MOKO MKL110BC Geolocation Module Owner’s Manual

: June 9, 2024
: MOKO

Table of Contents

MOKO MKL110BC Geolocation Module
Instruction
Specifications
Mechanical Size
Circuit Design
FCC STATEMENT
Documents / Resources

MOKO MKL110BC Geolocation Module

Instruction

Product Introduction

MKL110BC is a fusion positioning module based on LoRaWAN communication technology. The hardware mainly integrates Semtech’s LR1110 Edge chip and Nordic’s Nrf series Bluetooth chip, which can provide a variety of positioning technologies including Bluetooth positioning, LP-GPS, and WIFI positioning, as well as low power consumption, long-range communication, and high anti- interference characteristics.
It is an ideal platform for developing various Indoor/outdoor tracking product solutions, which can help users reduce development time and development costs.

Features and Benefits

Cost-effective, ultra-low power, and small size
Multi-location technology (WIFI Only RX+Bluetooth+LP GPS)
GNSS (GPS, BeiDou, geostationary) satellite signals Semtech’s LoRa Cloud™ geolocation capabilitiesHigh LoRa transmit power
Sensitivity: -137dBm@SF12 300bps
Max LoRa Tx power: 22dBm
Long range – LoRa range up to 10 km
Bluetooth v5.3 – Nordic nRF52840
BLE RX sensitivity: -96dBm
Built-in TCXO to improve high-frequency stability
Compact footprint and 50 pins with SMT package
Standard shielding cover protection for increased interference immunity
OTA via Bluetooth

Application

Shared scooters/bikes tracking
Tools monitoring for construction site
Cattle tracking
Fleet Management
Boats and Water Vehicles
Smart agriculture
Asset recovery
Inventory management
Asset loss and theft prevention

Specifications

Categories	Parameter	Value
General	Dimension	22.3mm17.1mm2.8mm(With Shield)
Package	SMT
PIN	50 Pin Half-Hole
Additional Feature	Geolocation (WIFI+Bluetooth+LP GPS)
MCU	NRF52840	ARM® Cortex™-M4 32-bit processor
Flash	1MB
RAM	256KB
LoRa Wireless Specification	LoRa Protocol	LoRaWAN V1.0.3
Frequency Plan	EU868/AU915/US915/AS923/IN865/KR920/EU4

33/CN470/CN779/RU864

Mechanical Size

Circuit Design

Block Diagram

PIN No.	Name	Type	Function
1	GND	Power	Ground
2	VDD_nRF	Power	Power Supply
3	P0.28	Digital I/O	General Purpose I/O
AIN4	Analog input 0	SAADC/COMP/LPCOMP input
4	P0.31	Digital I/O	General Purpose I/O
AIN7	Analog input 0	SAADC/COMP/LPCOMP input
5	P0.30	Digital I/O	General Purpose I/O
AIN6	Analog input 0	SAADC/COMP/LPCOMP input
6	P0.07	Digital I/O	General Purpose I/O
7	P0.05	Digital I/O	General Purpose I/O
AIN3	Analog input 0	SAADC/COMP/LPCOMP input
8	P0.27	Digital I/O	General Purpose I/O
9	P0.26	Digital I/O	General Purpose I/O
10	P0.04	Digital I/O	General Purpose I/O
AIN2	Analog input 0	SAADC/COMP/LPCOMP input
11	P0.06	Digital I/O	General Purpose I/O
12	P0.08	Digital I/O	General Purpose I/O
13	P1.08	Digital I/O	General Purpose I/O
14	P0.11	Digital I/O	General Purpose I/O
15	P1.09	Digital I/O	General Purpose I/O
16	P0.12	Digital I/O	General Purpose I/O
17	P0.14	Digital I/O	General Purpose I/O
18	P0.16	Digital I/O	General Purpose I/O
19	P0.18	Digital I/O	General Purpose I/O
RESET	Reset	Reserved for reset
20	P0.17	Digital I/O	General Purpose I/O
21	VBUS	Power	5 V input for USB controller
22	D-	USB	USB D-
23	D+	USB	USB D+
24	P0.13	Digital I/O	General Purpose I/O
25	P0.20	Digital I/O	General Purpose I/O
26	P0.22	Digital I/O	General Purpose I/O
27	P0.24	Digital I/O	General Purpose I/O
28	P1.00	Digital I/O	General Purpose I/O
29	P0.15	Digital I/O	General Purpose I/O
---	---	---	---
30	GND	Power	Ground
31	2G4_RF	RF	Reserved for BLE antenna port
32	GND	Power	Ground
33	P0.21	Digital I/O	General Purpose I/O
34	P1.01	Digital I/O	General Purpose I/O
35	P1.04	Digital I/O	General Purpose I/O
36	GND	Power	Ground
37	SWDIO	Debug	Serial wire debug I/O for debug and programming
38	SWDLCK	Debug	Serial wire debug clock input for

debug and programming

Note: Please refer to Nordic nRF52840 Product Specifications for detailed descriptions and features supported about the Pin assignments.

Cautions

Reflow soldering

Reflow soldering is a vitally important step in the SMT process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. The parameters of certain components will also directly impact the temperature curve selected for this step in the process.

The standard reflow profile has four zones:

preheat,
soak,
reflow, and
cooling. The profile describes the ideal temperature curve of the top layer of the PCB.

During reflow, modules should not be above 260°C and not for more than 30 seconds.

Specification	Value
Temperature Increase Rate	<2.5°C/s
Temperature Decrease Rate	Free air cooling
Preheat Temperature	0-150°C
Preheat Period (Typical)	40-90s
Soak Temp Increase Rate	0.4-1°C/s
Soak Temperature	150-200°C
Soak Period	60-120s
Liquidus Temperature (SAC305)	220°C
Time Above Liquidous	45-90s
Reflow Temperature	230-250°C
Absolute Peak Temperature	260°C

Usage Condition Notes

Follow the conditions written in this specification, especially the recommended condition
ratings about the power supply applied to this product.
The supply voltage has to be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a
ferrite in series connection and a bypass capacitor to ground of at least 47Uf directly at the module).
Take measures to protect the unit against static electricity. If pulses or other transient loads (a
large load applied in a short time) are applied to the products, check and evaluate their
operation before assembly on the final products.
The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or
spikes.
This product away from other high frequency circuits.
Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
Avoid assembly and use of the target equipment in conditions where the products’
temperature may exceed the maximum tolerance.
This product should not be mechanically stressed when installed.
Do not use dropped products.
Do not touch, damage or soil the pins.
Pressing on parts of the metal shield or fastening objects to the metal shield will cause damage.

Storage Notes

The module should not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics of
the product, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas.
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range specified.
Storage of the products for more than one year after the date of delivery storage period.
Keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.

FCC STATEMENT

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference, and
this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

FCC Radiation Exposure Statement

The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden.
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AO94 MKL110BC Or Contains FCC ID: 2AO94-MKL110BC”

When the module is installed inside another device, the user manual of this device must contain below warning statements:

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference, and
This device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in this manual, include:
This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
MOKO TECHNOLOGY LTD.
4F, Buidling2, Guanghui Technology Park, MinQing Rd, Longhua, Shenzhen, Guangdong, China
Tel:86 755 23573370 829
Support_[email protected]
https://www.mokosmart.com
www.mokosmart.com

Documents / Resources

| MOKO MKL110BC Geolocation Module [pdf] Owner's Manual
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