BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C User Manual

Datasheet
BDE-BD2564CN
Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C

General Description

BD2564CN is a Bluetooth 5.1 BR/EDR & LE dual mode transceiver module.
The module integrates Bluetooth classic and Bluetooth Low Energy radio TI’s CC2564C, a 26-MHz crystal oscillator, a bandpass filter, and all the passive components at a very affordable cost.
The module provides the best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth low-energy-only solutions. The power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low-energy modes of operation.

The certified and royalty-free Dual-mode Bluetooth 4.2 protocol stack software provides complete Bluetooth BR/EDR and Bluetooth Low Energy sample applications that reduce design effort and ensure a faster time to market.
The module has a very small form factor with dimensions of 7 mm x 7 mm x 1.55 mm.

Key Features

• Bluetooth 5.1 dual mode
•  Bluetooth Basic Rate (BR)
• Enhanced Data Rate (EDR)
• Low Energy (LE)
• BR and EDR features include:
• Up to seven active devices
• Scatternet: Up to three piconets simultaneously, one as master and two as slaves
• Up to two Synchronous Connection Oriented (SCO) links on the same piconet
• Support for all voice air-coding – Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, modified Subband Coding (NBC), and transparent (Uncoded)
• Provide an assisted mode for the HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host processing and power
• Support of multiple Bluetooth profiles with enhanced QoS
•  Low Energy features include:
• Multiple sniff instances tightly coupled to achieve minimum power consumption
• Independent buffering for Low Energy allows large numbers of multiple connections without
• affecting BR or EDR performance
• Built-In coexistence and prioritization handling for BR, EDR, and Low Energy
• Capabilities of link layer topology, Scatternet – can act concurrently as peripheral and central
• Network support for up to 10 devices
• Timeline optimization algorithms to achieve maximum channel utilization
• Best-in-Class Bluetooth (RF) performance (TX power, RX sensitivity, blocking)
• Class 1 TX power up to +12 dBm
• Internal temperature detection and compensation to ensure minimal variation in RF performance over temperature, no external calibration is required
• Improved Adaptive Frequency Hopping (AFH)
• Algorithm with minimum adaptation time
• Longer range, including twice the range of other Low-Energy-Only solutions
• Advanced power management for extended battery life and ease of design
• On-Chip power management, including direct connection to the battery
• Low power consumption for active, standby, and scan Bluetooth modes
• Shutdown and sleep modes to minimize power consumption
• Physical interfaces:
• UART Interface with support for maximum Bluetooth data rates
• UART transport layer (H4) with a maximum rate of 4 Mbps
• Three-Wire UART transport layer (H5) with the maximum rate of 4 Mbps
• Fully programmable Digital Pulse-Code Modulation (PCM) – I2S codec interface
• Flexibility for easy stack integration and validation into MCUs and MPUs
• HCI tester tool to evaluate RF performance of the device and configure service pack
• Antenna: without an antenna
• Size: 7 mm x 7 mm x 1.55 mm (With Shield)
• Standards Conformance
• Bluetooth® SIG
• CE-RED (Europe)
• FCC (US)
• ISED (Canada)
•  Japan (Telec)

Applications

• Mobile Accessories
• Sports and Fitness Applications
• Wireless Audio Solutions
• Set-Top Boxes and Remote Controls
• Toys
• Test and Measurement
• Industrial: Cable Replacement
• Wireless Sensors
• Automotive Aftermarket
• Wellness and Health

Block Diagram

BD2564CN integrates Bluetooth classic and Bluetooth Low Energy radio TI’s CC2564C, a 26-MHz crystal oscillator, a band pass filter and all the passive components at a very affordable cost.
Figure 1-1 shows the block diagram of the module.

Pinout

Table 2-1 describes the definitions of the pins.
Table 2-1. Pin Description

send data when
HCI_CTS is low
2| HCI_TX| DO, PU| HCI UART data transmit
3| HCI_RX| DI, PU| HCI UART data receive
4| HCI_RTS| DO, PU| HCI UART request-to-send. Host can send data when HCI_RTS

is low

5| GND| GND| Power ground
6| NC| –| Not connected
7| GND| DIO| GPIO, Sensor Controller
8| SLOW_CLK_IN| DI| 32.768-kHz clock in, fail-safe
9| GND| GND| Power ground
10| NC| –| Not connected
11| NC| –| Not connected
12| VDD_IN| Power| Main power supply for the module (2.2 to 4.8 V)
13| GND| GND| Power ground
14| BT_ANT| AIO| Bluetooth RF I/O
15| GND| GND| Power ground
16| nSHUTD| DI, PD| Shutdown input (active low)
17| GND| GND| Power ground
18| VDD_IO| Power| I/O power supply (1.8 V nominal)
19| AUD_IN| DI, PD| PCM data input, fail-safe
20| AUD_OUT| DO, PD| PCM data onput, fail-safe
21| AUD_CLK| DIO(Note 1), PD| PCM clock, fail-safe
Pin #| Pin Name| Type| Description
---|---|---|---
22| AUD_FSYNC| DIO, PD| PCM frame sync, fail-safe
23| NC| –| Not connected
24| TX_DBG| DO, PU| Internal debug messages
25| GND| GND| Power ground
26| GND| GND| Power ground
27| GND| GND| Power ground
28| GND| GND| Power ground
29| GND| GND| Power ground
30| GND| GND| Power ground
31| GND| GND| Power ground
32| GND| GND| Power ground
33| GND| GND| Power ground

Note 1: DI stands for Digital Input, DO stands for Digital Output, DIO stands for Digital Input-Output, AIO stands for Analog Input Output;
Note 2: PU stands for internal Pull-Up, PD stands for internal Pull-Down.

Characteristics

All MIN/MAX specification limits are guaranteed by design, production testing and/or statistical characterization. Typical values are based on characterization results at default measurement conditions and are informative only.
Default measurement conditions (unless otherwise specified): VDD_IN = 3.6 V, VDD_IO = 1.8V, TA = 25 ℃. All radio measurements are performed with standard RF measurement equipment.

3.1. Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 3-1. Absolute Maximum Ratings

3.2. Recommended Operating Conditions
Table 3-2. Recommended Operating Conditions 

Mechanical Specifications

4.1. Dimensions
The module dimensions are presented in the following figure:

4.2. PCB Footprint
The footprint for the PCB is presented in the following figure:

 Marking

Ordering Information

Regulation

7.1. FCC Warning

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01

1. List of applicable FCC rules FCC Part 15.247

2. Specific operational use conditions
   This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer’s instruction manual.

3. Limited module procedures Not applicable

4. Trace antenna designs It is “not applicable” as a trace antenna that is not used on the module.

5. RF exposure considerations
   This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This compliance to FCC radiation exposure limits for an uncontrolled environment, and a minimum of 20cm separation between antenna and body.
   The host product manufacturer would provide the above information to end users in their end-product manuals.

6. Antennas
   Antenna 1: Chip antenna; 0.5dBi; 2.402 GHz ~ 2.480GHz
   Antenna 2: Whip antenna; 2.5dBi; 2.402 GHz ~ 2.480GHz
   Antenna 3: Chip antenna; 0.8dBi; 2.402 GHz ~ 2.480GHz

7. Label and compliance information
   The end product must carry a physical label or shall use e-labeling followed by KDB784748D01 and KDB 784748 stating “Contains Transmitter Module FCC ID: 2ABRU-2564C”.

8. Information on test modes and additional testing requirements. For more information on testing, please contact the manufacturer.

9. Additional testing, Part 15 Subpart B disclaimer
   The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.

7.2. FCC Statements

(OEM) The integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore, the module should be transmitting and the evaluation should confirm that the module’s intentional emissions (15C) are compliant (fundamental/out-of-band). Finally, the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101. The integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated” has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as “Contains FCC ID: 2ABRU-2564C “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.” “Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.” The Integrator will be responsible to satisfy SAR/ RF Exposure requirements when the module is integrated into the host device.

7.3. Module statement

The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below.

1. The radio elements have the radio frequency circuitry shielded.
2. The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
3. The module contains power supply regulations on the module.
4. The module contains a permanently attached antenna.
5. The module demonstrates compliance in a stand-alone configuration.
6. The module is labeled with its permanently affixed FCC ID label.
7. The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
8. The module complies with RF exposure requirements.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help

7.4. IC Statements

The final host device, into which this RF Module is integrated” has to be labeled with an auxiliary label stating the IC of the RF Module, such as” Contains transmitter module IC: 25657-2564C
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science, and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause undesired operation of the device.

RF Exposure Warning Statements:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment shall be installed and operated with a minimum distance of 20cm between the radiator & body.

Radio Frequency Exposure Statement for IC:
The device has been evaluated to meet general RF exposure requirements. The device can be used in mobile exposure conditions. The min separation distance is 20cm.

This radio transmitter [IC: 25657-2564C] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.

Revision History

Contacts
Guangzhou BDE Technology Inc.
USA: 67 E Madison St, # 1603A, Chicago, IL 60603, US
Tel: +1-312-379-9589
Website: http://www.bdecomm.com
Email: info@bdecomm.com
China: B2-403, ChuangYi Building, 162 Science Avenue, Huangpu District, Guangzhou 510663, China
Tel: +86-20-28065335
Website: http://www.bdecomm.com
Email: sales@bdecomm.com

References

• BDE Technology Inc.
• BDE Technology Inc.

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