REXENSE REX3GF26 Zigbee Module Owner’s Manual
- June 11, 2024
- REXENSE
Table of Contents
Data Sheet of Zigbee Module
REX3GF26
V2.0
REX3GF26 Zigbee Module
Copyright
All information contained in this document is copyrighted by Zhejiang Rexense
IoT Technology Co., Ltd. (hereinafter referred to as “Rexense” or “the
company”). Without the written permission of the company, the content of this
document shall not be disclosed to any third party other than the company’s
employees, agents, partners or authorized licensors, and this document shall
not be copied or disseminated in any form without authorization. If the user
violates the copyright protection agreement, the company has the right to
pursue the legal responsibility arising from the user.
Version Updates
| V1.0.0 | 2023.4.25 | First Draft |
|---|---|---|
| V2.0.0 | 2023.5.23 | Update basic performance parameters, power consumption, |
etc.
Product Introduction
1.1 Introduction
REX3GF26 is a small, high-sensitivity and low-power Zigbee module. Based on
the PHY6226 chip, it provides a complete, high-performance, low-power and low-
cost Zigbee wireless communication system, which complies with the
IEEE802.15.4 specification and Zigbee 3.0 standard.
The module integrates 32-bit ARM Cortex-M0 MCU, Zigbee3.0 wireless
communication, 64KB SRAM, 1024KB built-in Flash, and 5-channel PWM.
The REX3GF26 module complies with FCC, IC and CE regulations. It can be
applied to equipment in many different environments, and complies with RoHS
regulations. At the same time, the company also provides a complete set of
development and evaluation kits. Users can choose different versions of kits
for testing and development according to their own needs.
1.2 Application
Rexense REX3GF26 module complies with IEEE802.15.4 specification and Zigbee
3.0 standard.
- Transparent transmission: Users can develop programs according to our UART protocols program.
- Customization: our company can provide customers with reliable and safe applications according to their specific application programs.
- Standard Zigbee 3.0 function
Modules are mainly used in the lighting fields.
1.3 Main Features
- Dimensions: 17.3mm (L)×15mm (W)×2.8mm (H) (with shield)
- High receiving sensitivity: up to -102.5dBm
- Reliable and wide communication range: 300m (outdoor open, visual distance)
- Multiple antenna options
- Very low power consumption
- Sleep mode: 13uA
- Receive mode: 11.6mA
- Transmission mode: 17.7mA@8dBm
- Frequency deviation range: ±10ppm@25℃
- Abundant storage resources: 1024K bytes Flash; 64K bytes RAM
1.4 Product Advantage
- Compact package design, even for small devices.
- Industry-leading link budget
- Excellent battery life
- Abundant storage resources for customer software applications
- Mesh networking capability
- Easy-to-use low-cost development kit
- ISM license-free frequency band
1.5 Abbreviations
| ADC | Analog-to -Digital Converter |
|---|---|
| GPIO | General Purpose Input/Output |
| HVAC | Heating, Ventilating and Air Conditioning |
| TWI | Inter-Integrated Circuit |
| IEEE | Institute of Electrical and Electronics Engineers |
| ISM | Industrial, Scientific and Medical radio band |
| JTAG | Digital interface for debugging of embedded device, also known as IEEE |
1149.1 standard interface
MAC| Medium Access Control layer
PCB| Printed Circuit Board
RAM| Random Access Memory
RF| Radio Frequency
RTS/CTS| Request to Send/ Clear to Send
RX| Receiver
SMA| Surface Mount Assembly
SPI| Serial Peripheral Interface
TX| Transmitter
UART| Universal Asynchronous Receiver/Transmitter
BLE| Bluetooth Low Energy
SigMesh| Specific Interesting Group Mesh Network Standard
Module Interface
2.1 Packaging Information
Dimensions: 17.3mm (L)×15mm (W)×2.8mm (H) (with shield)
(Dimensional tolerance: length and width ±0.25mm, height ±0.15mm)
2.2. Pin Definition
| Pin NO. | Pin Signal | Direction |
|---|---|---|
| 1 | P26 | Hardware PWM |
| 2 | P31 | Hardware PWM |
| 3 | P32 | Hardware PWM |
| 4 | P33 | Hardware PWM |
| 5 | P34 | Hardware PWM |
| 6 | GND | Ground |
| 7 | VCC | 3.3V |
Technical Specification
3.1. Electrical Specification
| Parameter | Min | Max |
|---|---|---|
| Module Input Voltage（VCC） | 1.8V | 3.6V |
| Pin Voltage (except ADC pin) | -0.3V | VDD_PADS+0.3 |
| ADC Pin Voltage | 0V | 0.8V |
| Chip I/O Drive Current Data | 2mA | 10 mA |
Note: Chip IO pins can output 10mA
3.2. Current Specification
| Parameter | Average | Max | Unit |
|---|---|---|---|
| Receiving Current | 11.6 | 12 | mA |
| Transmitting Current (@8dBm) | 17.7 | 21 | mA |
| Sleeping Current | 13 | – | uA |
3.3. Processors Specification
| Parameter | Value | Unit |
|---|---|---|
| On-chip Flash Storage Space | 1024K | bytes |
| On-chip RAM Storage Space | 64K | |
| 32K(SRAM Retention) + 32K(Without SRAM Retention) | bytes | |
| Working Frequency | 48 | MHz |
3.4. Module Interface Specification
| Parameter | Test Condition | Range | Unit |
|---|---|---|---|
| UART Max Baud Rate | 1M | bps | |
| Resolution of Analog Channels | 12 | Bits | |
| Analog Input Impedance | >1 | MΩ | |
| Analog Reference Voltage (Bypass) | 0.8 | V | |
| Analog Input Voltage (1/4 divider, attenuation mode) | 0-3.2 | V | |
| I2C Bus Maximum Clock Frequency | 400 | KHz | |
| GPIO Output Voltage (Logic 0) | 10mA | ≤0.5 | V |
| GPIO Output Voltage (Logic 1) | 10mA | ≥2.5 | V |
| Real Time Clock Frequency | 32.768 | KHz |
3.5. Physical/Ambient Specification
| Parameter | Value | Note |
|---|---|---|
| Physical Size | 17.3mm ×15mm×2.8mm（with shield） | |
| Weight | <1g | |
| **Working Temperature*** | -40°C to +105°C（Default） | |
| Working Relative Humidity | <95% |
RF Specification
4.1. Basic RF Specification
| Parameter | Range | Unit |
|---|---|---|
| Working Frequency | 2400~2483.5 | MHz |
| Number of Frequency Bands | 16 | |
| Channel Number | 0B~1A | Hex |
| Channel Spacing | 5 | MHz |
| Rated Input/Output Impedance | 50 | Ω |
4.2. Receiving Specification (RX)
| Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|
| Receiving Sensitivity（PER＜8%） | -101.5 | -102.5 | -102.5 | dBm |
Antenna Specification
5.1. PCB Antenna
When using PCB antenna output, pay attention to the following points:
- Avoid placing the module inside the equipment with metal casing.
- Avoid placing metal objects close to the ceramic antenna (at least 1 cm or more, 2.7 cm or more is recommended).
- Avoid placing metal objects close to the external antenna (at least 2cm, 5cm is recommended).
- Do not place the module next to devices that emit electromagnetic radiation, such as transformers.
The design of the user’s circuit board should prevent its components, wiring or ground from interfering with the PCB antenna of the wireless module. The basic principles are:
- Do not route wires, lay the ground or place other components around the PCB antenna
- The PCB antenna should extend out of the PCB board
- Do not use a metal casing around the PCB antenna.
FCC Regulations
Important Notice to OEM integrators
- This module is limited to OEM installation ONLY.
- This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
- The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
- For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part
15 Subpart B while the transmitter module(s) are installed and operating. The
modules should be transmitting and the evaluation should confirm that the
module’s intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional
unintentional emissions other than what is permitted in Part 15 Subpart B or
emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B
requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace,
as described by the instructions, require that the host product manufacturer
must notify to REXENSE that they wish to change the antenna trace design. In
this case, a Class II permissive change application is required to be filed by
the USI, or the host manufacturer can take responsibility through the change
in FCC ID (new application) procedure followed by a Class II permissive change
application.
End Product Labeling
When the module is installed in the host device, the FCC label must be visible
through a window on the final device or it must be visible when an access
panel, door or cover is easily re-moved. If not, a second label must be placed
on the outside of the final device that contains the following text: “Contains
FCC ID: 2AOE2REX3GF26” The FCC ID can be used only when all FCC compliance
requirements are met.
Antenna Installation
- The antenna must be installed such that 20 cm is maintained between the antenna and users,
- The transmitter module may not be co-located with any other transmitter or antenna.
- Only antennas of the same type and with equal or less gains as shown belowmay be used with this module.
Other types of antennas and/or higher gain antennas may require additional authorization for operation.
Antenna type| 2.4GHz band
Peak Gain (dBi)
---|---
PCB| 1
In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on
the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user
regarding how to install or remove this RF module in the user’s manual of the
end product which integrates this module. The end user manual shall include
all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circuit different from that to
which the receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate this equipment. This
transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with 15.247 requirements for
Modular Approval.
The modular transmitter is only FCC authorized for the specific rule parts
(i.e., FCC transmitter rules) listed on the grant, and that the host product
manufacturer is responsible for compliance to any other FCC rules that apply
to the host not covered by the modular transmitter grant of certification. If
the grantee markets their product as being Part 15 Subpart B compliant (when
it also contains unintentional-radiator digital circuity), then the grantee
shall provide a notice stating that the final host product still requires Part
15 Subpart B compliance testing with the modular transmitter installed.
This device is intended only for OEM integrators under the following
conditions:
(For module device use)
- The antenna must be installed such that 20 cm is maintained between the antenna and users, and
- The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be
required.
However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module
installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20 cm between the radiator & your body.
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