NXP AN14208 Migration Guide Mcxn User Guide
- June 15, 2024
- NXP
Table of Contents
NXP AN14208 Migration Guide Mcxn
Product Information
Specifications:
- MCXN Series:
- Advanced MCU with 32-bit Arm Dual Cortex-M33
- Neural Processor Unit
- Up to 2 MB flash size
- Package options: 100HLQFP and 184MAPBGA
- MCXA Series:
- Focuses on cost-effectiveness and ease of use
- Multiple part numbers with varying memory sizes and core speeds
- Package options: 64LQFP, 48HVQFN, and 32HVQFN
Product Usage Instructions
-
Part Number Selection:
If you are migrating from MCXN to MCXA, ensure you select the right part number destination based on your requirements. Use the decoder provided to understand the meaning of the part numbers for MCXA. -
Hardware and Software Changes:
Migrating between MCXN and MCXA microcontrollers requires both hardware and software changes. Ensure you make the necessary adjustments to accommodate the new MCU. -
Package Selection:
For MCXA, choose from the available package options based on your project needs: 64LQFP, 48HVQFN, or 32HVQFN. -
Orderable Part Numbers:
Refer to the tables provided in the user manual to select the appropriate MCXA part number destination or MCXN part number origin for your migration.
Document information
Information | Content |
---|---|
Keywords | AN14208, MCXN (N94x, N54x), MCXA (A143/2, A153/2) |
Abstract | This document provides information required to migrate from MCXN |
(N94x, N54x) microcontrollers to MCXA (A143/2, A153/2) microcontrollers.
Introduction
This document provides information required to migrate from MCXN (N94x, N54x) microcontrollers to MCXA (A143/2, A153/2) microcontrollers. Migration between the two devices requires hardware and software changes. The following sections describe the changes required when migrating from MCXN to MCXA microcontrollers.
Part number selection
- The MCXN series (N94x, N54x) MCU is an advanced MCU that offers extensive integration, including a 32-bit Arm Dual Cortex-M33, Neural Processor Unit, and up to 2 MB flash size. It is offered in two package options, which are 100HLQFP and 184MAPBGA.
- On the other hand, the MCXA series (A143/2, A153/2) MCU focuses on cost-effectiveness and ease of use. If you have already designed MCXN-based products and intend to migrate from MCXN to MCXA for cost reduction, you must select the right part number destination first.
- To select the right MCU for your product, check the available device options. Currently, there are 12 MCXA part numbers available (see Table 1), with more MCXA parts to be released soon that will provide a lot of options in memory set and performance to address different customer needs. The advantage of those parts is that they are software compatible, pin compatible within the MCXA series. So, you can go to market with these 12 parts that are launched first, then you have the freedom to upgrade or downgrade within the whole MCXA series.
- The following is a simple decoder, which can help you understand the three numbers that come after MCXA. The first number, which is 1, is considered the baseline and indicates cost-effectiveness. The second number indicates the core speed, where 4 stands for 48 MHz and 5 stands for 96 MHz. Finally, the third number indicates the memory size, where 2 represents 64 KB flash.
- For the package of MCXA, you can choose from the following three packages: 64LQFP, 48HVQFN, and 32HVQFN.
Table 1. MCXA part number destination
Orderable part number [1]| Part number [2]| Embedded
memory| Core Cortex- M33 (MHz)| Core cache (KB)| GPIO|
Package
---|---|---|---|---|---|---
Flash (KB)| SRAM (KB)| Pin count| Type
MCXA143| MCXA143VLH| 128| 32| 48| 4| 52| 64| LQFP
MCXA143| MCXA143VFT| 128| 32| 48| 4| 41| 48| QFN
MCXA143| MCXA143VFM| 128| 32| 48| 4| 26| 32| QFN
MCXA142| MCXA142VLH| 64| 16| 48| 4| 52| 64| LQFP
MCXA142| MCXA142VFT| 64| 16| 48| 4| 41| 48| QFN
MCXA142| MCXA142VFM| 64| 16| 48| 4| 26| 32| QFN
MCXA153| MCXA153VLH| 128| 32| 96| 4| 52| 64| LQFP
MCXA153| MCXA153VFT| 128| 32| 96| 4| 41| 48| QFN
MCXA153| MCXA153VFM| 128| 32| 96| 4| 26| 32| QFN
MCXA152| MCXA152VLH| 64| 16| 96| 4| 52| 64| LQFP
MCXA152| MCXA152VFT| 64| 16| 96| 4| 41| 48| QFN
MCXA152| MCXA152VFM| 64| 16| 96| 4| 26| 32| QFN
- To confirm the current availability of orderable part numbers, visit https://www.nxp.com and perform a part number search.
- As marked on the package
Table 2. MCXN part number origin
Orderable part number [1]| Part number [2]| Embedded
memory| Features| Package
---|---|---|---|---
Flash (MB)| SRAM (K)| Tamper pins (max)| GPIOs
(max)
| SRAM PUF| Pin count| Type
(P)MCXN547VNLT| (P)MCXN547VNLT| 2| 512| 2| 74| Y| 100| HLQFP
(P)MCXN546VNLT| (P)MCXN546VNLT| 1| 352| 2| 74| Y| 100| HLQFP
(P)MCXN547VDFT| (P)MCXN547VDFT| 2| 512| 8| 124| Y| 184| VFBGA
(P)MCXN546VDFT| (P)MCXN546VDFT| 1| 352| 8| 124| Y| 184| VFBGA
(P)MCXN947VDFT| (P)MCXN947VDFT| 2| 512| 8| 124| Y| 184| VFBGA
(P)MCXN947VNLT| (P)MCXN947VNLT| 2| 512| 2| 78| Y| 100| HLQFP
(P)MCXN946VNLT| (P)MCXN946VNLT| 1| 352| 2| 78| Y| 100| HLQFP
(P)MCXN946VDFT| (P)MCXN946VDFT| 1| 352| 8| 124| Y| 184| VFBGA
- To confirm the current availability of orderable part numbers, visit https://www.nxp.com and perform a part number search.
- As marked on the package
Feature comparison
This section provides a feature comparison between the MCXN and MCXA device.
High-level feature comparison
There are a significant number of differences between the two devices.
However, a logical migration path exists between the two devices. The power
management, system control architecture, and most of the peripherals on MCXA
are reused from MCXN, providing exceptional continuity and compatibility
across the devices. Table 3 outlines the system-level differences at a high
level.
Table 3. High-level feature comparison between MCXA and MCXN
Module | MCXN | MCXA |
---|---|---|
Core | 2x CM33F w TZ @ 150 MHz |
EZH, BSP32, PQ, Neutron, CoolFlux BSP32
| CM33 @ 96 MHz w/o FPU MPU DSP
Clocking| 2x PLL, FRO144M, FRO12M, OSC48M, OSC32K, FRO16K| FRO192M, FRO12M,
OSC48M, FRO16K
Flash| 2x 1 MB array, w RWW NPX(FMC+Prince), MSF| 1x 128 KB array FMC, MSF
RAM| 512 KB with 32 KB ECC, Configurable ECC 16 KB LPCAC, 16 KB FlexSPI Cache|
32 KB with 8 KB ECC
4 KB LPCAC
ROM| 256 KB
Secure Boot, Secure Image Update, TP Flow
| 16 KB ROM Boot
24 KB flashloader
System| 2x DMA3, CRC, 2x WWDT, SPC, SCG, EIM, ERM, INTM, EWM, SYSCON, WUU,
CMC, VBAT| 1x DMA3, CRC, WWDT, SPC, SCG, CMC, VBAT, EIM, ERM, SYSCON, WUU
Power supply| DCDC, SYS_LDO, CORELDO, VBAT, SRAM LDO, SRPG, TRO
1.2 V / 1.1 V / 1.0 V RUN Mode
| CORE_LDO, SRAM_RET_LDO
1.1 V / 1.0 V RUN Mode
Module | MCXN | MCXA |
---|---|---|
Power modes | Active / Sleep / Deep Sleep / Power Down/Deep Power Down / VBAT |
Active / Sleep / Deep Sleep / Power Down / Deep Power Down
High-speed interface| USB HS, FlexSPI, SDHC, ENET, eSPI, SPI-filter LPSPI
(LP_FlexCOMM)| LPSPI
Communications| USB FS, 10x LP_FLEXCOMM, 2x FlexCAN, 2x SAI, 2x I3C, FlexIO,
2x EMVSIM| 3x LPUART, 2x LPSPI, 1x LPI2C, 1x I3C
Timers| • 2x FlexPWM with four submodules each
• 2x QDC (quadrature decoder)
• 5x Ctimer (general-purpose timer)
• 1x FREQME (frequency measurement timer)
• 1x Micro-Tick timer
• 1x OS event timer
• 2x LPTMR (low-power timer)
• 1x RTC (real-time clock)
• 1x MRT (multirate timer)
• 1x SCT
| • 1x FlexPWM with three submodules
• 1x QDC (quadrature decoder)
• 3x CTimer (general-purpose timer)
• 1x FREQME (frequency measurement timer)
• 1x Micro-Tick timer
• 1x OS Event timer
• 1x LPTimer (low-power timer)
• 1x Wake timer
Analog| 2x 16 bit ADC, 3x DAC, 3x CMP, 3x OPAMP, VREF, TSI| 1x 16 bit ADC, 2x
CMP
IO| Up to 124 GPIO, 100M / 50M / 25M IO| Up to 52 GPIO, 50M / 25M IO
High-drive IO, 5 V Tolerant IO
Security| S50, PKC, PUF, TRNG, SM3, 2x GDET, Tamper, eFuse, ITRC, 2x CDOG,
LVD/HVD| LVD/HVD, ROP, 1x CDOG, GLIKEY
Package| 184VFBGA 9 x 9 x 0.86 mm, 0.5 mm
100HLQFP 14 x 14 x 1.4 mm, 0.5 mm
| 64LQFP 10 x 10 x 1.4 mm, 0.5 mm
32QFN 5 x 5 x 0.9 mm, 0.5 mm
48QFN 7 x 7 x 0.9 mm, 0.5 mm
System module comparison
This section outlines the system module differences when migrating from the
MCXN device to the MCXA device.
Memory map comparison
The memory map of the MCXA device is different from the MCXN device. It is
important that you update your linker control file and do not try to use the
MCXN device linker control file when compiling your MCXA project or vice
versa.
Table 4 is a side-by-side comparison of the two memory maps.
MCXN (Nonsecure) | MCXA |
---|---|
Start address | End address |
Start address | End address |
0000_0000 | 001F_FFFF |
KB
| Program Flash
0300_0000| 0303_FFFF| 256 KB| ROM-BOOT| 0300_0000| 0300_3FFF| 16 KB| ROM-BOOT
0400_0000| 0401_7FFF| 96 KB| RAMX| 0400_0000| 0400_1FFF| 8 KB| RAM X0
0800_0000| 0FFF_FFFF| 128 MB| FlexSPI| 0400_2000| 0400_2FFF| 4 KB| RAM X1
MCXN (Nonsecure)| MCXA
---|---
Start address| End address| Size| Destination slave|
Start address| End address| Size| Destination slave
2000_0000| 2000_7FFF| 32 KB| RAMA| 2000_0000| 2000_1FFF| 8 KB| RAM A0
2000_8000| 2000_FFFF| 32 KB| RAMB| 2000_2000| 2000_5FFF| 16 KB| RAM A1
2001_0000| 2001_FFFF| 64 KB| RAMC| 2000_6000| 2000_7FFF| 8 KB| RAM X0 Alias
2002_0000| 2002_FFFF| 64 KB| RAMD| –| –| | –
2003_0000| 2003_FFFF| 64 KB| RAME| –| –| | –
2004_0000| 2004_FFFF| 64 KB| RAMF| –| –| | –
2005_0000| 2005_FFFF| 64 KB| RAMG| –| –| | –
2006_0000| 2006_7FFF| 32 KB| RAMH| –| –| | –
Internal flash memory feature comparison
MCXN embeds up to 2 MB of flash. It is implemented as 2 x 1 MB flash block
instances. MCXA embeds 128 KB of single-array flash, sector size of 8 Kbytes.
Table 5. Flash memory feature comparison
Feature | Description | MCXN | MCXA |
---|---|---|---|
Flash array – phrase | Represents the smallest portion of the flash memory that | ||
can be programmed in one operation | 16 bytes | 16 bytes | |
Flash array – sector | Represents the smallest portion of the flash memory that | ||
can be erased in one operation. | 8 KB | 8 KB | |
Flash array – page | Represents the largest portion of the flash memory that | ||
can be programmed in one operation. | 128 bytes | 128 bytes | |
Flash memory controller – prefetch buffer | Prefetch the next 128-bit flash | ||
memory location. | 16 bytes | 16 bytes | |
Flash memory controller – cache | Flash cache memory stores already-fetched |
data. This code is immediately available for repeated execution without any wait states, if needed. It is a one-set, four-way associative cache with
128-bit (or 16-byte) size entries.
| 64 bytes| 16 bytes
Functional safety – Flash ECC| –| One-bit error correction; Two-bits error
detection capability| One-bit error correction; Two-bits error detection
capability
Functional safety – Flash ERM| ERM provides information and optional
interrupt| Report ECC two-bits error| Report ECC two-bits error
Feature| Description| MCXN| MCXA
---|---|---|---
| notification on memory
ECC and parity error events.
| |
Functional safety – Flash EIM| EIM provides a method for diagnostic coverage
of internal memories. It enables you to induce artificial errors on error-
checking mechanisms.| Single-bit error injection Double-bit error injection|
Single-bit error injection Double-bit error injection
Flash performance – Access frequency| Configured by FCTRL[RWSC].| 150 MHz / 4
= 37.5 MHz;
when RWSC = 3
| 96 MHz SD mode, 3 wait
states. 96 MHz / 3 = 32 MHz; when RWSC=2.
48 MHz, MD mode, 1 wait
state. 48 MHz / 2= 24 MHz; when RWSC=1.
Clocking comparison
The system clocking module provides the clock signals to the core, memories,
and peripherals (register interfaces and peripheral clocks).
MCXN system clock generation (SCG) module includes these clock sources:
- FRO high-speed output (fro_hf) from internal oscillator. By default, its speed is 48 MHz. fro_hf is the default main clock.
- 12 MHz free-running oscillator (FRO) output (FRO_12M) from the internal oscillator.
- External oscillator.
- Output of PLL0.
- Output of PLL1.
- RTC 32 kHz oscillator.
- Output of USB PLL (usb_pll_clk).
MCXA system clock generation (SCG-Lite) is simplified, includes:
- FRO192M: FRO high-speed output (fro_hf) from internal oscillator. By default, its speed is 48 MHz. fro_hf is the default main clock.
- FRO12M: 12 MHz free-running oscillator (FRO) output (FRO_12M) from internal oscillator.
- FRO16K: 16.384 kHz clock output from FRO16K. It is the clock of peripherals in the VSYS domain.
- External oscillator, 8 MHz – 50 MHz.
It is important to note the differences in the clocking diagrams as these differences can significantly affect the setup of your application.
Figure 1 shows the MCXN clocking diagram and Figure 2 shows the MCXA clocking diagram.
Table 6 outlines the clock module differences at a high level.
| MCXN| MCXA
---|---|---
Internal source
| FRO144M| FRO192M
FRO12M| FRO12M
FRO16K| FRO16K
External clock
| System crystal (16 MHz – 40 MHz)| System crystal (8 MHz – 50 MHz)
32 K crystal| NA
PLL| 550 MHz PLL0, PLL1| NA
Table 7 outlines system clock requirements differences.
Table 7. System clock requirement comparison
| MCXN| MCXA
---|---|---
| Max. clock frequency| Max. clock frequency
| Over Drive mode (VDDCORE = 1.2 V)| Standard Drive mode (VDD CORE = 1.1
V)| Mid Drive mode (VDDCORE = 1.0 V)| Standard Drive mode (VDD CORE = 1.1
V)| Mid Drive mode (VDD_CORE =
1.0 V)
CPU_CLK (Core clock)| 150 MHz| 100 MHz| 50 MHz| 96 MHz| 48 MHz
SYSTEM_CLK
(Peripheral Bus Clock 0)
| ****
150 MHz
| ****
100 MHz
| ****
50 MHz
| ****
96 MHz
| ****
48 MHz
SLOW_CLK (Peripheral Bus Clock 1)| ****
37.5 MHz
| ****
25 MHz
| ****
12.5 MHz
| ****
24 MHz
| ****
12 MHz
Peripheral module comparison
- The peripheral modules are classified.
- The modules marked by Unchanged in the Software driver comments column of the peripheral module differences table (see Table 8) are compatible, and use the same SDK driver. Although the designs of these modules were not changed, there is a possibility that they have been integrated differently or that different clock sources are now sourcing these modules. Also, they may have different instances.
- The modified modules refer to the modules that have been updated to use newer/different versions or simply have some minor differences. The overall functionality provided is similar. However, changes are required in software and possibly hardware changes are required to utilize updated features. These modules are marked by Changed in the Software driver comments column of the peripheral modules differences table (see Table 8).
- The new modules refer to the new modules that have been added and how they can benefit your design. They are marked with + in the Software driver comments column of the peripheral module differences table (see Table 8).
- Take a note of the removed modules. These modules are marked with – in the Software driver comments column of the peripheral module differences table (see Table 8). Unpredictable results occur if a module that is present on the MCXN is written on the MCXA. If your application is using a removed module, you should remove the code for this peripheral.
- Table 8 presents a comparison of the peripheral modules found on the MCXN device and the MCXA device.
Table 8. Peripheral module comparison
Peripheral | MCXN | MCXA | Software driver comments |
---|---|---|---|
FlexPWM | 2x | 1x | Unchanged 3 Sub Modules in FlexPWM of MCXA |
Quadrature decoder | 2x ENC | 1x QDC | Changed. QDC is a new design, but mostly |
compatible with MCXN ENC
CTimer| 5x CTimer| 3x CTimer| Unchanged
SCTimer| 1x| –| –
Micro-tick timer (UTICK)| 1x| 1x| Unchanged
OS Timer| 1x| 1x| Unchanged
Frequency measurement (FREQME)| 1x| 1x| Unchanged
RTC| 1x| –| –
LPTIMER| 2x| 1x| Unchanged
Multi-rate timer (MRT)| 1x| –| –
ADC| 2x 16 bit ADC| 1x 16 bit ADC| Changed. The ADC on MCXA features a single-
ended configuration, with a single sample/hold circuit. Supports up to 3.2
Msps in 16-bit mode.
MCXA ADC supports seven CMDs, one 8-entry conversion result FIFO; MCXN ADC supports 15 CMDs, two 16-entry conversion result FIFO.
CMP| 3x| 2x| Unchanged.
DAC| 3x| –| –
OPAMP| 3x| –| –
VREF| 1x| –| –
TSI| 1x| –| –
PORT| 6x| 4x| Changed. MCXN each port has the independent power supply VDD_Px.
MCXA all ports have the same power supply VDD.
GPIO| 6x| 4x| Changed. MCXA added high drive and 5 V tolerant IOs
Hardware comparison
This section outlines the differences and hardware considerations when migrating from the MCXN device to the MCXA device.
Package / pinout differences
The MCXN device is offered in two package options, which are 100HLQFP and
184MAPBGA. On the other hand, the MCXA device is available in three packages,
which are 64LQFP, 48HVQFN, and 32HVQN. These devices are not designed to be
pin-to-pin compatible. You can find the package drawing in the Device
datasheet.
Minimum system considerations
There are some additional hardware considerations when migrating from MCXN to
MCXA.
Figure 3 shows the MCXA minimum system.
The MCXN and MCXA devices have similar reset, ISP, and debug circuits for the
minimum system. However, MCXA integrates a simple capless LDO to power the
core in a power supply circuit, while MCXN offers an additional DCDC converter
with better power efficiency. Furthermore, MCXA does not have an external 32 K
crystal circuit.
Revision history
Table 9 summarizes revisions to this document.
Table 9: Revision history
Document ID | Release date | Description |
---|---|---|
AN14208 v.1 | 18 March 2024 | Initial public release |
- Date of release: 18 March 2024
- Document identifier: AN14208
FAQ
Q: Can I directly migrate my software from MCXN to MCXA without any
modifications?
A: No, migrating between MCXN and MCXA microcontrollers requires hardware and
software changes to ensure compatibility and optimal performance.
Q: How do I select the right MCXA part number for my project?
A: Use the decoder provided in the user manual to understand the meaning
behind the part numbers and choose based on your requirements for flash size,
SRAM, core speed, and package type.
Q: Where can I find the latest orderable part numbers for MCXA?
A: Visit https://www.nxp.com to perform a part number search and confirm the
current availability of orderable part numbers.
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