Lenovo PX Pinnacle of Workstation Technology User Guide

June 15, 2024
Lenovo

Lenovo-logo

Lenovo PX Pinnacle of Workstation Technology User Guide

Product Information

Version: 2.0 | 07/18/2023

Hardware and Software Maintenance Manual:
Available for Download

Hardware and Software: PX Drive &
Software

Available Whitepapers: PX MM

Product Usage Instructions

Power Configuration
To configure the power settings of the Lenovo PX, follow these steps:

  1. Access the Power Configurator.
  2. Select the desired power configuration.
  3. Save the changes.

Memory Configuration
To configure the memory settings of the Lenovo PX, follow these steps:

  1. Access the Memory Configurator.
  2. Select the desired memory configuration.
  3. Save the changes.

Storage Configuration
To configure the storage settings of the Lenovo PX, follow these steps:

  1. Access the Storage Configurator.
  2. Select the desired storage configuration.
  3. Save the changes.

Windows 11 Installation
To install Windows 11 on the Lenovo PX, follow these steps:

  1. Download the Windows 11 installation file.
  2. Run the installer and follow the on-screen instructions.
  3. Complete the installation process.

Windows 10 Installation
To install Windows 10 on the Lenovo PX, follow these steps:

  1. Download the Windows 10 installation file.
  2. Run the installer and follow the on-screen instructions.
  3. Complete the installation process.

Linux Installation
To install Linux on the Lenovo PX, follow these steps:

  1. Download the Linux installation file for the desired distribution.
  2. Create a bootable USB drive with the Linux installer.
  3. Boot from the USB drive and follow the on-screen instructions to install Linux.

Ubuntu 20.04 LTS Installation
To install Ubuntu 20.04 LTS on the Lenovo PX, follow these steps:

  1. Download the Ubuntu 20.04 LTS installation file.
  2. Create a bootable USB drive with the Ubuntu installer.
  3. Boot from the USB drive and follow the on-screen instructions to install Ubuntu.

Specifications

CPU

  • Processor Support: Dual 4th Generation Intel Xeon Scalable
  • Processors E6 Socket (LGA-4777)

Operating System Support

  • Windows 11
  • Windows 10
  • Ubuntu 20.04 LTS

Memory

  • Memory Slots: 16
  • Memory Channel Type: DDR4
  • Max System Memory Size: Up to 288GB DDR4 (DIMM per CPU)

Storage

  • Total Bays/Size: Up to 4 SATA 2.5″ or 3.5″ Bays
  • M.2 Slots: 3 x M.2 2280
  • Supports: SATA, NVMe

Video

  • Integrated Graphics: Not Available
  • Discrete Graphics: Supports Multi-GPU

Front I/O

  • USB: 10 x USB-A Gen 1, 2 x USB-A Gen 2, 2 x USB-C Gen 2 (With Always-On Charging)
  • Audio: Headphone + Mic Jack

Rear I/O

  • USB: 8 x USB-A, 2 x USB-C, 2 x USB-A (4Mbps)
  • Audio: Line Out, Line In, Mic
  • DisplayPort, HDMI, Serial Port, Ethernet

Frequently Asked Questions (FAQ)

Q: What is the maximum memory speed supported?
A: The actual memory speed depends on the CPU.

Q: How many storage bays are available?
A: Up to 4 SATA 2.5″ or 3.5″ bays are available.

Q: Does the Lenovo PX support multi-GPU?
A: Yes, the Lenovo PX supports multi-GPU configurations.

Downloads

Hardware Maintenance Manual| PX HMM
---|---
Drivers & Software| PX Drivers and Software:
Available Whitepapers| Power Configurator Memory Configurator Storage Configurator Windows 11 Installation Windows 10 Installation

Red Hat Enterprise Linux 9 Installation Ubuntu Linux 22.04 LTS Installation

Platform Overview

Description| The pinnacle of Lenovo technology, the ThinkStation PX goes beyond the limits of desktop performance to enable even the most extreme workflows. Featuring a thermally advanced chassis co-designed with Aston Martin, the latest dual 4th Gen Intel® Xeon® Scalable processors, up to 120 cores, and support for up to four NVIDIA RTX™ 6000 Ada Generation GPUs, this workstation powerhouse runs the most complex computing workloads seamlessly.
---|---

CPU

Processor Support Dual 4th Generation Intel Xeon Scalable Processors
Socket Type Socket-E (LGA-4677)
Disclaimers

Operating Systems

Preloaded| Windows 11 Pro 64-bit for Workstation Windows 10 Pro 64-bit for Workstation Windows 10 IOT

Ubuntu 22.04 LTS (configuration specific)

---|---
Supported| Windows 10 Enterprise Edition Red Hat Enterprise Linux 9.x Ubuntu 22.04 LTS
Disclaimers|

Memory

Slots Up to 16 DIMMS (8 DIMMs per CPU)
Channels 8 Memory Channels per CPU
Type DDR5, 288-Pin, ECC RDIMM and 3DS RDIMM*
ECC Support Yes
Speed Up to 4800MHz
Max DIMM Size 64GB DDR5 ECC RDIMM

128GB DDR5 ECC 3DS-RDIMM

Max System Memory| 2TB
Disclaimers| *Actual Memory Speed is dependent on the CPU.

Storage

Total Bays/Size Up to 4
SATA 3 x  SFF-8680  Receptacles 1 x SATA 3.0 Connectors
PCIe (M.2) 3 x M.2 NVMe 2280 PCIe Connectors Onboard 4 x M.2 NVMe 2280 Front

Accessible Drives
Disclaimers| *See Storage Whitepaper for details on the available usage options.

Video

Integrated Graphics Not Available
Discrete Graphics PCIe Add-In-Card, Details in Section Below
Multi-GPU Support Yes
Type PCIe Add-In-Card
Bus Interface PCIe x16
Disclaimers

Slots

Slot 1 PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 2)
Slot 2 PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 2)
Slot 3 PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 2)
Slot 4 PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 2)
Slot 5 PCIe 4.0 x8, Full Height, Full Length, 25W, Open Ended (CPU 2)
Slot 6 PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 1)
Slot 7 PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 1)
Slot 8 PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 1)
Slot 9 PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 1)
Disclaimers

Front I/O

USB| 1 x USB-A 3.2 Gen 2 (10Gbps)

1 x USB-A 3.2 Gen 2 (10Gbps) (with Always On Charging) 2 x USB-C 3.2 Gen 2 (10Gbps)

---|---
Audio| 1 x 3.5mm Global Headset Jack (Headphone + Mic in)
Media Card Reader| N/A
Flex Bay| 3 x Front access drive bay

Rear Flex Storage Enclosure (Shared with 2nd PSU Bay)

Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Rear I/O

USB| 2 x USB-A 2.0 (480Mbps)

4 x USB-A 3.2 Gen 1 (5Gbps)

1 x USB-C 3.2 Gen 2×2 (20Gbps)

---|---
Audio| 2 x Rear (Line Out, Line In retasked as Mic)
DisplayPort| As Supported by GPU
HDMI| As Supported by GPU
Serial Port| Optional 1x Rear Port
Ethernet| 1 x 1GbE – RJ45

1 x 10GbE – RJ45

PS/2| Optional PS/2 (2 port) PCIe adapter
Optional Network Adapter| Bitland RTL8168H 1000M PCIe Ethernet Adapter

Intel I210-T1 Single Port Gigabit PCIe Ethernet Adapter Intel I350-T2 Dual Port Gigabit PCIe Ethernet Adapter Intel I350-T4 Quad Port Gigabit PCIe Ethernet Adapter Intel AX210 WIFI PCIe Adapter with Internal Antennas

Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
---|---

Ethernet

Vendor Aquantia 10 GbE AQC113C-B1-C Intel 1 GbE I219 (Vpro, AMT)
Speeds 10/100/1000/10000Mbps Aquantia AQC113C

10/100/1000Mbps Intel I219

Functions| PXE, WOL, Jumbo Frames ASF, Teaming (Intel only)
Connectors| 2 x RJ45
Disclaimers| Note: Network speeds listed are theoretical.

Audio

Vendor Realtek
Type HD (2.0)
Internal Speaker 1 x 1.5 watt 4 ohm
Connectors 2 x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic)

1 x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset| Realtek ALC897Q Codec (rear) Realtec ALC4032 (front)
Number of Channels| Rear Audio: 2 Channels Front Audio: 2 Channels
Number of Bits/Audio Resolution| Rear Codec:

10 Channel DAC Supports 16/20/24-bit PCM 2 Stereo ADC Supports 16/20/24-bit PCM Front Codec:

One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit

One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Disclaimers| *Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Thermal

Temp Sensors| Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel

PCIe Zone 1 Sensor – Thermistor PCIe Zone 2 Sensor – Thermistor PCIe Zone 3 Sensor – Thermistor PCIe Zone 4 Sensor – Thermistor

M.2 Zone 1 Sensor – Thermistor

M.2 Zone 2 Sensor – Thermistor MISC Sensor – Thermistor

HDD 1 Sensor – I2C Temp Sensor

---|---
| HDD 2 Sensor – I2C Temp Sensor HDD 3 Sensor – I2C Temp Sensor

PSU Bay 2 (HDD) Sensor – I2C Temp Sensor

---|---
Fans| 2 x Front Fans (FRONT_FAN1) – 6-pin blind connect 1 Connector per 2 Fans

1 x Front Fan (FRONT_FAN2) – 4-pin blind connect 1 Connector per 1 Fans

1  x Front Fan (FRONT_FAN3) – 4-pin blind connect 1 Connector per 1 Fans

2    x Rear Fans (REAR_FAN1) – 6-pin blind connect 1 Connector per 2 Fans

1 x CPU 1 Fan (CPU1_FAN) – 4-pin header with 3-pin key 1 x CPU 2 Fan (CPU2_FAN) – 4-pin header with 3-pin key

1  x PSU HDD Fan (PSU_HDD_FAN) – PSU Edge Connector 3 x HDD Fans (HDD_FAN_X) – 4-pin header with 3-pin key 2 x PSU1 Fans – internal of PSU

2   x PSU2 Fans – internal of PSU

1 x CPU1 Memory Fan – CPU1_Pump_DDR – 4-pin header with 3-pin key   1  x CPU2 Memory Fan – CPU2_Pump_DDR – 4-pin header  with 3-pin key

Disclaimers|

Power Specifications

Power Supply 1850 watts
Power Efficiency 92% Efficient @ 50% Load
Main C20
Operating Voltage Range 100 – 240V (autosensing)
Rated Voltage Range 90-264VAC
Rated Line Frequency 47Hz / 63Hz
Operating Line Frequency Range 50Hz / 60Hz
Rated Input Current 13 – 20A
Graphics Up to 8 x 8-pin (6+2) PCIe*
Power Supply Fan Yes
ENERGY STAR® Qualified (config dependent) Yes
80 PLUS Compliant Yes
Built-in Self Test (BIST) LED Yes
Disclaimers *Quantity of Graphics power cables is configuration-dependent

*See Power Configuration Whitepaper for additional details.

BIOS

Vendor AMI
Disclaimers

Chassis Information

Colour Storm Gray
PSU One Fixed 1850W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Optional: 2nd 1850W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
Thermal Solutions| 2 Rear Fans

4 Front Fans

1  Fan per storage bay  1 Fan per CPU

2   Fans per PSU

Memory Fans (configuration dependent)

Dimensions| 434.4mm/17.1″ H (without feet) 440.4mm/17.3″ H (with feet) 575mm/22.6″ D

220mm/8.7″ W

Weight| 38 kg / 83.9 lbs
Disclaimers|

Packaging Dimensions

Height (mm/in) 658mm / 25.91″
Width (mm/in) 397mm / 15.63″
Depth (mm/in) 802mm / 31.57″
Weight (kgs/lbs) 40.135 kg / 88.48 lbs
Disclaimers

Security & Serviceability 

TPM Infineon SPI TPM SLB9672 TPM 2.0
Asset ID Yes, 1024 x 8bit
vPro Yes
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Access Panel Key Lock Yes
Boot Sequence Control Yes
Padlock Support No
Boot Without Keyboard Yes
and/or Mouse
--- ---
Access Panel Tool-less Side Cover Removal
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less*
Color-Coded User TouchPoints Yes
Colour-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Retained with Screws
Restore CD/DVD/USB Set Not Included, Restore Media Available via Lenovo

Download Recovery Service

or available through Lenovo Support.

Disclaimers| *Note: CPU Heatsink assembly requires a T30 bit.

Operating Environment

Air Temperature Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton

Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 10% to 80% (non-condensing) Relative Humidity Storage/Transit: 10% to 90% (non-condensing) Wet Bulb Temperature Operating: 25⁰C (77⁰F) max

Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude| Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level
Vibration| Operating Vibration:

Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z) Non-Operating Vibration:

Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock| Operating: X,Y axis: +- 15G/3ms Z axis: +- 30G/3ms Operating (Rack mounted): X,Y,Z axis: +- 15G/3ms

Non-operating target: Trapezoidal shock, 35g average, 11ms

Disclaimers|

Platform Detail

Board Size 16.26″ x 15.43″ (413mm x 392mm)
Layout Lenovo Custom Extended ATX

Motherboard Core

Processor Support| Intel Sapphire Rapids – Xeon Scalable Processors (Platinum, Gold, Silver)
---|---
Socket Type| Socket E (LGA 4677)
Memory Support| DDR5 up to 4800MHz RDIMM / 3DS RDIMM Memory
CPU-CPU Interconnect| Intel UPI v2.0, 3 links, x24, at speeds 12.8GT/s, 14.4GT/S and 16GT/s
Voltage Regulator| Intel VR14.0 – 400W TDP Capable
Chipset (PCH)| Intel Emmitsburg (Intel C741 Series)
Flash| 2 x 64MB
Super I/O| 2 x MEC1723(176 pin)
Clock| External Clock
Audio| Rear Codec: Realtek ALC897Q (Rear I/O) Front Codec: Realtek ALC4032 (FPIO)
Ethernet| Aquantia 10Gb AQC113C-B1-C Intel 1Gb I219

Supported Components

Processor Level Intel Xeon Platinum Intel Xeon Gold Intel Xeon Silver
Processor Intel XEON Sapphire Rapids Platinum 8490H

Intel XEON Sapphire Rapids Platinum 8468

| Intel XEON Sapphire Rapids Gold 6430 Intel XEON Sapphire Rapids Gold 5420+ Intel XEON Sapphire Rapids Gold 5416S| Intel XEON Sapphire Rapids Silver 4416+ Intel XEON Sapphire Rapids Silver 4410Y Intel XEON Sapphire Rapids Silver 4410T
Memory Type| RDIMMs – 4800MHz, CPU

Dependent

| 3DS-RDIMMs – 4800MHz, CPU

Dependent

Memory| 16GB DDR5 ECC RDIMM PC5-

4800

32GB DDR5 ECC RDIMM PC5-

4800

64GB DDR5 ECC RDIMM PC5-

4800

| 128GB DDR5 ECC 3DS-RDIMM PC5-4800
Disclaimers| Additional CPU SKU’s certified.
| | | |

Storage

3.5″ SATA Hard Disk Drive (HDD)| 2TB SATA – 7200rpm, 6Gb/s, 3.5″

6TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class) 12TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)

---|---
M.2 PCIe Solid State Drive (SSD)| 512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

1024GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

2048GB M.2  PCIe – SSD,  2280, Gen4 (x4), NVMe, TLC, OPAL2.0

4096GB M.2  PCIe – SSD,  2280, Gen4 (x4), NVMe, TLC,  OPAL2.0

Disclaimers| Additional Storage devices certified.

RAID

RAID Requirements M.2 and SATA RAID via Intel VROC Controller
Notes Supported RAID levels for a system will vary from the stated

capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Max supported RAID 0/1/5/10.

Intel VROC| Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10

Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10

Disclaimers| *NOTE: Some features available after launch
| | Keyboard| USB Traditional Keyboard PS/2 Tradition Keyboard Smart Card Keyboard USB Calliope Keyboard
---|---
Pointing Devices| USB Fingerprint Mouse USB Calliope Mouse

PS/2 Black Optical Mouse

Optical Drive/Removable Media Keyboard and Pointing Devices

Expansion Bays

5.25″ External Access Bays| 3 x Front access drive bays

1 x Rear PSU bay storage enclosure (Utilizes 2nd PSU bay)*

---|---
Disclaimers| See Storage Configuration whitepaper for detailed usage

*Only available on single PSU configurations

PCIe Adapters

Network| Bitland RTL8168H 1000M PCIE Ethernet Adapter Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
---|---
WiFi Cards| Intel PCIe WiFi Card With BT Internal Antenna Kit (AX210 6E)
PS/2| PS/2 (2-Port) PCIe adapter
Com port| Serial COM port cable with 5V transceiver

Supported Component Detail

| | # of Cores| 2| 2| 1| 1| 1| 1| 1| 2| 8| 8| 2| 6| 4| 4| 1| 1| 1| 1| 1     1| 8| 1| 1| 1
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
| 8| 4| 8| 8| 6| 6| 2| 2| | | 0| | | | 4| 6| 2| 0| 6 2| | 2| 0|

of Threads| 5| 4| 3| 3| 3| 3| 2| 4| 1| 1| 4| 1| 8| 8| 2| 3| 2| 2| 3 2| 1| 2|

2|
| 6| 8| 6| 6| 2| 2| 4| 4| 6| 6| 0| 2| | | 8| 2| 4| 0| 2 4| 6| 4| 0|

CPU Specifications

CPU I I I I I I I I I I I I I I I I I I I I I
n n n n n n n n n n n n n n n n n n n n n
t t t t t t t t t t t t t t t t t t t t t
el el el el el el el el el el el el el el el el el el e
e e
X X X X X X X X X X X X X X X X X X l l l
e e e e e e e e e e e e e e e e e e X X X
o o o o o o o o o o o o o o o o o o e e e
n n n n n n n n n n n n n n n n n n o o o
P P G G G G G G G G G G G G G G G G n n n
L L O O O O O O O O O O O O O O O O S S S
A A L L L L L L L L L L L L L L L L I I I
T T D D D D D D D D D D D D D D D D L L L
I I 6 6 6 6 6 6 6 6 6 6 5 5 5 5 5 5 V V V
N N 2 1 2 1 1 2 2 1 2 1 2 1 1 2 11 11 E E E
U U 5 5 4 4 3 3 3 3 3 2 2 2 2 1 8 5 R R R
M M 4 4 2 2 6 8 4 4 0 8 2 2 0 8 4 4 4
8 8 T T 2 11 2
2 1 1 6 1
8 6 6 5
0 0
T
Processor Base Frequency 2 2 3 3 2    2 3 1. 3 3 2    3    3   3   2
2     2    2 2 2 2     2
--- --- --- --- --- --- --- --- --- --- --- --- ---
. .1 .1 G .    . G 9 .     . . 1    .     .    .     .    .     .
. .1 .1 .     .

Max Turbo Frequency

| 7

G H

z

4

| G H

z

3

| G H

z

4

| H

z

3

| 8   6

G      G

H      H

z     z

3   3

| H

z

3

| G H

z

3

| 3   2

G      G

H      H

z     z

4   3

| G   4   8   6   2   3    3    4 H   G  G  G  G  G  G  G     z   H   H   H H   H   H   H

z     z     z     z     z     z     z

3   3   3   3   3   3   3   3

| G H

z

3

| G H

z

3

| 5 2

G H

z     z

3

| | | | | | | | | | | | |
| | Cache| 3| 3| 2| 2| 2| 2| 2| 3| 2| 2| 2| 1| | 1| 1| 1| 2| 1| 1| 2| 1     1
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
| 8.| 3| 4| 4| 2| 2| 4| 0| 4| 4| 7.| 9| 6| 6| 9| 2| 6| 3.| 2| 6
| 5| M| .7| .7| M| M| .7| .2| .7| .7| 5| .| 2| .5| .5| .2| M| .5| 7| M| .5
| M| B| 5| 5| B| B| 5| 5| 5| 5| M| 5| M| M| 5| B| M| 5| B| M
| B| L| M| M| | L| M| M| M| M| B| | | B| B| M| | B| M| | B
| | 3| B| B| | 3| B| B| B| B| | B| | L| B| | L| B| | L
| | | | L| | | L| | | L| | L| | 3| L| | 3| L| | 3
| | | | 3| | | 3| | | 3| | 3| | | 3| | | 3| |
TDP| 2| 15| 2| 2| | 15| 15| 15| 12| 13| 13| | 12| 11| 1| 0| 10| 10| 12| 10| 8
| 0| 0| 0| 0| | 0| 0| 0| 5| 0| 0| | 5| 5| | 5| 5| 5| 5| 5| 5
| 5

W

| W| 0

W

| 0

W

| | W| W| W| W| W| W| | W| W| | W| W| W| W| W| W

Intel ARK Spec Link| I

n t el X

e o n P L A T I N U M 8

2

8

0

| I

n t el X

e o n P L A T I N U M 8

1

6

0

T

| I

n t el X

e o n G O L D 6

2

5

4

| I

n t el X

e o n G O L D 6

1

5

4

| I

n t el X

e o n G O L D 6

2

4

2

| I

n t el X

e o n G O L D 6

1

4

2

| I

n t el X

e o n G O L D 6

1

3

6

| I

n t el X

e o n G O L D 6

2

3

8

T

| I

n t el X

e o n G O L D 6

2

3

4

| I

n t el X

e o n G O L D 6

1

3

4

| I

n t el X

e o n G O L D 6

2

3

0

| I

n t el X

e o n G O L D 6

1

2

8

| I

n t el X

e o n G O L D 5

2

2

2

| I

n t el X

e o n G O L D 5

1

2

2

| I

n t el X

e o n G O L D 5

1

2

0

T

| I

n t el X

e o n G O L D 5

2

1

8

| I

n t el X

e o n G O L D 5

11

8

| I

n t el X

e o n G O L D 5

11

5

| I

n t e l X

e o n S I L V E R 4

2

1

6

| I

n t e l X

e o n S I L V E R 4

11

6

| I

n t e l X

e o n S I L V E R 4

2

1

5

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Disclaimers| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | |
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | |

HDD Specifications

Drive| 500GB SATA –

7200rpm, 6Gb/s, 2.5″

| 1TB SATA –

7200rpm, 6Gb/s, 3.5″

| 2TB SATA –

7200rpm, 6Gb/s, 3.5″

| 4TB SATA –

7200rpm, 6Gb/s, 3.5″

| 6TB SATA –

7200rpm, 6Gb/s, 3.5″

---|---|---|---|---|---
3.5″ SATA Hard Disk Drive (HDD)| Not Available| Yes| Yes| Yes| Yes
2.5″ SATA Hard Disk Drive (HDD)| Yes| Not Available| Not Available| Not Available| Not Available
Connector| SATA| SATA| SATA| SATA| SATA
Transfer Rate (Gb/sec)| 160MB/s OD

read

| Average data rate, read/write 156MB/s| Average data rate, read/write 156MB/s| Sustained data transfer rate 216 – 226MB/s| Sustained data transfer rate 216 – 226MB/s
Spindle Speed (RPM)| 7,200| 7,200| 7,200| 7,200| 7,200
DC Power to Drive Ready (sec)| 3.5| <10.0| <17.0| <17.0| <17.0
Average Latency (msec)| 4.2| 4.16| 4.16| 4.16| 4.16
Input (VDC)| 5| 5| 5| 5| 5
Typical (Watts)| 1.9| 6.19| 6.7| 7.35| 8.13
Idle (Watts)| 0.7| 4.6| 4.5| 5.45| 6.21
Physical Dimensions| 69.85mm x 100.34mm x 7mm| 101.6mm x 146.99mm x 19.88mm| 101.6mm x 146.99mm x 26.1mm| 101.85mm x 147mm x 26.1mm| 101.85mm x 147mm x 26.1mm
Weight (grams)| 90| 420| 535| 680| 705
Operating (C) Ambient| 0 to 60| 0 to 60| 0 to 60| 5 to 60| 5 to 60
Operating (C) Base Casting| 60| 60| 60| 60| 60
Non-Operating (C) Ambient| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)
Gradient (C per Hour)| 20| 20| 20| 20| 20
Operating (Gs @ 2ms)| 400| 70| 80| Read 70 Gs

/ Write 40 Gs

| Read 70 Gs

/ Write 40 Gs

---|---|---|---|---|---
Non-Operating (Gs @ 2ms)| 1000| 350| 300| 300| 250
Disclaimers| | | | |

Solid State Storage Specifications

Drive| 256G B 2.5″ SATA SSD| 512G B 2.5″ SATA SSD| 1TB

2.5″ SATA SSD

| 2TB

2.5″ SATA SSD

| 256G B NVM e M.2 SSD TLC| 512G B NVM e M.2 SSD TLC| 1024

GB NVM e M.2 SSD TLC

| 2048

GB NVM e M.2 SSD TLC

| 480

GB AIC

Opta ne™ SSD

| 1.5TB U.2

Opta ne ™ SSD

---|---|---|---|---|---|---|---|---|---|---
Dimensions Millimeters (W x D x H)| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 20 x

168 x

104

| 70 x

100 x

15

Interface Type| SANTA

-III

| SANTA

-III

| SANTA

-III

| SANTA

-III

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

Power Active (AVG)| 1.8W| 1.9W| 2.2W| 6W| 5W| 5W| 5W| 5W| 18W| 18W
Power Idle| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 7W| 7W
Typical Sequential Read| 540

MB/s

| 540

MB/s

| 540

MB/s

| 530

MB/s

| 300

0MB

/s

| 3200

MB/s

| 3200

MB/s

| 3500

MB/s

| 2700

MB/s

| 2700

MB/s

Typical Sequential Write| 500

MB/s

| 500

MB/s

| 500

MB/s

| 500

MB/s

| 1300

MB/s

| 1600

MB/s

| 1600

MB/s

| 300

0MB

/s

| 2200

MB/s

| 2200

MB/s

Operating Temperature Range| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 85°C| 0 to 85°C
Endurance Rating (Lifetime Writes)| 85TB| 150T B| 300T B| 600T B| 85TB| 150T B| 300T B| 600T B| 8.76

PB

| 27.3P B
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| No| No
Disclaimers| SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.

HDD Controllers

PCI Bus PCH Integrated
PCI Modes SATA 3.0
RAID Levels 0/1/5/10
--- ---
Data Transfer Rates 6Gb/s
Internal Connectors 2 x MiniSAS HD (2 ports each) + 3 x SATA
Disclaimers

Optical Drive Specifications

Operating Systems Supported| Windows 10 Pro for Workstations (Preload) Windows 7 Pro 64

Red Hat Enterprise Linux 7.3 Ubuntu 16.04 and 18.04.2

---|---
Temperature| 10° – 35°C (50° – 95°F)
Relative Humidity| 10%-80% (non-condensing)
Maximum Wet Bulb Temperature| 25°C max
Disclaimers|

Integrated Graphics Adapter

Disclaimers|
---|---

Discrete Graphics Adapter

Adapter| Qu ad ro P4 00| Qu ad ro P6 20| Qu ad ro P1 00

0

| Qu ad ro P2 20

0

| T4 00| T6 00| T1 00

0

| Qu ad ro RT X 40

00

| Qu ad ro RT X 50

00

| Qu ad ro RT X 60

00

| Qu ad ro RT X 80

00

| RT X A4 00

0

| RT X A5 00

0

| RT X A6 00

0

| Qu ad ro GV 10

0

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Bus Interface| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 3.

0

x1 6

Display Interface| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 4

x DP 1.4

| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 3 x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

Graphics Chipset| Pa sc al| Pa sc al| Pa sc al| Pa sc al| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| A

m pe re

| A

m pe re

| A

m pe re

| Vo lta
Memory Clock Frequency (MHz)| 1003

MHz

| 1252

MHz

| 1253

MHz

| 1251

MHz

| 1625

MHz

| 1750

MHz

| 1750

MHz

| 1750

MHz

| 2000

MHz

| 858

MHz

---|---|---|---|---|---|---|---|---|---|---
Memory Size| 2G B G D DR 5| 2G B G D DR 5| 4G B G D DR 5| 5G B G D DR 5X| 2G B G D DR 6| 4G B G D DR 6| 4G B G D DR 6| 8G B G D DR 6| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 32

GB HB M2

Memory Interface| 64

bit

| 12

8-

bit

| 12

8-

bit

| 16

0-

bit

| 64

bit

| 12

8-

bit

| 12

8-

bit

| 25

6-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 40

96

bit

Memory Bandwidth| Up to 32 GB

/s

| Up to 80 GB

/s

| Up to 82 GB

/s

| Up to 20

0G

B/ s

| 80

GB

/s

| 16

0G

B/ s

| 16

0G

B/ s

| Up to 41

6G

B/ s

| Up to 44

8G

B/ s

| Up to 67

2G

B/ s

| Up to 67

2G

B/ s

| 44

8

GB

/s

| Up to 76

8G

B/ s

| Up to 76

8G

B/ s

| Up to 87

0G

B/ s

GPU Cores| CU D A

Co res

: 25

6

| CU D A

Co res

: 51

2

| CU D A

Co res

: 64

0

| CU D A

Co res

: 12

80

| CU D A

Co res

: 38

4

| CU D A

Co res

: 64

0

| CU D A

Co res

: 89

6

| CU D A

Co res

: 23

04

Te ns or Co res

: 28

8

RT

Co res

: 36

| CU D A

Co res

: 30

72

Te ns or Co res

: 38

4

RT

Co res

: 48

| CU D A

Co res

: 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| CU D A

Co res

: 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| CU D A

Co res

: 64

11

Te ns or Co res

: 19

2

RT

Co res

: 48

| CU D A

Co res

:

8,1

92

Te ns or Co res

: 25

6

RT

Co res

: 64

| CU D A

Co res

:

10,

75

2

The ns or Co res

: 33

6

RT

Co res

: 84

| CU D A

Co res

: 51

20

The ns or Co res

: 64

0

GPU Core Frequency (MHz)| 1228M

Hz

| 1266M

Hz

| 1266M

Hz

| 1000

MHz

| 1005

MHz

| 1620

MHz

| 1440

MHz

| 1395M

Hz

| 1132M

Hz

Maximum Power Consumption| 30

W

| 40

W

| 47

W

| 75

W

| 30

W

| 40

W

| 50

W

| To tal bo ar d po, we r: 16

0

W

To tal gr ap hic s po we r: 12

5

W

| To tal bo ar d po, we r: 26

5

W

To tal gr ap hic s po we r: 23

0

W

| To tal bo ar d po, we r: 29

5

W

To tal gr ap hic s po we r: 26

0

W

| To tal bo ar d po, we r: 29

5

W

To tal gr ap hic s po we r: 26

0

W

| 14

0

W

| 23

0

W

| 30

0

W

| 25

0

W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)| 3 x

409

6×2

| 4 x

409

6×2

| 4 x

409

6×2

| 4 x

409

6×2

| 4 x

384

0×2

| 4 x

409

6×2

| 4 x

409

6×2

| 4 x

384

0 x

| 4 x

409

6×2

| 4 x

409

6×2

| 4 x

409

6×2

| 4 x

409

6×2

| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | |
| 160

@ 60H

z

1 x

512

0×2

880

@ 60H

z

| 160

@ 60H

z

4 x

512

0×2

880

@ 60H

z

| 160

@ 60H

z

4 x

512

0×2

880

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

4 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 216

0 @

120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

---|---|---|---|---|---|---|---|---|---|---|---|---
Thermal Solution| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ult ra- qu iet Ac tiv e Fa nsi nk| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa nsi nk
Dimension| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr of e

| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr of e

| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr of e

| 4.

4″ H

x 7.9

″ L Single

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 4.

4″ H

x 9.5

″ L Single

Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 9.5

″ L Single

Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

Advanced Display| Not Avai labl e| Not Avai labl e| Not Avai labl e| Not Avai labl e| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| Not Avai labl e
SLI/NVLink Support| Not Avail able| Not Avail able| Not Avail able| Not Avail able| Not Avail able| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

Disclaimers| | | | | | | | | | | | | | |
| | | | | | | | | | | | | | | | | | | | | | | | | | | | |

Intel® Ethernet Specifications

Card| Intel I210-T1

Single Port Gigabit Ethern et Adapt er

| Intel I350- T2

Dual Port Gigabit Ethern et Adapt er

| Intel I350- T4

Quad Port Gigabit Ethern et Adapt er

| Intel X540- T2

Dual Port Coppe r 10Gb Ethern et

| Intel X710- DA2

Dual Port Fiber 10Gb

Ethern et

| Intel Ethern et SFP+ SR

Optics Module

| Intel Dual Band Wirele ss-AC 7260 ASM| Intel Winsto rm Peak 8265

2×2

AC+BT 4.2

Vpro

---|---|---|---|---|---|---|---|---
| (Sprin gville)| (Stony Lake T2)| (Stony Lake T4)| Adapt er| Adapt er| | | M.2

Combo

---|---|---|---|---|---|---|---|---
Supplier PN| I210T1, MM# 941033| I350T2 G1P20, MM# 928941| I350T4 G1P20, MM# 92894

2

| MM#9 28955| MM# 952103| MM#: 941243| 7260H MWDT X.R, MM# 936170| MM#: 94665

8

Data Rates Supported| 10/100

/1000

Mbps copper

| 10/100

/1000

Mbps (Copper), 1000M

bps (Fiber)

| 10/100

/1000

Mbps (Copper), 1000M

bps (Fiber)

| 100/10

00Mbp s and 10Gbp s Copper

| 1GbE/1

0GbE

Optical fiber 10GbE

Direct Attach (DAC)

| Not Available le| Intel Dual Band Wireless ss-AC 7260| Intel Dual Band Wireless ss-AC 8265
Controller Details| Intel® Ethern et Contro ller I210| Intel Ethernet Contro ller I350| Intel Ethernet Contro ller I351| Intel Ethernet Contro ller X540| Intel Ethernet Contro ller X710- AM2| Not Available le| Intel Dual Band Wireless ss-AC 7260,

Dual Band, 2×2,

WiFi+B T

| Intel Dual Band Wireless ss-AC 8265,

2×2,

WiFi+B T, MU- MIMO

Controller Bus Architecture| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 3.0

(8GT/s

)

| Not Available le| PCIe M.2| PCIe M.2
Data Transfer Mode| Ethern et| Ethern et| Ethern et| Ethern et| Ethern et| Not Available le| WiFi (802.11

ac), 2.4GHz

, 5GHz

| WiFi (802.11

ac), 2.4GHz

, 5GHz

Power Consumption| 0.81W| Coppe r:

I350- T2 V2= 4.4W

Fiber: I350- F2= 5.5W

| Coppe r: I350T4 V2= 5W

LC-

Fiber: I350F4

= 6W

| X540- T2:

10Gps= 17.4W

1Gbps= 9.5W

100Mb

ps=6.6 W X540- T1:

10Gbp s=10.8 W

1Gbps= 7.7W

100Mb

ps= 6.4W

| Dual- port 10GBA SE- SR= 4.3W

typ/4.8 W max Dual- port 1000B ASE- SX= 4W

typ/4.3 W max Dual- port 10GBA SE- LR= 4.5W

typ/ 5.1W

max Dual-port Direct Attach (Twina x)= 3.3W

| Not Available le| Not Available le| Not Available le
| | | | | typ/3.7 W max| | |
---|---|---|---|---|---|---|---|---
IEEE Standards Compliance| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3

100/10

00/10

HBASE

-T

| IEEE 802.3

1/1010

HBASE

– SR/LR, SFF- 8431

10GSF P+DAC

| Not Available le| IEEE 802.11a

bgn, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w

| IEEE 802.11a

bgn, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w, 802.11r,

802.11k,

802.11v

(pending)

Boot ROM Support| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| PXE

boot, Intel iSCSI

Remot e Boot for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| Not Available le| Not Available le| Not Available le
Network Transfer Mode (Full/Half Duplex)| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
Network Transfer Rate| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| Not Available le| 300/8

67Mbp s

| 867Mb

ps

Operating System Driver Support| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Windows Server Linux, FreeBSD D

| Windows 2008,

2012; RHEL 6.5/7.0,

FreeBSD D 9/10,

Vmware e ESXi 5. x

| Not Available le| Windows 10, 32-bit*, Windows 10,

64-

bit, Windows 8.1, 32-bit, Windows 8.1,

64-

bit, Windows 8, 32-bit, Windows 8,

64-

bit*,

| Windows 10,

64-

bit*, Windows 8.1,

64-

bit, Windows 7, 32-bit, Windows 7,

64-

bit, Linux

| | | | | | | Windows 7, 32-bit*, Windows 7,

64-

bit, Linux

|
---|---|---|---|---|---|---|---|---
Manageability| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
Manageability Capabilities Alerting| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
TDP| Firmw are Based Therm al Management| Firmw are Based Therm al Management| Firmw are Based Therm al Management| Firmw are Based Therm al Manag management| Not Available le| Not Available le| Not Available le| Not Available le
Operating Temperature Range| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| 0°C to 55°C (32°F

to 131°F)

| Not Available le| 0°C to 80°C (32°F

to 176°F)

| 0°C to 80°C (32°F

to 176°F)

of Ports| 1| 2| 4| 2| 2| Not Available le| Not Available le| Not Available

le
Data Rate Per Port| 10/100

/1000

Mbps (copper)

| 10/100

/1000

Mbps (copper), 1000M

bps (fibre)

| 10/100

/1000

Mbps (copper), 1000M

bps (fibre)

| 100/1,0

00Mbp s, 10Gbp s

| 1Gbps, 10Gbp s| Not Available le| Not Available le| Not Available le
System Interface Type| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe 3.0| Not Available le| PCIe M.2| PCIe M.2
NC Sideband Interface| Not Available le| Not Available le| Not Available le| Not Available le| Yes| Not Available le| Not Available le| Not Available le
Jumbo Frames Supported| Yes| Yes| Yes| Yes| Yes| Not Available le| Not Available le| Not Available le
1000Base-T| Yes| Yes| Yes| Yes| Not Available le| Not Available le| Not Available le| Not Available le
IEEE 1588| Suppor ted| Suppor ted| Suppor ted| Not Available le| Suppor ted| Not Available le| Not Available le| Not Available le
Supported Under vPro| Not Available le| Not Available le| Not Available le| Not Available le| Not Available le| Not Available le| Suppor ted| Suppor ted
Disclaimers| | | | | | | |

Ethernet

Model| i210-T1| Dual Port Copper

= I350- T2V2

Dual Port LC- Fiber= I350-F2

| Dual Port Copper

= I350- T4 V2

Dual Port LC- Fiber= I350-F4

| Dual Port Copper

= X540- T2

| X710- DA2| AC 7260 NGW| AC 8265 NGW
---|---|---|---|---|---|---|---
Connector| RJ-45

Copper

| 2 x Ports RJ-45

Copper or 2 x Ports

LC-Fiber

| 4 x Ports RJ-45

Copper or 4 x Ports

LC-Fiber

| 2 x Ports RJ-45

Copper

| 2 x SFPs Recepta ble| 2 x Antenna s| 2 x Antenna s
Website| i210 T1| i350 T2/F2| i350 T4/F4| x540 T2| x710 DA2| 7260

NGW

| 8265

NGW

Auto-Negotiation| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| Not Available e| Not Available e
Intel® vPro™| Not Available e| Not Available e| Not Available e| Not Available e| Not Available e| Support ed| Support ed
Intel® Standard Manageability| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Power Optimizer Platform Low-power Management Systems| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed
Energy Efficient Ethernet| Support ed| Support ed| Support ed| Not Available e| Support ed| Not Available e| Not Available e
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Receive Side Scaling| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Dual Tx and Rx Queues| Yes| Yes| Yes| Yes| Yes| Not Available e| Not Available e
Jumbo Frames (up to 9KB)| Support ed| Support ed| Support ed| Not Available e| Support ed| Not Available e| Not Available e
Teaming| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Wake from Deep Sx| Support ed| Support ed| Support ed| Not Available e| Not Available e| Not Available e| Not Available e
Server Operating System Support| Windows Server 2008,

2012,

| Windows Server 2008,

2012,

| Windows Server 2008,

2012,

| Windows Server 2003,

2008;

RHEL 4,

| Window s 2008,

2012; RHEL 6.5/7.0,

| Not Available e| Not Available e
| 2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| 2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| 2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Linux/S LES 11,

Vmware

| FreeBSD D 9/10,

Vmware ESXi 5.x

| |
---|---|---|---|---|---|---|---
Network Proxy/ARP Support| Support ed| Support ed| Support ed| Support ed| Support ed| Not Available e| Not Available e
Disclaimers| | | | | | |

Media Card Reader

Description 9-in-1 (USB 2.0)
Disclaimers

BIOS/Certifications/Standards/Environmental

BIOS Specifications

WMI Support| Compliant With Microsoft WBEM and the DMTF Common Information Model
---|---
ROM-Based Setup Utility (F1)| System Configuration Setup Program (text-only interface) Available at Power-on With F1 Key
Bootblock Recovery| Recover system BIOS if the Flash ROM Becomes Corrupted
Replicated Setup| Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control| Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert| Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert| Power-on Error message in the Event of a Fan Failure
Asset Tag| Supports the Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery With Video| Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown| System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
Quick Resume Time| Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level| System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
---|---
Keyboard-less Operation| System Can be Booted Without a Keyboard
Per-port Control| Allows I/O Ports to be Individually Enabled/Disabled Through ROM- based Setup or WMI Interface
Adaptive Cooling| Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security| User and Administrator Passwords Can Protect Boot and ROM-based Setup

–  Support Electronic Lock

–  Chassis Intrusion Detection

–  UEFI Secure Boot Support

–  HDD Password Can Protect HDD Data

–  Windows UEFI Firmware Update Support

–  Device Guard Support

–  Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)| Allows System to be Supported from a Remote Location
Intel(R) TXT| Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software-Based Attacks
Memory Modes| Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready| Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and Power management Interface) Advanced

Configuration and Power Interface v6.1
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI| NA (No PCI slot)
PCI Express| PCI Express Base Specification v3.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal Serial Bus v3.0
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control| Lenovo is a member of an eco-declaration system that enforces regular independent quality control
---|---
Hazardous Substances and Preparation| • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydro bromo fluoro carbons (HBFC), hydro chloro fluor carbons (HCFC), Halons, carbon tetra chloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short-chain chloro paraffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week

REACH Article 33 information about substances in articles is available at:

http:/ www.lenovo.com/social_responsibility/us/en/ThinkGreen_produc ts.html#environment

Batteries| Not Available
Safety, EMC Connection to the Telephone Network and Labeling| Not Applicable, no Connection to a Telephone Network

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager| Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
---|---

Regulations & Standards

EMC & Safety| FCC DoC for North America VCCI Certification for Japan BSMI Certification for Taiwan EU/EFTA CE Mark & DoC

UL/CUL(P920,P720,P520,P520c), cTUVus(P330) UL-GS(P920,P720,P520,P520c), TUV- GS(P330)

IEC60950-1 CB Report/Certificate Saudi Arabia SASO

Kuwait KUCAS China CCC Mark

Hong Kong SAR (CB report) Singapore PSB

South Africa SABS Russia-EAC

---|---
| Morocco-CM Mexico-NOM Kazakhstan-EAC Belarus-EAC Serbia KVALITET Ukraine UKrCEPRO India-BIS

USA Chemical Emission Test

---|---

Environmental

Energy Star ENERGY STAR® v7.0
REPEAT EPEAT® Silver Certification Available on Select Models
Greenguard Greenguard
RoHS RoHS Compliant
ErP Lot-3 2013 Yes
Hazardous Substances • Products do not contain more than; 0.1% lead, 0.01%

cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydro bromo fluoro carbons (HBFC), hydro chloro fluor carbons (HCFC), Halons, carbon tetra chloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short-chain chlor paraffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification| 9.0
Disclaimers| EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

References

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>

Lenovo User Manuals

Related Manuals