LB-LINK BL-M6158NS1-M 802.11n 150Mbps WLAN +BLE v5.0 SDIO Module Owner’s Manual

July 11, 2024
LB-LINK

LB-LINK BL-M6158NS1-M 802.11n 150Mbps WLAN +BLE v5.0 SDIO Module

Product Usage Instructions

  • Introduction
    • The BL-M6158NS1-M is a highly integrated Combo module that provides wireless connectivity for devices like OTT boxes, IP cameras, POS, etc.
  • Features
    • Operating Frequency: 2.4~2.4835GHz
    • Interface: SDIO 2.0 with clock up to 50MHz
    • Wireless Standards: IEEE802.11 b/g/n with PHY rate up to 150Mbps
    • Bluetooth Specification: v5.0 supporting BLE 1Mbps only
  • Pin Assignments
    • The module has various pins for different functions like RF, GPIO, SDIO, UART, etc. Refer to the manual for detailed definitions.
  • Electrical and Thermal Specifications
    • Ambient Operating Temperature: -20°C to 70°C
    • Supply Voltage (VDD33): 3.1V to 3.5V
    • I/O Supply Voltage (VDDIO): 1.75V to 3.3V

FAQs

  • Q: What is the operating frequency of the module?
    • A: The operating frequency is in the range of 2.4~2.4835GHz.
  • Q: What is the Bluetooth specification supported by the module?
    • A: The module supports Bluetooth core specification v5.0 and BLE 1Mbps only.
  • Q: What is the recommended ambient operating temperature?
    • A: The recommended ambient operating temperature is between -20°C to 70°C.

SPECIFICATION

Module Name: BL-M6158NS1-M

Module Type: 802.11b/g/n 150Mbps WLAN+BLE v5.0 Combo SDIO Module
Revision: V1.0
Customer Approval:
Company:
Title:
Signature:| Date:
LB-link Approval:
Title:
Signature:| Date:

Revision History

Revision Summary Release Date
0.1 Initial release 2022-10-22
1.0 Official version 2022-11-30
   

Introduction

  • The BL-M6158NS1-M is a highly integrated Combo module based on SV6158-M, which combines with 2.4G 1T1R WLAN, Bluetooth Low Energy, MCU and RAM, SDIO interface, PMU in a single chip.
  • The module provides feature-rich wireless connectivity, cost-effective, high throughput performance, and low-power ideal for OTT boxes, IP cameras, POS, and other devices that need wireless connection.

Features

  • 2.4G single band with 2.4~2.4835GHz operating frequencies
  • SDIO 2.0 interface supports clocks up to 50MHz
  • Compatible with IEEE802.11 b/g/n with 20/40M bandwidth, the PHY rate can reach up to 150Mbps
  • Compatible Bluetooth core specification v5.0 supports BLE 1Mbps only
  • Connect to the external antenna through a hole pad

Block Diagram

General Specifications

Module Name BL-M6158NS1-M
Chipset MPN: SV6158-M

Certified Type: SV6158

WLAN Standards| IEEE802.11b/g/n
BT Specification| Bluetooth v5.0 Low Energy
Host Interface| SDIO for WLAN & Bluetooth
Antenna| Connect to external antenna through a hole pad
Dimension| 12.012.02.20mm (LWH)
Power Supply| 3.3V±0.2V @500 mA (Max) main power; 1.8V/3.3V for digital I/O power
Operation Temperature| -20℃ to +70℃
Operation Humidity| 10% to 95% RH (Non-Condensing)
Storage Temperature| -40℃ to +85℃
Storage Humidity| 10% to 95% RH (Non-Condensing)

Pin Assignments

Pin Definition

No Pin Name Type I/O Level Description
1 GND RF   RF Ground connections
2 RF I/O   RF Pad for 2.4G WLAN/2.4G BT
3 GND RF   RF Ground connections
4 NC /   NC
5 GPIO12 I/O VDDIO 1.  General-Purpose I/O Pin GPIO12

2.  Strap Pin, internal pull low to set “ SDIO Mode ” , external pull high to set “SPI Mode” during power on
6| NC| /|  | NC
7| NC| /|  | NC
8| NC| /|  | NC
9| VDD33| P|  | VDD3.3V power supply
10| NC| /|  | NC
11| NC| /|  | NC
12| LDO_EN| I| VDDIO| Reset input signal to reset /power down the module, active low, internal pull high by 10K resistor.
13| WL_WAKE_UP_HOST| I/O| VDDIO| 1.  General-Purpose I/O Pin GPIO14
2.  WLAN Wake Up Host output signal
14| SD_D2| I/O|  | SDIO data 2
15| SD_D3| I/O|  | SDIO data 3 / SPI_CSN
16| SD_CMD| I/O|  | SDIO command / SPI_MOSI
17| SD_CLK| I|  | SDIO clock / SPI_CLK
18| SD_D0| I/O|  | SDIO data 0 / SPI_MISO
19| SD_D1| I/O|  | SDIO data 1
20| GND| P|  | Ground connections
21| NC| /|  | NC
22| VDDIO| P|  | 1.8V or 3.3V power supply for digital I/O
23| NC| /|  | NC
24| NC| /|  | NC
25| NC| /|  | NC
26| NC| /|  | NC
27| NC| /|  | NC
28| NC| /|  | NC
29| NC| /|  | NC
30| NC| /|  | NC
31| GND| P|  | Ground connections
---|---|---|---|---
32| NC| /|  | NC
33| GND| P|  | Ground connections
34| NC| /|  | NC
35| NC| /|  | NC
36| GND| P|  | Ground connections
37| GPIO01/UART_LOG_TX| I/O| VDDIO| 1.  General-Purpose I/O Pin GPIO1

2.  UART_TXD for debug

38| GPIO00/UART_LOG_RX| I/O| VDDIO| 1.  General-Purpose I/O Pin GPIO0

2.  UART_RXD for debug

39| NC| /|  | NC
40| NC| /|  | NC
41| NC| /|  | NC
42| NC| /|  | NC
43| NC| /|  | NC
44| NC| /|  | NC

  • P: Power,
  • I: Input,
  • O: Output,
  • I/O: In/Output,
  • RF: Analog RF Port

Electrical and Thermal Specifications

Recommended Operating Conditions

Parameters Min Typ Max Units
Ambient Operating Temperature -20 25 70
External Antenna VSWR   1.7 2.0 /
Supply Voltage VDD33 3.1 3.3 3.5
I/O Supply Voltage VDDIO 1.75 3.3 3.5

Current Consumption

Conditions : VDD33=3.3V ; Ta:25℃

Use Case| VDD33 Current (average)
Typ| Max| Units
WLAN TRX Throughput (Linux Driver) 2g| 135| 292| mA
2.4G 11b@1Mbps TX (RF-Test) 17dBm| 231| 256| mA
2.4G 11b@1Mbps RX (RF-Test)| 48| 72| mA
---|---|---|---
2.4G 11b@11Mbps TX (RF-Test) 17dBm| 230| 256| mA
2.4G 11b@11Mbps RX (RF-Test)| 48| 72| mA
2.4G 11g@6Mbps TX (RF-Test)16dBm| 228| 256| mA
2.4G 11g@6Mbps RX (RF-Test)| 48| 72| mA
2.4G 11g@54Mbps TX (RF-Test)14dBm| 191| 232| mA
2.4G 11g@54Mbps RX (RF-Test)| 48| 72| mA
2.4G 11n@HT20_MCS0 TX (RF-Test)16dBm| 225| 248| mA
2.4G 11n@HT20_MCS0 RX (RF-Test)| 48| 72| mA
2.4G 11n@HT20_MCS7 TX (RF-Test)14dBm| 189| 232| mA
2.4G 11n@HT20_MCS7 RX (RF-Test)| 50| 75| mA
2.4G 11n@HT40_MCS0 TX (RF-Test)16dBm| 221| 256| mA
2.4G 11n@HT40_MCS0 RX (RF-Test)| 50| 75| mA
2.4G 11n@HT40_MCS7 TX (RF-Test)14dBm| 186| 232| mA
2.4G 11n@HT40_MCS7 RX (RF-Test)| 50| 75| mA
BT
BLE 1M TX(RF-Test) 5dBm| 101| 128| mA
BLE 1M RX(RF-Test)| 48| 75| mA

WLAN & Bluetooth RF Specifications

2.4G WLAN RF Specification

Conditions : VDD33=3.3V ; Ta:25℃

Features| Description
WLAN Standard| IEEE 802.11b/g/n
Frequency Range| 2.4~2.4835GHz (2.4GHz ISM Band)
Channels| Ch1~Ch13 (For 20MHz Channels)

Modulation

| 802.11b (DSSS): DBPSK, DQPSK, CCK;

802.11g (OFDM): BPSK, QPSK, QAM16, QAM64;

802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;

Date Rate

| 802.11b: 1, 2, 5.5, 11Mbps;

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;

802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;

802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps;

Frequency Tolerance ≦ ±20ppm

2.4G Receiver Specifications
RX Rate| Min Input Level(Typ,dBm)| Max Input Level(Typ,dBm)| PER
802.11b@1Mbps| -94| -10| < 8%
802.11b@11Mbps| -85| -10| < 8%
802.11g@6Mbps| -88| -10| < 10%
802.11g@54Mbps| -70| -10| < 10%
802.11n@HT20_MCS0| -86| -10| < 10%
802.11n@HT20_MCS7| -69| -10| < 10%
802.11n@HT40_MCS0| -84| -10| < 10%
802.11n@HT40_MCS7| -66| -10| < 10%

Bluetooth RF Specification

Mechanical Specifications Module Outline Drawing

  • Module dimension: 12.012.02.20mm (LWH; Tolerance: ±0.15mm)

  • Module Bow and Twist: ≤0.1mm

Mechanical Dimensions

Application Information

Typical Application Circuit

Recommend PCB Layout Footprint

Reflow Soldering Standard Conditions

  • Please use the reflow within 2 times.
  • Set up the highest temperature within 250℃.

Key Components Of Module

No. Parts Specification Manufacturer Note
1 Chipset MPN:SV6158-M Certified Type: SV6158 iComm-semi
2 PCB BL-M6158NS1 Shenzhen Tie Fa Technology

Quzhou Sunlord Electronics Co., Ltd
3| Crystal| 24MHZ-10PPM-12pF- 3225| Lucki Electronics Co., Ltd|
Shenzhen Kaiyuexiang Electronics Co., Ltd|
Chengde Oscillator Electronic Technology Co., Ltd.|

Package and Storage Information

Package Dimensions

Package specification:

  1. 1,000 modules per roll and 5,000 modules per box.
  2. Outer box size: 37.53629cm.
  3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt).
  4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
  5. Each carton is packed with 5 boxes.

Storage Conditions

  • Absolute Maximum Ratings:
    • Storage temperature: -40℃ to +85℃,
    • Storage humidity: 10% to 95(Non-Condensing)
    • Recommended Storage Conditions:
    • Storage temperature: 5℃ to +40℃,
    • Storage humidity: 20% to 90% RH
    • Please use this Module within 12 months after vacuum-packaged.
    • The Module shall be stored without opening the packing.
    • After the packing is opened, the Module shall be used within 72 hours.
    • When the color of the humidity indicator in the packing changes, the Module shall be baked before soldering.
    • Baking condition: 60℃, 24hours, 1time.
  • ESD Sensitivity:
    • ESD Protection: 2KV(HBM, Maximum rating)
    • The Module is a static-sensitive electronic device.
    • Do not operate or store near strong electrostatic fields. Take proper ESD precautions!

FCC

FCC Statement

This device complies with part 15 of the FCC Rules.

Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and
  2. this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, under part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used by the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and the receiver.
  • Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

This modular has been tested and found to comply with part 15 requirements for Modular Approval.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01

List of applicable FCC rules

  • CFR 47 FCC Part 15 Subpart C and Subpart F have been investigated. It applies to the modular transmitter.

Specific Operational Use Conditions – Antenna Placement Within the Host Platform

  • The module is tested for standalone mobile RF exposure use conditions.
  • The antenna must be installed such that 20cm is maintained between the antenna and users,
  • The transmitter module may not be co-located with any other transmitter or antenna.
  • If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Trace Antenna Designs
Users should connect antennas to hole pad through copper tube structures or FP types of RF trace and the trace impedance must be controlled at 50Ω.recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:

Trace loss

Frequency Loss
2400MHz-2500MHz <0.6dB
5150MHz-5850MHz <1.2dB

To facilitate the antenna tuning and certification test, an RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.

The module needs to be attached to the PCB board and connected to the external antenna through the solder joint of the circuit on the PCB. The gain of the external antenna is 2dBi(Max.) the internal structure is copper tube structure or FPC. A resistance of 0R is added between the module and the antenna at L1 to ensure that the impedance of the connection between the module and the antenna reaches 50R. The CON1 position on the PCB is where the external antenna is connected.

RF traces layout

  1. Keep the RF trace from the module and pin to the antenna as short as possible
  2. RF trace should be 50 Ω either on the top layer or in the inner layer
  3. RF trace should be avoided right angle and sharp angle.
  4. Put enough GND vias around RF traces.
  5. RF trace should be far away from other high-speed signal lines.

Avoiding the paroling route of other system antennas nearly. There should be some distance from The GND to the inner conductor of the IPEX connector. It is better to keep out all the layers from the inner to the outer conductor.

External Antenna VSWR

Parameters Min Typ Max
External Antenna VSWR   1.7 2.0

RF Exposure Considerations

  • This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.

Antenna Type and Gain

  • The following antennas have been certified for use with this module.
  • Only antennas of the same type with equal or lower gain may also be used with this module.
  • Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna Specification list below:

Model Type Connector Peak gain ( dB )

2400-2483.5 MHz
BL-M6158NS1-M| External Antenna| /| 2.3dBi

End Product Labelling Compliance Information

  • When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door, or cover is easily removed.
  • If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2AL6KBL-M6158NS1-M”. The FCC ID can be used only when all FCC compliance requirements are met.

Information on Test Modes and Additional Testing Requirements

  • This transmitter is tested in a standalone mobile RF exposure condition and any co-located or simultaneous transmission with another transmitter (s) class II permissive change re-evaluation or new FCC authorization.
  • The host manufacturer installed this modular with single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C, Part 15E, 15.209, 15.207 requirements, only if the test result complies with FCC part 15C, Part 15E, 15.209, 15.207 requirements, then the host can be sold legally.

Additional testing, Part 15 Subpart B Disclaimer

  • This transmitter modular is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rules requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rules requirements if applicable.
  • As long as all conditions above are met, further transmitter tests will not be required.
  • However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this modular installation.

Manual Information to The End User

  • The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module.
  • The host integrator must follow the integration instructions provided in this document and ensure that the composite system end product complies with the requirements by a technical assessment or evaluation to the rules and KDB Publication 996369.
  • The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation, and should refer to guidance in KDB Publication 996369.

OEM/Host Manufacturer Responsibilities

  • OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module.
  • The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market.
  • This includes reassessing the transmitter module for compliance with the Radio and RF
  • Exposure essential requirements of the FCC rules.

How to Make Changes – Important Note

  • If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product.
  • In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Limited Module Procedures

  • Not applicable

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References

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