Toshiba KXG50ZNV256G XG5 PCIe Gen3 NVMe SSD Specifications And Datasheet

Toshiba KXG50ZNV256G XG5 PCIe Gen3 NVMe SSD

Introduction

XG5 series SSDs feature Toshiba’s latest 64-layer, 3D TLC (3-bit-per-cell) flash memory BiCS FLASH™. This new line of NVMe™ based client SSDs deliver high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write with a maximum interface bandwidth of 32 GT/s. XG5 series SSDs also feature an SLC cache to accelerate burst-type workloads, as well as improved power consumption compared to prior generation XG3, making these SSDs an efficient option for high-performance mobile computing.

XG5 Series SSDs are available in 256GB, 512GB, and 1024GB capacities in compact single-sided M.2 2280 form factors. Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 are also offered, making the new series highly suited to address data security needs for commercial PCs or other business applications.

KEY FEATURES

• Toshiba 64-Layer BiCS FLASHTM
• PCIeⓇ Gen3*4L NVMeTM
• Capacities up to 1024GB
• M.2 2280 Single-sided
• TCG OPAL 2.01 Optional for SED

APPLICATIONS

• Thin performance Notebook

• Enthusiast Desktop/Laptop

• Mainstream PC Computing

• Server/Storage Boot

• Availability of the SED model line-up may vary by region.

SPECIFICATIONS

Standard Models

|  | M.2 2280-S2

(Single-sided)

|
---|---|---|---
Model Number| KXG50ZNV256G KXG5AZNV256G| KXG50ZNV512G KXG5AZNV512G| KXG50ZNV1T02 KXG5AZNV1T02
Memory| TOSHIBA BiCS FLASHTM
Interface| PCI Express® Base Specification Revision 3.1 (PCIe®)
Maximum Speed| 32 GT/s (PCIe®  Gen3×4 Lane)
Command| NVM ExpressTM Revision 1.2.1 (NVMeTM)
Connector Type| M.2 M
Formatted Capacity1)| 256 GB| 512 GB| 1,024 GB

Performance2)

| Sequential Read| 2,700 MB/s {2,580 MiB/s}| 3,000 MB/s {2,900 MiB/s}
Sequential Write| Up to

1,050 MB/s {1,000 MiB/s}

| Up to

2,100 MB/s {2,000 MiB/s}

Supply Voltage| 3.3 V ±5 %

Power Consumption

| Active| 4.0 W type.| 4.3 W type.| 4.5 W type.
L1.2 mode| 3 mW typ.
Size| 80.0 mm x 22.0 mm x 2.23 mm
Weight| 7.0 g type.| 7.3 g type.

Standard Models

| M.2 2280-S2

(Single-sided)

---|---

Temperature

| Operating| 0 to 95 °C (Controller Temperature)

0 to 85 °C (Other Components Temperature)

Non- operating| -40 to 85 °C
Reliability3)| Mean Time to Failure (MTTF): 1,500,000 hours

Product Life: Approximately 5 years

More Features

| • Device Self-test is supported.

• Host Controlled Thermal Management (HCTM) is supported.

• Strong & highly efficient ECC named QSBCTM is supported.

• TCG Pyrite Version 1.00 is supported.

• Storage Interface Interactions Specification(SIIS) Version 1.06 is supported.

Compliance| UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, IC, VCCI

Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using them, customers must refer to and comply with the latest versions of the product specifications.

Note

1. Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software, and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
2. 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.
3. MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. The actual operating life of the product may be different from the MTTF.
   • PCIe® and PCI Express® are registered trademarks of PCI-SIG*NVMeTM and NVM ExpressTM are trademarks of NVM Express, Inc.
   • A product image may represent a design model.
   • Read and write speed may vary depending on the host device, read and write conditions, and file size.

ORDERING INFORMATION

PRODUCT LINE UP

Model Number

| Formatted Capacity|

Form Factor/Connect Type

| Function
---|---|---|---
Note
KXG50ZNV256G| 256 GB|

M.2 2280-S2 1)-M module

|

Non- SED

KXG50ZNV512G| 512 GB
KXG50ZNV1T02| 1,024 GB
KXG5AZNV256G| 256 GB|

SED2)

KXG5AZNV512G| 512 GB
KXG5AZNV1T02| 1,024 GB

Note:

1. Single Sided
2. Availability of the SED model line-up may vary by region.

CAPACITY

Capacity

| Total Number of User Addressable Sectors in LBA Mode
---|---
512 bytes sector| 4,096 bytes sector
256 GB| 500,118,192| 62,514,774
512 GB| 1,000,215,216| 125,026,902
1,024 GB| 2,000,409,264| 250,051,158

Note: 1 GB (Gigabyte) = 1,000,000,000 bytes

PERFORMANCE

Standard Models

| KXG50ZNV256G KXG5AZNV256G| KXG50ZNV512G KXG5AZNV512G| KXG50ZNV1T02 KXG5AZNV1T02
---|---|---|---

Interface Speed

|

32 GT/s (Gen3x4 Lane), 20 GT/s (Gen2x4 Lane), 16 GT/s (Gen3x2 Lane), 10 GT/s (Gen2x2 Lane)

@32GT/s|
Sequential Read1)| 2,700 MB/s

{2,580 MiB/s}

| 3,000 MB/s

{2,900 MiB/s}

| 3,000 MB/s

{2,900 MiB/s}

Sequential Write2)3)| 1,050 MB/s

{1,000 MiB/s}

| 1,050 MB/s

{1,000 MiB/s}

| 2,100 MB/s

{2,000 MiB/s}

Time from Power-on to process the Admin Commands4)|

100 ms typ.

Time from Power-on to process the I/O Commnads4)|

100 ms typ.

Note:

1. Under the condition of measurement with 128 KiB unit sequential access (1 KiB = 1024 bytes) and queue depth is 64.
2. Under the condition of measurement with 128 KiB unit sequential access with 4KiB (1 KiB = 1024 bytes) align and queue depth is 64.
3. SLC cache is effective.
4. After an unexpected power down, it may increase up to 10 s.

SUPPLY VOLTAGE

Note: The drive has over over-current protection circuit. (Rated current: 3.15A)

POWER CONSUMPTION

KXG50ZNV1T02 KXG5AZNV1T02
Read2)| 4.0 W typ.| 4.3 W typ.| 4.5 W typ.
Write2)| 2.6 W typ.| 2.6 W typ.| 3.4 W typ.
Power State 33)| 50.0 mW typ.| 50.0 mW typ.| 50.0 mW typ.
Power State 43)| 5.0 mW typ.| 5.0 mW typ.| 5.0 mW typ.
Power State 53)| 3.0 mW typ.| 3.0 mW typ.| 3.0 mW typ.

Note:

1. Ambient Temperature
2. The values are specified at the condition causing maximum power consumption and Power State 0.
3. PCIe Link state is L1.2. Power consumption during the Admin command processing is excluded.

ENVIRONMENTAL CONDITIONS

TEMPERATURE

Operating1)

| 0°C (Tc) – 95°C (Tc) (Controller Temperature)

0°C (Tc) – 95°C (Tc) (Other Components Temperature)

| ****

30 °C (Ta) / h maximum

Non-operating| -40 °C – 85 °C| 30 °C / h maximum
Under Shipment2)| -40 °C – 85 °C| 30 °C / h maximum

Note:

1. Ta: Ambient Temperature, Tc: Components Temperature
2. Packaged in Toshiba’s original shipping package

HUMIDITY

40.0 °C (Non-operating / Shipping)

Note:

1. Packaged in Toshiba’s original shipping package

SHOCK

14.709 km/s2 {1,500 G}, 0.5 ms half sine wave

Non-operating

VIBRATION

(20 minutes per axis) x 3 axis

Non-operating

COMPLIANCE

SAFETY / EMI STANDARDS

UL

(Underwriters Laboratories)

| UL 60950-1| USA1)
cUL

(Underwriters Laboratories of Canada)

| CSA-C22.2 No.60950-1-07| Canada
TÜV

(Technischer Überwachungs Verein)

| EN 60950-1| EURO
KC| KN32, KN35| Korea
FCC| FCC part 15 Subpart B| USA
BSMI

(Bureau of Standards, Metrology and Inspection)

| CNS13438 (CISPR Pub. 22)| Taiwan
CE| EN 55032, EN 55024| EURO
RCM| AS/NZS CISPR 32| Australia, New Zealand
ISED| ICES-003| Canada
VCCI| VCCI-CISPR32| Japan

Note

1. UL certification is basically on a voluntary basis.

RELIABILITY

MECHANICAL SPECIFICATIONS

M.2 2280 MODULE

22.00 mm

| ****

2.23 mm

| ****

80.00 mm

KXG50ZNV512G KXG5AZNV512G| 7.3 g typ.
KXG50ZNV1T02 KXG5AZNV1T02| 7.3 g typ.

INTERFACE CONNECTOR

M.2 2280 MODULE INTERFACE CONNECTOR

PIN ASSIGNMENT ON M.2 2280 MODULE CONNECTOR

Pin #| Name| Description|  | Pin #| Name| Description
---|---|---|---|---|---|---
1| GND| GND| 2| +3.3V| 3.3 V Source
3| GND| GND| 4| +3.3V| 3.3 V Source
5| PETn3| PCIe Lane 3 Device Transmitter| 6| Reserved| NC
7| PETp3| 8| Reserved| NC
9| GND| GND| 10| LED1#| Device Activity
11| PERn3| PCIe Lane 3 Device Receiver| 12| +3.3V| 3.3 V Source
13| PERp3| 14| +3.3V| 3.3 V Source
15| GND| GND| 16| +3.3V| 3.3 V Source
17| PETn2| PCIe Lane 2 Device Transmitter| 18| +3.3V| 3.3 V Source
19| PETp2| 20| Reserved| NC
21| GND| GND| 22| Reserved| NC
23| PERn2| PCIe Lane 2 Device Receiver| 24| Reserved| NC
25| PERp2| 26| Reserved| NC
27| GND| GND| 28| Reserved| NC
29| PETn1| PCIe Lane 1 Device Transmitter| 30| Reserved| NC
31| PETp1| 32| Reserved| NC
33| GND| GND| 34| Reserved| NC
35| PERn1| PCIe Lane 1 Device Receiver| 36| Reserved| NC
37| PERp1| 38| Reserved| NC
39| GND| GND| 40| Reserved| NC
41| PETn0| PCIe Lane 0 Device Transmitter| 42| Reserved| NC
43| PETp0| 44| Reserved| NC
45| GND| GND| 46| Reserved| NC
47| PERn0| PCIe Lane 0 Device Receiver| 48| Reserved| NC
49| PERp0| 50| PERST# 1)| PE-Reset
51| GND| GND| 52| CLKREQ#| Clock Request
53| REFCLKn| PCIe Reference Clock| 54| PEWAKE#| NC
55| REFCLKp| PCIe Reference Clock| 56| MFG1| Manufacturing pin. Must be no- connect on the host board.
57| GND| GND| 58| MFG2

Notch

| ****

Notch

67| Reserved| NC|  | 68| SUSCLK| NC
69| PEDET| NC-PCIe| 70| +3.3V| 3.3 V Source
71| GND| GND| 72| +3.3V| 3.3 V Source
73| GND| GND| 74| +3.3V| 3.3 V Source
75| GND| GND|

Note:

1. The driver can’t detect PERST# in L1.2.

COMMAND TABLE

ADMIN Command set

Set Features / Get Features Set

NVM Command Set

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve the Product’s quality and reliability, the Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software, and systems which minimize risk and avoid situations in which a malfunction or failure of a Product could cause loss of human life, bodily injury, or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENT OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT (“UNINTENDED USE”). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships, and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators, and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE THE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR THE PRODUCT. For details, please contact your TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate, or copy the Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of the Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR THE PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of the Product. Please use the Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

FAQ’s

What is the Toshiba KXG50ZNV256G XG5 PCIe Gen3 NVMe SSD?

The Toshiba KXG50ZNV256G XG5 is a high-performance NVMe (Non-Volatile Memory Express) solid-state drive designed for use in various computing devices, offering fast data storage and retrieval.

What is the storage capacity of this SSD?

The Toshiba XG5 SSD typically has a storage capacity of 256GB, providing ample space for data storage and applications.

What form factor does it have?

This SSD often uses the 2.5-inch form factor, which is commonly used in laptops and some desktop computers. It may also come in an M.2 form factor for ultrabooks and compact devices.

What interface does it use for data transfer?

The Toshiba KXG50ZNV256G XG5 SSD typically uses the PCIe Gen3 x4 interface, which offers high-speed data transfer rates for improved system performance.

Is it compatible with both laptops and desktops?

Yes, this SSD is often compatible with both laptops and desktop computers, depending on the form factor and interface used.

What is the read and write speed of this SSD?

The read and write speeds of this SSD can vary, but it often offers fast sequential read speeds of over 2,000 MB/s and sequential write speeds of over 1,000 MB/s, providing rapid data access.

Does it include software for data migration and management?

Some versions of the Toshiba XG5 SSD may come with software for data migration and drive management, making it easier to transfer data from an existing drive and optimize performance.

Is it suitable for gaming and multimedia applications?

Yes, this SSD is often used for gaming and multimedia applications due to its fast data access and load times, which can improve the overall gaming and media experience.

Is there support for TRIM and wear-leveling?

Yes, most modern SSDs, including the Toshiba XG5, typically support TRIM and wear-leveling algorithms to optimize performance and prolong the lifespan of the drive.

What is the power consumption of this SSD?

The power consumption may vary by model, but NVMe SSDs like the Toshiba XG5 are known for their energy efficiency, often consuming less power than traditional hard drives.

Is it suitable for upgrading older computers?

Yes, upgrading older computers with this SSD can significantly improve system performance, especially if the computer currently has a traditional hard drive.

What is the warranty provided with this SSD?

Toshiba typically offers a limited warranty for their SSD products. The specific warranty terms and coverage may vary, so it's advisable to check the warranty details for your model.

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