HF-LPS170 Low Power SDIO Wi-Fi + BLE Module User Manual

: June 6, 2024
: HF

Table of Contents

Overview of Characteristic
HISTORY
PRODUCT OVERVIEW
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HF-LPS170 Wi-Fi &BLE
User Manual
V 1.3

Overview of Characteristic

Support Wi-Fi IEEE802.11b/g/n and BLE5.0 Wireless Standards
Based on RISC SOC, 160MHz CPU, 276KB RAM, 2MB Flash
Support SDIO Interface, Provide Linux Driver(Kernel Require 3.10 Above)
Single +3.3V Power SupplySelective 1.8V or 3.3V SDIO Voltage
Size: 12mm x 12mm, SMT44
FCC ID:2ACSVHF-LPS170

HISTORY

Ed. V1.0 07-21-2020 First Version.
Ed. V1.1 07-27-2020 Update IO voltage.
Ed. V1.2 11-03-2020 Update Kernel requirement, update GPIO_8 description.
Ed. V1.3 01-04-2021 Update GPIO8 description

PRODUCT OVERVIEW

1.1. General Description
The HF-LPS170 module is a Wi-Fi and BLE combo module for ultra-low-power application Wireless subsystem contains a 2.4G radio, Wi-Fi 802.11bgn, and BLE5.0 baseband/MAC designs. The microcontroller subsystem contains a low- power 32-bit RISC CPU, high-speed cache, and memories. Power Management Unit controls low-power modes. Moreover, a variety of security features are supported.
Peripheral interfaces include SDIO, SPI, UART I2C, IR remote, PWM, ADC, and GPIOs.
Province Linux driver for external MCU integration using SDIO interface.

Figure 1. HF-LPS170 Block Diagram
1.1.1 Wireless

2.4G RF transceiver
Wi-Fi 802.11bgn
BLE 5.0, Channel Selection#2 is supported, 2M PHY / Coded PHY / ADC extension is not supported.
Wi-Fi 20MHz bandwidth
Wi-Fi Security WEP / WPA / WPA2 Personal / WPA2 Enterprise / WPS
STA, soft, and Sniffer modes Multi-cloud connectivity
Wi-Fi and BLE coexistence
Integrated balun, PA/LNA

1.1.2 MCU Subsystem

32-bit RISC CPU with FPU
Level-1 Cache
One RT timer up to one year
Two 32b general-purpose timers
Four DMA channels
DFS from 1MHz to 192MHz
The HF-LPS170 module is a Wi-Fi and BLE combo module for ultra-low-power application
The wireless subsystem contains a 2.4G radio, Wi-Fi 802.11bgn, and BLE5.0 baseband/MAC designs.

1.1.3 Memory

276KB SRAM
128KB ROM
1Kb eFuse
2MB Flash

1.1.4 Security

Secure boot
Secure debug ports
AES 128/192/256 bits
SHA01/224/256
TRNG PKA

1.1.5 Peripheral

One SDIO 2.0 slave
One SPI master/slave
Two UART
One I2CC master/slave
Five PWM
10-bit DAC
12-bit ADC
Two general analog comparators
PIR detection
IR remote HW accelerator
16 GPIOs

1.1.6 Power ModSecurity

Off
Hibernate
Power-Down Sleep
Active

1.1.7 Clock

Support XTAL 40MHz
Internal RC 32KHz oscillator
Internal System PLL
Hibernate
Power-Down
Sleep Active

1.1.8 Device Parameters
Table1.HF-LPS170 Module Technical Specifications

Class	Item	Parameters
Wi-Fi Parameters	Wireless standard	802.11 la/g/n
Frequency range	2.412GHz-2.462GHz
Transmit Power	802.11 b: +16 +/-2dBm (g11Mbps)

802.11g: +14 +/-2dBm (@54Mbps)
802.11n: +13 +/-2dBm (gHT20. MCS7)
Receiver Sensitivity| 802.11b: -87 dBm (gi 1Mbps .CCK)
802.11g: -73 dBm (@54Mbps. OFDM)
802.11n: -71 dBm (gHT20. MCS7)
BLE Parameters| Wireless standard| BLE5.0
Frequency range| 2.402GHz-2.480GHz
Transmit Power| Max 9dBm
Receiver Sensitivity| -90dBm
Hardware Parameters| Antenna Option| antenna Pad
Data Interface| CART
GPIO. SPI. PWM
Operating Voltage(TBD)| 2.6-3.6V
Operating Current(TBD)| Peak (Continuous TX): 350mA Average(STA. No data): 30mA Average(STA. Continuous TX): 85mA Average(AP): 110mA
Standby: 300uA(Reset Pin set to low)
Operating Temp.| -40°C- 85°C
Storage Temp.| -40 C 125 C
| Humidity| <85%
---|---|---
Dimensions and Size| 12mm x 12mm
Software Parameters| Driver| Linux

1.2. Hardware Introduction
HF-LPS170 Wi-Fi module appearance is as follows.

1.2.1. HF-LPS170 Pins Definition

Figure 3. HF-LPS170 Pins Map
Table2. HF-LPS170 Pins Definition

Pin| Description| Net Name| Signal Type|

Comments

---|---|---|---|---
1, 3, 20,

31, 33 ，

36

Comments

---|---|---|---|---
6| | BT_HOST_WAK E_DEV| I/O| 3.3V Voltage GPIO12SPI, I2C, PWM, ADC
7| | BT_DEV_WAKE_HOST| I/O| 3.3V Voltage GPIO11SPI, I2C, PWM, ADC
8| Module Reset| EXT_RESET| I, PU| 3.3V Voltage“Low” effective reset input. There is RC reset circuit internally. No need for an external RC reset circuit.
9| +3.3V Power| VDD| Power|
12| | WL_DIS#| I/O| VDDIO Voltage (1.8V/3.3V) GPIO21SPI, I2C, PWM
13| | WL_DEV_WAKE _HOST| I/O| VDDIO Voltage (1.8V/3.3V) GPIO20 SPI, I2C, PWM
14| | SD_D2| I/O| VDDIO Voltage (1.8V/3.3V) SDIO DATA2, GPIO4
15| | SD_D3| I/O| VDDIO Voltage (1.8V/3.3V) SDIO DATA3, GPIO5
16| | SD_CMD| I/O| VDDIO Voltage (1.8V/3.3V) SDIO CMD, GPIO1
17| | SD_CLK| I/O| VDDIO Voltage (1.8V/3.3V) SDIO CLK, GPIO0
18| | SD_D0| I/O| VDDIO Voltage (1.8V/3.3V) SDIO DATA0, GPIO2
19| | SD_D1| I/O| VDDIO Voltage (1.8V/3.3V) SDIO DATA1, GPIO3
22| IO Power| VIDEO| Power| 3.3V or 1.8V Power Input
24| | 32L_IN| Analog| 32.768K clock in, leave it open if not use
34| | BT_DIS#| I/O| VDDIO Voltage (1.8V/3.3V) GPIO22
SPI, I2C, PWM
41| UART_RTS| UART_RTS| I/O| VDDIO Voltage (1.8V/3.3V) GPIO17
SPI, I2C, PWM
42| UART_TX| UART_TX| I/O| VDDDIO Voltage (1.8V/3.3V) UART
Communication Output GPIO16
43| UART_RX| UART_RX| I/O| 3.3V UART Communication Input GPIO7
44| UART_CTS| UART_CTS| I/O| 3.3V Voltage GPIO14
SPI, I2C, PWM, ADC, DAC

Note:
VDDIO: Some IO uses this IO voltage, if the input is 1.8V, then these IO all use 1.8V voltage.
NC: means no connection. it is unconnected and useless.
UART_TX, UART_RX, and GPIO_8 is also used for firmware download, must connect these three pins out. If VDDIO is 1.8V input, then UART_TX is 1.8V TTL, UART_RX is 3.3V TTL, GPIO8 is 3.3V TTL. If GPIO_8 default low, module boot from internal Flash, VDDIO must input 3.3V, otherwise, the module will fail to boot up. Wi-Fi and BLE driver firmware need to be programmed into the module, see driver for more detail.
If GPIO_8 is set to High(3.3V), module boots from an external, module only support Wi-Fi function and no power save function.
1.2.2. Electrical Characteristics
Table3.
Electrical Characteristics

Parameter

| Condition| Min.| Typ.| Max.|

Unit

---|---|---|---|---|---
Work temperature range| | -40| | 85| °C
VDD| | 2.6| 3.3| 3.6| V
VIDEO| | 2.6/1.62| 3.3/1.8| 3.6/1.98| V
Maximum soldering temperature| IPC/JEDEC J-STD-020| | | 260| °C
ESD (Human Body Model HBM)| TAMB=25°C| | | 2.5| KV
ESD (MM)| TAMB=25°C| | | 0.25| KV

1.2.3. HF-LPS170 Mechanical Size
HF-LPS170 modules physical size （Unit: mm is as follows:

Figure 4. HF-LPS170 Mechanical Dimension

1.2.4. External Antenna
HF-LPS170 module supports external antenna(PAD) option for user dedicated application.
If the user selects an external antenna, HF-LPS170 Wi-Fi modules must be connected to the 2.4G antenna according to IEEE 802.11b/g/n standards. We can provide an external antenna if needed. Contact with our salesman.
The antenna parameters required are as follows:
Table4. External Antenna Parameters

Item	Parameters
Frequency range	2.4~2.5GHz
Impedance	50 Ohm
VSWR	2 (Max)
Return Loss	-10dB (Max)
Antenna Type	Dipole antenna
Maximum Gain	3.0dBi

Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.
MODULE HINT:
1. The module is limited to OEM installation only.
2. The module is limited to installation in the mobile or fixed application.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
FCC Radiation Exposure Statement:
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and it also complies with Part 15 of the FCC RF Rules.
This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and
The transmitter module may not be co-located with any other transmitter or antenna,
For all products markets in the US, OEM has to limit the operation channels in CH1 to CH11 for 2.4Gband by supplying firmware programming tools. OEM shall not supply any tool or info to the end-user regarding Regulatory Domain change.

As long as the 3 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labelling
The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2ACSVHF-LPS170”.
Manual Information to the End-User
The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.

APPENDIX A: CONTACT INFORMATION
Address: Room 1002, Building 1, No.3000, Longdong Avenue, Pudong New
Area, Shanghai, China,201203 Web: www.hi-flying.com
Service Online: 400-189-3108/18616078755
Sales Contact: sales@hi-flying.com
For more information about High-Flying modules, applications, and solutions, please visit our web site http://www.hi-flying.com/en/
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© Copyright High-Flying, May 2011
The information disclosed herein is proprietary to High-Flying and is not to be used by or disclosed to unauthorized persons without the written consent of High-Flying. The recipient of this document shall respect the security status of the information. The master of this document is stored on an electronic database and is “write-protected” and may be altered only by authorized persons at High-Flying. Viewing of the master document electronically on an electronic database ensures access to the current issue. Any other copies must be regarded as uncontrolled copies.

Shanghai High-Flying Electronics Technology Co., Ltd(www.hi- flying.com)