lierda L-BTMEB55-G0BP4 E55 Bluetooth Module User Manual

L-BTMEB55-G0BP4 E55 Bluetooth Module
User Manual

L-BTMEB55-G0BP4 E55 Bluetooth Module

File Rivision History

Overview

L-BTMEB55-G0NP4 low-power Bluetooth module is a high-performance Bluetooth module developed based on Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts stamp type and side-plug interface, which is exquisite and compact. Use, help users bypass the cumbersome RF hardware design, development and production, users can easily realize the development of Bluetooth applications on this basis, shorten the research and development cycle, and help you seize market opportunities.Table 1-1 Model Description

roduct with software, please communicate with the sales for the specific model and MPQ and other information

1.1 Features of the module
Working voltage: 1.8~3.6 V
Working frequency:2400MHz~2483.5MHz
Transmitting power: Max 10dBm (3.3V)
Receiving sensitivity: -95dBm (@1Mbps)
1.2 Applications
Smartphone and tablet peripherals Products
Wireless sensor networks such as smart meters and data collection
Wireless wearable Bluetooth devices
Smart cloud platform and ecological access
Smart light control, smart home, smart city

Specifications

Table 2-1 Product limit parameters

Table 2-2 Module working temperature@25℃

m**
Working voltage(V)| 1.8| 3.3| 3.6| Ripple requirements：peak to peak voltage < 30mV
Working frequency(MHz)| 2402| /| 2480|
Communication protocol| Bluetooth 5.0|
Number of channels| 40|
Modulation type| GFSK|
Receive sensitivity(dBm)| /| -96| /| @BLE mode 1Mbps;Payload=37
Transmitter current(mA)| /| 6.3| /| @0dBm
/| 18| /| @10dBm
Receiver current(mA)| /| 6| /| @5.0V(DCDC-Mode);1Mbps
transmit power（dBm）| /| 10| /| Typical value of output power when the software is configured to the maximum (in actual use, different power levels are configured according to requirements)
Interface Type| 3-sided stamp hole| Lead pitch and dimensions refer to the dimension drawing

 Hardware layout and interface description

3.1 Dimensional drawing

When designing this product, there are alternative material types for Secondary components and PCB. The appearance color may be different under the premise of Performance.
The main material (main chip, crystal oscillator, etc.) has no replacement model, but changes will be notified in advance. * The dimensional tolerances not shown in the figure are in accordance with the GB/T1804-m standard. Picture 3-2 Internal block diagram of the E55 series module.
3.2 Dimensional drawing
Table 3-1 Module Pin Function Description

when using

For detailed Pin descriptions, please refer to the TLSR8250 chip data sheet.
Table 3-2 Module power consumption parameter @25℃

3.3 PCB Package Note: The shaded area is the PCB antenna, and the bottom layer cannot be copper or placed in any layer of this area.

 Application note

4.1 Antenna design guide
If you have high requirements for communication distance, an external antenna can be used. The IO port required to use the external antenna is PIN27 (ANT). The original antenna position under the module must be completely copperm
The figure below shows the circuit from the module ANT Pin to the external antenna.
The red thick line should guarantee 50Ω impedance control. Keep the line as short as possible, do not hit the hole, do not take the acute line. Place more GND vias around the RF traces. Figure 4-1 Schematic diagram of external antenna impedance matching circuit Picture 4-2 External antenna impedance matching circuit PCB schematic and routing instructions
The highlight of the trace sould control the impedance of 50Ω, the relationship between board thickness and line width, line spacing can be referred to:
Recommended value of FR4 Double panel: (H=plate thickness，W=line width，D= Trace and copper spacing)
H=1.0mm，W=0.8mm，D=0.2mm
H=1.0mm，W=1.0mm，D=0.254mm(recommended)
H=1.2mm，W=1.0mm，D=0.2mm(recommended)
H=1.6mm，W=1.0mm，D=0.2mm (recommended) (More design support is available to Lierda Technology Consulting)
4.2 Backplane layout considerations
A large clearance area is required around the antenna. Clearance refers to the open area in the projected area of the vertical plane of the antenna (both upper and lower ranges
must be considered). In the range of the projection area of the antenna, whether it is patch or side-insertion, do not lay the ground (especially the on-board antenna), do not have metal or devices, and keep the antenna clearance to improve the radiation efficiency of the antenna.
The height (distance) between the antenna and the motherboard is also an important consideration. In general, the antenna needs to be at least 10mm above the main board, and at least 5mm in extreme environments. When the height of the antenna is less than 8 mm, the radiation efficiency of the antenna is limited.
The RF part of the module should not be avoided by the metal cavity. The distance between the RF part and the interference source should be more than 10mm. Common sources of interference are: battery (including electrical connection), capacitor, inductor, button, oscillator, power cord, Metal- containing screws or nuts, CPU, LCD, transformer, speaker, camera, product communication interface cable, power circuit, motor, etc.
If the PCB antenna is used, the PCB antenna should be on the edge of the PCB on the entire substrate. The spacing around the PCB antenna should be 10mm. The layers around the antenna should not be copper, trace or arranged. If there are multiple antennas, the distance between the antennas should be as far as possible to avoid co-channel interference and intermodulation interference;
Users should pay attention to the design. In the area where the Bottom layer has window opening for the antenna pad, no via hole can be placed to prevent short circuit.
4.4 Precautions

1. Power supply
   It is recommended to use the DC stabilized power supply to supply power to the module. The power supply ripple is as small as possible. Generally, the ripple is less than 30mV. Excessive ripple may cause low sensitivity and poor connection quality. And the Bluetooth transmit signal will be coupled into the interference signal, causing the RF  indicator to exceed the Bluetooth specification. In severe cases, it will be unable to connect and communicate. Try to use LDO to supply power to the module. The LDO should be away from the DC-DC power supply and inductance to prevent DC-DC radiation from contaminating the LDO’s power supply. The module needs to be grounded reliably, and please pay attention to the correct connection of the positive and negative poles of the power supply. If a reversed connection is made, the module may be permanently damaged.

2. ESD electrostatic protection
   Users should pay attention to the static requirements of the product when designing, see Table 2-1, and add static protection measures when designing the terminal product.

Production guidance

5.1 Production guide
It is recommended to use SMT machine patch, and the patch should completed within 24 hours after unpacking, otherwise it is necessary to re-vacuate the package to avoid the bad condition caused by moisture.。
If the package contains a humidity indicator card, it is recommended to judge whether the module needs to be baked according to the humidity card indication. The  conditions for baking are as follows:
Baking temperature：125° C±5° C;
Set alarm temperature to 130° C;
After cooling <36 ° C under natural conditions, the SMT patch can be performed;
If the unpacking time is more than 3 months, special attention should be paid to whether the product is damp or not. Because the PCB immersion gold process may cause the pad to oxidize for more than 3 months, it may cause problems such as rosin joint and dry joint.
In order to ensure the reflow soldering pass rate, it is recommended to extract 10% of the products for visual inspection and AOI testing for the first time to ensure the correctness of furnace temperature control, device adsorption mode and placement method.
Operators at all stations in the entire production process must wear electrostatic gloves.
5.2 Module requirements for floor position
It is recommended that the green oil thickness of the bottom plate module position is less than 0.02mm, to avoid excessive thickness, and the high height module cannot effectively contact the solder paste to affect the welding quality.
In addition, the module needs to reserve 2mm space around to ensure the maintenance of it.
5.3 Steel stencil design
The thickness of the steel stencil is selected according to the package type of the device in the board. It is necessary to focus on the following requirements:
The module pad position can be locally thickened to 0.15~0.20mm to avoid rosin joint.
5.4 Reflow soldering instructions
Note: This work instruction is only suitable for lead-free work and is for reference only.。

Product packaging

6.1 Packaging method

• Tape
• Foam
• Electrostatic bag

6.2 Strip size
6.3 Product direction
Module roll tape packaging orientation： Advise the user
Welcome to use the products of Lierda Technology Group Co., Ltd. Please read this warning before using our products. If you have started using the instructions, you have read and accepted this notice.
Lierda Technology Group Co., Ltd. reserves the right to interpret and modify all materials provided, and is subject to change without notice.
RF Exposure Information and Statement
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. When using the product, maintain a distance of 20cm from the
body to ensure compliance with RF exposure requirements.
This device complies with part 15 of the FCC rules . Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause undesired operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
• This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.

ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES
The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC ID: N8NL-BTMEB55GONP4.
Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and
(2) this device must accept any interference received, including interference that may cause undesired operation.”
The module is allowed to be installed in mobile and portable applications
A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end‐use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional
options for host manufacturers. Integrations using modules where additional testing and/or FCC  application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY.
Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user.

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>