MOKO MKL62 RF Module Installation Guide

MOKO MKL62 RF Module

Product Information

MKL62 module is an RF module with SPI interface based on Smetech’s high performance LoRa RF chip SX1262. The maximum transmit power up to 22dBm, using LoRaTM modem, with long communication distance, strong anti-interference, low power consumption, high sensitivity. The module supports 868/915 MHz frequency band.
The module is mainly suitable for applications requiring long transmission distance, such as vehicle tracking, smart agriculture, intelligent farm, industrial control, etc.

Specifications:

Features and Benefits

• Support LoRaTM modem
• SPI interface, easy to programming
• Compatible with 868MHZ/915MHZ
• Ultra-low power consumption:
  • Supply Voltage 1.8V to 3.7V
  • TX Current < 115mA
  • RX Current < 6mA
  • Sleep Current < 2uA
• High transmit power:
  • Sensitivity: -137dBm@SF12 300bps
  • Max LoRa Tx power: 22dBm
• Standard shielding cover protection for increased interference immunity
• Long communication distance, up to 10km (In urban space, with 5 dBi antenna)
• Small size: 14.610.62.8mm (With shield)

Application

• Security Monitoring
• Logistics and Transportation
• Smart Agriculture
• Warehouse Management
• Industrial Control
• Smart Farm
• Kinds of low-power sensor
• Other scenarios that require long communication distance

Product Usage Instructions

The MKL62 RF Module is an RF module with SPI interface based on Smetech’s high performance LoRa RF chip SX1262. It is mainly suitable for applications requiring long transmission distance, such as vehicle tracking, smart agriculture, intelligent farm, industrial control, etc.
To use the MKL62 RF Module, follow the steps below:

1. Connect the module to the microcontroller or device using the SPI interface.
2. Connect the antenna to the module’s antenna interface. The module supports 868/915 MHz frequency band.
3. Supply power to the module within the specified range of 1.8V to 3.7V.
4. Program the module using SPI interface as per your application requirements.
5. The module supports LoRaTM modem with long communication distance, strong anti-interference, and high sensitivity. It can transmit up to 22dBm of power and receive signals with a sensitivity of -137dBm@SF12 300bps.

The MKL62 RF Module is RoHS compliant and has a standard shielding cover protection for increased interference immunity. It has a small size of 14.610.62.8mm (With shield) and is compatible with various low-power sensors. It can be used in scenarios that require long communication distance such as security monitoring, logistics and transportation, warehouse management, and other applications.

Circuit Design

Block Diagram

Hardware Design Reference

The following diagram shows a typical application design:

Mechanical Size

Pin Assignments

Cautions

Reflow soldering

Reflow soldering is a vitally important step in the SMT process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. The parameters of certain components will also directly impact the temperature curve selected for this step in the process.

• The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, ④cooling. The profile describes the ideal temperature curve of the top layer of the PCB.
• During reflow, modules should not be above 260°C and not for more than 30 seconds.

Usage Condition Notes

• Follow the conditions written in this specification, especially the recommended condition ratings about the power supply applied to this product.
• The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47Uf directly at the module).
• Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
• The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
• This product away from other high frequency circuits.
• Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
• Avoid assembly and use of the target equipment in conditions where the products’ temperature may exceed the maximum tolerance.
• This product should not be mechanically stressed when installed.
• Do not use dropped products.
• Do not touch, damage or soil the pins.
• Pressing on parts of the metal shield or fastening objects to the metal shield will cause damage.

Storage Notes

• The module should not be stressed mechanically during storage.
• Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected:
  • Storage in salty air or in an environment with a high concentration of corrosive gas.
  • Storage in direct sunlight
  • Storage in an environment where the temperature may be outside the range specified.
  • Storage of the products for more than one year after the date of delivery storage period.
• Keep this product away from water, poisonous gas and corrosive gas.
• This product should not be stressed or shocked when transported.

Revision History

4F,Buidling2, Guanghui Technology Park,
MinQing Rd, Longhua, Shenzhen, Guangdong, China
Tel:86-755-23573370-829
Support_lora@mokotechnology.com
https://www.mokosmart.com

References

• Your IoT Devices ODM & JDM Partner - MOKOSmart #1 Smart Device Solution in China
• Your IoT Devices ODM & JDM Partner - MOKOSmart #1 Smart Device Solution in China
• Your IoT Devices ODM & JDM Partner - MOKOSmart #1 Smart Device Solution in China

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