| Down
CQ172| SM132CQ-ACTEL| Down
CQ196| SM132CQ-ACTEL| Down
CQ208| SM208CQ-ACTEL-2 SM208CQSX-ACTEL

SMAX-208CQ-ACTEL

| Down
CQ256| SM208CQ-ACTEL-2 SM208CQSX-ACTEL

SMAX-256CQ-ACTEL

| Down
CQ352| SMAX-352CQ-ACTEL

SMAX-352CQ4K-ACTEL

| Down

  1. Use the latest version of the Libero® IDE software to generate your programming file (Recommended). The file used to program SoC Products Group antifuse devices (*.afm) contains important information about the fuses that are programmed in the FPGA. For more information, see the Libero IDE page.
    Note:  Programming files must always be zipped during file transfer to avoid the possibility of file corruption.

  2. Use the latest version of the Silicon Sculptor software. The programming software is frequently updated to accommodate yield enhancements in FPGA manufacturing. These updates ensure maximum programming yield and minimum programming times. Before programming, always check that the version of the Silicon Sculptor software you use is the most recent by visiting Silicon Sculptor Tools page.

  3. Use the most recent Adapter Module. SoC Products Group makes modifications to their modules to improve programming yields and programming times. To identify the latest version of each module before programming, see Silicon Sculptor Adapter Modules.

  4. Check Insertion Limit of the Adapter Module. Before programming with any Adapter Module, ensure the insertion limit is within the range specified on the SoC Products Group website. The number of socket module insertion can be found in Socket Module Counter in the Tools menu.

  5. Perform Routine Hardware Self-Diagnostic Test. The self-diagnostic test verifies correct operation of the
    pin drivers, power supply, CPU, memory, and adapter module. This test must be performed before every programming session. The test must be executed atleast every week. To perform self-diagnostic testing using the Silicon Sculptor software, follow the steps.
    – Select Device > SoC Products Group Diagnostic > Test tab > OK.

  6. Perform Routine Hardware Verification and Calibration. The verification and calibration procedure ensures that the test limits used during the self-diagnostic test are accurate. SoC Products Group recommends periodic verification of the calibration of the programmer, especially, when you observe higher than normal programming failures. For Radiation-Tolerant (RT) devices, SoC Products Group requires verification of the calibration of the programmer to be performed prior to each programming session. For verification and calibration instructions, see Silicon Sculptor 3 and Silicon Sculptor 4.
    If the programmer fails the calibration, contact SoC Products Group Technical Support and send the log file. Notes:  For FPGA family specific guidelines, see the following documents:
    • Recommendations for Programming RTSX-S and RTSX-SU
    • RTAX Programming User Guide

Programming Antifuse FPGAs
The following steps are required to program SoC Products Group antifuse FPGAs:

  1. Setup: In the programming software, select the device you want to program and load the Data Pattern with the programming file.

  2. Perform Blankcheck (recommended): This test confirms that the actual device about to be programmed matches the device selected and is completely blank. This helps to prevent mixing up programming failures with blank devices.
    Note:  SoC Products Group recommends performing this step before each programming session.

  3. Program: During this step, the actual programming file is mapped into the device. Remember to enable programming of the security fuses if necessary. If broadcasting, press Start to program each site.

  4. Checksum (recommended): This step confirms that the FPGA is programmed correctly.

Programming Failure Allowances
Even though it is impossible for SoC Products Group to screen 100% of potential programming failures on antifuse FPGAs, SoC Products Group does screen for low programming yields by programming a sample of devices from every lot that is shipped. The test sample size is chosen, therefore, there is a high level of confidence that 97% (most antifuse devices) programming yield criteria is met. As long as all the requirements listed above are satisfied, SoC Products Group replaces 100% of field programming rejects. See Programming and Functional Failure Guidelines User Guide for programming failure allowance tables.
If the programming yield is lower than expected (failure quantity exceeds those listed in the allowance tables), SoC Products Group performs an investigation to determine if the high level failure rate is caused by the system used to program the devices or can be attributed to the devices themselves.
For a complete procedure on handling programming failures, see 2.4. Guidelines for Handling Programming Failures.

Guidelines for Handling Programming Failures
The following sections provide specific guidelines on handling programming failures with SoC Products Group FPGAs.
Antifuse FPGAs (Non-RadTolerant)
To handle programming failures for antifuse FPGAs, follow these instructions:

  1. Debug the Error Message. Any time you encounter a failure:

    • Record the error message. It is important that the message is recorded exactly as it appears. The detailed error message can be found in the programming log file generated by the software. The default location for these log files is C:\BP\DATALOG\. The log file for the current programming session is named as BlackBox.log. Previous programming sessions are saved to log files named as bp<#>.log.
    • Compare your error message to those listed in the 2.5. Common Programming Failure Modes. Try to resolve the problem based on the given suggestions.
      If failures continue, proceed to the next step.
  2. Check the Programming Setup.

    • Record the version of the software you use. Then, upgrade to the latest version.
    • Perform the self-diagnostic test.
    • Record the exact part number of the adapter module(s) you use. Then, upgrade to the latest version.
      Continue programming and proceed to the next step.
  3. Check the Programming Yield.
    Compare your programming fallout with the appropriate tables listed in Programming and Functional Failure Guidelines User Guide. Continue programming if you are within the guidelines. Contact your distributor or sales office to return devices, and provide failure rates along with your request.
    If the failure rate exceeds the expected fallout, proceed to the next step.

  4. Record Device Details. Record the following for all failures and programmed devices:

    • Date code (four digit number on top of device)
    • Lot code (alphanumeric usually on underside of device)
    • Number of devices that failed and number that passed programming, from each lot
  5.  Contact SoC Products Group Technical Support. Complete the Customer Complaint Information Request Checklist Programming Failure Analysis (FA) checklist for antifuse devices and contact SoC Products Group Technical Support. Ensure to include the following information:

    • Specific error message obtained
    • Software version used
    • Adapter module part number
    • Date and lot code
    • Failure rates for each lot

RadHard and RadTolerant FPGAs
To handle programming failures for Rad-Hard (RH) and Rad-Tolerant (RT) FPGAs, follow these instructions:

  1. Debug the error message and check the programming setup.
    Note:  Stop programming immediately.
    Due to the high cost of RH/RT devices, it is important to verify that the software and hardware are up-to-date and are in good working condition. It is also important to provide detailed information about the failure to SoC Products Group.

    • Record the error message. It is important that the message is recorded exactly as it appears. The detailed error message can be found in the programming log file generated by the software. The default location for these log files is C:\BP\DATALOG\ . The log file for the current programming session is named as BlackBox.log. Previous programming sessions are saved to log files named as bp<#>.log.
    • Save the *.txt file under a different name, therefore, it is not overwritten.
    • Perform the self-diagnostic test.
    • Record the current version of the software, then, upgrade to the latest version.
    • Record the exact part number of the adapter module(s) being used, then, upgrade to the latest version.
  2. Check the Programming Yield. Compare your programming fallout to the appropriate table listed in Programming and Functional Failure Guidelines User Guide. Continue programming if you are within the guidelines.
    If the failure rate exceeds the expected fallout, proceed to the next step.

  3. Record Device Details. Record the following for all failures and programmed devices:

    • Date code (four digit number on top of device)
    • Lot code (alphanumeric usually on underside of device)
    • Serial number (top of device)
    • Number of devices that failed and number that passed programming, from each lot
  4. Contact SoC Products Group Technical Support. Complete the Customer Complaint Information Request Checklist Programming FA checklist for antifuse devices and contact SoC Products Group Technical Support. Ensure to include the following information:

    • Specific error message obtained
    • The *.log file
    • Software version used
    • Adapter module part number
    • Result of self-test with adapter module connected to programmer (provide log file)
    • Last calibration date of the programmer
    • Date and lot code
    • Failure rates for each lot
    • Number of devices that still require programming

Common Programming Failure Modes
For a list of common programming failure modes and suggested troubleshooting tips, see Sculptor II and Silicon Sculptor 3 Programmer User’s Guide.

Return Material Authorization (RMA) Policies
SoC Products Group consistently strives to exceed customer expectations by continuing to improve the quality of our products and our quality management system. SoC Products Group has RMA procedures in place to address programming fallout. You must be mindful of the following RMA policies:

  • All devices, submitted for an RMA, must be within the SoC Products Group warranty period of one year from date of shipment. For fallout greater than what is shown in the table listed in Progamming and Functional Failure Guidelines, a case must be initiated with SoC Products Group technical support. For fallout within the guidelines listed, return the parts for credit and replacement by requesting an RMA number through an SoC Products Group sales representative or distributor.
    Note:  RMAs are only authorized for current SoC Products Group devices. Devices that have been discontinued do not receive RMAs.
    If you experience long programming times, contact SoC Products Group technical support for assistance. Note:  Programming times for –F material might be longer than for other speed grades.

  • All devices returned for FA and Return must be in their original packaging and must have an RMA number.

  • Programming files *.afm and log files are mandatory. Any parts returned to SoC Products Group for Failure Analysis without a valid RMA number and required files are returned immediately to the customer at the customer’s expense.

  • If during the FA process, SoC Products Group is able to successfully program the units, these units are returned to the customer against the replacement order and the units are labeled as programmed.

References

Following is a list of related documents, their location on the SoC Products Group website, and a brief summary of each document:

  • Silicon Sculptor Quick Reference Card: This guide is designed as a reference to keep near your programming station and use as a training guide for programming operators.
  • Silicon Sculptor User’s Guides: Microchip Silicon Sculptor II and Silicon Sculptor 3 User’s Guide
  • Silicon Sculptor Programmer Calibration Verification Procedure: Includes hardware and software setup, calibration, use instructions, and troubleshooting/error message guide.

Revision History

The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.

Revision Date Description
A 05/2022 The following changes are made in this revision:

•     Migrated to the Microchip standard template format.

•     Renamed AC225 to AN4535.

5| 11/2011| The Certified Programming Solutions section content was revised.
4| 04/2011| The Programming Failure Allowances section content was revised and Table 7, Table 8, and Table 9 have been deleted.
3| 04/2009| •     The Supported BP Programmers section is new.

•     The Programming Failure Allowances section was updated to be consistent with the latest RMA policies. The text and Table 7 on page 9 to Table 9 on page 10.

•     The RadHard and RadTolerant FPGAs section was revised. Three additional items were added to the list of required information to report to Technical Support in the event of programming failure.

•     The Return Material Authorization (RMA) Policies section was updated to be consistent with the latest RMA policies.

2| 05/2008| The Return Material Authorization (RMA) Policies section was updated to be consistent with the latest RMA policies.
1| 06/2005| •     Programming Basics and the following subsections were deleted: Reprogrammable or One-Time Programmable (OTP), Device Programmer or In-System Programming (ISP), Live-at-Power-Up (LAPU) or Boot PROM, Design Security.

•     All information regarding Flash was removed since this application note only discusses antifuse. Table 1 was deleted.

•     The Device Programmers section was updated to include Silicon Sculptor 3.

•     Table 2 on page 4 was updated to include Silicon Sculptor 3.

•     Table 3 on page 4 was updated to include Silicon Sculptor 3.

•     Table 4 on page 5 was updated to include Silicon Sculptor 3.

•     Table 5 on page 6 was updated to include the following changes:

–    Silicon Sculptor 3 was added.

–    Silicon Sculptor I support was changed to No for RT54SX16 and RT54SX32.

–    RTAX4000S data is new.

–    Note 3 is new.

•     The Silicon Sculptor 3 section is new.

•     The Silicon Sculptor I and Silicon Sculptor 6X section was updated.

•     The Activator section was updated.

•     The Noncertified Programmers section was updated.

•     The Check Insertion Limit of the Adapter Module section is new.

•     The Contact SoC Products Group Technical Support section was updated.

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Tel: 86-27-5980-5300

China – Xian

Tel: 86-29-8833-7252

China – Xiamen

Tel: 86-592-2388138

China – Zhuhai

Tel: 86-756-3210040

| India – Bangalore

Tel: 91-80-3090-4444

India – New Delhi

Tel: 91-11-4160-8631

India – Pune

Tel: 91-20-4121-0141

Japan – Osaka

Tel: 81-6-6152-7160

Japan – Tokyo

Tel: 81-3-6880- 3770

Korea – Daegu

Tel: 82-53-744-4301

Korea – Seoul

Tel: 82-2-554-7200

Malaysia – Kuala Lumpur

Tel: 60-3-7651-7906

Malaysia – Penang

Tel: 60-4-227-8870

Philippines – Manila

Tel: 63-2-634-9065

Singapore

Tel: 65-6334-8870

Taiwan – Hsin Chu

Tel: 886-3-577-8366

Taiwan – Kaohsiung

Tel: 886-7-213-7830

Taiwan – Taipei

Tel: 886-2-2508-8600

Thailand – Bangkok

Tel: 66-2-694-1351

Vietnam – Ho Chi Minh

Tel: 84-28-5448-2100

| Austria – Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark – Copenhagen

Tel: 45-4485-5910

Fax: 45-4485-2829

Finland – Espoo

Tel: 358-9-4520-820

France – Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany – Garching

Tel: 49-8931-9700

Germany – Haan

Tel: 49-2129-3766400

Germany – Heilbronn

Tel: 49-7131-72400

Germany – Karlsruhe

Tel: 49-721-625370

Germany – Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany – Rosenheim

Tel: 49-8031-354-560

Israel – Ra’anana

Tel: 972-9-744-7705

Italy – Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy – Padova

Tel: 39-049-7625286

Netherlands – Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Norway – Trondheim

Tel: 47-72884388

Poland – Warsaw

Tel: 48-22-3325737

Romania – Bucharest

Tel: 40-21-407-87-50

Spain – Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden – Gothenberg

Tel: 46-31-704-60-40

Sweden – Stockholm

Tel: 46-8-5090-4654

UK – Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

References

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>

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