GOWIN DK-BLE-CEIT-ASSEM Development Kit User Guide

June 5, 2024
GOWIN

GOWIN DK-BLE-CEIT-ASSEM Development Kit

Introduction

The DK-BLE-CEIT-ASSEM Development Kit is comprised of BLE module containing the GW1NRF-4 Bluetooth enabled µSoC FPGA along with a carrier board to quickly start developing applications. The GW1NRF-4 is the first device of its kind to offer a Bluetooth Low Energy 5.0 transceiver, a 32-bit ARC processor to hold the Bluetooth LE software stack as well as user applications and a 4.6k LUT of FPGA fabric for IO expansion, interfacing, parallel and accelerated gate array computing. The GW1NRF-LV4MOD/CEIT Bluetooth LE 5.0 module contains the GW1NRF-4 µSoC FPGA, radio antenna, and appropriate passives. The DK_BLE_CARRIER_INIT board provides a breakout of FPGA and microcontroller IO, LEDs for power and GPIO and an FTDI FT232H USB to JTAG device for easy programming. Figure 1 GW1NRF-4 BLE 5.0 Module (GW1NRF-LV4MOD/CEIT)

GOWIN DK-BLE-CEIT-ASSEM Development Kit 1

GW1NRF Carrier Board (DK_BLE_CARRIER_INIT)

GOWIN DK-BLE-CEIT-ASSEM Development Kit 2

Overview

The GW1NRF-4 module provides all passives, antenna as well as other components as a reference example. Bluetooth chips are typically developed on a module to enable an easier certification process. The GW1NRF-LV4MOD/CEIT module adopts GOWIN’s patented CoolStartTM technology, which allows power down of the FPGA IO and core voltages using the MCU PMU.

Note! FPGA pin assignments are labeled as they are defined in GOWIN EDA. MCU pin assignments are labeled as they are defined in GW1NRF SoC SDK, Synopsys Metaware and C/C++ definition files.

GOWIN DK-BLE-CEIT-ASSEM Development Kit 3

Table 1 – GW1NRF-LV4MOD/CEIT Header Pinouts and Description

Header Pin Number Signal Name Description
L1 VBAT Battery Voltage Rail (1.9 – 3.6V); provides MCU and BLE VCC core

voltage via built in Step Down DCDC
L2| EN| Enable. Used to enable BLE and ARC power rails
L3| B19A_2| FPGA GPIO
L4| B19B_2| FPGA GPIO
L5| B20A_2| FPGA GPIO
L6| B20B_2| FPGA GPIO
L7| B26A_2| FPGA GPIO
L8| B26B_2| FPGA GPIO
L9| B32A_2| FPGA GPIO
L10| B32B_2| FPGA GPIO
L11| VCCIO_FPGA| VCCIO for FPGA ( – )
L12| GND| Ground
B1| VCC_GPIO| VCCIO for MCU ( – )
B2| R11B_1| FPGA GPIO
B3| R11A_1| FPGA GPIO
B4| R9A_1| FPGA GPIO
B5| TM| MCU GPIO 5 and/or MCU reset
B6| R3A_1| FPGA GPIO
B7| VCCX| FPGA VCCX Voltage (2.5- 3.3V)
B8| GPIO6| MCU GPIO 6
B9| T34A_0| FPGA GPIO
B10| T30B_0| FPGA GPIO
B11| T30A_0| FPGA GPIO
B12| T24B_0| FPGA GPIO
B13| T24A_0| FPGA GPIO
R1| VCC| FPGA VCC core voltage (LV = 1.2V, UV = 1.8-3.3V)
R2| L11A_3| FPGA GPIO
Header Pin Number| Signal Name| Description
---|---|---
R3| TMS| JTAG for FPGA and MCU
R4| TDI| JTAG for FPGA and MCU
R5| TDO| JTAG for FPGA and MCU
R6| JTAGSEL| JTAG for FPGA and MCU
R7| GPIO7| MCU GPIO 7
R8| T9A_0| FPGA GPIO
R9| T9B_0| FPGA GPIO
R10| T16A_0| FPGA GPIO
R11| T16B_0| FPGA GPIO

The GW1NRF-4 Carrier Board provides LEDs attached to power, MCU and FPGA GPIOs, IO breakout of FPGA and MCU GPIOs, appropriate regulator for 5V to 3.3V conversion and a USB to JTAG circuit to program the device. It also provides programming headers to perform various methods of programming the device either through the USB to JTAG circuit or for wireless OTA (over-the-air) programming of the MCU and FPGA.

Note!
FPGA pin assignments are labeled as they are defined in GOWIN EDA. MCU pin assignments are labeled as they are defined in GW1NRF SoC SDK, Synopsys Metaware and C/C++ definition files.
Figure 4 – GW1NRF-4 BLE 5.0 Carrier Board Pinout

GOWIN DK-BLE-CEIT-ASSEM Development Kit 4

Table 2 – GW1NRF-4 BLE 5.0 Carrier Board Header Pinouts and Description

LEDs|
---|---
LED 1| LED connected to FPGA Pin 8
LED 2| LED connected to +3V3 Power Rail
LED 3| LED connected to MCU GPIO 7
Header SV4 (Left Side Header)|
FPGA Pin 40| FPGA GPIO assigned to QFN pin 40
FPGA Pin 41| FPGA GPIO assigned to QFN pin 41
FPGA Pin 42| FPGA GPIO assigned to QFN pin 42
FPGA Pin 43| FPGA GPIO assigned to QFN pin 43
FPGA Pin 44| FPGA GPIO assigned to QFN pin 44
FPGA Pin 45| FPGA GPIO assigned to QFN pin 45
FPGA Pin 46| FPGA GPIO assigned to QFN pin 46
FPGA Pin 47| FPGA GPIO assigned to QFN pin 47
Header SV3 (Right Side Header)|
+5V| 5.0V power rail from USB input
+3V3| 3.3V power Rail from regulator output
GND| Ground
FPGA Pin 23| FPGA GPIO assigned to QFN pin 23
FPGA Pin 24| FPGA GPIO assigned to QFN pin 24
FPGA Pin 33| FPGA GPIO assigned to QFN pin 33
FPGA Pin 35| FPGA GPIO assigned to QFN pin 35
MCU GPIO 7| MCU GPIO 7
MCU GPIO 5| MCU GPIO 5

Getting Started

The best place to start using the GW1NRF-4 Development Kit is the “GW1NRF_Getting_Started_v1” getting started package. The guide steps through programming the FPGA and MCU, synthesizing and compiling RTL and C/C++ code respectively and showing an example of how to communicate between the 32-bit ARC microprocessor and the FPGA fabric.

Schematic

DK_BLE_GW1NRF-4_INIT_MOD Schematic can be available at Gowin website: www.gowinsemi.com, Support > Starter Kits and Development Boards > GW1NRF-LV4MOD/CEIT.

DK_BLE_CARRIER_INIT Schematic
DK_BLE_CARRIER_INIT Schematic can be available at Gowin website: www.gowinsemi.com, Support > Starter Kits and Development Boards > DK BLE GW1NRF-4 INIT.

Support and Feedback

Gowin Semiconductor provides customers with comprehensive technical support. If you have any questions, comments, or suggestions, please feel free to contact us directly using the information presented below.

Website: www.gowinsemi.com E-mail: [email protected]

Revision History

Date Version Description
04/20/2020 1.0E Preliminary Version

Copyright © 2020 Guangdong Gowin Semiconductor Corporation. All Rights Reserved. No part of this document may be reproduced or transmitted in any form or by any denotes, electronic, mechanical, photocopying, recording or otherwise, without the prior written consent of GOWINSEMI.

Disclaimer
GOWINSEMI®, LittleBee®, Arora, and the GOWINSEMI logos are trademarks of GOWINSEMI and are registered in China, the U.S. Patent and Trademark Office, and other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders, as described at www.gowinsemi.com.cn. GOWINSEMI assumes no liability and provides no warranty (either expressed or implied) and is not responsible for any damage incurred to your hardware, software, data, or property resulting from usage of the materials or intellectual property except as outlined in the GOWINSEMI Terms and Conditions of Sale. All information in this document should be treated as preliminary. GOWINSEMI may make changes to this document at any time without prior notice. Anyone relying on this documentation should contact GOWINSEMI for the current documentation and errata.

References

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