KYOCERA 5861 Series 0.35mm Pitch Board to Board Connector Instruction Manual

No. : 205-03-300
INSTRUCTION MANUAL
5861Series
0.35mm Pitch Board-to-Board Connector
KYOCERA Corporation

OUTLINE

Series 5861 connector is a board-to-board connector with 0.35mm pitch designed to miniaturize outer dimension for high-density mounting.

PART NAMES AND MODEL NUMBERS

PART NAMES

1. Plug

2. Receptacle

MODEL NUMBERS

1. Plug

(2) Receptacle

PRECAUTIONS IN HANDLING

USING FOR BOARD-TO-BOARD CONNECTION

1. When the printed circuit boards on which connectors are mounted were fixed by using screw, the mated connector could be twisted due to variations in dimensions of such as screw holes. So great attention should be given not to twist connectors when fixing the boards.
   

2. When connectors are mounted off-center of the printed circuit board, or when the printed circuit boards to be connected are rather large, mating may tilt. In order to avoid tilting, it is recommended that the printed circuit boards are fixed by the spacer and something that generates a force to retain the proper mated condition.
   

USING FOR BOARD-TO-FPC CONNECTION

1. Please make sure to attach reinforcing board to FPC’s back so that it will relieve the product from the stress caused by connector insertion /extraction．
   Such reinforcing board should be bigger than our product and its suitable thickness should be decided through actual test．
   In addition, the thickness of FPC+reinforcing board recommends 0.3mm or more from our check result. (Our condition is FPC:0.1mm + heat adhesive line:0.05mm

• SUS Supporting Tape 0.15mm)
  

  2. When such possibility as the product may fall receive any impact or reaction force from being thrashed is expected and then it is recommended to fix them in the direction of engagement．
     

MOUNTING

1. Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tail．

2. When the connectors are automatically mounted please apply cream soldering printing in the process in accordance with the pattern chart of our recommendation．

3. For the soldering through infrared reflow please apply our recommended temperature and profile condition as the chart below．(Solder : Sn-3.0Ag-0.5Cu)
   ※The temperature should be measured on the surface of connector.

4. For the soldering through N2 reflow please apply our recommended temperature and profile condition as the chart below under the condition of 1000 ppm of O2 level．And, the reflow recommend 2 times or less. (Solder : Sn-3.0Ag-0.5Cu)

5. When the mounting condition differs from those of our profile in any way please make sure that you do not observe any deformity nor color change with the mounted connector beforehand.

6. Please do not apply flux onto the tail and PC board, when it is soldered manually, Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact．
   Also avoid giving any stress to the product with the soldering iron. It could deform tail or melt insulator.

7. Since the contacting areas of the plug connector are exposed to the outer side, pay attention that the areas would not be splashed with flux in the soldering process.

8. There is no influence in the product performance thought discoloration might be seen in the soldering tail after mounting.

9. There is no influence in the product performance though the tail surface doesn’t get wet with solder after mounting.

ENGAGEMENT

1. If something touches the contact points or with some foreign object, the spring could be deformed．

2. We minimized the thickness of this product to achieve downsizing and light weightiness, Because of this, distorted attachment at engagement /disengagement could cause destruction, terminal deformity, plating detachment on the tail.
   If it is required to unmate connectors with uneven pressure, apply such pressure to the long side of the connector. Applying the uneven pressure to the long side of the connector may cause doomed warpage or destruction on the connector depending on the PCB/FPC thickness. Please make sure beforehand when you apply the uneven pressure to the long side of the connector.
   

3. Align connectors before mating, and apply pressure on plug and receptacle connectors so that they would be mated straight in parallel. Do not apply an excessive pressure when aligning them, or mold goods could be damaged or broken.

4. Because the connector is very small, be careful not to move the plug or receptacle connector when aligning them.

5. The connector is impossible to support the PCB by itself. Without other supporting objects, imperfect mating , peeling of tails or contacting failure may be caused. As supporting objects, use spacers fixed by screws.

CHECKER

If the connector targeted in this manual is used as a checker, please be informed that durability may not be high enough or the product to be checked could be damaged excessively.
Please contact us when you request our specified plug or receptacle for the checker.

HOT SWAP

Insertion and separation under live current shall not be done.

PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK

This series of connector is required to be mounted in the high density due to its 0.35mm pitches. The connectors mounted in the high density need to be controlled adequate amount of solder in order to prevent failures in the mounting process such as short-circuit caused by solder bridge. For the dimensions of the metal mask opening, therefore, please refer to our recommended dimensions shown in the attached drawing. (For detailed dimensions of the printed circuit board, please refer to our product drawings.)

As dimensions shown in the drawings are our recommendations. Please feel free to contact us if you have any questions and ／or concerns about these dimensions.

5861 Series: 0.35 mm Pitch
Recommended Pad & Stencil size （SIGNAL CONTACT)

REC. MOUNTING LAYOUT

RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE

The following is the recommended dimensions of the pick-up nozzle.

Maximum pressure when the connector is placed on a PCB: 20N

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