lierda LoRa 868/915MHz SPI Passive Crystal User Manual
- June 9, 2024
- lierda
Table of Contents
lierda LoRa 868/915MHz SPI Passive Crystal User Manual
Applicable scenarios
- Automated Building Circulation System
- Smart Home
- Temperature and humidity sensors
- Wireless remote control, drones
- For applications requiring high communication distance
Product features
- TX 860～930MHz
- TX 860～930MHz
- RX 860～930MHz
- High Link Budget
- Sensitivity：-124dBm@SF7_BW125KHz
- Transmit power Max. 22 dBm
- Communication interface
- half-duplex
- Ultra-low power consumption
- power supply：DC3.3V
- Transmit current：130mA@TX power_22dBm
- Communication interface
- UART
Copyright This document is the copyright of Lilda Corporation and anyonewhoreproduces this document without our permission will be held liable. Copyright © Lilda Technology Group, all rights reserved.Copyright ©LierdaScience & Technology Group Co.,Ltd
Document revision history
| Vers | Date | Change description |
|---|---|---|
| Rev01 | 2022-06-21 | Initial version |
Specification
| Main parameters | Performance | Remakes |
|---|---|---|
| Min | Max | |
| Supply voltage（V） | -0.3 | +3.7 |
| Max RF input power（dBm） | – | +10 |
| Operating temperature（℃） | -40 | +85 |
Table1-2 Module operating parameters
| **Main parameters** | Performance | **Remakes** |
|---|---|---|
| Min | Typical | Max |
| Supply voltage（V） | 1.8 | 3.3 |
| Operating temperature(℃) | -40 | – |
| Operating frequency band(MHz) | Emission | 868 |
| Receive | 868 | – |
| Frequency deviation(KHz) | -1 | – |
| Emission currentmA) | 120 | 130 |
| Receive current (mA) | – | 7 |
| Transmit power(dBm) | 14 | – |
| Reception sensitivity(dBm) | – | -124 |
| Communication interface | 2*UART | |
| Digital interface level | 3.3V TTL |
Table1-3 Digital I / O specification
Main parameters
| Performance| **VCC_IO| ****Remakes
---|---|---|---
Min| Typical| Max*
VIH(V)| 0.7VCC_IO| –| VCC_IO+0.3| 3.3V| –
VIL(V)| -0.3| –| 0.3*VCC_IO| 3.3V| –
VOH(V)| VCC_IO-0.6| –| VCC_IO| 3.3V| –
VOL(V)| 0| –| 0.4| 3.3V| –
- The above test conditions :temperature: 25℃, center frequency: 490M, working voltage: 3.3V
2 Dimension drawing and pin definition
Dimensional drawings
Figure2-1 Dimensional drawing of L-LRNWB25-84DN4
Hardware block diagram and pin definition
Figure 2-2 Hardware system block diagram
The defined pins of each module are shown in Table 2-1
| PIN | Functionality | definition por | type 3 | description |
|---|---|---|---|---|
| 1 | GND | Power | – | GND |
| 2 | GND | Power | – | GND |
| 3 | NC | I/O | Low | |
| 4 | NC | I/O | Low | |
| 5 | NC | I/O | Low | |
| 6 | GND | Power | – | |
| 7 | NC | I/O | Low | |
| 8 | NC | I/O | Low | |
| 9 | SWDIO | I/O | – | NC |
| 10 | SWCLK | I/O | – | NC |
| 11 | NC | I/O | Low | |
| 12 | GND | Power | – | GND |
| 13 | VCC | Power | – | Supply voltage 1.8~3.6V |
| 14 | NRST | Reset | PULL-UP | NC |
| 15 | NC | I/O | Low | |
| 16 | NC | I/O | Low | |
| 17 | NC | I/O | Low | |
| 18 | TXD | Output | High | TX |
| 19 | RXD | Input | High-impendance | RX |
| 20 | GND | Power | – | GND |
| 21 | GND | Power | – | GND |
| 22 | ANT | RF | – | RF_OUTPUT |
Hardware design instructions
Power supply circuit
The node module adopts 3.3V working voltage, and the typical current
consumption under the maximum transmitting power of 22dBmis 130mA. In order to
prevent the abnormal operation of the RF board due to the load change, the
maximum output current of the external 3.3V power supply is recommended to
meet the requirements above 300mA, and the power wiring is as short as
possible.
Antenna interface
A type of circuit reserved between the rf pin of the module and the antenna interface is mainly used to match the antenna input impedance later.See”3.3Typical Reference Design Circuit” for details.
Typical reference design circuit
Figure 3-1 is the typical design circuit of the module, and the use of
other pins is adjusted accordingly according to the actual application
requirements.
Disable frequency point description
Disable frequency point refers to the frequency point with extremely poor
module performance, and it is strictly prohibited to use.It is recommended
that the frequency point used in the customer application is at least 1MHz
from the disabled frequency point. Disable frequency points: 472MHz, 480MHz,
Frequently Asked Questions
Modules cannot communicate even at close range
- Confirm that the configuration of the transmit and receive sides do not match, different configurations do not communicate properly.
- Voltages are abnormal, low voltages can lead to transmission abnormalities.
- Low battery, low battery voltage will be pulled down when transmitting causing a transmission abnormality.
- Antenna soldering abnormality RF signal is not reaching the antenna or πcircuit is soldered incorrectly.
Module power consumption anomaly
-
he module is damaged due to static electricity, etc., resulting in abnormal
power consumption. -
hen doing low-power reception, incorrect timing configuration etc. leads to module power consumption does not achieve the expected effect.
-
Individually measured module or MCU are normal, the power consumption abnormalities appear in the joint tuning is due to the MCU and RF module connection pins are not handled properly.
-
The working environment is harsh, in high temperature, high humidity, low temperature and other extreme environment module power consumption will
fluctuate.
Insufficient module communication distance
-
The antenna impedance is not matched properly resulting in low power being transmitted.
-
There are objects such as metal around the antenna or the module is insidemetal causing severe signal attenuation.
-
There are other interfering signals in the test environment causing the moduleto communicate at a close distance.
-
Insufficient power supply causes the module to transmit at an abnormal power
level. -
The test environment is harsh and the signal attenuation is high.
-
Module through the wall and other environments and then communicate with the other end, the wall, etc. on the signal attenuation is very large, most of the signal is bypassed through the wall signal attenuation is large.
-
The module is too close to the ground is absorbed and reflected resulting in poor communication.
operation instruction
Steel mesh opening design
In principle, the thickness selection of the steel network on the
bottomplateis
selected according to the comprehensive consideration of the packaging type of
the devices in the plate, and the following requirements should be focused on:
The module pad position can be locally thickened to 0.15~0.20mmto avoid air
welding;
Reflux welding operation instruction
Note:
This operation instruction is only suitable for lead-free operations andis for
reference only.
contact us
Lilda Technologies Group Limited has always provided the most timely and
comprehensive service to our customers. For any help, please contact our
relevant personnel, or contact us as follows:
Data web site： http://wsn.lierda.com
mail：wsn_support@lierda.com
Technology forum: http://bbs.lierda.com
Sample purchase： https://lierda.taobao.com
This equipment complies with FCC RF radiation exposure limits set forth for an
uncontrolled environment. This device complies with part 15 of the FCC rules .
Operation is subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
NOTE:
The manufacturer is not responsible for any radio or TV interference caused by
unauthorized modifications to this equipment. Such modifications could void
the user’s authority to operate the equipment.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio
frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radioor
television reception, which can be determined by turning the equipment off and
on, the useris encouraged to try to correct the interference by one or more of
the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help
- This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter
ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES
The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC ID: 2AOFDL LRNWB2584DN4. Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.”
The module is allowed to be installed in mobile and portable applications A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end‐use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user.