QUECTEL FCU741R Series Wi-Fi Module User Manual

QUECTEL FCU741R Series Wi-Fi Module

Wi-Fi Module Series

• Version: 1.0.0
• Date: 2023-06-19
• Status: Preliminary

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China

• Tel: +86 21 5108 6236
• Email: info@quectel.com
• Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
• For technical support, or to report documentation errors, please visit http://www.quectel.com/support/technical.htm.
• Or email us at: support@quectel.com.

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

License Agreements
Documents and information provided by us shall be kept confidential unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with the abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights about the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any of our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any warranties arising from the course of dealing or usage of trade.

Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party servers, including carriers, chipset suppliers, or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data to perform the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

• We acknowledge no liability for any injury or damage arising from the reliance upon the information.
• We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
• While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
• We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

• Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
• Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
• Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities..
• Terminals or mobiles operating over radio signal and cellular networks cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
• The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
• In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document defines the FCU741R and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

Product Overview

FCU741R is a highly integrated IEEE 802.11a/b/g/n Wi-Fi 4 module. It supports 2.4 GHz, 5 GHz and 1T1R with a maximum data transmission rate up to 150 Mbps. It provides a USB 2.0 interface for Wi-Fi functions. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 1: Basic Information

Key Features

Table 2: Key Features

1. To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s indicators comply with IEEE specification requirements.

RF Performances

Wi-Fi Performances

Table 3: Wi-Fi Performances

Table 4: Wi-Fi Power Consumption

Application Interfaces

Pin Assignment

Pin Description

Table 5: I/O Parameters Definition

DC characteristics include power domain and rate current.

Table 6: Pin Description

Power Supply
The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient up to 0.6 A. For better power supply performance, it is recommended to parallel a 47 μF decoupling capacitor, and 1 μF and 100 nF filter capacitors near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:

Wi-Fi Application Interface

The module provides USB 2.0 interface communicating with the host for Wi-Fi function.

USB Interface
USB 2.0 interface connection between the module and the host is illustrated in the following figure.

To ensure compliance of interface design with the USB 2.0 specification, it is recommended to adopt the following principles:

• The impedance of USB signal trace is 90 Ω ±10 %. Route the USB traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below.
• Keep USB signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals.
• USB signal traces (USB_DP and USB_DM) need to be equal in length, width and distance (the distance between the traces should be less than 1 mm).
• The distance between USB signal line and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF.
• Junction capacitance of the ESD protection components might influence on USB data lines, so you should pay attention to the selection of the device. Typically, the stray capacitance should be less than 2.0 pF for USB 2.0.

For more details about the USB 2.0 specifications, please visit http://www.usb.org/home.

RF Antenna Interface
Appropriate antenna type and design should be used with matched antenna parameters according to specific applications. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module supports an ANT_WIFI antenna (stamp hole) and the coaxial RF connector which is optional. The coaxial RF connector is not mounted on the module when using ANT_WIFI antenna.

Table 7: Antenna Design Requirements

ANT_WIFI Antenna (Optional)

Reference Design
The module provides one antenna pin. It is recommended to reserve a π-type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1 and C2) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF.

RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the material’s dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguides with different PCB structures .

To ensure RF performance and reliability, follow the principles below in RF layout design:

• Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
• The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
• The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
• There should be clearance under the signal pin of the antenna connector or solder joint.
• The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 × W).
• Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.

RF Connector Recommendation
If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose.

U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

Figure 11: Specifications of Mated Plugs

• The following figure describes the space factor of mated connectors.

• For more details, please visit http://www.hirose.com.

Coaxial RF Connector (Optional)

Receptacle Specifications
The mechanical dimensions of the receptacle provided by the module are as follows.

Table 8: Major Specifications of the RF Connector

Antenna Connector Installation
U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.

Figure 14: Dimensions of Mated Plugs (Ø 0.81 mm Coaxial Cables) (Unit: mm)

The following figure describes the space factor of mated connectors.

Assemble Coaxial Cable Plug Manually
The pictures for plugging in a coaxial cable plug is shown below, θ = 90° is acceptable, while θ ≠ 90° is not.

The pictures of pulling out the coaxial cable plug is shown below, θ = 90° is acceptable, while θ ≠ 90° is not.

Assemble Coaxial Cable Plug with Jig
The pictures of installing the coaxial cable plug with a jig is shown below, θ = 90° is acceptable, while θ ≠ 90° is not.

Recommended Manufacturers of RF Connectors and Cable
RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com.

Electrical Characteristics & Reliability

Absolute Maximum Ratings

Power Supply Ratings

ESD Protection
Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

• Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
• Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
• Follow the principles below when the heatsink is necessary:
  • Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  • Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
  • Choose the heatsink with adequate fins to dissipate heat;
  • Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
  • Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE
The package warpage level of the module conforms to JEITA ED-7306 standard.

Recommended Footprint

NOTE
Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

Top and Bottom Views

NOTE
Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing & Packaging

Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
2. Shelf life (in vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
   • The module is not stored in the Recommended Storage Condition;
   • Violation of the third requirement mentioned above;
   • Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
   • Before module repair.
5. If needed, the pre-baking should follow the requirements below:
   • The module should be baked for 8 hours at 120 ±5 °C;
   • The module must be soldered to PCB within 24 hours after the baking, otherwise, it should be put in a dry environment such as in a dry cabinet.

This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

NOTE

1. To avoid blistering, layer separation, and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If a shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of the stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15–0.18 mm. The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Table 11: Recommended Thermal Profile Parameters

NOTE

1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in the document [2].

Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follows:

Carrier Tape
Dimension details are as follow:

Table 12: Carrier Tape Dimension Table (Unit: mm)

Plastic Reel

Table 13: Plastic Reel Dimension Table (Unit: mm)

Mounting Direction

Packaging Process

• Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.
• Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, and vacuumize it.
• Place the vacuum-packed plastic reel into the pizza box.
• Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules.

Appendix References

Table 14: Related Documents

Table 15: Terms and Abbreviations

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable configurations concerning Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part
   15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out-of-band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or that emissions are compliant with the transmitter(s) rule(s). The Grantee will guide the host manufacturer for Part 15 B requirements if needed.

Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (XMR2023FCU741R) procedure followed by a Class II permissive change application.

End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FCU741R” “Contains IC: 10224A-2023FCU741R “ The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna type| 2.4GHz band Peak       Gain

(dBi)

| 5.2GHz band Peak       Gain

(dBi)

| 5.3GHz band Peak       Gain

(dBi)

| 5.5GHz band Peak       Gain

(dBi)

| 5.8GHz band Peak       Gain

(dBi)

---|---|---|---|---|---
PIFA| 0.73| 1.14| 1.00| 0.60| 0.95

If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

FCC STATEMENT

Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules
This module has been tested and found to comply with 15.247 and 15.407 requirements for Modular Approval. The modular transmitter is only FCC- authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co- located or operating in conjunction with any other antenna or transmitter. contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For module device use

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed.

FCC ID: XMR2023FCU741R.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator & your body.

Industry Canada Statement
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.

Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator & your body.

RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz)
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit the transmission of control or signaling information or the use of repetitive codes where required by the technology. The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.

This device is intended only for OEM integrators under the following conditions: (For module device use

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna. As long as the 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. IC :10224A-2023FCU741R，HVIN:FCU741R.

IMPORTANT NOTE
If these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

End Product Labeling
This transmitter module is authorized only for use in devices where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The end product must be labeled in a visible area with the following: “Contains IC:10224A-2023FCU741R”.

Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact us | Quectel
• Connectors Home | I-PEX

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