Lierda L-LRNWB25-84DN4 LoRa868-915MHzSPI Passive Crystal Standard Modules User Manual
- June 12, 2024
- lierda
Table of Contents
- Lierda L-LRNWB25-84DN4 LoRa868-915MHzSPI Passive Crystal Standard Modules
- Product Information
- Product Usage Instructions
- Specification
- Dimension drawing and pin definition
- Hardware design instructions
- Frequently Asked Questions
- operation instruction
- contact us
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Lierda L-LRNWB25-84DN4 LoRa868-915MHzSPI Passive Crystal Standard Modules
Product Information
The product is a LoRa 868/915MHz SPI Passive crystal standard module with the model number L-LRNWB25-84DN4. It is designed for various applications such as automated building circulation systems, smart homes, temperature and humidity sensors, wireless remote control, drones, and applications requiring high communication distance.
The module operates within a supply voltage range of -0.3V to +3.7V and has a maximum RF input power of +10dBm. The operating temperature range is -40°C to +85°C. It supports communication in the 868MHz to 930MHz frequency band, with a frequency deviation of -1KHz to +1KHz. The module has a transmit power range of 14dBm to 22dBm and a reception sensitivity of -124dBm to -125dBm.
It features two UART communication interfaces and a digital interface level of 3.3V TTL. The digital I/O specification includes parameters for VCC_IO, VIH(V), VIL(V), VOH(V), and VOL(V).
Product Usage Instructions
Power Supply Circuit:
The module operates at a working voltage of 3.3V. To ensure proper
functionality and prevent abnormal operation, it is recommended to provide a
power supply with a maximum output current of at least 300mA. Keep the power
wiring as short as possible.
Antenna Interface:
A circuit should be reserved between the RF pin of the module and the
antenna interface to match the antenna input impedance. Refer to the Typical
Reference Design Circuit for more details.
Typical Reference Design Circuit:
Refer to the provided circuit design for guidance on matching the antenna
input impedance and ensuring optimal performance.
The L-LRNWB25-84DN4 is a new generation of LORA spread spectrum RF transceiver module from Lierda Technology Group, with smaller size, lower power consumption and higher transmitting power. Based on SEMTECH’s RF integrated chip SX1262 development block. It is a high-performance IoT wireless transceiver, and its special LoRa debugging method can greatly increase the communication distance, which can be widely used in various occasions in the field of short-range IoT wireless communication. It has the characteristics of small size, low power consumption, long transmission distance and strong anti- interference ability, etc. A variety of antenna solutions are available according to the actual application, and the module is equipped with a micro- control chip.
Applicable scenarios
- Automated Building Circulation System
- Smart Home
- Temperature and humidity sensors
- Wireless remote control, drones
- For applications requiring high communication distance
Product features
- Operating frequency band
- TX 860~930MHz
- RX 860~930MHz
- High Link Budget
- Sensitivity:-124dBm@SF7_BW125KHz
- Transmit power Max. 22 dBm
- Communication interface
- half-duplex
- Ultra-low power consumption
- power supply:DC3.3V
- Transmit current:130mA@TX power_22dBm
- Communication interface
- UART
Copyright This document is the copyright of Lilda Corporation and anyone who
reproduces this document without our permission will be held liable.
Copyright © Lilda Technology Group, all rights reserved.Copyright © Lierda
Science & Technology Group Co.,Ltd
Document revision history
Vers Date Change description
Rev01 2022-06-21 Initial version
Specification
Table1-1 Module limit parameters
Main parameters
| Performance|
Remakes
---|---|---
Min| Max
Supply voltage(V)| -0.3| +3.7| Exceeding the limit could damage the chip
Max RF input power(dBm)| –| +10
Operating temperature(℃)| -40| +85
Table1-2 Module operating parameters1
Main parameters
| Performance| ****
Remakes
---|---|---
Min| Typical| Max
Supply voltage(V)| 1.8| 3.3| 3.6|
Operating temperature(℃)| -40| –| 85|
Operating frequency
band(MHz)
| Emission| 868| –| 930|
Receive| 868| –| 930|
Frequency deviation(KHz)| -1| –| 1|
Emission currentmA)| 120| 130| 135| @TX POWER 22dBm
Receive current (mA)| –| 7| –|
Transmit power(dBm)| 14| –| 22|
Reception sensitivity(dBm)| –| -124| -125| SF 7_BW 125KHz
Communication interface| 2*UART|
Digital interface level| 3.3V TTL|
Table1-3 Digital I / O specification
Main parameters| Performance| ****
VCC_IO
| ****
Remakes
---|---|---|---
Min| Typical| Max
VIH(V)| 0.7VCC_IO| –| VCC_IO+0.3| 3.3V| –
VIL(V)| -0.3| –| 0.3VCC_IO| 3.3V| –
VOH(V)| VCC_IO-0.6| –| VCC_IO| 3.3V| –
VOL(V)| 0| –| 0.4| 3.3V| –
The above test conditions :temperature: 25℃, center frequency: 490M, working voltage: 3.3V
Dimension drawing and pin definition
Dimensional drawings
Figure2-1 Dimensional drawing of L-LRNWB25-84DN4
Figure 2-2 Hardware system block diagram
The defined pins of each module are shown in Table 2-1.
Table2-1 Pin name and function description
PIN | 功能定义 | 端口类型 | 缺省值3 | 描述 |
---|---|---|---|---|
1 | GND | Power | – | GND |
2 | GND | Power | – | GND |
3 | NC | I/O | Low | |
4 | NC | I/O | Low | |
5 | NC | I/O | Low | |
6 | GND | Power | – | |
7 | NC | I/O | Low | |
8 | NC | I/O | Low | |
9 | SWDIO | I/O | – | NC |
10 | SWCLK | I/O | – | NC |
11 | NC | I/O | Low | |
12 | GND | Power | – | GND |
13 | VCC | Power | – | Supply voltage 1.8~3.6V |
14 | NRST | Reset | PULL-UP | NC |
15 | NC | I/O | Low | |
16 | NC | I/O | Low | |
17 | NC | I/O | Low | |
18 | TXD | Output | High | TX |
19 | RXD | Input | High-impendance | RX |
20 | GND | Power | – | GND |
21 | GND | Power | – | GND |
22 | ANT | RF | – | RF_OUTPUT |
Hardware design instructions
Power supply circuit
The node module adopts 3.3V working voltage, and the typical current
consumption under the maximum transmitting power of 22dBm is 130mA. In order
to prevent the abnormal operation of the RF board due to the load change, the
maximum output current of the external 3.3V power supply is recommended to
meet the requirements above 300mA, and the power wiring is as short as
possible.
Antenna interface
A type of circuit reserved between the rf pin of the module and the antenna
interface is mainly used to match the antenna input impedance later. See “3.3
Typical Reference Design Circuit” for details.
Typical reference design circuit
Figure 3-1 is the typical design circuit of the module, and the use of other
pins is adjusted accordingly according to the actual application requirements.
Figure 3-1Point-to-point communication flow chart
Disable frequency point description
Disable frequency point refers to the frequency point with extremely poor
module performance, and it is strictly prohibited to use. It is recommended
that the frequency point used in the customer application is at least 1MHz
from the disabled frequency point.
Disable frequency points: 472MHz, 480MHz, 496MHz.
Frequently Asked Questions
Modules cannot communicate even at close range
- Confirm that the configuration of the transmit and receive sides do not match, different configurations do not communicate properly.
- Voltages are abnormal, low voltages can lead to transmission abnormalities.
- Low battery, low battery voltage will be pulled down when transmitting causing a transmission abnormality.
- Antenna soldering abnormality RF signal is not reaching the antenna or π circuit is soldered incorrectly.
Module power consumption anomaly
- The module is damaged due to static electricity, etc., resulting in abnormal power consumption.
- hen doing low-power reception, incorrect timing configuration etc. leads to module power consumption does not achieve the expected effect.
- Individually measured module or MCU are normal, the power consumption abnormalities appear in the joint tuning is due to the MCU and RF module connection pins are not handled properly.
- The working environment is harsh, in high temperature, high humidity, low temperature and other extreme environment module power consumption will fluctuate.
Insufficient module communication distance
- The antenna impedance is not matched properly resulting in low power being transmitted.
- There are objects such as metal around the antenna or the module is inside metal causing severe signal attenuation.
- There are other interfering signals in the test environment causing the module to communicate at a close distance.
- Insufficient power supply causes the module to transmit at an abnormal power level.
- The test environment is harsh and the signal attenuation is high.
- Module through the wall and other environments and then communicate with the other end, the wall, etc. on the signal attenuation is very large, most of the signal is bypassed through the wall signal attenuation is large.
- The module is too close to the ground is absorbed and reflected resulting in poor communication.
operation instruction
Steel mesh opening design
In principle, the thickness selection of the steel network on the bottom plate
is
selected according to the comprehensive consideration of the packaging type of
the devices in the plate, and the following requirements should be focused on:
The module pad position can be locally thickened to 0.15~0.20mm to avoid air
welding;
Reflux welding operation instruction
Note: This operation instruction is only suitable for lead-free
operations and is for reference only.
contact us
Lilda Technologies Group Limited has always provided the most timely and
comprehensive service to our customers. For any help, please contact our
relevant personnel, or contact us as follows:
Data website:http://wsn.lierda.com
mail:wsn_support@lierda.com
Technology forum:http://bbs.lierda.com
Sample purchase :https://lierda.taobao.com
When using the product, maintain a distance of 20cm from the body to ensure
compliance with RF exposure requirements.
This device complies with part 15 of the FCC rules . Operation is subject to
the following two conditions:
- This device may not cause harmful interference, and
- This device must accept any interference received, including interference that may cause undesired operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help
This device and its antenna(s) must not be co-located or operating in
conjunction with any other antenna or transmitter ORIGINAL EQUIPMENT
MANUFACTURER (OEM) NOTES
The OEM must certify the final end product to comply with unintentional
radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the
final product to Part 15 of the FCC rules and regulations. Integration into
devices that are directly or indirectly connected to AC lines must add with
Class II Permissive Change.
The OEM must comply with the FCC labeling requirements. If the module’s label
is not visible when installed, then an additional permanent label must be
applied on the outside of the finished product which states: “Contains
transmitter module FCC ID: 2AOFDL-LRNWB2584DN4. Additionally, the following
statement should be included on the label and in the final product’s user
manual: “This device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions:
- This device may not cause harmful interferences, and
- this device must accept any interference received, including interference that may cause undesired operation.”
The module is allowed to be installed in mobile and portable applications A
module or modules can only be used without additional authorizations if they
have been tested and granted under the same intended end‐use operational
conditions, including simultaneous transmission operations. When they have not
been tested and granted in this manner, additional testing and/or FCC
application filing may be required. The most straightforward approach to
address additional testing conditions is to have the grantee responsible for
the certification of at least one of the modules submit a permissive change
application. When having a module grantee file a permissive change is not
practical or feasible, the following guidance provides some additional options
for host manufacturers. Integrations using modules where additional testing
and/or FCC application filing(s) may be required are: (A) a module used in
devices requiring additional RF exposure compliance information (e.g., MPE
evaluation or SAR testing); (B) limited and/or split modules not meeting all
of the module requirements; and (C) simultaneous transmissions for independent
collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY.
Integration into devices that are directly or indirectly connected to AC lines
must add with Class II Permissive Change. (OEM) Integrator has to assure
compliance of the entire end product include the integrated Module. Additional
measurements (15B) and/or equipment authorizations (e.g. Verification) may
need to be addressed depending on co-location or simultaneous
transmissionissues if applicable. (OEM) Integrator is reminded to assure that
these installation instructions will not be made available to the end user.
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>