Lenovo P7 Workstation and PX AEC Magazine User Guide

June 15, 2024
Lenovo

Lenovo P7 Workstation and PX AEC Magazine

Product Description

  • The Lenovo ThinkStation P7 is a powerful workstation designed to deliver high performance.
  • With advanced architecture, breakthrough design, and top-notch components, the P7 is built to provide optimal performance from a single-socket platform.

Product Usage Instructions

Installation

Windows 11 Installation

  • Follow the on-screen instructions to install Windows 11 on your Lenovo P7 workstation.

Windows 10 Installation

  • Follow the on-screen instructions to install Windows 10 on your Lenovo P7 workstation.

Ubuntu Linux 22.04 LTS Installation

  • Follow the on-screen instructions to install Ubuntu Linux 22.04 LTS on your Lenovo P7 workstation.

Memory Configuration

To configure the memory on your Lenovo P7 workstation, follow these steps:

  1. Locate the memory slots on the motherboard.
  2. Insert the DDR4 DIMMs into the slots, ensuring they are properly seated.
  3. Refer to the user manual for specific memory configurations and supported speeds.

Storage Configuration

To configure the storage on your Lenovo P7 workstation, follow these steps:

  1. Identify the available storage bays on your workstation.
  2. Connect SATA drives to the SATA connectors or install M.2 PCIe/NVMe drives in the corresponding slots.
  3. Refer to the user manual for detailed instructions on storage configuration options.

FAQ

  • Q: What operating systems are supported by the Lenovo P7?
  • A: The Lenovo P7 supports Windows 11, Windows 10, and Ubuntu Linux 22.04 LTS (configuration specific).
  • Q: How many memory slots does the Lenovo P7 have?
  • A: The Lenovo P7 has 8 DDR4 DIMM slots.
  • Q: What is the maximum system memory size supported by the Lenovo P7?
  • A: The Lenovo P7 supports up to 1TB of system memory.
  • Q: Can I install multiple GPUs in the Lenovo P7?
  • A: Yes, the Lenovo P7 supports multi-GPU configurations with up to 7 discrete graphics cards.

Downloads

Hardware Maintenance Manual P7 HMM
Drivers & Software P7 Drivers and Software
Available Whitepapers Power Configurator Memory Configurator Storage

Configurator Windows 11 Installation Windows 10 Installation

Red Hat Enterprise Linux 9 Installation Ubuntu Linux 22.04 LTS Installation

Platform Overview

Description| The bold Lenovo ThinkStation P7 is a force to be reckoned with and brings together a breakthrough new compute architecture with an advanced thermal design in a rack-optimized, Aston Martin-inspired chassis. Featuring the latest Intel® Xeon® W processors, up to 56 cores, robust PCIe Gen 5 connectivity, and highspeed DDR5 memory, the P7 delivers staggering performance output from a single-socket platform.
---|---

CPU

Processor Support 4th Generation Intel Xeon Scalable Processors
Socket Type Socket-E (LGA-4677)

Operating Systems

Preloaded| Windows 11 Pro 64-bit for Workstation Windows 10 Pro 64-bit for Workstation Windows 10 IOT

Ubuntu 22.04 LTS (configuration specific)

---|---
Supported| Windows 10 Enterprise Edition Red Hat Enterprise Linux 9. x Ubuntu 22.04 LTS

Memory

Slots Up to 8 DIMMS
Channels 8 Memory Channels
Type DDR5, 288-Pin, ECC RDIMM and 3DS RDIMMS*
ECC Support Yes
Speed Up to 4800MHz
Max DIMM Size 64GB DDR5 ECC RDIMM

128GB DDR5 ECC 3DS-RDIMM

Max System Memory| 1TB
Disclaimers| *Actual Memory Speed is dependent on the CPU

Storage

Total Bays/Size 3 (2 std, 1 optional)
SATA 3 x SATA 3.0 Connectors
PCIe (M.2) 2 x M.2 NVMe 2280/22110 PCIe Connectors Onboard (Gen5) 1x optional

M.2 NVMe 2280/22110 Onboard (Gen4)
Disclaimers| *See Storage Whitepaper for details on the available usage options.

Video

Integrated Graphics Not Available
Discrete Graphics PCIe Add-In-Card, Details in Section Below
Multi-GPU Support Yes
Type PCIe Add-In-Card
Bus Interface PCIe x16

Slots

Slot 1 PCIe 5.0 x16, Full Height, Full Length, 75W
Slot 2 PCIe 4.0 x8, Full Height, Full Length, 25W, Open Ended
Slot 3 PCIe 5.0 x16, Full Height, Full Length, 75W
Slot 4 PCIe 4.0 x4, Full Height, Full Length, 25W, Open Ended
Slot 5 PCIe 5.0 x16, Full Height, Full Length, 75W
Slot 6 PCIe 4.0 x16, Full Height, Full Length, 75W
Slot 7 PCIe 5.0 x4, Full Height, Full Length, 25W, Open Ended
Disclaimers Note: Slot 7 will not support a full-length card when the

vertical M.2 option is installed

Front I/O

USB| 2 x USB-A 3.2 Gen 2 (10Gbps)

2 x USB-C 3.2 Gen 2 (10Gbps)

---|---
Audio| 1 x 3.5mm Global Headset Jack (Headphone + Mic-in)
Media Card Reader| USB 3.0 15-in-1 Media card reader supporting SD UHS-II (Optional)
Flex Bay| Front access drive bay
Disclaimers| Note: Actual USB throughput will vary depending on the type and quantity of USB devices used.

Rear I/O

USB| 3x USB-A 3.2 Gen 1 (5Gbps)

2 x USB-A 2.0 (480Mbps)

1x USB-C 3.2 Gen 2×2 (20Gbps)

---|---
Audio| 2 x Rear (Line Out, Line In retasked as Mic)
DisplayPort| As Supported by GPU
HDMI| As Supported by GPU
Serial Port| Optional 1x Rear Port
Ethernet| 1 x 1GbE – RJ45

1 x 10GbE – RJ45

PS/2| Optional PS/2 AIC PCIe adapter (2 port)
Optional Network Adapter| Bitland RTL8168H 1000M PCIE Ethernet Adapter Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter Intel AX210 WIFI PCIe adapter with Internal Antennas
Disclaimers| Note: Actual USB throughput will vary depending on the type and quantity of USB devices used.

Ethernet

Vendor Aquantia 10 GbE AQC113C-B1-C Intel 1 GbE I219 (Vpro, AMT)
Speeds 10/100/1000/10000Mbps Aquantia AQC113C

10/100/1000Mbps Intel I219

Functions| PXE, WOL, Jumbo Frames ASF, Teaming (Intel only)
Connectors| 2 x RJ45
Disclaimers| Note: Network speeds listed are theoretical.

Audio

Vendor Realtek
Type HD (2.0)
Internal Speaker 1 x 1.5 watt 4 ohm
Connectors 2 x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic)

1 x Front 3.5mm Global Headset Jack (Headphone + Mic-in)

Chipset| Realtek ALC897Q Codec (rear) Realtec ALC4032 (front)
Number of Channels| Rear Audio: 2 Channels Front Audio: 2 Channels
Number of Bits/Audio Resolution| Rear Codec:

10 Channel DAC Supports 16/20/24-bit PCM 2 Stereo ADC Supports 16/20/24-bit PCM Front Codec:

One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit

One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Disclaimers| *Note: Audio Codec ALC897Q can support 7.1 channels, but the motherboard only has 2 rear jacks – MIC in and Line out, and only 2 channels for Line out.

Thermal

Temp Sensors| Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel

PCIe Zone 1 Sensor – Thermistor PCIe Zone 2 Sensor – Thermistor PCIe Zone 3 Sensor – Thermistor PCIe Zone 4 Sensor – Thermistor DIMM Right Sensor – Thermistor DIMM Left Sensor – Thermistor Storage (M.2) Sensor – Thermistor

---|---
Fans| 2x Front PCIe Fans (PCIe1_4_FAN & PCIe5_7_Fan) – 4-pin cable connector

1x Front BCB Optional Fan (FAN_INT_STORG) – 4-pin cable connector 2x Memory Fans (MEM_FAN_B & MEM_FAN_T) – 4-pin cable connector 1x Rear Fan (REAR_FAN1) – 4-pin cable connector

1x CPU Fan (FAN_CPU) – 4-pin cable connector

 | 1x CPU Optional Fan (FAN_FRNT) – 8-pin cable connector

1x Front Flex Bay Optional Fan (FLEX_BAY_FAN) – 4-pin cable connector

PSU Fans – provided by PSU vendor

---|---

Power Specifications

Power Supply 1000W / 1400W
Power Efficiency 92% Efficient @ 50% Load
Main C14 socket to std C13 line cord
Operating Voltage Range 100 – 240V (autosensing)
Rated Voltage Range 90-264VAC
Rated Line Frequency 47Hz / 63Hz
Operating Line Frequency Range 50Hz / 60Hz
Rated Input Current 1000W: 6A-12A

1400W: 9A-15A

Graphics| Up to 6 x 8-pin (6+2) PCIe*
Power Supply Fan| Yes
ENERGY STAR® Qualified (config dependent)| Yes
80 PLUS Compliant| Yes
Built-in Self Test (BIST) LED| Yes
Disclaimers| Note: Power Output of 1400W PSU Limited to 1125W for 100-111.9 Input Voltage.

*Quantity of Graphics power cables is configuration-dependent

*See Power Configuration Whitepaper for additional details.

BIOS

Vendor AMI

Chassis Information

Color Storm Gray
PSU One Fixed 1400W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified or

One Fixed 1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions| 3 Front PCIe Fans 1 Rear Fan

2 CPU Fans (1 optional, 200-250W CPU SKUs)

1 Front Access Storage Fan (optional, configuration dependent) 2 DIMM Memory Fans

1  CPU Heatsink Fan

2   Autonomous PSU Fans

Dimensions| 434mm / 17.1″ H (without feet) 440mm / 17.3″ (with feet) 508mm / 20″ D

175mm / 6.9″ W

---|---
Weight| 23kg / 49.6lbs (max config)

Packaging Dimensions

Height (mm/in) 618mm / 24.23″
Width (mm/in) 324mm / 12.8″
Depth (mm) 695mm / 27.4″
Weight (kgs/lbs) 26.2kg / 57.8lbs (max config)

Security & Serviceability

TPM Infineon SPI TPM SLB9672 TPM 2.0
Asset ID Yes, 1024 x 8bit
vPro Yes
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Access Panel Key Lock Yes – common or unique
Boot Sequence Control Yes
Padlock Support No
Boot Without Keyboard and/or Mouse Yes
Access Panel Tool-less Side Cover Removal
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less*
Color-Coded User TouchPoints Yes
Colour-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Retained with Screws
Restore CD/DVD/USB Set Not Included, Restore Media Available via Lenovo

Download Recovery Service
 | or available through Lenovo Support.
---|---
Disclaimers| *Note: CPU Heatsink assembly requires a T30 bit.

Operating Environment

Air Temperature Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton

Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 10% to 80% (non-condensing) Relative Humidity Storage/Transit: 10% to 90% (non-condensing) Wet Bulb Temperature Operating: 25⁰C (77⁰F) max

Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude| Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level
Vibration| Operating Vibration:

Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X, Y,Z) Non-Operating Vibration:

Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock| Operating: X, Y axis: +- 15G/3ms Z axis: +- 30G/3ms Operating (Rack mounted): X, Y, Z axis: +- 15G/3ms

Non-operating target: Trapezoidal shock, 35g average, 11ms

Platform Detail

Board Size 15″ x 11.57″ (381mm x 294mm)
Layout Lenovo Custom Extended ATX

Motherboard Core

Processor Support Intel(R) Xeon(R) W-3400 series processors
Socket Type Socket E (LGA 4677)
Memory Support DDR5 up to 4800MHz RDIMM / 3DS RDIMM Memory
Voltage Regulator Intel VR14.0 – 400W TDP Capable
Chipset (PCH) Intel Alder Lake S PCH W790
Flash 2 x 64MB
Super I/O 1 x MEC1723(176 pin)
Clock External Clock
Audio Rear Codec: Realtek ALC897Q (Rear I/O) Front Codec: Realtek ALC4032

(FPIO)
Ethernet| Aquantia 10Gb AQC113C-B1-C
 | Intel 1Gb I219
---|---

Supported Components

Processor Level Intel Xeon Sapphire Rapids
Processor Intel Xeon W9-3495X Intel Xeon W9-3475X Intel Xeon W7-3465X Intel

Xeon W7-3455 Intel Xeon W7-3445 Intel Xeon W5-3435X Intel Xeon W5-3433 Intel Xeon W5-3425 Intel Xeon W5-3423
Memory Type| RDIMMs – 4800MHz, CPU Dependent
Memory| 16GB DDR5 ECC RDIMM PC5-4800

32GB DDR5 ECC RDIMM PC5-4800

64GB DDR5 ECC RDIMM PC5-4800

128GB DDR5 ECC 3DS-RDIMM PC5-4800

Disclaimers| Additional CPU SKUs certified.

Storage

3.5″ SATA Hard Disk Drive (HDD)| 2TB SATA – 7200rpm, 6Gb/s, 3.5″

6TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class) 12TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)

---|---
M.2 PCIe Solid State Drive (SSD)| 512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

1024GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

2048GB M.2  PCIe – SSD,  2280, Gen4 (x4), NVMe, TLC, OPAL2.0

4096GB M.2  PCIe – SSD,  2280, Gen4 (x4), NVMe, TLC,  OPAL2.0

Disclaimers| Additional storage devices certified

RAID

RAID Requirements M.2 and SATA RAID via Intel VROC Controller
Notes Supported RAID levels for a system will vary from the stated

capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Max supported RAID 0/1/5/10.

Intel VROC| Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10

Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10

Disclaimers| *NOTE: Some features available after launch

Keyboard and Pointing Devices

Keyboard| USB Traditional Keyboard PS/2 Traditional Keyboard Smart Card Keyboard USB Calliope Keyboard
---|---
Pointing Devices| USB Calliope Mouse

PS/2 Black Optical Mouse USB Fingerprint Mouse

Expansion Bays

5.25″ External Access Bays Front access drive bay
Internal Access Bays Optional internal 3.5″ drive bay

PCIe Adapters

Network| Bitland RTL8168H 1000M PCIE Ethernet Adapter Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
---|---
WiFi Cards| Intel PCIe WiFi Card With BT Internal Antenna Kit (AX210 6E)
Parallel Card| PS/2 (2 Port) PCIe adapter
Com port| Serial COM port cable with 5V transceiver
PCIe to M.2 Adapter Card| ThinkStation Quad AIC Gen 3 M.2 adapter

CPU Specifications

CPU| I

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| I

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| I

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---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
 | U M 8

2

8

0

| U M 8

1

6

0

T

| 5

4

| 5

4

| 4

2

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2

| 3

6

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| 3

4

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| 2

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| 2

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| 1

8

| 11

8

| 11

5

| R 4

2

1

6

| R 4

11

6

| R 4

2

1

5

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---

of Cores| 2

8

| 2

4

| 1

8

| 1

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| 1

6

| 1

6

| 1

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| 8| 8| 2

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| 4

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|
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Cache| 3

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M B

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M B L 3

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M B

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TDP| 2

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5

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| 15

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Intel ARK Spec Link| I

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| I

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Disclaimers|  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | |  |  |  |  |  |  |  |  |

HDD Specifications

Drive| 500GB SATA –

7200rpm, 6Gb/s, 2.5″

| 1TB SATA –

7200rpm, 6Gb/s, 3.5″

| 2TB SATA –

7200rpm, 6Gb/s, 3.5″

| 4TB SATA –

7200rpm, 6Gb/s, 3.5″

| 6TB SATA –

7200rpm, 6Gb/s, 3.5″

---|---|---|---|---|---
3.5″ SATA Hard Disk Drive (HDD)| Not Available| Yes| Yes| Yes| Yes
2.5″ SATA Hard Disk Drive (HDD)| Yes| Not Available| Not Available| Not Available| Not Available
Connector| SATA| SATA| SATA| SATA| SATA
Transfer Rate (Gb/sec)| 160MB/s OD

read

| Average data rate, read/write 156MB/s| Average data rate, read/write 156MB/s| Sustained data transfer rate 216 – 226MB/s| Sustained data transfer rate 216 – 226MB/s
Spindle Speed (RPM)| 7,200| 7,200| 7,200| 7,200| 7,200
DC Power to Drive Ready (sec)| 3.5| <10.0| <17.0| <17.0| <17.0
Average Latency (msec)| 4.2| 4.16| 4.16| 4.16| 4.16
Input (VDC)| 5| 5| 5| 5| 5
Typical (Watts)| 1.9| 6.19| 6.7| 7.35| 8.13
Idle (Watts)| 0.7| 4.6| 4.5| 5.45| 6.21
Physical Dimensions| 69.85mm x 100.34mm x 7mm| 101.6mm x 146.99mm x 19.88mm| 101.6mm x 146.99mm x 26.1mm| 101.85mm x 147mm x 26.1mm| 101.85mm x 147mm x 26.1mm
Weight (grams)| 90| 420| 535| 680| 705
Operating (C) Ambient| 0 to 60| 0 to 60| 0 to 60| 5 to 60| 5 to 60
Operating (C) Base Casting| 60| 60| 60| 60| 60
Non-Operating (C) Ambient| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)
Gradient (C per Hour)| 20| 20| 20| 20| 20
Operating (Gs @ 2ms)| 400| 70| 80| Read 70 Gs

/ Write 40 Gs

| Read 70 Gs

/ Write 40 Gs

Non-Operating (Gs @ 2ms)| 1000| 350| 300| 300| 250
Disclaimers|  |  |  |  |

Solid State Storage Specifications

Drive| 256G B 2.5″ SATA SSD| 512G B 2.5″ SATA SSD| 1TB

2.5″ SATA SSD

| 2TB

2.5″ SATA SSD

| 256G B NVM e M.2 SSD TLC| 512G B NVM e M.2 SSD TLC| 1024

GB NVM e M.2 SSD TLC

| 2048

GB NVM e M.2 SSD TLC

| 480

GB AIC

Opta ne™ SSD

| 1.5TB U.2

Opta ne ™ SSD

---|---|---|---|---|---|---|---|---|---|---
Dimensions Millimeters (W x D x H)| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 70 x

100 x

7.0

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 22 x

80 x

2.3

| 20 x

168 x

104

| 70 x

100 x

15

Interface Type| SATA

-III

| SATA

-III

| SATA

-III

| SATA

-III

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

| PCIe

Gen 3.0

x4 NVM

e

---|---|---|---|---|---|---|---|---|---|---
Power Active (AVG)| 1.8W| 1.9W| 2.2W| 6W| 5W| 5W| 5W| 5W| 18W| 18W
Power Idle| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 50m W| 7W| 7W
Typical Sequential Read| 540

MB/s

| 540

MB/s

| 540

MB/s

| 530

MB/s

| 300

0MB

/s

| 3200

MB/s

| 3200

MB/s

| 3500

MB/s

| 2700

MB/s

| 2700

MB/s

Typical Sequential Write| 500

MB/s

| 500

MB/s

| 500

MB/s

| 500

MB/s

| 1300

MB/s

| 1600

MB/s

| 1600

MB/s

| 300

0MB

/s

| 2200

MB/s

| 2200

MB/s

Operating Temperature Range| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 85°C| 0 to 85°C
Endurance Rating (Lifetime Writes)| 85TB| 150T B| 300T B| 600T B| 85TB| 150T B| 300T B| 600T B| 8.76

PB

| 27.3P B
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| AES 256

bit

| No| No
Disclaimers| SSD performance was measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.

HDD Controllers

PCI Bus PCH Integrated
PCI Modes SATA 3.0
RAID Levels 0/1/5/10
Data Transfer Rates 6Gb/s
Internal Connectors 2 x MiniSAS HD (2 ports each) + 3 x SATA
Disclaimers

Optical Drive Specifications

Operating Systems Supported| Windows 10 Pro for Workstations (Preload) Windows 7 Pro 64

Red Hat Enterprise Linux 7.3 Ubuntu 16.04 and 18.04.2

---|---
Temperature| 10° – 35°C (50° – 95°F)
Relative Humidity| 10%-80% (non-condensing)
Maximum Wet Bulb Temperature| 25°C max
Disclaimers|
---|---

Integrated Graphics Adapter

Disclaimers|
---|---

Discrete Graphics Adapter

Adapter| Qu ad ro P4 00| Qu ad ro P6 20| Qu ad ro P1 00

0

| Qu ad ro P2 20

0

| T4 00| T6 00| T1 00

0

| Qu ad ro RT X 40

00

| Qu ad ro RT X 50

00

| Qu ad ro RT X 60

00

| Qu ad ro RT X 80

00

| RT X A4 00

0

| RT X A5 00

0

| RT X A6 00

0

| Qu ad ro GV 10

0

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Bus Interface| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 3.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 4.

0

x1 6

| PC

Ie 3.

0

x1 6

Display Interface| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 4

x DP 1.4

| 3 x m DP 1.4| 4

x m DP 1.4

| 4

x m DP 1.4

| 3 x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

1 x Vir tu alL ink

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

a

| 4

x DP 1.4

Graphics Chipset| Pa sc al| Pa sc al| Pa sc al| Pa sc al| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| Tu rin g| A

m pe re

| A

m pe re

| A

m pe re

| Vo lta
Memory Clock Frequency (MHz)| 1003

MHz

| 1252

MHz

| 1253

MHz

| 1251

MHz

| 1625

MHz

| 1750

MHz

| 1750

MHz

| 1750

MHz

| 2000

MHz

| 858

MHz

Memory Size| 2G B G D DR 5| 2G B G D DR 5| 4G B G D DR 5| 5G B G D DR 5X| 2G B G D DR 6| 4G B G D DR 6| 4G B G D DR 6| 8G B G D DR 6| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 16

GB G D DR 6

| 24

GB G D DR 6

| 48

GB G D DR 6

| 32

GB HB M2

Memory Interface| 64

bit

| 12

8-

bit

| 12

8-

bit

| 16

0-

bit

| 64

bit

| 12

8-

bit

| 12

8-

bit

| 25

6-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 25

6-

bit

| 38

4-

bit

| 38

4-

bit

| 40

96

bit

Memory Bandwidth| Up to 32 GB

/s

| Up to 80 GB

/s

| Up to 82 GB

/s

| Up to 20

0G

B/ s

| 80

GB

/s

| 16

0G

B/ s

| 16

0G

B/ s

| Up to 41

6G

B/ s

| Up to 44

8G

B/ s

| Up to 67

2G

B/ s

| Up to 67

2G

B/ s

| 44

8

GB

/s

| Up to 76

8G

B/ s

| Up to 76

8G

B/ s

| Up to 87

0G

B/ s

GPU Cores| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

| CU D A

Co res

 | : 25

6

| : 51

2

| : 64

0

| : 12

80

| : 38

4

| : 64

0

| : 89

6

| : 23

04

Te ns or Co res

: 28

8

RT

Co res

: 36

| : 30

72

Te ns or Co res

: 38

4

RT

Co res

: 48

| : 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| : 46

08

Te ns or Co res

: 57

6

RT

Co res

: 72

| : 64

11

Te ns or Co res

: 19

2

RT

Co res

: 48

| :

8,1

92

The ns or Co res

: 25

6

RT

Co res

: 64

| :

10,

75

2

The ns or Co res

: 33

6

RT

Co res

: 84

| : 51

20

Te ns or Co res

: 64

0

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
GPU Core Frequency (MHz)| 1228M

Hz

| 1266M

Hz

| 1266M

Hz

| 1000

MHz

| 1005

MHz

| 1620

MHz

| 1440

MHz

| 1395M

Hz

| 1132M

Hz

Maximum Power Consumption| 30

W

| 40

W

| 47

W

| 75

W

| 30

W

| 40

W

| 50

W

| To tal bo ar d po, we r: 16

0

W

To tal gr ap hic s po we r: 12

5

W

| To tal bo ar d po, we r: 26

5

W

To tal gr ap hic s po we r: 23

0

W

| To tal bo ar d po, we r: 29

5

W

To tal gr ap hic s po we r: 26

0

W

| To tal bo ar d po, we r: 29

5

W

To tal gr ap hic s po we r: 26

0

W

| 14

0

W

| 23

0

W

| 30

0

W

| 25

0

W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)| 3 x

409

6×2

160

@ 60H

z

1 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 60H

z

4 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 60H

z

4 x

512

0×2

880

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

| 4 x

384

0×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

4 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

384

0 x

216

0 @

120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

| 4 x

409

6×2

160

@ 120

Hz 4 x

512

0×2

880

@ 60H

z

2 x

768

0×4

320

@ 60H

z

Thermal Solution| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ult ra- qu iet Ac tiv e Fa| Ac tiv e| Ac tiv e| Ac tiv e| Ult ra- qu iet Ac tiv e Fa
 | nsi nk| nsi nk| nsi nk| nsi nk|  |  |  | nsi nk| nsi nk| nsi nk| nsi nk|  | |  | ni nk
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
Dimension| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr of e

| 2.7

13” H

x 5.7

” L

Single Slot, Low Pr of e

| 2.7

13” H

x 5.7

” L

Sin gle Sl ot, Lo w Pr of e

| 4.

4″ H

x 7.9

″ LSin gle

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 2.7

″ H x 6.1

″ L Single

Sl ot

| 4.

4″ H

x 9.5

″ LSin gle

Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 9.5

″ LSin gle

Sl ot

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

| 4.

4″ H

x 10.

5″ L

Du al Sl ot, Fu ll He ig ht

Advanced Display| Not Avai label e| Not Avai label e| Not Avai label e| Not Avai label e| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| SYN C 2| Not Avai label e
SLI/NVLink Support| Not Avail able| Not Avail able| Not Avail able| Not Avail able| Not Avail able| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

| NVL

ink

Disclaimers|  |  |  |  |  |  |  |  |  |  |  |  |  |  |

Intel® Ethernet Specifications

Card| Intel I210-T1

Single Port Gigabit Ethern et Adapt er (Sprin gville)

| Intel I350- T2

Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

| Intel I350- T4

Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

| Intel X540- T2

Dual Port Coppe r 10Gb Ethernet Adapter

| Intel X710- DA2

Dual Port Fiber 10Gb

Ethern et Adapter

| Intel Ethernet SFP+ SR

Optics Module

| Intel Dual Band Wireless ss-AC 7260 ASM| Intel Winsto rm Peak 8265

2×2

AC+BT 4.2

Vpro M.2

Combo

---|---|---|---|---|---|---|---|---
Supplier PN| I210T1, MM# 941033| I350T2 G1P20, MM# 928941| I350T4 G1P20, MM# 92894

2

| MM#9 28955| MM# 952103| MM#: 941243| 7260H MWDT X.R, MM# 936170| MM#: 94665

8

Data Rates Supported| 10/100

/1000

Mbps copper

| 10/100

/1000

Mbps (Copper), 1000M

bps (Fiber)

| 10/100

/1000

Mbps (Copper), 1000M

bps (Fiber)

| 100/10

00Mbp s and 10Gbp s Copper

| 1GbE/1

0GbE

Optical fiber 10GbE

Direct Attach (DAC)

| Not Available le| Intel Dual Band Wireless ss-AC 7260| Intel Dual Band Wireless ss-AC 8265
Controller Details| Intel® Ethern et Contro ller I210| Intel Ethernet Controller I350| Intel Ethernet Controller I351| Intel Ethernet Controller X540| Intel Ethernet Controller X710- AM2| Not Available le| Intel Dual Band Wireless ss-AC 7260,

Dual Band,

| Intel Dual Band Wireless ss-AC 8265,

2×2,

WiFi+B

 |  |  |  |  |  |  | 2×2,

WiFi+B T

| T, MU- MIMO
---|---|---|---|---|---|---|---|---
Controller Bus Architecture| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 2.1

(5GT/s

)

| PCIe 3.0

(8GT/s

)

| Not Available le| PCIe M.2| PCIe M.2
Data Transfer Mode| Ethern et| Ethern et| Ethern et| Ethern et| Ethern et| Not Available le| WiFi (802.11

ac), 2.4GHz

, 5GHz

| WiFi (802.11

ac), 2.4GHz

, 5GHz

Power Consumption| 0.81W| Coppe r:

I350- T2 V2= 4.4W

Fiber: I350- F2= 5.5W

| Coppe r: I350T4 V2= 5W

LC-

Fiber: I350F4

= 6W

| X540- T2:

10Gps= 17.4W

1Gbps= 9.5W

100Mb

ps=6.6 W X540- T1:

10Gbp s=10.8 W

1Gbps= 7.7W

100Mb

ps= 6.4W

| Dual- port 10GBA SE- SR= 4.3W

typ/4.8 W max Dual- port 1000B ASE- SX= 4W

typ/4.3 W max Dual- port 10GBA SE- LR= 4.5W

typ/ 5.1W

max Dual-port Direct Attach (Twina x)= 3.3W

typ/3.7 W max

| Not Available le| Not Available le| Not Available le
IEEE Standards Compliance| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3/1

0BASE

-T, 100BA SE-TX, 1000B ASE-T

| IEEE 802.3

100/10

00/10

HBASE

-T

| IEEE 802.3

1/1010

HBASE

– SR/LR, SFF- 8431

10GSF P+DAC

| Not Available le| IEEE 802.11a

bg, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w

| IEEE 802.11a

bg, 802.11a

c, 802.11d

, 802.11e,

802.11i,

802.11h

, 802.11

w, 802.11r,

802.11k,

802.11v

(pending)

Boot ROM Support| PXE

boot, Intel iSCSI

Remot e Boot

| PXE

boot, Intel iSCSI

Remot e Boot

| PXE

boot, Intel iSCSI

Remot e Boot

| PXE

boot, Intel iSCSI

Remot e Boot

| PXE

boot, Intel iSCSI

Remot e Boot

| Not Available le| Not Available le| Not Available le
 | for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| for Windows, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

| for Windo ws, Linux and Vmwar e, Intel BootA gent Softwa re via PXE or BootP, WDMS

or UEFI

|  |  |
---|---|---|---|---|---|---|---|---
Network Transfer Mode (Full/Half Duplex)| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
Network Transfer Rate| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| 1,000M

bps Full Duplex

| Not Available le| 300/8

67Mbp s

| 867Mb

ps

Operating System Driver Support| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Linux, Free BSD, XEN, V

VMware

| Windo was 7/8/10,

Windows Server Linux, FreeBSD D

| Windows 2008,

2012; RHEL 6.5/7.0,

FreeBSD D 9/10,

Vmware e ESXi 5. x

| Not Available le| Windows 10, 32-bit*, Windows 10,

64-

bit, Windows 8.1, 32-bit, Windows 8.1,

64-

bit, Windows 8, 32-bit, Windows 8,

64-

bit, Windows 7, 32-bit, Windows 7,

64-

bit, Linux

| Windows 10,

64-

bit*, Windows 8.1,

64-

bit, Windows 7, 32-bit, Windows 7,

64-

bit, Linux

Manageability| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
Manageability Capabilities Alerting| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Suppor ted| Not Available le| Not Available le| Not Available le
TDP| Firmw are Based on Thermal Management| Firmw are Based on Thermal Management| Firmw are Based on Thermal Management| Firmw are Based on Thermal Management| Not Available le| Not Available le| Not Available le| Not Available le
Operating Temperature Range| 0°C to 55°C (32°F| 0°C to 55°C (32°F| 0°C to 55°C (32°F| 0°C to 55°C (32°F| 0°C to 55°C (32°F| Not Available le| 0°C to 80°C (32°F| 0°C to 80°C (32°F
 | to 131°F)| to 131°F)| to 131°F)| to 131°F)| to 131°F)|  | to 176°F)| to 176°F)
---|---|---|---|---|---|---|---|---

of Ports| 1| 2| 4| 2| 2| Not Available le| Not Available le| Not Available

le
Data Rate Per Port| 10/100

/1000

Mbps (copper)

| 10/100

/1000

Mbps (copper), 1000M

bps (fibre)

| 10/100

/1000

Mbps (copper), 1000M

bps (fibre)

| 100/1,0

00Mbp s, 10Gbp s

| 1Gbps, 10Gbp s| Not Available le| Not Available le| Not Available le
System Interface Type| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe

Gen 2.1

| PCIe 3.0| Not Available le| PCIe M.2| PCIe M.2
NC Sideband Interface| Not Available le| Not Available le| Not Available le| Not Available le| Yes| Not Available le| Not Available le| Not Available le
Jumbo Frames Supported| Yes| Yes| Yes| Yes| Yes| Not Available le| Not Available le| Not Available le
1000Base-T| Yes| Yes| Yes| Yes| Not Available le| Not Available le| Not Available le| Not Available le
IEEE 1588| Suppor ted| Suppor ted| Suppor ted| Not Available le| Suppor ted| Not Available le| Not Available le| Not Available le
Supported Under vPro| Not Available le| Not Available le| Not Available le| Not Available le| Not Available le| Not Available le| Suppor ted| Suppor ted
Disclaimers|  |  |  |  |  |  |  |

Ethernet

Model| i210-T1| Dual Port Copper

= I350- T2V2

Dual Port LC- Fiber= I350-F2

| Dual Port Copper

= I350- T4 V2

Dual Port LC- Fiber= I350-F4

| Dual Port Copper

= X540- T2

| X710- DA2| AC 7260 NGW| AC 8265 NGW
---|---|---|---|---|---|---|---
Connector| RJ-45

Copper

| 2 x Ports RJ-45

Copper or 2 x Ports

LC-Fiber

| 4 x Ports RJ-45

Copper or 4 x Ports

LC-Fiber

| 2 x Ports RJ-45

Copper

| 2 x SFPs Recepta ble| 2 x Antenna s| 2 x Antenna s
Website| i210 T1| i350 T2/F2| i350 T4/F4| x540 T2| x710 DA2| 7260

NGW

| 8265

NGW

Auto-Negotiation| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| IEEE 802.3

Auto- negotiate on

| Not Available e| Not Available e
Intel® vPro™| Not Available| Not Available| Not Available| Not Available| Not Available| Supported| Supported
---|---|---|---|---|---|---|---
Intel® Standard Manageability| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Power Optimizer Platform Low-power Management Systems| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed| Support ed
Energy Efficient Ethernet| Support ed| Support ed| Support ed| Not Availabl e| Support ed| Not Availabl e| Not Availabl e
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Receive Side Scaling| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Dual Tx and Rx Queues| Yes| Yes| Yes| Yes| Yes| Not Availabl e| Not Availabl e
Jumbo Frames (up to 9KB)| Support ed| Support ed| Support ed| Not Availabl e| Support ed| Not Availabl e| Not Availabl e
Teaming| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Wake from Deep Sx| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e| Not Availabl e| Not Availabl e
Server Operating System Support| Windows Server 2008,

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2008,

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2008,

2012,

2019

Linux (RHEL/ SLES),

Free BSD,

Xen, Vmware

| Windows Server 2003,

2008;

RHEL 4,

Linux/S LES 11,

Vmware

| Window s 2008,

2012; RHEL 6.5/7.0,

FreeBSD D 9/10,

Vmware ESXi 5. x

| Not Availabl e| Not Availabl e
Network Proxy/ARP Support| Support ed| Support ed| Support ed| Support ed| Support ed| Not Availabl e| Not Availabl e
Disclaimers|  |  |  |  |  |  |

Media Card Reader

Description 9-in-1 (USB 2.0)
Disclaimers

BIOS/Certifications/Standards/Environmental

BIOS Specifications

WMI Support| Compliant With Microsoft WBEM and the DMTF Common Information Model
---|---
ROM-Based Setup Utility (F1)| System Configuration Setup Program (text-only interface) Available at Power-on With F1 Key
Bootblock Recovery| Recover system BIOS if the Flash ROM Becomes Corrupted
Replicated Setup| Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control| Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert| Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert| Power-on Error message in the Event of a Fan Failure
Asset Tag| Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery With Video| Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown| System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
Quick Resume Time| Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level| System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
Keyboard-less Operation| System Can be Booted Without a Keyboard
Per-port Control| Allows I/O Ports to be Individually Enabled/Disabled Through ROM- based Setup or WMI Interface
Adaptive Cooling| Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security| User and Administrator Passwords Can Protect Boot and ROM-based Setup

–  Support Electronic Lock

–  Chassis Intrusion Detection

–  UEFI Secure Boot Support

–  HDD Password Can Protect HDD Data

–  Windows UEFI Firmware Update Support

–  Device Guard Support

–  Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)| Allows System to be Supported from a Remote Location
Intel(R) TXT| Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software-Based Attacks
Memory Modes| Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready| Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and Power Management Interface) Advanced

Configuration and Power Interface v6.1
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI| NA (No PCI slot)
PCI Express| PCI Express Base Specification v3.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal Serial Bus v3.0
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control| Lenovo is a member of an eco-declaration system that enforces regular independent quality control
---|---
Hazardous Substances and Preparation| • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorocarbons (HCFC), Halons, carbon tetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short-chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week

REACH Article 33 information about substances in articles is available at:

http:/ www.lenovo.com/social_responsibility/us/en/ThinkGreen_produc ts.html#environment

Batteries| Not Available
Safety, EMC Connection to the Telephone Network and Labeling| Not Applicable, no Connection to a Telephone Network

Safety, EMC Connection to the Telephone Networkand Labeling

System Software Manager| Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
---|---

Regulations & Standards

EMC & Safety| FCC DoC for North America VCCI Certification for Japan BSMI Certification for Taiwan EU/EFTA CE Mark & DoC

UL/CUL(P920,P720,P520,P520c), cTUVus(P330) UL-GS(P920,P720,P520,P520c), TUV- GS(P330)

IEC60950-1 CB Report/Certificate Saudi Arabia SASO

Kuwait KUCAS China CCC Mark

Hong Kong SAR (CB report) Singapore PSB

South Africa SABS Russia-EAC Morocco-CM Mexico-NOM Kazakhstan-EAC Belarus-EAC Serbia KVALITET Ukraine UKrCEPRO India-BIS

USA Chemical Emission Test

---|---

Environmentals

Energy Star ENERGY STAR® v7.0
EPEAT EPEAT® Silver Certification Available on Select Models
Greenguard Greenguard
RoHS RoHS Compliant
ErP Lot-3 2013 Yes
Hazardous Substances • Products do not contain more than; 0.1% lead, 0.01%

cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydr obromo fluoro carbons (HBFC), hydrochlorofluorocarbon (HCFC), Halons, carbon tetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short-chain chloroparaffins

 | (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

---|---
TCO Certification| 9.0
Disclaimers| EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

References

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