STMicroelectronics UM3239 Motion Mems and Environmental Sensor Expansion Board User Manual

UM3239
User manual
Getting started with the X-NUCLEO-IKS4A1 motion
MEMS and environmental
sensor expansion board for STM32 Nucleo

Introdu ction

The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board XNUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVALMKE001A, which hosts the Qvar swipe electrodes.
It is compatible with the Arduino UNO R3 connector layout and features the LSM6DSO16IS and LSM6DSV16X MEMS 3D accelerometers, the LIS2MDL 3-axis magnetometer, the LIS2DUXS12 3-axis accelerometer, the LPS22DF MEMS pressure sensor, the SHT40AD1B humidity and temperature sensor, and the STTS22H temperature sensor.
The X-NUCLEO-IKS4A1 interfaces with the STM32 microcontroller via the I²C pin or, for external sensors mounted on DIL24 adaptor, SPI Pins.

Getting started

1.1 Hardware requirements
The X-NUCLEO-IKS4A1 is designed to be used with STM32 Nucleo boards (visit www.st.com for further information).The X-NUCLEO-IKS4A1 must be connected on the matching pins of any STM32 Nucleo board with the Arduino UNO R3 connector.
X-NUCLEO-IKS4A1 components are ESD sensitive and, as the board has male/female pass-through connectors, it is important to handle it with care to avoid bending or damaging the pins.

System requirements

To complete the system setup, you need:

• a Windows® (7, 8, 10) PC
• a USB type A to mini-B USB cable to connect the STM32 Nucleo to the PC
• board firmware and software package (X-CUBE-MEMS1) installed on the user PC

Hardware description

The board lets you test the functionality of the motion MEMS accelerometer, gyroscope and magnetometer, and environmental humidity, temperature and pressure sensors, via the I²C communication bus.
It also allows complete testing of all LSM6DSO16IS and LSM6DSV16X functionalities and Qvar touch and swipe gestures. There is also the possibility to attach the STHS34PF80 IR sensor to enable presence and motion detection applications.
The board features:

• LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit)
• LIS2MDL: MEMS 3D magnetometer (±50 gauss)
• LIS2DUXS12: ultralow power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing
• LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
• SHT40AD1B
• STTS22H: Low-voltage, ultralow power, 0.5 °C accuracy temperature sensor (-40°C to +125°C)
• LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
• DIL 24-pin socket available for additional MEMS adapters and other sensors
• Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware
• Equipped with Qvar touch/swipe electrode
• I²C sensor hub features on LSM6DSO and LSM6DSV16X available
• MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF
• Compatible with STM32 Nucleo boards
• Equipped with Arduino UNO R3 connector
• Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter
• Available interface for external camera module applications coupled with LIS2DUXS12 through aux SPI (3/4 w)
• RoHS compliant
• WEEE compliant
• UKCA compliant

Each device has a separate power supply to allow power consumption measurement of every sensor.
The expansion board is power supply compatible with STM32 Nucleo boards: it mounts an LDO to generate 1.8 V for all the MEMS sensors except for the external sensor mounted on DIL24 adapter, which can be supplied both from 1.8 V and 3.3 V (main supply from Nucleo board).
All signals between the sensors and the main board are translated by a level shifter.
Default solder bridge configuration
The user can configure several aspects of the X-NUCLEO-IKS4A1 through several solder bridges which can be left open (not mounted) or closed (mounted) to configure different hardware settings.
Block diagram
The LSM6DSO16IS and the LSM6DSV16X have an I²C sensor hub that allows them to behave as the I²C master for other slave devices connected via an I²Caux bus. Various bus configurations are possible to select the I²C master of the environmental/DIL24 sensors.
Mode 1: standard I²C bus connection (all sensors)
In standard I²C mode, all devices are connected to an external main board via the same I²C bus.
The board configuration is:

• J4: 1-2, 11-12 (STM_SDA = SENS_SDA, HUB_SDx = GND)
• J5: 1-2, 11-12 (STM_SCL = SENS_SCL, HUB_SCx = GND)

Mode 2: LSM6DSO16IS I²C sensor hub (all sensors)
In this sensor hub I²C mode, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities by collecting external data through a direct control of the on-board environmental sensors (temperature, pressure and magnetometer) and external sensor (DIL24) through the auxiliary I²Cz bus “SENS_I2C”. LSM6DSV16X, LIS2DUXS12 and SHT40AD1B remains connected to the main bus “uC_I2C” coming from the external board.
The board configuration is:

• J4: 5-6 (HUB2_SDx = SENS_SDA)
• J5: 5-6 (HUB2_SCx = SENS_SCL)

Mode 3: LSM6DSV16X I²C sensor hub
In this sensor hub, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities by collecting external data through a direct control of the on-board environmental sensors (temperature, pressure and magnetometer) and external sensor (DIL24) through the auxiliary I2C bus “SENS_I2C”. LSM6DSO16IS, LIS2DUXS12 and SHT40AD1B remains connected to the main bus “uC_I2C” coming from the external board.
The board configuration is:

• J4: 7-8 (HUB1_SDx = SENS_SDA)
• J5: 7-8 (HUB1_SDx = SENS_SDA)
  DIL24 adapter (to I²C2): SB16, SB21
  Not mounted: SB6, SB10, SB12, SB14, SB18, SB19, SB20, SB22

Mode 4: DIL24 I²C sensor hub (all sensors)
In case a sensor with sensor hub embedded functionality is mounted to the board through DIL24 adapter, it is possible to exploit this functionality as for LSM6DSO16IS and the LSM6DSV16X.
In this configuration, may be necessary to connect the DIL24 to the external board through SPI lines in order to avoid an address conflict on I2C bus with the LSM6DSO16IS and the LSM6DSV16X. This is done by changing the SBx configuration.
The board configuration is:

• J4: 9-10 (DIL_SDx = SENS_SDA)
• J5: 9-10 (DIL_SDx = SENS_SDA)

Mode 5: LSM6DSO16IS as Qvar controller
In this configuration, it is possible to use the equipped Qvar swipe electrode (by plugging it on JP6 and JP7 connectors) through the LSM6DSO16IS.
The board configuration is:

• J4: 3-4 (HUB1_SDx = QVAR1)
• J5: 3-4 (HUB1_Scx = QVAR2)

3.3  Sensor I²C address selection
Most sensors allow I²C address LSB selection by pulling the SD0 pin low or high. The board has solder bridges to control SD0 level.
Table 1. Solder bridges for I²C address
Address in bold are the default I2C addresses

3.4  Sensor current consumption measurement
The X-NUCLEO-IKS4A1 expansion board is equipped with OR resistors that allow separate current consumption measurement for each sensor.
To measure current consumption, connect an ammeter to the appropriate pads.
As the sensors have very low current consumption, you should set a suitable range and use an ammeter with low burden voltage.
Table 2. Resistors/jumpers for current consumption measurement

3.5 Sensor disconnection
To disconnect a sensor, you should disconnect the I²C bus as well as the power supply. See the table below for the relevant jumpers and solder bridges.
Table 3. Link between sensors, jumpers and I²C solder bridges

3.6 Adapter board for DIL24 socket
An additional sensor can be connected as an adapter board to J6 DIL24 socket.
As there are a few different interrupt signal assignments for DIL24 pins, the appropriate pin can be selected using
the J2 header.
Related links
Please visit the ST website to find other available sensors

3.7 Connectors
Table 4. Arduino R3 UNO connectors

1. The unlisted pins are not connected.

Table 5. ST morpho connectors

1. unlisted pins are not connected.

Schematic diagrams

Bill of materials

Table 6. X-NUCLEO-IKS4A1 bill of materials

Item| Quantity| Reference| Part / value| Description| Manufacturer| Part number
---|---|---|---|---|---|---
1| 2| C23, C25| 220pF| Multilayer Ceramic
Capacitors 220pF
±5% 100V COG SMD 0402| TDK| C1005C0G2A221J050BA
2| 6| C2, C4,
C10, C12,
C14, C20| 10uF| CAP CER 0603
10uF 6.3V X5R
20%| Walsin| 0603X106M6R3CT
3| 12| C3, C5,
C6, C7,
C8, C9,
C11, C13,
C15, C16,
C17, C18,
C21, C22| 100nF| CAP CER 0603
100nF 25V X7R
10%| MULTICOMP| MC06038104K250 CT
4| 1| C19| 220nF| CAP CER 0603
220nF 25V X7R
10%| KEMET| C0603X224K4RACTU
5| 1| CN5| | 1×10 Pin elevated| socket
Samtec| ESQ-110-24-T-S
—
6| 2| CN9, CN6| | 1×8 Pin elevated
socket| Samtec| ESQ-108-24-T-S
7| 1| CN8| | 1×6 Pin elevated
socket| Samtec| ESQ-106-24-T-S
8| 2| D1, D2| SOD-882| Trans Voltage
Suppressor Diode, 40W, Bidirectional, 1 Element, Silicon| STMicroelectronics| ESDAXLC6-1BT2
9| 1| J1| | Header 4| MULTICOMP| 2211 S-04G
10| 1| J2| | 16 Position, Dual –
Row, Shrouded
Terminal Strip, 2mm pitch| Adam Tech| 2PH2-16-UA
11| 1| J3| | 12 Position, Dual –
Row, Shrouded
Terminal Strip, 2mm pitch| Samtec| SHF-106-01-L-D-SM
12| 2| J4, J5| | 12 Position, Dual –
Row, Shrouded
Terminal Strip, 2mm pitch| Adam Tech| 2PH2-12-UA
13| 1| J6| | Adapter DIL24| E-TEC| 2BL1-036-G-700-01
14| 5| JP1, JP2,
JP5, JP6,
JP7| | Header 3| MULTICOMP| 2211S-03G
15| 2| JP3, JP4| | Header 1×2 pins,
2.54mm, stright| MULTICOMP| 2211S-02G
16| 2| QVAR1,
QVAR2| | Header_3pin_SMD| GCT| BG125-03-A-1-1-0440-ND
17| 15| R1, R2,
R9, R10,
R11, R12,
R13, R14,
R15, R23,
R24, R25,
R28, R29,
R34| 4k7| RES 0603 4k7 1%
1/16W, RESISTOR| YAGEO| RC0603FR-074K7L
18| 1| R3| 15k| RES 0603 12k 1%
1/16W, RESISTOR| YAGEO| RC0603FR-1315KL
19| 1| R4| 12k| RES 0603 0R0 1%
1/16W| YAGEO| RC0603FR-1312KL
20| 9| R32, R33,
R16, R17,
R18, R19,
R20, R21,
R22| 0R| RES 0603 2k2 1%
1/16W| YAGEO| RC0603FR-070RL
21| 2| R26, R27| 2k2| RES Thick Film,
10MΩ, 1%, 0.1W,
100ppm/°C, 0603| YAGEO| RC0603FR-132K2L
22| 4| R5, R6,
R7, R8| 10M| RES 0603 0R0 1%
1/16W| YAGEO| RC0603FR-0710ML
23| 40| SB1, SB2,
SB4, SB5,
SB6, SB7,
SB8, SB9,
SB10, SB11,
SB12, SB14,
SB15, SB16,
SB18, SB20,
SB21, SB22,
SB23, SB24,
SB25, SB26,
SB27, SB28,
SB29, SB30,
SB32, SB33,
SB35, SB36,
SB37, SB38,
SB39, SB40,
SB42, SB44,
SB47, SB51,
SB55, SB56| 0R| | YAGEO| RC0603FR-070RL
24| 1| U1| SOT23-5L| LDO Voltage
Regulators 300mA
Low Quiescent
Crnt low noise
LDO| STMicroelectronics| LDK130M-R
25| 2| U2, U3| | IC TRANSLATOR
BIDIRECTIONAL
20VQFN| Nexperia| NXS0108BQX
26| 1| U4| VFLGA2.5X3X.86 14L P.5
L.475X.25| 6-axis IMU with embedded sensor fusion, AI, Qvar for
high-end applications| STMicroelectronics| LSM6DSV16XTR
27| 1| U5| LGA 2X2X0.74MAX 12
LEADS| Ultra-low-power 3axis smart
accelerometer with embedded
machine learning core and
antialiasing filter| STMicroelectronics| LIS2DUXS12TR
28| 1| U6| HLGA 2X2X.8 10L EXP.
SILIC .91SQ| Low-power and high-precision
MEMS nano pressure sensor:
260-1260 hPa| STMicroelectronics| LPS22DFTR
29| 1| U7| LGA 2×2 12L| Ultra-low-power, high-performance 3-axis magnetometer| STMicroelectronics| LIS2MDLTR
30| 1| U8| UDFN-6L_2X2X0P5_STM| Low-voltage, ultralow-power, 0.5 °C accuracy temperature
sensor| STMicroelectronics| STTS22HTR
31| 1| U9| VFLGA2.5X3X.86 14L P.5
L.475X.25| 3-axis accelerometer and
3-axis gyroscope with ISPU| STMicroelectronics| LSM6DSO16ISTR
32| 1| U10| | Digital Relative Humidity
Temperature Sensor, ±1.8 /
max 3.5 %RH, ±0.2 °C, UltraLow-Power| Sensirion| SHT40-AD1B-R3

Kit versions

Table 7. X-NUCLEO-IKS4A1 versions

of materials

1. This code identifies the X-NUCLEO-IKS4A1 evaluation kit first version. The kit consists of the main board X-NUCLEOIQS4A1 whose version is identified by the code X$NUCLEO-IQS4A1A and the detachable board STEVAL-MKE001A whose version is identified by the code STEVAL$MKE001AA.

Regulatory compliance information

Notice for US Federal Communication Commission (FCC)
For evaluation only; not FCC approved for resale
FCC NOTICE – This kit is designed to allow:

1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and
2. Software developers to write software applications for use with the end product.
   This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter 3.1.2.

Notice for Innovation, Science and Economic Development Canada (ISED)
For evaluation purposes only. This kit generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to Industry Canada (IC) rules.

Notice for the European Union
This device is in conformity with the essential requirements of the Directive 2014/30/EU (EMC) and of the Directive 2015/863/EU (RoHS).

Notice for the United Kingdom
This device is in compliance with the UK Electromagnetic Compatibility Regulations 2016 (UK S.I. 2016 No. 1091) and with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012 (UK S.I. 2012 No. 3032).

Revision history
Table 8. Document revision history

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2023 STMicroelectronics – All rights reserved
UM3239 – Rev 1

References

• MEMS and Sensors - STMicroelectronics
• LIS2DUXS12 - Ultralow-power 3-axis smart accelerometer with Qvar, AI, antialiasing filter, and advanced digital features - STMicroelectronics
• LIS2MDL - Magnetic sensor, digital output, 50 gauss magnetic field dynamic range, ultra-low power high performance 3-axis magnetometer - STMicroelectronics
• LPS22DF - Low-power and high-precision MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer - STMicroelectronics
• LSM6DSO16IS - iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with ISPU - Intelligent Sensor Processing Unit - STMicroelectronics
• LSM6DSV16X - 6-axis IMU with embedded sensor fusion, AI, Qvar for high-end applications - STMicroelectronics
• STTS22H - Low-voltage, ultra-low-power, 0.5 °C accuracy I2C/SMBus 3.0 temperature sensor - STMicroelectronics
• LDK130 - 300 mA low quiescent current very low noise LDO (automotive for SOT23-5L package) - STMicroelectronics
• X-CUBE-MEMS1 - Sensor and motion algorithm software expansion for STM32Cube - STMicroelectronics
• X-NUCLEO-IKS4A1 - Motion MEMS and environmental sensor expansion board for STM32 Nucleo - STMicroelectronics
• ESDAXLC6-1BT2 - Single-line bidirectional ESD protection for high speed interface - STMicroelectronics

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