ATS 2ATC300C17 Dual Channel High Power IGBT Drive Board Owner’s Manual

ATS 2ATC300C17 Dual Channel High Power IGBT Drive Board

Specifications

• Product Name: 2ATC300C17 Dual Channel Driver Core
• Manufacturer: AT Electronics Hongkong Limited
• Channels: Dual
• High-power IGBT Driver
• Primary Side Pin Grid: 2.54mm
• Pin Cross Section: 0.64mm x 0.64mm

Product Usage Instructions

Mechanical Dimensions
Refer to the mechanical drawing provided in Fig.2 for detailed dimensions. Ensure adherence to margin tolerances per ISO 2768-1. Solder pads should have a diameter of 2mm, and drill holes should have a diameter of 1mm.

Pin Designation

• P1 Terminal:
  • VDDS (1-3): Signal and logic supply voltage for the primary side
  • Fault (4,10): Open drain fault output with active high signal and logic input
  • Reset (5): Input for reset
  • Mode (9): Operating mode selection input
  • INA (11): Active high PWM input for channel A
  • GNDS (12): Signal and logic common ground for the primary side

P2 Terminal:

• E.A (1): Active high external digital fault input for driver channel A
• VCEsatA (2): IGBT desaturation sensing input for driver channel A

P3 Terminal

• E.B (1): Active high external digital fault input for driver channel B
• VCEsatB (2): IGBT desaturation sensing input for driver channel B

FAQ

• Q: What is the recommended solder pad diameter for this product
  A: The recommended diameter for solder pads is 2mm.

• Q: How can I adjust the dead time in half-bridge mode for Channel A?
  A: You can adjust the dead time by using an external capacitor connected to terminal CA.

• Q: What is the purpose of the Mode input?
  A: The Mode input is used for selecting the operating mode of the driver core.

2ATC300C17
Dual Channel Driver Core

2ATC300C17 Dual-Channel High-power IGBT Driver Preliminary Description & Application Manual

Description

The 2ATC300C17 is a dual channel high voltage gate driver board featuring reinforced isolation
between logic side and high voltage output. Control and protection functions are included to ease the design of highly reliable systems.
The 2ATC300C17 is designed for use in industrial applications and the 2ATC300C17T, with special coating, for the use in more demanding applications like railway traction or windmills.The device consists of two galvanically separated driver channels and features two operating functions, the direct mode and the half-bridge mode, to drive IGBT modules.
The 2ATC300C17 is designed for use with Infineon IGBT modules up to 1700V in applications with high safety and reliability requirements and aims for power ratings of 75kW to 1MW.
The driver also includes IGBT desaturation protection, external failure input and Undervoltage Lockout
(UVLO) detection. All fault states set the fault memory and activate the open drain fault output.

Mechanical Dimensions

Note:

1. Legend unit: mm.
2. The margin tolerance conforms with the ISO 2768-1.
3. The primary side and secondary side pin grid is 2.54mm with a pin cross section of 0.64mmx0.64mm. Recommended diameter of solder pads is 2mm and diameter of drill holes is 1mm

Pin Designation

P1 Terminal

voltage primary side

| 13| GNDS| Signal and logic common

ground primary side

2| VDDS| Signal and logic supply

voltage primary side

| 14| VDDP| DC/DC-SMPS supply voltage

primary side

3| VDDS| Signal and logic supply

voltage primary side

| 15| VDDP| DC/DC-SMPS supply voltage

primary side

4| /Fault| Open drain fault output| 16| VDDP| DC/DC-SMPS supply voltage

primary side

5| Reset| Active high signal and logic

reset input

| 17| VDDP| DC/DC-SMPS supply voltage

primary side

6

| ****

CA

| External capacitor terminal for

half-bridge mode dead time adjustment channel A

| ****

18

| ****

VDDP

| DC/DC-SMPS supply voltage primary side
7| INB| Active high PWM input

channel B

| 19| GNDP| DC/DC-SMPS ground primary

side

8

| ****

CB

| External capacitor terminal for half-bridge mode dead time

adjustment channel B

| ****

20

| ****

GNDP

| DC/DC-SMPS ground primary side
9| Mode| Operating mode selection

input

| 21| GNDP| DC/DC-SMPS ground primary

side

10| /Fault| Open drain fault output| 22| GNDP| DC/DC-SMPS ground primary

side

11| INA| Active high PWM input

channel A

| 23| GNDP| DC/DC-SMPS ground primary

side

12| GNDS| Signal and logic common

ground primary side

| | |

P2 Terminal

channel A
5| VA-| External capacitor terminal for negative power supply driver channel A
6| VA+| External capacitor terminal for positive power supply driver channel A
7| COMA| Common ground terminal driver channel A
---|---|---
8| COMA| Common ground terminal driver channel A
9| GateA| IGBT gate output driver channel A
10| GateA| IGBT gate output driver channel A

P3 Terminal

channel   B
5| VB-| External capacitor terminal for negative power supply driver channel B
6| VB+| External capacitor terminal for positive power supply driver channel B
7| COMB| Common ground terminal driver channel B
8| COMB| Common ground terminal driver channel B
9| GateB| IGBT gate output driver channel B
10| GateB| IGBT gate output driver channel B

Absolute Maximum Ratings
Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the driver board. Unless otherwise noted all primary side parameters refer to GNDS. The secondary side signals from driver channel A and driver channel B are measured with respect to their individual COMA or COMB.

Positive power supply voltage Logic and

Signa

| VVDDS（note 1）| | 16.5| V
Positive power supply voltage DC/DC SMPS| VVDDP（note 2）| | 16.5| V
Total input current VVDDS and VVDDP| IVDDS,sum  （note 3）| | 670| mA
PWM signal input voltage INA, INB| VINA, VINB| -20| 20| V
Logic signal input voltage Mode, Reset| VMode, VReset| -20| 20| V
Voltage on open drain fault output| Vfault| | 20| V
Total fault output current on one or both

terminals

| IFault| | 40| mA
Peak turn on output current| IGateA, IGateB（note 4）| | 30| A
Peak turn off output current| IGateA, IGateB（note 4）| -30| | A
DC/DC SMPS average current per output| IVX  （note5）| | 133| mA
Total DC/DC SMPS output power| PSMPS| | 8| W
Collector emitter voltage of IGBT| VCES| | 1700| V
Minimum total gate resistor| Rgmin| 1| | Ω
---|---|---|---|---
Maximum IGBT gate charge| Qgmax| | 52| µC
Maximum slew rate| dvce/dt（note 6）| | 50| kV/µs
Maximum switching frequency| fsmax（note 7）| | 60| kHz
Operating temperature| Top （note 7）| -40| 85| °C
Storage temperature| Tsto| -40| 85| °C

NOTE：

1. With respect to GNDS
2. With respect to GNDP
3. Calculated value for equivalent average DC input current @ maximum SMPS output power of 8W
4. Maximum output current of the transistor power stage
5. Maximum DC output current per DC/DC output voltage calculated for total SMPS power of 8W
6. The parameter is not subject to production test – verified by design/characterization
7. Operating temperature depends on load and environmental conditions

Electrical Characteristics

Recommended Operating Parameters
Unless noted otherwise, all primary side signals refer to GNDS. The secondary side signals from driver channel A and driver channel B are measured with respect to their individual COMA or COMB.

Vfault

|

15

|

V

Switching frequency @ 65°C operating

temperature

| fsmax| 60| kHz

Electrical Characteristics
The electrical characteristics involve the spread of values for the supply voltages, load and junction temperatures given below. Typical values represent the median values, which are related to production processes at T = 25°C. VVDDS and VVDDP are 15V. Unless otherwise noted all voltages are given with respect to GNDS. The specification for all output driver signals is valid for driver channel A and driver channel B without special notice. The secondary signals are measured with respect to their individual COMA or COMB

Reactivation after fault condition @ INA and INB with

low input signal

| treact| 50| 60| | ms
Reference voltage for IGBT desaturation sensing| | | 10| | V
Coupling capacitance primary/secondary| Ccps| | 18| | pF
Coupling capacitance between secondary sides| Ccss| | 15| | pF
External capacitor for Logic and Signal power supply.

Connected between VDDS and GNDS.

| CVDDP| 10| | | µF
External capacitor for SMPS power supply.

Connected between VDDP and GNDP

| CVDDS| 470| | | µF
Positive supply voltage driver channel A and B @ no

switching operation

| VVA+, VVB+| | 16| | V
Negative supply voltage driver channel A and B @ no

switching operation

| VVA-, VVB-| | -16| | V
Internal capacitor on positive supply voltage

driver channel VA+ and VB+

| CVA+,int,

CVB+,int

| | 28| | µF
Internal capacitor on negative supply voltage

driver channel VA- and VB-

| CVA-,int,

CVB-,int

| | 23| | µF
Internal UVLO level for positive supply voltage driver

channel

| VUVLO,pos| | 10.9| | V
Internal UVLO level for negative supply voltage driver

channel

| VUVLO,neg| | -9.3| | V
External capacitor for interlocking generation| CCA, CCB| 0| | 1| nF

Electrical Isolation
Electrical characteristics, at Ta = 25 °C, unless otherwise specified.

Isolation test voltage

|

Signal and Logic Side – Driver Channel A and Driver Channel B (RMS, 50Hz, 1s)

|

5000

|

V

solation test voltage

| Driver Channel A – Driver Channel B (RMS, 50Hz, 1s)|

2250

|

V

Surge voltage tes| Surge test according to EN50178 Signal and Logic Side to Driver Channels A and| 9600| V
---|---|---|---
Partial discharge test voltage| RMS; transformer series test According to EN 61800-5-1| >1920| V
Clearance and creepage distance primary to secondary| Distance Signal and Logic Side to Driver Channels A and B| >15| mm
Clearance distance secondary to secondary| Distance Driver Channel A to Driver Channel

B. 4mm air gap included.

| >4.59| mm
Creepage distance secondary to secondary| Distance Driver Channel A to Driver Channel B| >14| mm

Recommended Interface Circuitry for the Primary Side Connector

Both ground pins must be connected together with low parasitic inductance. A common ground plane or wide tracks are strongly recommended. The connecting distance between ground pins must be kept at a minimum.

Description of Primary Side Interface

General
The primary side interface of the driver 2ATC300C17 is very simple and easy to use.
The driver primary side is equipped with a 23-pin interface connector with the following terminals:

• 8 x power-supply terminals
• 2 x drive signal inputs
• 2 x status outputs (fault returns)
• 1 x mode selection (half-bridge mode / direct mode)
• 2 x inputs to set the dead time (half-bridge mode)
• 1 x not connected (N.C.)

All inputs and outputs are ESD-protected. Moreover, all digital inputs have Schmitt-trigger characteristics.

VDDP terminal
The driver has 5 VDDP terminals on the interface connector to supply the DC-DC converter for the secondary sides. VDDP should be supplied with a stabilized +15V power supply.
It is recommended to use a stabilizing capacitor of 220μF between VDDP and GND.

VDDS terminal

• The driver has 3 VDDS terminals on the interface connector to supply the primary side electronics with 15V.
• It is recommended to connect the VDDS terminals to VDDP via a 10Ω resistor. An additional stabilizing capacitor of 1μF should be placed between VDDS and GND.
• It is also possible to run VDDP and VDDS directly in parallel without a 10Ω resistor.

Mod (mode selection)
The Mod input allows the operating mode to be selected.

Direct mode
If the Mod input is connected to GND, direct mode is selected. In this mode, there is no interdependence between the two channels. Input INA directly influences channel A while INB influences channel B. High level at an input (INA or INB) always results in turn-on of the corresponding IGBT. This mode should be selected only when the dead times are generated by the control circuitry so that each IGBT receives its own drive signal.

Caution: Synchronous or overlapping timing of both switches of a half- bridge basically shorts the DC link.

Half-bridge mode
If the Mod input is connected to VDDS, half-bridge mode is selected. In this mode, the input INA influences channel A while INB influences channel B. However, only one channel can be turned-on at a given time and a defined dead time (interlock time) between both channels is generated (Fig. 4). The dead time between both channels can be adjusted with the input pins CA and CB (see “CA and CB (input for adjusting the dead time in half-bridge mode)” on page 10). If both signals INA/INB are high, both gate signals are low (-15V).

The following Fig. 4 shows the driver behavior in half-bridge mode. INA, INB (channel drive inputs, e.g. PWM)
INA and INB are basically drive inputs, but their function depends on the Mod input (see above). 15V logic-level signals should be applied at INA and INB.
No pulse shorter than 1.5μs should be applied to the driver inputs. A pulse shorter than 1.5μs could occasionally activate the soft turn-off function of the driver.

SOA, SOB (status outputs)
The outputs SOx have open-drain transistors. When a fault condition is detected in channel “x”, the status output SOx goes to low (connected to GND). Otherwise, the output has high impedance.
Both SOx outputs are not connected to a single signal on the driver. They can be connected together to provide a common fault signal (e.g. for one phase) if required.
The maximum SOx current in a fault condition should not exceed the value specified in the driver data sheet /3/.

How the status information is processed
A fault on the secondary side (detection of short-circuit of IGBT module, supply under voltage or external fault input) is transmitted to the corresponding SOx output immediately. The corresponding SOx output is automatically reset (returning to a high impedance state) after the blocking time has elapsed (refer to the driver data sheet for timing information /3/).
A supply under voltage on the primary side is indicated to both SOx outputs at the same time. Both SOx outputs are automatically reset (returning to a high impedance state) when the under voltage on the primary side disappears (refer to the driver data sheet for timing information /3/).

Note that no external reset input is available on the driver. The driver is automatically reset after the blocking time has elapsed.

Terminals CA and CB allow the generated dead time between both channels A and B to be determined in half- bridge mode. The dead time can be defined with a capacitor placed between pins CA and CB and GND (Fig. 5).

The following table 1 shows the dead time as a function of the capacitance of CA and CB:

Table 1 Generated dead time as a function of CA and CB in half-bridge mode
In direct mode, it is recommended to connect the inputs CA and CB with a 470pF capacitor to GND. CA or CB must not be connected to any external potential (e.g. GND or VDDS).

Recommended Interface Circuitry for the Secondary Side Connectors

Description of Secondary Side Interfaces

General
The driver’s secondary sides are each equipped with a 10-pin interface connector with the following terminals (x stands for A or B):

• 2 x DC/DC output terminals (Vx+ and Vx-)
• 2 x emitter terminals COM x
• 1 x reference terminal RC x for overcurrent or short-circuit protection
• 1 x collector sense terminal VCE x
• 2 x gate terminals Gate x
• 1 x sense terminal for active clamping and/or soft-turn-off Sense x
• 1 x external fault input E.x

All inputs and outputs are ESD-protected.

DC/DC output (Vx+, Vx-) and COM x terminals
The driver is equipped with blocking capacitors on the secondary side of the DC/DC converter (for values, refer to the data sheet /3/). It is recommended to use additional external blocking capacitors of 220μF to reduce the dynamic voltage drop due to high pulse currents.
The blocking capacitors must be placed between Vx+ and COM x as well as between COM x and Vx- (Fig. 5). They must be connected as close as possible to the driver’s terminal pins with minimum inductance. Capacitors with high ripple current capability should be used.

Reference terminal (RC x)
The reference terminal RC x allows the threshold to be set for short-circuit and/or overcurrent protection with a resistor Rth placed between RC x and COM x. Moreover, instead of a static reference, a dynamic reference is used to check the collector-emitter voltage of the IGBT at turn-on. The time constant of the dynamic reference can be set with a capacitor Cth placed between RC x an COM x. It allows the short-circuit duration to be adjusted in case of IGBT short-circuit.
The following table 2 shows the static reference as well as the short-circuit duration (short-circuit type I) according to IEC 60747-9 for different values of Rth and Cth. The short-circuit duration was measured under the following conditions:

• IGBT module: FF1000R17IE4 from Infineon
• Rg,on=1.2Ω and Rg,off=1.8Ω
• Rssd=10kΩ, Ca=1nF (Fig. 5)
• DC-link voltage: 1000V

| Short-circuit duration
---|---
Resistance Rth| Threshold| Cth=0pF| Cth=100pF| Cth=220pF| Cth=470pF| Cth=1nF
2kΩ| 1.9V| 2μs| 2.1μs| 2.3μs| 2.7μs| 3.6μs
5.4kΩ| 3.9V| 2.2μs| 2.6μs| 3.1μs| 3.9μs| 5.6μs
12kΩ| 5.8V| 2.5μs| 3.5μs| 4.2μs| 5.5μs| 7.6μs
32kΩ| 7.8V| 3.7μs| 4.9μs| 5.9μs| 7.4μs| 10μs
70kΩ| 8.8V| 5.1μs| 6μs| 7μs| 8.6 μs| 11.7μs

Table 2 Dynamic threshold voltage for overcurrent and/or short-circuit protection
Note that the short-circuit duration is dependent on the IGBT module used and the gate resistors. It is therefore recommended to measure it in the final application. The short-circuit duration should not exceed the maximum value given in the IGBT module data sheet.

Collector sense (VCE x)
2ATC300C17 drivers are equipped with a dynamic collector sense function. The collector sense must be connected to the IGBT collector with the circuit shown in Fig. 5 in order to detect an IGBT overcurrent or short-circuit.

Gate terminals Gate x
These terminals allow the turn-on and turn-off gate resistors to be connected to the gate of the power semiconductor. Please refer to the driver data sheet /3/ for the limit values of the gate resistors used.
The auxiliary emitter of the IGBT must be connected directly to the COM x terminals of the driver.
A resistor Rge of 10kΩ between Gate x and COM x is recommended in order to provide a low-impedance path from the IGBT gate to the emitter even if the driver is not supplied with power. Moreover, gate clamping should be realized with a zener diode between Gate x and COM x.

Note however that it is not advisable to operate the power semiconductors within a half-bridge with a driver in the event of a low supply voltage. Otherwise, a high rate of increase of Vce may cause partial turn-on of these IGBTs.

Sense input (Sense x)
The Sense x inputs can be used:

• to adjust the soft turn-off behavior
• to activate active clamping.

Both techniques allow the IGBT to be protected against collector-emitter overvoltages in case of overcurrent and/or short-circuit turn-off. Note that soft turn-off does not offer 100% protection against turn-off overvoltages. If the pulse duration determined by the corresponding input INx is shorter than the driver response time (time between gate-emitter turn-on and short-circuit detection), the driver will switch off the short-circuit without the soft turn-off function. In this case, active clamping can be used to limit the turn-off overvoltage.
A typical value of Rssd=10kΩ is recommended. If necessary, this value can be modified in order to adjust the soft turn-off behavior of the driver.

External fault input E.x
The 2ATC300C17 is equipped with an external fault input on each driver channel. This allows a fault to be generated on the corresponding channel. The external fault is handled in the same way as an overcurrent/short-circuit or supply undervoltage fault.

If the external fault input E.x is not used, it must be connected to COM x.
If it is used, the following conditions must be met in order to ensure proper function of the driver:

• The slew rate of E.x should be higher than 0.1V/μs
• The pulse width applied to E.x must be longer than 1μs
• As soon as one channel is in a fault condition (SOx output goes to low), the other channel must be switched off (it is not switched off by the driver)

The dead time between both channels must be higher than 2μs + reaction time of the host system (time between fault feedback SOx of the driver and turn-off command for the other channel)

Working in Detail

Power supply and electrical isolation
The driver is equipped with a DC/DC converter to provide an electrically insulated power supply to the gate driver circuitry. All transformers (DC/DC and signal transformers) feature safe isolation to EN 50178, protection class II between the primary side and either secondary side.

Note that the driver requires a stabilized supply voltage.

Power-supply monitoring
The driver’s primary side as well as both secondary-side driver channels are equipped with a local under voltage monitoring circuit.
In case of a primary-side supply under voltage, both IGBTs are driven with a negative gate voltage to keep them in the off-state (both channels are blocked) and the fault is transmitted to both outputs SOA and SOB until the fault disappears.
In case of a secondary-side supply under voltage, the corresponding IGBT is driven with a negative gate voltage to keep it in the off-state (the channel is blocked) and a fault condition is transmitted to the corresponding SOx output. The SOx output is automatically reset (returning to a high impedance state) after the blocking time.

Vce monitoring / short-circuit protection

The 2ATC300C17 driver is equipped with a Vce monitoring circuit. The recommended circuit is illustrated in Fig. 5. A resistor and a capacitor (Rth and Cth in Fig. 5) are used as the reference elements for defining the dynamic turn-off threshold.
It is recommended to use a value of Ca=1nF and fast diodes such as UF4007 (2 diodes for 1200V or 1700V IGBTs) for D1.
During the response time, the Vce monitoring circuit is inactive. The response time is the time that elapses after turn-on of the power semiconductor until the collector/drain voltage is measured
Vce is checked after the response time at turn-on to detect a short circuit or overcurrent. If this voltage is higher than the programmed threshold Vth, the driver detects a short circuit or overcurrent, switches the power semiconductor off and signals the fault immediately to the corresponding SOx output. The power semiconductor is kept off (non-conducting) and the fault is shown at pin SOx as long as the blocking time is active.

Blocking time
In case of a secondary side fault (short-circuit or overcurrent, supply under voltage, external fault input), the fault is immediately transmitted to the primary side and shown at the corresponding output SOx. The corresponding channel is blocked during the blocking time (for timing information, refer to the driver data sheet). After the blocking time, the driver channel is automatically reset and the fault at the corresponding SOx output disappears.
Note that the other channel (channel without fault) is not turned off and no fault is generated at the corresponding SOx output.

2ATC300C17 datasheet
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References

• semi.com

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