LANTRONIX Open-Q 865 Development Kit User Guide
- June 6, 2024
- LANTRONIX
Table of Contents
Open-QTM 865 Development Kit
**Quick Start Guide
**
Package Contents
- Open-Q 865 Carrier Board compatible with Open-Q 865 family of System-on-Modules (SOM)
- AC Power Adapter (not shown)
- CPU Heatsink (not shown)
- ST Micro Sensor Board (not shown)
SOM SOLD SEPARATELY
1. 12V DC power jack
2. Power source switch (DC/Batt)
3. Battery connector
4. USB 3.0 Type-A Connector
5. Power button
6. Volume +
7. Volume – / Reset button
8. General Purpose Button
9. Audio Headset Jack
10. USB 3.0 Type-C connector
11. USB debug UART Micro B
12. Debug UART Header
13. WLAN/BT Channel 0 Antenna (PCB trace)
14. Audio I/O expansion header
15. MIPI Camera 3 Connector
16. Coin Cell Battery Holder
17. Power Header
18. MIPI Camera 2 Connector| 19. VPH_PWR current sense header
20. MIPI Camera 1 Connector
21. Sensor expansion header
22. System configuration switches
23. SOM current sense header
24. Micro SD socket
25. Open-Q LCD Touch Panel (Sold Separately)
26. WLAN Channel 1 Antenna (PCB trace)
27. Digital I/O connector
28. SIM Card connector
29. Audio Output expansion header
30. M.2 PCIe Socket (B-key) *
31. Audio Input expansion header
32. WLAN Channel 1 U.FL Antenna Connector
33. WLAN/BT Channel 0 U.FL Antenna Connector
34. Qualcomm System-on-Chip (SoC) with PoP DDR memory on top
35. Open-Q System on Module (Sold separately)
---|---
Your use of this document is subject to and governed by those terms and conditions in the LICENSE AND PURCHASE TERMS AND CONDITIONS FOR INTRINSYC DEVELOPMENT PLATFORM KITS, which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing a Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of the Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Lantronix is a trademark of Lantronix, Inc., registered in the United States and other countries. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm® is a trademark of Qualcomm® Incorporated, registered in the United States and other countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.
SOM Installation and Development Kit Setup
CAUTION: The SOM and Dev Kit are susceptible to damage from static discharge.
-
At a static-safe workstation , remove the development kit board and the SOM carefully from their antistatic bags. Do not apply power until after following the steps below to install the SOM, connect the antenna cables, and install the heatsink.
-
SOM Installation: To prevent damage, be gentle while inserting the SOM onto the carrier board. Ensure that the three board-to-board connectors are properly aligned between the SOM and carrier board before applying any force. Then apply vertical force only along both long edges of the SOM above the board-to-board connectors. Force should be applied on the indicated locations (see figure below) until the SOM is fully seated on the carrier board connectors. For further information and removal instructions refer to the Development Kit User Guide document.
-
Antenna Connection: After the SOM is installed onto the carrier board, connect the two WLAN/BT antenna cables (32/33) to the SOM as shown on page 1. Gently align the U.FL cable connectors over top of the corresponding SOM connectors and then apply gentle vertical pressure on top until you feel them click into place.
-
Heatsink Installation: A stick-on heatsink for the Qualcomm SoC is included with the development kit. It is safe to operate the SOM without the heatsink installed but the processor performance may be limited. For better thermal performance, install the heatsink on top of the SoC by removing the adhesive covering and sticking the heatsink on top of the SoC (34).
-
Power Up: Connect the AC Power Adapter to the 12V DC Jack (1), connect a PC with serial console program to the USB debug UART connector (11), and then press and hold the power button (5) until you see the boot indicator LED light (~3 seconds).
-
Further Information: Refer to the SW release notes and Development Kit User Guide for your specific SOM and SW package for more information about supported features, connecting peripherals, and how to log in.
Development Kit Support
Documentation and software
To access the documentation (schematics, user guides, datasheets, programming
guides, tech notes…), platform BSP software and much more, please register at:
http://tech.intrinsyc.com
Technical Support
Should you require more information or assistance, you can contact us at:
https://www.lantronix.com/support
Lantronix also provides technical information and videos on Qualcomm
processors at: https://www.lantronix.com/resources
Should you require additional technical support for your Development Kit you
can easily purchase a technical support package from the Lantronix store:
http://lantronix.com/embedded-compute-support-packages
Thank you for purchasing an Open-Q 865 Development Kit The Lantronix Team
Specifications are subject to change – 895-0047-00 Rev. B