ON SEMICONDUCTOR NVBLS001N06C onsemii screte Semiconductor Owner’s Manual

August 13, 2024
ON Semiconductor

ON SEMICONDUCTOR NVBLS001N06C onsemii screte Semiconductor

Product Information

Specifications:

  • Model: NVBLS001N06C
  • Type: MOSFET – Power, Single N-Channel
  • Drain-to-Source Voltage (VDSS): 60 V
  • Power Dissipation: 0.9 mW
  • Continuous Drain Current (ID): 422 A

Product Usage Instructions

Features:

  • Compliant

Parameter and Value:

Parameter Symbol Value Unit
Drain-to-Source Voltage VDSS 60 V
Gate-to-Source Voltage VGS V

Operating Instructions:

  1. Ensure the device is properly connected following the given voltage specifications.
  2. Avoid exceeding the maximum ratings as it may damage the device.
  3. Refer to the ordering information for package details.

FAQ:

  • Q: What should I do if I exceed the maximum ratings?
    A: If any of the maximum ratings are exceeded, device functionality should not be assumed, damage may occur, and reliability may be affected.

  • Q: Where can I find information on tape and reel specifications?
    A: For tape and reel specifications, including part orientation and tape sizes, refer to the Tape and Reel Packaging Specification Brochure, BRD8011/D.

Features

  • Low RDS(on) to Minimize Conduction Losses
  • Low QG and Capacitance to Minimize Driver Losses
  • Lowers Switching Noise/EMI
  • AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
V (BR)DSS R DS(ON) MAX I D MAX
60 V 0.9 mQ @ 10 V 422 A

MAXIMUM RATINGS

Parameter Symbol Value Unit
Drain−to−Source Voltage VDSS 60 V
Gate−to−Source Voltage VGS ±20 V
Continuous Drain Current RSJC (Note 2) Steady State TC = 25°C ID
TC = 100°C 298
Power Dissipation RSJC (Note 2) TC = 25°C PD 284
TC = 100°C 142
Continuous Drain Current RSJA (Notes 1, 2) Steady State TA = 25°C ID
TA = 100°C 36
Power Dissipation RSJA (Notes 1, 2) TA = 25°C PD 4.2
TA = 100°C 2.1
Pulsed Drain Current TA = 25°C, tp = 10 µs IDM 900
Operating Junction and Storage Temperature Range TJ, Tstg − 55 to

+175

| °C
Source Current (Body Diode)| IS| 236| A
Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 39 A)| EAS| 1640| mJ
Lead Temperature Soldering Reflow for Solder- ing Purposes (1/8² from case for 10 s)| TL| 260| °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter Symbol Value Unit
Junction−to−Case − Steady State (Note 2) RSJC 0.53 °C/W
Junction−to−Ambient − Steady State (Note 2) RSJA 36
  1. Surface−mounted on FR4 board using a 1 in2 pad size, 2 oz. Cu pad.
  2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted.

ORDERING INFORMATION

Device Package Shipping
NVBLS001N06C H−PSOF8L

(Pb−Free)

| 2000 / Tape & Reel

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

CHARACTERISTICS

Table 1. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Parameter| Symbol| Test Conditions| Min| Typ| Max| Units
---|---|---|---|---|---|---

OFF CHARACTERISTICS

Drain−to−Source Breakdown Voltage| V(BR)DSS| ID = 250 µA, VGS = 0 V| 60|  |  | V
---|---|---|---|---|---|---
Drain−to−Source Breakdown Voltage Temperature Coefficient| V(BR)DSS/TJ| ID = 562 µA, ref to 25°C|  | 26|  | mV/°C
Zero Gate Voltage Drain Current| IDSS| VDS = 60 V, VGS = 0 V| TJ = 25°C|  |  | 10| µA
TJ = 125°C|  |  | 100| µA
Gate−to−Source Leakage Current| IGSS| VDS = 0 V, VGS = 20 V|  |  | 100| nA

ON CHARACTERISTICS (Note 3)

Gate Threshold Voltage VGS(th) VGS = VDS, ID = 562 µA 2.0 2.8 4.0 V
Negative Threshold Temperature Coefficient VGS(th)/TJ ID = 562 µA, ref to
25°C   9.9   mV/°C
Drain−to−Source On Resistance RDS(on) VGS = 10 V, ID = 80 A   0.75 0.9

mQ
Forward Transconductance| gFS| VDS = 5 V, ID = 80 A|  | 290|  | S

CHARGES & CAPACTIANCES

Input Capacitance Ciss VGS = 0 V, VDS = 30 V, f = 10 kHz   11575   pF
Output Capacitance Coss   5973   pF
Reverse Transfer Capacitance Crss   76   pF
Total Gate Charge QG(tot) VGS = 10 V, VDS = 30 V, ID = 80 A   143   nC
Threshold Gate Charge QG(th)   31   nC
Gate−to−Source Charge Qgs   54   nC
Gate−to−Drain Charge Qgd   13   nC

SWITCHING CHARACTERISTICS, VGS = 10 V (Note 3)

Turn−On Delay Time| td(on)| VGS = 10 V, VDS = 30 V, ID = 80 A, RG = 6 Q|  | 34|  | ns
---|---|---|---|---|---|---
Rise Time| tr|  | 53|  | ns
Turn−Off Delay Time| td(off)|  | 119|  | ns
Fall Time| tf|  | 91|  | ns

DRAIN−SOURCE DIODE CHARACTERISTICS

Forward Diode Voltage VSD IS = 80 A, VGS = 0 V TJ = 25°C   0.79 1.2 V
IS = 80 A, VGS = 0 V TJ = 125°C   0.66   V
Reverse Recovery Time trr VGS = 0 V, dIS/dt = 100 A/µs, IS = 56 A   120
ns
Charge Time ta   60   ns
Discharge Time tb   60   ns
Reverse Recovery Charge Qrr   322   nC

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Switching characteristics are independent of operating junction temperatures

TYPICAL CHARACTERISTICS

PACKAGE DIMENSIONS

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ADDITIONAL INFORMATION

www.onsemi.com

Documents / Resources

| ON SEMICONDUCTOR NVBLS001N06C onsemii screte Semiconductor [pdf] Owner's Manual
NVBLS001N06C onsemii screte Semiconductor, NVBLS001N06C, onsemii screte Semiconductor, screte Semiconductor, Semiconductor
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