LB-LINK BL M8723DS1 150Mbps WLAN+BTv4.2 SDIO Module User Manual

June 15, 2024
LB-LINK

LB-LINK-logo

LB-LINK BL M8723DS1 150Mbps WLAN+BTv4.2 SDIO Module

Product Information

Specifications

  • Module Name: BL-M8723DS1
  • Module Type: 802.11b/g/n 150Mbps WLAN + Bluetooth v4.2 SDIO Module
  • Revision: V1.0
  • Operating Frequencies: 2.4~2.4835GHz
  • IEEE Standards: IEEE802.11b/g/n
  • Wireless PHY rate: up to 150Mbps
  • Supports Bluetooth: v2.1+EDR/v4.2
  • Host Interface: SDIO and HSUART
  • Antenna: Connect to external antenna through half hole pad
  • Power Supply: 3.3V main power and 1.8V/3.3V I/O power

Block Diagram

Product Usage Instructions

Introduction

  • The BL-M8723DS1 is a highly integrated IEEE802.11b/g/n WLAN and Bluetooth 2.1/4.2 combo module based on the RTL8723DS chip. It combines an MCU with SDIO and HSUART interface, a WLAN MAC, a 1T1R capable WLAN baseband, BT Protocol Stack, BT Baseband, modem, and WLAN/BT RF in a single chip.
  • The module provides a complete solution for high throughput performance integrated WLAN and Bluetooth.

Features

  • Operating Frequencies: 2.4~2.4835GHz
  • IEEE Standards: IEEE802.11b/g/n
  • Wireless PHY rate can reach up to 150Mbps
  • Supports Bluetooth v2.1+EDR/v4.2
  • Connect to external antenna through half hole pad
  • Power Supply: 3.3V main power and 1.8V/3.3V I/O power

Pin Assignments

Pin Definition

No Pin Name Type I/O Level Description
1 BT_DIS# I/O Shared with GPIO11 This pin can externally shut down BT

function when BT_DIS# is
pulled Low, and UART interface will be also disabled.
2| NC| N/A| N/A| Ground connections

FAQ (Frequently Asked Questions)

  • Q: What are the operating frequencies of the BL-M8723DS1 module?
    A: The operating frequencies of the module are 2.4~2.4835GHz.

  • Q: What are the supported IEEE standards?
    A: The module supports IEEE802.11b/g/n standards.

  • Q: What is the maximum wireless PHY rate?
    A: The maximum wireless PHY rate can reach up to 150Mbps.

  • Q: What Bluetooth versions are supported?
    A: The module supports Bluetooth v2.1+EDR/v4.2.

  • Q: What is the power supply requirement for the module?
    A: The module requires a 3.3V main power supply and 1.8V/3.3V I/O power.

BL-M8723DS1
802.11 n 150Mbps WLAN+BTv4.2 SDIO Module Specification

SHENZHEN BILIAN ELECTRONIC CO.,LTD
Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn

LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(1\)

Module Name:BL-M8723DS1

Module Type: 802.11b/g/n 150Mbps WLAN + Bluetooth v4.2 SDIO Module
Revision: V1.0
Customer Approval:
Company:
Title:
Signature:| Date:
LB-link Approval:
Title:|
Signature:| Date:

Revision History

Revision Summary Release Date Revised By
0.1 Initial release 2022-03-21
1.0 official release (Update picture) 2023-06-16 Drq

Introduction

BL-M8723DS1 is a highly integrated IEEE802.11b/g/n WLAN and Bluetooth 2.1/4.2 combomodulebaseonRTL8723DSchip,whichcombinesMCUwithSDIOandHS- UARTinterface,aWLANMAC,a1T1R capable WLAN baseband, BT Protocol Stack, BT Baseband, modem, and WLAN/BT RF in a single chip. The module provides a complete solution for a high throughput performance integrated WLAN and Bluetooth.

Features

  • Operating Frequencies:2.4~2.4835GHz
  • IEEE Standards: IEEE802.11b/g/n
  • Wireless PHY rate can reach up to150Mbps
  • Supports Bluetoothv2.1+EDR/v4.2
  • Connect to external antenna through half hole pad
  • Power Supply: 3.3V main power and 1.8V/3.3V I/O power

Block DiagramLB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(2\)

General Specifications

Module Name BL-M8723DS1
Chip set RTL8723DS-CG
WLAN Standards IEEE802.11b/g/n
BT Standards Bluetooth Core Specificationv4.2/2.1
Host Interface SDIO for WLAN & UART for Bluetooth
Antenna Connect to the external antenna through half hole pad
Dimension 12122.1mm(LWH)
Power Supply DC 3.3V±0.2V @ 450 mA (Max)

main power DC 3.3V±0.2V or 1.8V±0.1V

Operation Temperature| -20℃ to+70℃
Operation Humidity| 10% to 95% RH(Non-Condensing)

Pin Assignments

Pin Definition

No Pin Name Type I/O Level Description
1 BT_DIS# I VDD33 Shared withGPIO11. This pin can externally shut down BT

function when BT DIS #Ispulled Low, and UART interface will be also disabled. This pin can be also defined as the BT Radio-off function with host interface remaining connected. There is no pull-up resistor inside the module and high level input is required to enable
2| NC| /| | NC
3| GND| P| | Ground connections
4| NC| /| | NC
5| NC| /| | NC
6| NC| /| | NC
---|---|---|---|---
7| NC| /| | NC
8| GND| P| | Ground connections.(This pin has been connected to other GNDs on the module, so it NC or connected to other signals such as UART_CTS in the customer’s application circuit will not affect normal use)
9| UART_TX| O| VDIO| High-Speed UART Data output
10| UART_RX| I| VDIO| High-Speed UART Data input
11| UART_CTS| I| VDIO| High-Speed UART CTS input
12| GND| RF| | RF Ground connections
13| WLAN/BTANT| RF| | RF Pad for 2.4G WLAN/BTANT
14| GND| RF| | RF Ground connections
15| NC| /| | NC
16| NC| /| | NC
17| HOST_WAKE_DEV| I| VDIO| Shared withGPIO13. This pin can be configured as the host wakes up the WLAN or Bluetooth controller or both of them in Remote Wake
18| DEV_WAKE_HOST

_BT

| O| VDIO| Shared withGP1O14. This pin is shared with either WLAN or BT functions to wakeup the host when the remote wake function is enabled. The polarity can be defined by the customer. It can be configured as shared wake up pin by both WL and BT when any of WL and BT function issue the wake signal to the host.
19| NC| /| | NC
20| VDD33| P| | DC 3.3V power supply
21| NC| /| | NC
22| NC| /| | NC
23| WL_DIS#| I| VDD33| Shared withGP1O9. This pin can externally shut down WLAN function when WL DIS# is pulled low, and SDIO interface will be also disabled. This pin can also be configured as the WLAN Radio-off function with host interface remaining connected. There is no pull-up resistor inside the module and high level input is required to enable WLAN function.
24| DEV_WAKE_HOST

_WL

| O| VDIO| Shared withGPIO6. This pin is shared with either WLAN or BT functions to wakeup the host when the remote wake function is enabled. The polarity can be defined by the customer. It can be
| | | | wake up pin by both WL and BT when any of WL and BT function issue the wake signal to the host.
---|---|---|---|---
25| SD_D2| I/O| VDIO| SDIO dataline2
26| SD_D3| I/O| VDIO| SDIO dataline3
27| SD_CMD| I/O| VDIO| SDIO commandline
28| SD_CLK| I| VDIO| SDIO clock input
29| SD_D0| I/O| VDIO| SDIO dataline0
30| SD_D1| I/O| VDIO| SDIO dataline1
31| GND| P| | Ground connections
32| NC| /| | NC
33| VDIO| P| | 1.8V or 3.3V power supply for some digitalI/O
34| NC| /| | NC
35| CLK_IN| I| VDD33| General Purpose Input/Output PinGPIO8

36

|

PCM_OUT

|

O

| VDIO|

  1. PCM data output, shared withGPIO1.
  2. Strap Pin, internal pull low by 100K resistor toset“SPS_Mode”, do not pull High during

37| PCM_CLK| I| VDIO| PCM Clock input, shared withGPIO3
38| PCM_IN| I| VDIO| PCM data input, shared withGPIO0
39| PCM_SYNC| O| VDIO| PCM synchronization control, shared withGPIO2
40| NC| /| | NC
41| NC| /| | NC
42| GND| P| | Ground connections
43| NC| /| | NC
44| GND| P| | Ground connections

P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port

Electrical and Thermal Specifications

Recommended Operating Conditions

Parameters Min Typ Max Units
Ambient Operating Temperature -20 25 70
External Antenna VSWR 1.7 2 /
Supply Voltage VDD33 3.1 3.3 3.5
VDIO(3.3V) 3.1 3.3 3.5 V
VDIO(1.8V) 1.7 1.8 1.9 V

Digital 3.3V GPIO DC Specifications

Symbol Parameter Min Typ Max Units
VIH Input High Voltage 2.0 3.3 3.6 V
VIL Input Low Voltage 0 0.9 V
VOH Output High Voltage 2.97 3.3 V
VOL Output Low Voltage 0 0.33 V

Digital 1.8V IO DC Specifications

Symbol Parameter Min Typ Max Units
VIH Input High Voltage 1.3 1.8 1.9 V
VIL Input Low Voltage 0 0.8 V
VOH Output High Voltage 1.62 1.8 V
VOL Output Low Voltage 0 0.18 V

Current Consumption

Conditions : VDD33=3.3V ;Ta:25℃

Use Case| VDD33Current
Typ I RMS | Max I Peak | Units
WLAN Radio Off (Linux Driver)| 42| 50| mA
WLAN Unassociated (Linux Driver)| 40| 60| mA
2.4G 11b 1Mbps TX@ 17dBm (TX RF test)| 285| 310| mA
2.4G 11b 1Mbps RX(RF-Test)| 60| 70| mA
2.4G 11b 11Mbps TX@ 17dBm (TX RF test)| 280| 310| mA
2.4G 11b 11Mbps RX(RF-Test)| 59| 70| mA
2.4G 11g 6Mbps TX@ 17dBm (TX RF test)| 250| 280| mA
2.4G 11g 6Mbps RX(RF-Test)| 63| 77| mA
2.4G 11g 54Mbps TX@ 15dBm (TX RF test)| 260| 270| mA
2.4G 11g 54Mbps RX(RF-Test)| 60| 65| mA
2.4G 11n HT20_MCS0 TX@ 17dBm (TX RF test)| 255| 272| mA
2.4G 11n HT20_MCS0 RX(RF-Test)| 65| 70| mA
2.4G 11n HT20_MCS7 TX @ 14dBm (TX RF test)| 220| 285| mA
2.4G 11n HT20_MCS7 RX(RF-Test)| 63| 70| mA
---|---|---|---
2.4G 11n HT40_MCS7 TX@ 14dBm (TX RF test)| 220| 270| mA
2.4G 11n HT40_MCS7 RX(RF-Test)| 63| 80| mA
BT| | |
BT BR_1M DH5 TX@ 5dBm(RF-Test)| 125| 152| mA
BT EDR_3M DH5 TX@ 5dBm(RF-Test)| 119| 147| mA
BT LE_1M TX@ 5dBm(RF-Test)| 122| 161| mA
BT BR_1M DH5 RX Active(RF-Test)| 103| 127| mA
BT EDR_3M DH5 RX Active(RF-Test)| 102| 130| mA
BT LE_1M RX Active(RF-Test)| 110| 133| mA

WLAN RF Specifications

G WLAN RF Specification

Conditions : VDD33=3.3V ;Ta:25℃

Features| Description
WLANStandard| IEEE802.11b/g/n
FrequencyRange| 2.4~2.4835GHz (2.4GHz ISMBand)
Channels| Ch1~Ch13 (For 20MHzChannels)
Modulation|

  • 802.11b (DSSS): DBPSK, DQPSK,CCK;
  • 802.11g (OFDM): BPSK, QPSK, 16QAM,64QAM;
  • 802.11n (OFDM): BPSK, QPSK, 16QAM,64QAM;

DataRate|

  • 802.11b: 1, 2, 5.5,11Mbps;
  • 802.11g: 6, 9, 12, 18, 24, 36, 48,54Mbps;
  • 802.11n (HT20): MCS0~MCS7(1T1R_SISO)6.5~72.2Mbps;
  • 802.11n (HT40): MCS0~MCS7(1T1R_SISO)13.5~150Mbps;

FrequencyTolerance| ≦±20ppm
2.4G Transmitter Specifications (TX power of some rates is calibrated, customers can define the targetTX power of other rates by modifying configuration file of the driver software. Customers must define theTX power same or lower than recommended Target TX Power asbelow)
TXRate| TXPower( dBm)| TX Power To lerance( dBm)| EVM (dB)
802.11b@1Mbps| Recommended TargetTX Power:17| ±1.5| ≦-10
802.11b@11Mbps| Calibrated TX Power:17| ±1.5| ≦-10
802.11g@6Mbps| Recommended TargetTX Power:17| ±1.5| ≦-10
802.11g@54Mbps| Calibrated TX Power:15| ±1.5| ≦-25
802.11n@HT20_MCS0| Recommended TargetTX

Power:17

| ±1.5| ≦-10
---|---|---|---
802.11n@HT20_MCS7| Calibrated TX Power:14| ±1.5| ≦-28
802.11n@HT40_MCS0| Recommended TargetTX

Power:17

| ±1.5| ≦-10
802.11n@HT40_MCS7| Calibrated TX Power:14| ±1.5| ≦-28
2.4G Receiver Specifications
RXRate| Min Input Level (Typ, dBm)| Max Input Level (Typ,dBm)| PER
802.11b@1Mbps| -93| -10| <8%
802.11b@11Mbps| -86| -10| <8%
802.11g@6Mbps| -90| -15| <10%
802.11g@54Mbps| -72| -15| <10%
802.11n@HT20_MCS0| -88| -15| <10%
802.11n@HT20_MCS7| -67| -15| <10%
802.11n@HT40_MCS0| -86| -15| <10%
802.11n@HT40_MCS7| -66| -15| <10%

Bluetooth RF Specification

Conditions : VDD33=3.3V ;Ta:25℃

Features| Description
Bluetooth Specification| Bluetooth Core Specificationv4.2/v2.1
Frequency Range| 2.4~2.4835GHz (2.4GHz ISMBand)
Channels|

  • Bluetooth Classic: Ch0~Ch78 (For 1MHzChannels);
  • Bluetooth Low Energy: Ch0~Ch39 (For 2MHzChannels);

Power Classes|

  • Bluetooth Classic:Class1;
  • Bluetooth Low Energy:Class1.5;

Data Rate &Modulation

|

  • BR_1Mbps:GFSK;
  • EDR_2Mbps:π/4- DQPSK;EDR_3Mbps:8DP SK;LE_1Mbps:GFSK;

Bluetooth Transmitter Specifications
Items| Min (dBm)| Typ (dBm)| Max (dBm)
TX Power
BR_1M TX Power| 2| 5| 8
EDR_2/3M TXPower| 2| 5| 8
LE_1M TXPower| 2| 5| 8
BR_1M(DH1) Modulation Characteristics
Δf1avg| 140KHz| 166.26KHz| 175KHz
Δf2avg| 115KHz| 156.33KHz| /
Δf2max| 115KHz| 152.29KHz| /
---|---|---|---
Δf2avg/Δf1avg| 0.8| 1.09| /
EDR _3M(3DH5) Modulation Accuracy
8DPSK RMSDEVM| /| 0.047| 0.13
8DPSKDEVM| /| 0.089| 0.25
LE_ Modulation characteristics
Δf1avg| 225kHz| 251.7kHz| 275kHz
Δf2avg| 185KHz| 241.2KHz| 275kHz
Δf2max| 185kHz| 244.7kHz| /
Δf2avg /Δf1avg| 0.8| 0.93| /
Bluetooth Receiver Specifications
Items| Sensitivity| Maximum InputLevel
Input Level( Typ )| BER| Input Level( Typ )| BER
BR_1M(DH1)| -88 dBm| ≦0.1%| -20 dBm| ≦0.1%
EDR_3M(3DH5)| -82 dBm| ≦0.01%| -20 dBm| ≦0.1%
Items| Sensitivity| Maximum InputLevel
Input Level( Typ )| PER| InputLevel( Typ )| PER
LE_1M| -87 dBm| ≦5%| -20 dBm| ≦5%

Mechanical Specifications

Module Outline Drawing LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-
Module-01 \(4\)

  • Module dimension: 12.012.02.1mm (LWH; Tolerance:±0.15mm) LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01 \(5\)
  • Module Bow andTwist:≤0.1mm

Mechanical Dimensions LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-
Module-01 \(6\)

Application Information

Typical Application Circuit

LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(7\) Recommend PCB Layout Foot print

Reflow Soldering Standard Conditions LB-LINK-BL-M8723DS1-150Mbps-WLAN-
BTv4-2-SDIO-Module-01 \(9\)

  • Please use the reflow within 2times.
  • Set up the highest temperature within250℃.

Key Components Of Module

No. Parts Specification Manufacturer Note
1 Chipset RTL8723DS-CG Realtek SemiconductorCorp.


2

| ****


PCB

| ****


BL-M8723DS1

| Huizhou DayawanKexiang Technology Circuit Board Co.,Ltd|
QuzhouSunlord ElectronicsCo.,Ltd|
ShenZhen Tie Fa TechnologyLimited|
SHEN ZHEN QILI ELECTRONCO.,LTD|


3

| ****

Crystal

| ****

24MHz-2520

| LUCKI CM ELECTRONICSCO.,LTD|
Chengde oscillator Electronic TechnologyCO.,LTD|
HUBEI TKD CRYSTAL ELECTRONIC SCIENCEANDTECHNOLOGYCO.,LTD|

Package and Storage Information

Package Dimensions LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(10\) LB-LINK-BL-M8723DS1-150Mbps-
WLAN-BTv4-2-SDIO-Module-01 \(11\) Pack a Package specification:

  1. 1,000 modules per roll and 5,000 modules per box.
  2. Outer box size:37.53629cm.
  3. Thediameteroftheblueenvironment-friendlyrubberplateis13inches,withatotalthicknessof28mm(with a width of 24mm carrying belt).
  4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
  5. Each carton is packed with 5boxes.

Storage Conditions

  • Absolute Maximum Ratings:
    • Storage temperature: -40℃ to+85℃
    • Storage humidity: 10% to 95%RH(Non-Condensing)
  • Recommended
    • Storage Conditions: Storage
    • temperature: 5℃ to+40℃ Storage
    • humidity: 20% to 90%RH

Please use this Module within 12month aftervacuum-packaged.

  • The Module shall be stored without opening the packing.
  • After the packing opened, the Module shall be used within72hours.When the color of the humidity indicator in the packing changed, The Module shall be baked before soldering.
  • Baking condition: 60℃, 24hours,1time.

ESD Sensitivity:
ESD Protection: 2KV(HBM ,Maximum rating)

The Module is a static-sensitive electronic device.
Do not operate or store near strong electrostatic fields. Take proper ESD precaution LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(12\)

FCC Statement

  • This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part15of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occuring a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
    • Reorient or relocate the receiving antenna.
    • Increase the separation between the equipment and receiver.
    • Connecttheequipmentintoanoutletonacircuitdifferentfromthattowhichthereceiverisconnected.
    • Consult the dealer or an experienced radio/TV technician for help.

Labeling requirements.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and
  2. This device must accept any interference received, including interference that may cause undesired operation.

Information to user.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’ authority to operate the equipment.

The antenna(s) used for this transmitter must be installed to provide as epuration distance of at least 20cm from all persons and must not be collocated or operating in conjunction with another antenna or transmitter.

FCC WARNING

  • FCC Caution : Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
    This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and
  2. This device must accept any interference received, including interference that may cause undesired operation.

This device and its antenna(s) must not be co-located or operating inconjunct ion with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:

Note:

  • This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and use din accordance with the instructions, may cause harmful interference to radiocommunications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning
    the equipment off and on, the user is encouraged to try to correct the
    interference by one or more of the following measures:

    • Reorient or relocate the receiving antenna.
    • Increase the separation between the equipment and receiver.
    • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
    • Consult the dealer or an experienced radio/TV technician for help.
  • This equipment complies with FCC radiation exposure limits set forth foramen controlled environment .This equipment should be installed and operated with minimum distance20 cm between the radiator and your body. Radiation

Exposure Statement:

  • This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
  • This transmitter must not be co-located or operating in conjunction with any other  antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following: “Contains Transmitter Module2BDDW-BLM8723DS1”
  • General Statements The module is limited to OEM installation only. The OEM integrators responsible for ensuring that the end-user has no manual instruction to remove or install module. This module should be installed and operated with a minimum distance 20cmbetween the radiator and your body. OEM integrator shall equipped the antenna to compliance with antenna requirement part 15.203& 15.204 and must not be co-located or operating conjunction with any other antenna or transmitters. And OEM host shall implement a Class ill Permissive Change (C2PC) or a new FCC ID to demonstrate complied with FCC standard. This module is for use with extremal antennas only, and the antenna is recommended as below:

LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01
\(13\)

  • Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the module. The OEM integrator is still responsible for testing the rend- product for any additional compliance requirements required with this module installed. This module support Bluetooth 2402-2480MHz & 2.4G WLAN 2412-2462MHz which compliance with part 15.247.dThe product is typically use in industrial, household and general office/ITE and audio & video end-products.

Requirement per KDB996369D03

List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. Seal so Section 2.10 below concerning the need to notify host manufacturers that further testing isrequired.3
Explanation: This module meets the requirements of FCC part 15C(15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density ,Antenna Requirement.

Summarize the specific operational use conditions

  • Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, point-to- point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devicesor 5 GHz DFS bands.
  • Explanation: The antenna can’t be replaced by other authorized antennas, and the gain of each replacement antenna is no more than 2.57dBi, This module is limited used antenna as below:LB-LINK-BL-M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01 \(14\)

Limited module procedures
In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 * Module Equip Auth Guide v02′. FCC ID 2BDDW-BLM8723DS1 cannot meet the integrated antenna and do not contain power supply regulation on the module.

  • If a modular transmitter is approved as a “limited module,” then the module manufacturer isresponsible for approving the host environment that thelimitedmodule is used with. The manufacturer of a limited module mustdescribe,both in the filing and in the installation instructions, the alternative meansthatthe limited module manufacturer uses to verify that the host meetsthenecessary requirements to satisfy the module limitingconditions. A limited module manufacturer has the flexibility to define itsalternativemethod
    to address the conditions that limit the initial approval, such as :shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval.

  • This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.

  • Explanation: The module is a limited single module. the module without antenna and the module was not tested in stand-alone configuration – it was tested in the Host.

Trace antenna designs

  • If trace antenna designs are applicable, full-detail design specifications are required per D02 Module Q&A Question 11.
  • For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ –Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4
    •  Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
    • Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
    •  The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
    • Appropriate parts by manufacturer and specifications;
    •  Test procedures for design verification; and
    • Production test procedures for ensuring compliance.
  • The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.

Explanation: not applicable

RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RFexposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information:

  1. to the host product manufacturer, to define the application conditions
    (mobile, portable – xx cm from a person’s body); and

  2. additional text needed for the host product manufacturer to provide to end users in their end- product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application).

Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. “This module is designed to comply with the FCC statement, FCC ID is:2BDDW- BLM8723DS1.

Antennas

  • A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific” antenna type”)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product.
  • The module manufacturers shall provide a list of acceptable unique connectors.

Explanation: This module is limited used antenna as below:LB-LINK-BL-
M8723DS1-150Mbps-WLAN-BTv4-2-SDIO-Module-01 \(15\) Label and compliance information

  • Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices –KDBPublication784748.
  • Explanation: The host system using this module, should have label in a visible area indicated the following texts: “Contains FCC ID: 2BDDWBLM8723DS1.

Information on test modes and additional
testing requirements5 Additional guidance for testing host products is given in KDBPublication996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a
host product.

  • The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for astand-alonemodular transmitter in a host, versus with multiple, simultaneouslytransmittingmodules or other transmitters in ahost.
  • Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements.
  • Explanation: Hangzhou Sound live Electronic Co.,Ltd. can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling transmitter.

Additional testing, Part 15 Sub part B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host should be evaluated by the FCC Subpart B.

OEM integration instructions

  • This device is intended only for OEM integrators under the following conditions:
    • The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module.
    • As long as the conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example ,digital device emissions, PC peripheral requirements ,etc.).
  • Validity of using the module certification:
    • In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
  • End product labeling:
    • The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID:2BDDW-BLM8723DS1”. Information that must be placed in the end user manual:
    • The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

The WFCO smart power control system gives the user control of devices throughout the RV, ranging from lights, to the water pump, to the awnings and slide outs. Whether using the APP through a smart device or using voice commands, the end user has complete control of their RV. The device is installed in the RV entrance, as shown in the drawing location 1. The module is installed in the Power Pro Control System position 1 in the following figure. The installation requirement is SMT mount. The antenna is in the picture position 2, and the distance between the antenna and the human body is greater than 20cm.The device is only used indoors

References

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>

Related Manuals