Sun itec BMS003 Bluetooth Module Owner’s Manual

: July 23, 2024
: Sun itec

BMS003 Bluetooth Module

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Product Specification

Product Name: BMS003 BT5.3 LE Audio Module
Manufacturer: Made in China
Bluetooth Version: 5.3 (BDR/EDR/BLE)
Integrated Features: Bluetooth stack, PWB antenna, worldwide
radio certifications
SoC: AIROHA MT2833D

Product Description

The BMS003 LE Audio module is a fully qualified Bluetooth 5.3
dual-mode module designed to enable wireless audio and voice
applications in products. It comes with integrated features like
the Bluetooth stack, PWB antenna, and global radio certifications
in a compact surface-mount package.

Device Overview

Block Diagram

Details about the block diagram of the BMS003 module.

BMS003 Module Series

Information about the different modules in the BMS003
series.

Power Management

Power-on/off Sequence

Instructions on how to power on and off the module using PWRKEY
and charger plug-in.

Module Details

Module Description

Overview of the structure, pin diagram, and function description
of the BMS003 module.

Antenna Information

Antenna of BMS003 Module

Recommendations for PWB antenna design and module placement
guidelines.

Electrical Characteristics

Details about module power consumption and power supply
specifications.

Reflow Temperature Profile

Recommended reflow temperature profile for the module.

Certification

Information regarding certifications obtained by the
product.

User Configuration

Users can configure the UI and DSP settings of the BMS003 module
using a Windows-based tool.

FAQ

Q: How do I configure the BMS003 module for wireless audio

transmission?

A: To configure the BMS003 module for wireless audio
transmission, you can use the Windows-based tool provided by the
manufacturer to adjust the UI and DSP settings as needed.

Q: What is the recommended reflow temperature profile for the

BMS003 module?

A: The recommended reflow temperature profile for the BMS003
module can be found in the product specifications. Ensure to follow
these guidelines during reflow soldering.

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Product Specification

Features · Supports Bluetooth 5.3 dual-mode (BDR/EDR/ BLE) specifications · ARM® Cortex®-M33 with Floating Point Unit (FPU) and Memory Protection Unit (MPU)
Maximum speed: 260MHz · Cadence® HiFi5® Audio Engine DSP coprocessor with Neural Network Extension
Maximum speed: 520MHz · low latency 1MB system RAM (SYSRAM) with
maximum speed 260MHz · USB 2.0 device · Support maximum three I2C Master mode 400kbps Up
to 3.4Mbps · Support maximum three I3C Master mode up to 12Mbps · Support maximum three UART interface Up to 3Mbps · Support maximum three SPI master interface, Clock up
to 52MHz · EMMC4.41/SDIO v2.0, up to 52MHz, 1-bit/4-bit mode
eMMC4.41, · Stand-alone module with on-board PWB antenna and Bluetooth stack · Supports high resolution up to 24-bit, 192 kHz audio data format · Supports14 PWM channels · Supports12-bit AUXADC channels · Supports maximum four I2S interface · Supports SPDIF receiver · Supports to connect max three hosts with HFP/A2DP profiles simultaneously · Supports smart phone applications by Bluetooth SPP or BLE link · Supports firmware field upgrade by USB/OTA · Supports four microphones · Compact surface mount module:28.28 15.60 4.0 mm · LGA package 122pin, Flatness is less than 0.05mm · RoHS compliant · Ideal for portable battery operated devices · Internal battery regulator circuitry DSP Audio Processing · Support for single SCO or Esco link with CVSD/mSBC
coding.

BMS003 BT5.3 LE Audio Module
Qualifie
MT2833D
(This Photos are for reference only)
RF/Analog · Frequency spectrum: 2.402 GHz to 2.480 GHz · Receive sensitivity: -97 dBm (2 Mbps EDR) · Crystal : 26MHZ ±20PPM@-20~+70 · AVG Output Power
8±2dBm (BDR) , 6±2dBm (EDR) 4±2dBm (BLE1M/2M) · Antenna gain2.7dBi(Peak)
Audio Codec · SBC,AAC, LDAC · 24-bit digital-to-analog converter (DAC) with 105dB SNR · 24-bit analog-to-digital converter (ADC) with 95dB SNR · Supports up to 24-bit, 192 kHz I2S digital audio
MAC/Baseband Processor · Supports Bluetooth 5.3 dual-mode · BDR/EDR transport for audio, voice, and SPP data exchange · BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange
Operating Condition · Operating voltage: 3.2V to 4.6V · Operating temperature: -20°C to +70°C

Peripherals · Integrated 1.8V and 3V configurable switching regulator and low- dropout (LDO) regulator · Built-in ADC for battery monitoring and voltage sense · Built-in ADC for charger thermal protection · Built-in under voltage protection (UVP) · An AUX-In port for external audio input · Multiple I/O pins for control and status
HCI Interface · High-speed HCI-UART interface (supports up to 3M bps)

Description The BMS003 LE Audio module is made in China, a fully qualified Bluetooth 5.3 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BMS003 products is a Bluetooth module that provides a complete wireless solution with Bluetooth stack, integrated PWB antenna, and worldwide radio certifications in a compact surface-mount package.
Applications · Sound bar and Subwoofer (FW dependent) · Bluetooth portable speaker phone · Multi-speaker (FW dependent) · Bluetooth headset

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Product Specification
1. DEVICE OVERVIEW ………………………………………………………………………………………………….. 3 1.1 Block Diagram ……………………………………………………………………………………………………. 3 1.2 BMS003 Module series ………………………………………………………………………………………… 3
2. AUDIO CODEC …………………………………………………………………………………………………………… 4 2.1 Auxiliary ADC Block description …………………………………………………………………………….. 4 2.2 Audio uplink (Analog part) ……………………………………………………………………………………… 4 2.3 Audio downlink (Analog part)………………………………………………………………………………….. 5 2.4 Digital controller for Class-G amplifier …………………………………………………………………… 5
3. Power-on/off sequence ………………………………………………………………………………………………….. 6 3.1 Pulling PWRKEY low (User presses PWRKEY.) ………………………………………………………. 6 3.2 Valid charger plug-in ………………………………………………………………………………………………. 6
4. Battery charge specification revision 1.2 (BC1.2)……………………………………………………………… 7 4.1 Feature and description ………………………………………………………………………………………… 7 4.2 Functional block ………………………………………………………………………………………………….. 7 4.3 Linear Battery Charging……………………………………………………………………………………….. 8
5. Bluetooth RF Subsystem ……………………………………………………………………………………………….. 8 5.1 Bluetooth description …………………………………………………………………………………………… 8 5.2 Functional specifications………………………………………………………………………………………. 9 5.3 Basic data rate Receiver & Transmitter specifications …………………………………………… 9 5.4 Enhanced data rate Receiver & Transmitter specifications ……………………………………… 9 5.5 Bluetooth LE Receiver & Transmitter specifications ……………………………………………. 10
6. Module Description …………………………………………………………………………………………………….. 10 6.1 BMS003 module structure ………………………………………………………………………………….. 10 6.2 BMS003 module pin diagram ……………………………………………………………………………… 11 6.3 BMS003 module pin function description and power domain …………………………………. 12
7. Antenna of BMS003 Module………………………………………………………………………………………… 19 7.1 Recommended for PWB Antenna design ……………………………………………………………… 19 7.2 Module Placement Guidelines …………………………………………………………………………….. 19
8. Electrical Characteristics ……………………………………………………………………………………………… 21 8.1 Module Power Consumption (Vcore =0.8V) …………………………………………………………. 21 8.2 Module Power Supply………………………………………………………………………………………… 22
9. Recommended Reflow Temperature Profile: ………………………………………………………………….. 23 10. QR code label information: ……………………………………………………………………………………. 23 11. Certification …………………………………………………………………………………………………………. 24
11.1 BQB Certification QDID ……………………………………………………………………………………… 24 11.2 EMC Certification ………………………………………………………………………………………………. 24 12. Electrostatic dischargeESDHBM 1000VCDM500V ……………………………….. 25 13. Un-opened reels Shelf life: …………………………………………………………………………………….. 25 14. Reliability Test: ……………………………………………………………………………………………………. 25 15. Standard Packing Information ………………………………………………………………………………… 26 16. Document History…………………………………………………………………………………………………. 28

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® 1. DEVICE OVERVIEW

Product Specification

The BMS003 LEAudio modules built around AIROHA MT2833D SoC respectively. Module integrates the Bluetooth 5.3 dual- mode radio transceiver, Power Management Unit (PMU), a crystal and DSP. Users can configure the UI and DSP setting of BMS003 module by use a Windows-based tool.
1.1 Block Diagram

BMS003 module provides a fully compliant Bluetooth system to v5.3 of the specification for data and voice communications. The module and device’s firmware is fully compliant with the Bluetooth specification V5.3. BMS003 module integrate a SPI serial flash up to 256Mbit, a master crystal frequency is 26MHz, shielding case (depending on needs) and diversifying interface.
1.2 BMS003 Module series

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2. AUDIO CODEC
2.1 Auxiliary ADC Block description

Product Specification

Figure 2.1-1 ADC Block Diagram
The auxiliary ADC includes the following functional blocks: Analog multiplexer. Selects signal from one of the seven auxiliary input pins. Real- world messages, such as temperature, are monitored and translated to the voltage domain. 12-bit A/D converter: Converts the multiplexed input signal to 12-bit digital data.
2.2 Audio uplink (Analog part)
The block diagram of audio uplink is illustrated below Figure 2.2-1. Audio uplink path is composed of PGA and audio ADC. The uplink front-end to PGA input can be configured as ACC differential and single-ended type. Besides, the ACC type has 10K and 20K input impedance for selection. The PGA gain range of differential mode is the 0~30dB per 6dB step and the ACC type of PGA can provide 3dB and 9dB gain option additionally. There are four input pairs of the uplink path that can be configured as AMIC.
Four channel PGA and ADC analog MIC input VIN2P/N and VIN3P/N can be configured as Line-in mode High performance support: 100dB SNR and -90dB THD+N Normal performance support: 100dB SNR and -80dB THD+N Low-power performance support: 95dB SNR and -88dB THD+N Ultra-low power mode support: 90Db SNR and -80dB THD+N Analog Gain Rang is 0dB to 30dB of differential mode ACC mode input impedance of PGA: 10K or 20K VIN2P/N~VIN3P/N configuration: Differential or single-ended input

Figure 2.2-1 The Block Diagram of Audio Uplink (Analog part)

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2.3 Audio downlink (Analog part)

Product Specification

Low-power MT2833D audio downlink includes stereo DACs and audio Class-G/D amplifiers for audio playback. The amplifiers is implemented with class-D and class-G mode The digital Class-G controller preview the maximum signal level of input digital LCH and RCH signals, and then adjust the power level up or down in advance before the signal is played. The fully differential headphone amplifiers can deliver up to 38mW into 16Ohm load. The class-G gain range of amplifier is -22dB to +8dB, 1dB/step. The class-D gain range of amplifier is -8dB to +4dB, 3dB/step. The VCM Tacker is embedded to generate an adaptive reference voltage for Class-G amplifier. AVDD18_AUD_DRV.The Capless LDOs are embedded in the audio downlink to enhance the power supply rejection ratio(PSRR).
38mW Stereo HP driver diff. output into 16Ohm High-performance mode support: -95dB THD and 110dB(A) SNR for HP output path Low-power music playback with Class-G Operation Ultra Low-power music playback with Class-D Operation Click- and-pop noise suppression of Class-G amplifiers <-80dBVpp Low output DC offset < 300uV

Figure 2.3-1 The Block Diagram of Audio Downlink (Analog part)
The proposed downlink path supports the following features: The data precisions in the downlink path are 24-bit data width. The supported input sample rates for downlink: 8K/11.025K/12K/16K/22.05K/24K/32K/44.1K/48K/96K/192K

2.4 Digital controller for Class-G amplifier
The Class-G amplifier is used for power saving of playback, and it can adjust the HP amplifier power rail according the audio content. The Class-G digital controller detects audio signal amplify and sends a control signal to buck converter through GPIO. When source swing goes high, the digital controller makes the Class-G amplifier change the DAC output from low-voltage to high- voltage state to avoid signal clipping. When source swing goes low, it has a configurable hold time control to prevent the Class-G amplifier from frequently adjusting the voltage. If the signal stays in a low state after a specific hold time, the digital controller sends a request to make the Class-G amplifier change the output from a high-voltage state to a low-voltage state. Otherwise, the output stays in a high-voltage state.
Figure 2.4-1 shows the block diagram of the Class-G digital controller. The audio digital Class-G path includes the following blocks: Preview FIFO, Frame Preview, EN-FSM, Hold Time control and DA signal generator. The EN-FSM module enables each voltage level in Class G. The Class-G input source is from the O_08 and O_09 (the same as downlink), which is defined in the audio interconnection. The output of DA Generator is sent to the analog DAC.

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Product Specification

Figure 2.4-1 The Block Diagram of Class-G Amplifier Digital Part
The Class-G digital controller supports the following features: Support for the independent selection for Class-G amplifier high-voltage and low-voltage levels. Support for programmable high-voltage and low-voltage thresholds in the digital controller. Support for a programmable hold time in the digital controller to prevent frequently voltage switching. Built-in signal generator hardware for the DA signal request to the Class-G amplifier.
3. Power-on/off sequence
PMIC manages the power-on and power-off of the handset. If the battery voltage is neither in the UVLO state nor in the thermal condition, there are three methods to power on the handset system.
3.1 Pulling PWRKEY (CHIP_EN pull high) Pushing PWRKEY (pulling the CHIP_EN pin to high level) Pulling PWRKEY high is a typical method to turn on the handset. The system reset ends at the moment when all default-on regulators are sequentially turned on. After that, the MCU will send the PWRHOLD signal back to PMIC for acknowledgement. To successfully power on the handset, PWRKEY should be kept high until PMIC receives PWRHOLD from the MCU.

AVDD18_VRTC_IN
VDD18_IN AVDD18_USB

CHIP_EN

VRTC EXT_PWR_EN

1.93ms

VDDK

VIO18 VDD31

35.14ms

1.85ms

VSRAM VRF

1.85ms 1.85ms

1.85ms GO_RTC=1

Figure 3.1-1 Power-on/off control sequence by press PWRKEY Note: Those timings are typical values in regulator timing; timing variation is +/-50% 3.2 Valid charger plug-in
Valid charger plug-in (CHRIN voltage within valid range) The charger plug-in will also turn on the handset if the charger is valid and VSYS > UVLO, the handset will also be powered on.

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Product Specification

AVDD18_VRTC_IN
VDD18_IN AVDD18_USB

CHIP_EN

VRTC EXT_PWR_EN

1.93ms

VDDK

VIO18 VDD31

35.14ms

1.85ms

VSRAM VRF

1.85ms 1.85ms

1.85ms GO_RTC=1

Figure 3.2-1 Power-on/off control sequence by charger plug-in Note: Those timings are typical values in regulator timing; timing variation is +/-50%

4. Battery charge specification revision 1.2 (BC1.2)

4.1 Feature and description
USB charging port detection:
MT2833D BC1.2 charger detector is used to distinguish the different types of charger. This BC1.2 detector provide a capable method to determine several types of charging port which including Standard Downstream Ports (SDP), Charging Downstream Ports (CDP), Dedicated Charger Ports (DCP), Apple charger, non-standard charger. Typically, BC1.2 detection will execute immediately after the charger is plugged-in for charger input current limit configuration (The current limit setting please refer to the Charger’s Datasheet). The BC1.2 detection circuits follow the “Battery Charging Specification Revision 1.2”, please refer to this specification for detailed charger detection flow.
4.2 Functional block

Spec-BMS003-V1.3

Figure 4.2-1 BC1.2 function block diagram

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4.3 Linear Battery Charging Input current limit: 1.0A Power Path Management for Powering the System and Charging the Battery 24V Maximum Rating for VBUS Power JEITA Charge Protection NTC Thermistor Input Supports up to 0.5-A Charge Current with Current Monitoring Output (ISET) Programmable fast charging mode

Product Specification

5. Bluetooth RF Subsystem
5.1 Bluetooth description
The MT2833 series Bluetooth (BT) RF subsystem (as shown in Figure 5.1-1) consists of a highly integrated transceiver with tunable on-chip RF band pass filter (BPF) and BT TRX co-matching network.
MT2833 series adopts a low intermediate frequency (LIF) receiver architecture. The receiver, including the on-chip RF BPF and TRX co-matching network, consists of a LNA and single balanced passive mixer, a complex BPF and a pair of 10-bit SAR ADCs.
The direct conversion transmitter consists of a pair of 10-bit current DACs and passive LPFs, an active IQ modulator(IQM) and a Class AB push-pull PA. This PA is capable of transmitting +11dBm power for enhanced data rate(EDR) and +15dBm for basic data rate(BDR).
The – fractional-N RF synthesizer is phase locked to 26MHz reference clock to generate the RF LO frequency. The BBPLL generates sampling clock for ADC and DAC as well as digital clock to BT modem.
MT2833 series implements various automatic calibration schemes to minimize changes in RF performance from chipto-chip and temperature variations.

Figure 5.1-1 BC1.2 Bluetooth RF transceiver system

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Product Specification
5.2 Functional specifications Typical RF performances are specified for mid. channel, TA = +25, and under recommended operating
conditions, unless stated otherwise. Table 5.2-1 Recommended operating conditions

5.3 Basic data rate Receiver & Transmitter specifications

Items

Rate

Frequency Range
RF AVG Maximum Output Power RF Peak Maximum Output Power RF Maximum Power Control gain step Range RF Maximum Receiver Sensitivity@ BER0.1% Maximum detectable input power @ BER0.1% Crystal Frequency Calibration Modulation CharacteristicsDelta F1 Avg Carrier Frequency Drift

—
GFSK GFSK GFSK GFSK GFSK –GFSK

Units
MHZ
dBm dBm dBm dBm dBm KHz KHz KHz

Min Typ

2402 —

—

-97 -95

-20 -5

-5

140 157

-40 0

Max
2480
10 10 8 -70 5 175 40

5.4 Enhanced data rate Receiver & Transmitter specifications

Items

Rate

Units

Frequency Range RF AVG Maximum Output Power RF Peak Maximum Output Power RF Maximum Power Control gain step Range RF Maximum Receiver Sensitivity@ BER0.01% Maximum detectable input power @ BER0.01% Frequency stability 0 Frequency stability 1 |0+1| Crystal Frequency Calibration

-/4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK /4 DQPSK
8DPSK —

MHZ dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm KHz KHz KHz KHz KHz KHz KHz

Min Typ Max

2402 — 2480

4 6

—

2 4

-97 -95 -70

-91 -89 -70

-20 -5

-10 4 10

-75 20 75

-5 0

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Product Specification

5.5 Bluetooth LE Receiver & Transmitter specifications

Items

Rate Units Min Typ Max

Frequency Range Maximum Output Power
Maximum Receiver Sensitivity@ PER30.8% Maximum detectable input power @ PER30.8%
Crystal Frequency Calibration Modulation Characteristics(Delta F1 Avg)
Carrier Frequency Drift

—

MHZ 2402

—

2480

1M dBm

2M dBm

1M dBm -100 -98 -70

2M dBm -97 -95 -70

1M dBm -10 -5

–

2M dBm -10 -5

—

KHz -5

1M KHz 235 250 265

2M KHz 450 500 550

—

KHz -50

6. Module Description
6.1 BMS003 module structure

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6.2 BMS003 module pin diagram

Product Specification

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Product Specification

6.3 BMS003 module pin function description and power domain

Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 17 27 28 41 42 43 48 49 50 55 56 57 62 63 64 69 70 71 76 77 78
14

Pin Type P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P
AI

Pull-Type –
–

Power domain –
–
–

Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
BT_RFIN

Description Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Bluetooth 50 ohm transmitter output and receiver input

DIO

DVDD_IO_0

GPIO0 GPIO1 GPIO2 GPIO3 GPIO4

General purpose input/output, Pin 0
Alternate Pin Functions: CM33 JTAG I2C(0) CTP
General purpose input/output, Pin 1
Alternate Pin Functions: CM33 JTAG I2C(0) CTP
General purpose input/output, Pin 2
Alternate Pin Functions: DSP JTAG I2S master (0) I2S slave (2) CTP
General purpose input/output, Pin 3
Alternate Pin Functions: DSP JTAG I2S master (0) I2S slave (2) CTP
General purpose input/output, Pin 4
Alternate Pin Functions:

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119

DIO

116

DIO

105

DIO

104

DIO

Hi-Z

DIO

Spec-BMS003-V1.3

DVDD_IO_0

GPIO5

DVDD_IO_0

GPIO6

DVDD_IO_0

GPIO7

DVDD_IO_0

GPIO8

DVDD_IO_0

GPIO9

DVDD_IO_0

GPIO10

DVDD_IO_0

GPIO11

DVDD_IO_0

GPIO12

DVDD_IO_1

GPIO13

DVDD_IO_1

GPIO14

DVDD_IO_1

GPIO15

DVDD_IO_1

GPIO16

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Product Specification
DSP JTAG I2S master (0) I2S slave (2) AUX_ADC
General purpose input/output, Pin 5
Alternate Pin Functions: DSP JTAG I2S master (0) DMIC (0) AUX_ADC
General purpose input/output, Pin 6
Alternate Pin Functions: DSP JTAG DMIC (0) I2S master (0) I2S slave (2) AUX_ADC
General purpose input/output, Pin 7
Alternate Pin Functions: UART(2) AUXADC
General purpose input/output, Pin 8
Alternate Pin Functions: UART(2) AUXADC
General purpose input/output, Pin 9
Alternate Pin Functions: UART(1) PWM AUXADC
General purpose input/output, Pin 10
Alternate Pin Functions: UART(1) PWM
General purpose input/output, Pin 11
Alternate Pin Functions: UART(0) PWM
General purpose input/output, Pin 12
Alternate Pin Functions: UART(0)
General purpose input/output, Pin 13
Alternate Pin Functions: UART(1) PWM I2C(0) IRRX
General purpose input/output, Pin 14
Alternate Pin Functions: UART(1) PWM I2C(0) I2S_master0
General purpose input/output, Pin 15
Alternate Pin Functions: I3C(1) PWM I2C(1) I2S_master0 I2S_master1 CLK03
General purpose input/output, Pin 16
Alternate Pin Functions: I3C(1) I2C(1) I2S_master0
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DIO

HIGH

DIO

106

DIO

107

DIO

Spec-BMS003-V1.3

DVDD_IO_1

GPIO17

DVDD_IO_1

GPIO18

DVDD_IO_1

GPIO19

DVDD_IO_0

GPIO20

DVDD_IO_0

GPIO21

DVDD_IO_0

GPIO22

DVDD_IO_0

GPIO23

DVDD_IO_0

GPIO24

DVDD_IO_0

GPIO25

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Product Specification
I2S_master1 I2S_slave1
General purpose input/output, Pin 17
Alternate Pin Functions: I3C(1) I3C(0) I2C(2) I2S_master0 I2S_master1 I2S_slave1 CM33_JTAG
General purpose input/output, Pin 18
Alternate Pin Functions: I3C(1) I3C(0) I2C(2) I2S_master0 I2S_master1 I2S_slave1 CM33_JTAG
General purpose input/output, Pin 19
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0) UART(0) CLK01
General purpose input/output, Pin 20
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0) UART(0)
General purpose input/output, Pin 21
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0) UART(0)
General purpose input/output, Pin 22
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0) UART(0)
General purpose input/output, Pin 23
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0)
General purpose input/output, Pin 24
Alternate Pin Functions: MSDC(0) ESC SPI Slave(0) SPI Master(0) I2S_master0 I2S_slave3
General purpose input/output, Pin 25
Alternate Pin Functions: MSDC(0)
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DIO

DVDD_IO_0

DIO

DVDD_IO_0

DIO

DVDD_MC0

DIO

DVDD_IO_1

DIO

DVDD_IO_0

DIO

DVDD_IO_0

DIO

DVDD_IO_0

DIO

DVDD_MC0

DIO

DVDD_IO_0

DIO

DVDD_IO_0

GPIO26 GPIO27 GPIO28 GPIO29 GPIO30 GPIO31 GPIO32 GPIO33 GPIO34 GPIO35

Product Specification
I2S_master0
I2S_slave3 CLK02 SPDIF Pull high to enter USB download mode
General purpose input/output, Pin 26
Alternate Pin Functions: I2S_master (1) I2S_slave1
General purpose input/output, Pin 27
Alternate Pin Functions: I2S Master(0) I2S Slave(0) SPI Master(1) PWM
General purpose input/output, Pin 28
Alternate Pin Functions: I2S Master(1) I2S Slave(3) SPI Master(1) PWM
General purpose input/output, Pin 29
Alternate Pin Functions: I2S Master(2) I2S Slave(4) SPI Master(1) PWM SPDIF
General purpose input/output, Pin 30
Alternate Pin Functions: I2S Master(0) I2S Slave(0) SPI Master(1) PWM
General purpose input/output, Pin 31
Alternate Pin Functions: I2S Master(2) I2S Slave(1) SPI Master(1) PWM
General purpose input/output, Pin 32
Alternate Pin Functions: I2S Master(2) I2S Slave(1) SPI Master(1) PWM
General purpose input/output, Pin 33
Alternate Pin Functions: I2S Master(2) I2S Slave(1) SPI Master(1) PWM
General purpose input/output, Pin 34
Alternate Pin Functions: I2S Master(1) I2S Slave(2) SPI Master(2) PWM DSP JTAG
General purpose input/output, Pin 35
Alternate Pin Functions: I2S Master(0) I2S Slave(0) SPI Master(2) DSP JTAG

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DIO

Spec-BMS003-V1.3

DVDD_IO_0

GPIO36

DVDD_IO_0

GPIO37

DVDD_IO_0

GPIO38

DVDD_IO_0

GPIO39

DVDD_IO_0

GPIO40

DVDD_IO_0

GPIO41

DVDD_IO_0

GPIO42

DVDD_IO_0

GPIO43

DVDD_IO_0

GPIO44

DVDD_IO_0

GPIO45

DVDD_IO_0

GPIO46

Page 16 of 28

Product Specification
General purpose input/output, Pin 36
Alternate Pin Functions: I2S Master(1) I2S Slave(3) SPI Master(2) DMIC(0)
General purpose input/output, Pin 37
Alternate Pin Functions: I2S Master(2) I2S Slave(4) SPI Master(2) DMIC(0) PWM
General purpose input/output, Pin 38
Alternate Pin Functions: I2S Master(3) I2S Slave(3) SPI Master(2) SPDIF_RX PWM
General purpose input/output, Pin 39
Alternate Pin Functions: I2S Master(3) I2S Slave(4) SPI Master(2) DMIC(1) PWM
General purpose input/output, Pin 40
Alternate Pin Functions: I2S Master(3) I2S Slave(4) SPI Master(1) DMIC(1)
General purpose input/output, Pin 41
Alternate Pin Functions: I2S Master(3) I2S Slave(2) SPI Master(1) DMIC(0) PWM
General purpose input/output, Pin 42
Alternate Pin Functions: I2S Master(1) I2S Slave(2) SPI Master(1) DMIC(0) PWM
General purpose input/output, Pin 43
Alternate Pin Functions: I2S Master(3) I2S Slave(2) SPI Master(1) DMIC(1) DSP_JTAG
General purpose input/output, Pin 44
Alternate Pin Functions: SPI Master(1) CLKO0 DSP_JTAG
General purpose input/output, Pin 45
Alternate Pin Functions: SPI Master(2) DSP_JTAG
General purpose input/output, Pin 46
Alternate Pin Functions: SPI Master(2) DSP_JTAG
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DIO

101

DIO

Hi-Z

100

DIO

Hi-Z

102

DIO

Hi-Z

103

DIO

Hi-Z

115

–

108

–

120

–

Spec-BMS003-V1.3

DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0
DVDD_IO_0 VDIG18 VDIG18 VDIG18 VDIG18
VDD18_VRTC_IN
AVDD18_AU D_DRV
AVDD18_AU D_DRV
AVDD18_AU D_DRV
AVDD18_AU D_DRV –

GPIO47
GPIO48
GPIO49
GPIO50
GPIO51
GPIO52
GPIO53
GPIO54
GPIO55
GPIO56
GPIO57 RTC_GPIO0 RTC_GPIO1 RTC_GPIO2 RTC_GPIO3
CHIP_EN AU_HPLP AU_HPLN AU_HPRN AU_HPRP AU_VIN0_P

Product Specification
General purpose input/output, Pin 47 Alternate Pin Functions: UART(2) I2C(0) I2C(2) I3C(0) General purpose input/output, Pin 48 Alternate Pin Functions: UART(2) I2C(0) I2C(2) I3C(0) General purpose input/output, Pin 49 Alternate Pin Functions: UART(1) I2C(1) I2C(2) I3C(1) General purpose input/output, Pin 50 Alternate Pin Functions: UART(1) I2C(1) I2C(2) I3C(1) General purpose input/output, Pin 51 Alternate Pin Functions: CLKO0 SPI Master (2) General purpose input/output, Pin 52 Alternate Pin Functions: PWM SPI Master (2) General purpose input/output, Pin 53 Alternate Pin Functions: IRRX SPI Master (2) General purpose input/output, Pin 54 Alternate Pin Functions: SPI Master (1) SPI Master (2) General purpose input/output, Pin 55 Alternate Pin Functions: SPI Master (1) SPI Master (2) General purpose input/output, Pin 54 Alternate Pin Functions: SPI Master (1) USB General purpose input/output, Pin 54 Alternate Pin Functions: SPI Master (1) USB RTC GPIO0 RTC GPIO 1 RTC GPIO 2 RTC GPIO 3 PWRKEY Button
Headphone L-ch P-side
Headphone L-ch N-side
Headphone R-ch N-side
Headphone R-ch P-side
Audio input CH0 P-side

Page 17 of 28

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Product Specification

121

–

122

–

109

–

AU_VIN0_N Audio input CH0 N-side

–

AU_VIN1_P Audio input CH1 P-side

–

AU_VIN1_N Audio input CH1 N-side

–

AU_VIN2_P Audio input CH2 P-side

–

AU_VIN2_N Audio input CH2 N-side

–

AU_VIN3_P Audio input CH3 P-side

–

AU_VIN3_N Audio input CH3 N-side

110

input

–

VBAT

Battery connection. Connect VBAT to the positive terminal of battery.

output

VBAT

AVDD18_VRT C_IN

PMU supply

input

–

DVDD_IO_0 Power input of GPIO group 0

input

–

VDDK_SEL VCORE power switch default low

111

output

VBAT

VDD31_USB VLDO33 output voltage

113

output

–

VIO18

Buck VIO18, 1V8 power output, max130mA.

114

input

–

VAUDIO18 DAC Power supply input.

112

output

–

VDD18_BUCK

DC-DC Buck VDD18, 1V8 power output, max500mA

117

AIO

–

VDD31_USB

USB_DP

USB signal DP

118

AIO

–

VDD31_USB

USB_DM

USB signal DN

Spec-BMS003-V1.3

Page 18 of 28

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®
Product Specification
7. Antenna of BMS003 Module
7.1 Recommended for PWB Antenna design Around of the PWB Antenna should keep out of metal over 15mm, so that RF have a good performance, show as Figure 7.1-1
Figure 7.1-1 BMS003 PWB ANT design 7.2 Module Placement Guidelines For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. Recommend that the areas underneath the antenna on the host PWB must not contain copper on top, inner, or bottom layers, as illustrated in Figure 7.2-2. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation, as required for the main PWB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PWB trace antenna. Figure 7.2-1 illustrate examples of good and poor placement of the BMS003 module on a host board with GND plane.

Spec-BMS003-V1.3

Figure 7.2-1
Page 19 of 28

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®
Product Specification

Figure 7.2-2 Recommended PWB footprint of BMS003 module

Spec-BMS003-V1.3

Page 20 of 28

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®
Product Specification

8. Electrical Characteristics

This section provides an overview of the BMS003 LEAudio module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the BMS003 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification is not implied.

8.1 Module Power Consumption (Vcore =0.8V) Table 8.1-1 BMS003 power consumption
Module base on Sunitec BMS003 EVB

ConditionTA = +25 , Vcore=0.8V

Mode

Power Consumption (mA)

Max.

4.65

BT Pairing mode

Avg.

3.88

Min.

2.20

Max.

4.2

Connected mode

Avg.

3.46

Min.

3.2

Max.

5.0

Disconnect mode

Avg.

3.62

Min.

3.35

Max.

5.2

Reconnecting mode

Avg.

3.82

Min.

2.89

Max.

8.03

BT SBC streaming mode Play 1KHZ 0dB

Avg.

7.03

Min.

5.58

Max.

7.95

BT SBC streaming mode Play Silence tone

Avg.

6.23

Min.

5.38

Max.

8.35

AUX in mode

Avg.

6.94

Min.

6.43

Call active mode

Max. Avg.

17.54 13.84

Min.

10.42

Note:
1. BT Firmware: FW_ER3_speaker_ref_design_20240111_TEST1
2. BT Codec SBC 3. The current consumption values are measured with the BMS003 EVB as test platform, with BAT_IN = 3.89V.
The Distance between the smartphone and BMS003 EVB is 30cm, and the speaker is without loading.

Spec-BMS003-V1.3

Page 21 of 28

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®
Product Specification

8.2 Module Power Supply

Table 8.2-1 operating conditions

Recommended Operating Conditions

Min

Operating Temperature Range

-20C

Supply Voltage, (VBAT)

+3.0V

VSYS Voltage (VSYS)

+3.0V

Supply Voltage, (VBUS)

+4.1V

Power keyHigh voltage Power keyLow voltage SYSRSTB High voltage SYSRSTB Low voltage

0.7 AVDD50 —
0.7 VIO —

Max +70C +5.0V +4.8V +7.2V
-0.3 AVDD50
-0.3 VIO

Table 8.2-2 Absolute Maximum rate conditions

Absolute Maximum rate Conditions

Min

Operating Temperature Range

-55C

Supply Voltage, (VBAT)

-0.5V

VSYS Voltage (VSYS)

-0.5V

Power supply for GPIO group (DVDD_IO_0-1)

+1.62V

Supply Voltage, (VBUS)

-0.5V

Digital input voltage for IO typeVIN0-VIN3

-0.5V

Max +125C +6.0V +6.0V +3.63V +24V +3.63V

Spec-BMS003-V1.3

Page 22 of 28

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® 9. Recommended Reflow Temperature Profile:

Product Specification

Key features of the profile: -Initial Ramp=1-2.5/sec to 175 equilibrium -Equilibrium time=60 to 90 seconds -Ramp to Maximum temperature (250)=3/sec Max -Time above liquidus temperature (217): 70 – 90 seconds -Device absolute maximum reflow temperature: 250 -TAMURA solder paster
10.QR code label information:
Label
MAC IDXXXXXX (last 6 digits) FW Ver: Vxxxx (V3700) Customer part NO: 07XXXX- XXXXXX-X Argentina certification NO. :RC-27404

(These Photos are for reference only)
Spec-BMS003-V1.3

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®
11. Certification
11.1 BQB Certification QDID
Declaration ID QDID

Product Specification

11.2 EMC Certification
The BMS003 module has received the regulatory approval for following countries:

No Country Certification

STANDARD

Certification ID/No.

1 United FCC States
2 Canada IC
3 Europe CE
4 Argentina CNC

FCC Part 15C
RSS-247 EN 62368-1:2014 EN 623681:2014/A11:2017 EN 50663:2017 EN 301 489-1 V2.2.3 EN 301 489-17 V3.2.4 EN 300 328 V2.2.2
Protocolo para Equipos de Espectro Ensanchado por Salto en Frecuencia V13.1; Protocolo para Equipos de Banda Ancha V13.2

5 Japan TELEC/JATE ARIB STD -T66 Version 3.7

MIC Notification NO.88

Appendix NO.43

6 Malaysia Malaysia MCMC MTSFB TC T007:2020

7 UAE

TRA

TIC-D01-CS01

8 Peru

Peru

0902-2022-MTC/29.01

The component does not contain any prohibited substance specified in “SS-00259”. If using recycled plastic or sheathed wire as customer-classified, it shall be procured from a Sony green partner.

Spec-BMS003-V1.3

Page 24 of 28

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®
Product Specification
12.Electrostatic dischargeESDHBM 1000VCDM500V
13.Un-opened reels Shelf life:
The module can be stored for 25±3°C 30-60%RH for 6 months. After unpacking, the finished patch should be used within 24 hours to avoid welding pad oxidation. Unused materials are returned to sealed packaging in time.

14.Reliability Test:
Test items
Vibration ReliabilityTest Drop Reliability Test Low Temperature Reliability Test
High Temperature Reliability Test Aging Test Vibration Reliability Test
Drop Reliability Test
Weldability

Test method
1.Single module: Vibration frequency: 50Hz Vibration amplitude: 0.5mm Vibration time: 30 minutes
2.After the test, confirm whether the appearance and function are qualified. 1.Single module weight <10g, drop height 1.0mmarble floor. 2.The top, bottom, left, right, front and rear 6 surfaces fell once each, a total of 6 times. 3.After the test, confirm whether the appearance and function are qualified. 1.The BMS003 module is installed on the EVB, bluetooth connection is made with the BMS003 module, and the music is continuously played on the phone. 2.The installed EVB was placed in the high-low temperature test chamber at a working temperature of -20 degrees for 4 hours. 3.After the completion of the test, the EVB and the module were removed from the high-low temperature test chamber and placed at room temperature for 1 hour,then confirm whether the appearance and function are qualified. 1.The BMS003 module is installed on the EVB, bluetooth connection is made with the BMS003 module, and the music is continuously played on the phone. 2.The installed EVB was placed in the high- low temperature test chamber at a working temperature of 70 for 4 hours. 3.After the completion of the test, the EVB and the module were removed from the high-low temperature test chamber and placed at room temperature for 1 hour,then confirm whether the appearance and function are qualified. 1.The BMS003 module is installed on the EVB, bluetooth connection is made with the BMS003 module. 2.Place the installed EVB at room temperature and continue playing music for 48 hours. 3.After the test, confirm whether the appearance and function are qualified. 1.The BMS003 module is installed on the EVBthen put the EVB into a protective housing to do test:
Vibration frequency: 50Hz Vibration amplitude: 0.5mm Vibration time: 30 minutes 2.After the test, confirm whether the appearance and function are qualified. 1.The module is installed on the EVBthen put the EVB into a protective housing to do test, the drop test condition as follow [2019/6/11 SONY] Drop height = 122cm 6-surface, 8-corner, 12-edge line, = total 26times. Please add some weight to the housing to make total weight to be [2021/5/25 SONY] 1XE-M 1380g 2XE-L 810g If 1) test was Failed, then please test 2). 2.After the test, confirm whether the appearance and function are qualified.
Recommended Reflow Temperature Profile

Spec-BMS003-V1.3

Page 25 of 28

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®
Product Specification
15.Standard Packing Information
Module packing Box (Max 2100pcs module per box) 42pcs per tray, 10trays per ESD bag, vacuum packing sealed in ESD PE bag. Maximum modules per ESD bag is 420pcs Module packing bag dimension: 2901606.5mm Delivering carton box To hold of module carton box for shipment, 6bags per box (Max 2520pcs modules per box) Delivery Carton Box dimension: 310.0mm x 340.0mm x 340.0mm (W x D x H) ESD tray dimension: 2901606.5mm
plastic tray size :290mm160mm6.5mmqty :42 pcs/ tray
10 trays / package bag

carton size 310mm340mm340mm6 bags / carton , total :2520pcs/carton

Spec-BMS003-V1.3

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®
The actual photo

Product Specification

plastic tray photo :42 pcs/ tray ESD PE bag dimension
Vacuum packing 10trays per ESD bag)

Spec-BMS003-V1.3

Carton box (6bags in per carton box)

Page 27 of 28

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®
Product Specification

16.Document History

Revision

Date

V1.0

2023-07-17

V1.1

2023-12-27

V1.2

2024-05-30

V1.3

2024-06-07

History
First release Updated pin description Updated shielding case, Antenna gain and ESD
Updated RF performances

Contact Information SUNITEC ELECTRONICS TECHNOLOGY LIMITED
China Factory: Building C No.725 , WeiXiangTai Industrial Zone, FuCheng Street , LongHua District , ShenZhen ,Guangdong , China Tel: 86-755-28016180 Fax: 86-755-28016097
E-mail: sales16@sunitec-cn.com or manager@sunitec-cn.com
Http://www.sunitec-cn.com

Spec-BMS003-V1.3

Page 28 of 28

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IC Warning This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device.
For a host manufacture’s using a certified modular, if (1) the module’s IC number is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the IC number of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module IC: 23011-BMS003” or “Contains IC: 23011-BMS003” must be used.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement Le modular peut être installé ou intégré dans un mobile ou réparer une seule chose Installation dans n’importe quell appareil portable.
Pour un hôte, on utilise un modular, si (1) le numéro de module est non visible Quand on est installé dans le serveur, or (2) si le propriétaire est commercialisé Straightforward commonly used for the access to remove travail so that the number IC en vue Le module est visible;Ensuite, le label permanent a été attribué au module: “Contient le Module IC: 23011-BMS003″ ” ou “contenu IC: 23011-BMS003” doit be used.
Radiation Exposure Statement This modular complies with RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
Déclaration d’exposition aux rayonnements Ce module est conforme aux limites d’exposition aux rayonnements RF définies pour un environnement non contrôlé. Cet émetteur ne doit pas être co-localisé ou fonctionner en conjonction avec une autre antenne ou émetteur, sauf conformément aux procédures du produit multi-émetteur. Ce modulaire doit être installé et exploité avec une distance minimale de 20 cm entre le radiateur et le corps de l’utilisateur.

FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AMX3BMS003” Or “Contains FCC ID: 2AMX3BMS003”
When the module is installed inside another device, the user manual of the host must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
Any company of the host device which install this modular with Limited Single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirementthen the host can be sold legally.

Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3
Explanation: This module meets the requirements of FCC part 15.247.
2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
Explanation: The EUT has a PCB Antenna, and the antenna use a permanently attached antenna which is not replaceable.
2.4 Limited module procedures If a modular transmitter is approved as a “limited module,” then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.
Explanation: The module is a single module.

2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.
Explanation: Yes, The module with trace antenna designs, and This manual has been shown the layout
of trace design, antenna, connectors, and isolation requirements.
2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.” This module is designed to comply with the FCC statement, FCC ID is: 2AMX3BMS003.

2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors.
Explanation: The EUT has a PCB Antenna, and the antenna use a permanently attached antenna which is unique.
2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: “Contains FCC ID: 2AMX3BMS003, Contains IC: 23011-BMS003 ”
2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements.
Explanation: Top band can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter.

2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Explanation: The module without unintentional-radiator digital circuity, so the module does not require
an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

References

cn.com

Read User Manual Online (PDF format)

Read User Manual Online (PDF format) >>

Download This Manual (PDF format)

Download this manual >>

BMS003 Bluetooth Module

Product Specification

Product Description

Device Overview

Block Diagram

BMS003 Module Series

Power Management

Power-on/off Sequence

Module Details

Module Description

Antenna Information

Antenna of BMS003 Module

Electrical Characteristics

Reflow Temperature Profile

Certification

User Configuration

FAQ

Q: How do I configure the BMS003 module for wireless audio

Q: What is the recommended reflow temperature profile for the

References

Read User Manual Online (PDF format)

Download This Manual (PDF format)

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