BDE-BLEM203P Bluetooth 5.0 Low Energy Module User Manual
- June 12, 2024
- BDE
Table of Contents
BDE-BLEM203P Bluetooth 5.0 Low Energy Module User Manual
Key Features
-
Bluetooth 5.0 Single-Mode Compliant
-
Powerful ARM Cortex-M3
- Up to 48-MHz Clock Speed
- 275KB of Nonvolatile Memory including 128KB of In-System Programmable Flash
- Up to 28KB of System SRAM, of Which 20KB is Ultra-Low Leakage SRAM
- 8KB of SRAM for Cache or System RAM use
- 2-Pin cJTAG and JTAG Debugging
- Supports Over-The-Air Upgrade (OTA)
- Ultra-Low Power Sensor Controller
- 10 GPIOs
- All Digital Peripheral Pins Can Be Routed to Any GPIO
- Four General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
- 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX
- Continuous Time Comparator
- Ultra-Low-Power Analog Comparator
- Programmable Current Source
- UART
- 2× SSI (SPI, MICROWIRE, TI)
- I2C
- I2S
- Real-Time Clock (RTC)
- AES-128 Security Module
- True Random Number Generator (TRNG)
- Support for Eight Capacitive-Sensing Buttons
- Integrated Temperature Sensor
-
RF Performance
- TX Power: up to 2dBm
- RX Sensitivity: up to -96dBm
-
Communication Range: 60 meters (LOS)
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Antenna: Integrated PCB antenna
-
Size: 16.55mm x 10.8mm x 1.5mm (Without Shielding)
16.55mm x 10.88 mm x 2.3mm (With Shielding) -
Ultra Low Power Consumption:
- Shutdown: 100nA (Wake up on External Events)
- Standby: 1.1uA (RTC Running and RAM/CPU Retention)
- RX Current: 5.9mA
- TX Current @ 0dBm: 6.1mA
-
BQB, FCC, CE, RoHS compliant
Descriptions
BDE-BLEM203P is a Bluetooth 5.0 single-mode compliant Bluetooth low energy module targeted at low power sensors and PC/Phone accessories. It supports BLE 5.0 futures, including 2Mbits and PHY coded.
BDE-BLEM203P highly integrates Bluetooth Low Energy radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application.
It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.
Block Diagram
Applications
- Home and Building Automation
- Industrial
- Retail
- Health and Medical
- Sports and Fitness
- HID
Electrical Characteristics
- Absolute maximum rating
- Recommended operating conditions
Pin Out
Overall Dimensions
Fig. 1 shows the overall dimensions of BDE-BLEM203P. The module measures 16.55mm long by 10.88mm wide by 2.3mm high with the shield.
Module Location for Reference
In order to get a fine performance when integrate the module to your product, it is advised to use the recommended module location to the respective PCB.
- Location in X-Y plane
- Location in Z plane
Typical Solder Reflow Profile
Package Information
Contacts
BDE Technology Inc.
Address: Originality Building B2-403, 162 Science Ave, Huangpu District,
Guangzhou, 510663, China
494 E Thornhill Ln, Palatine, IL 60074, USA
Tel: +86-020-28065335 Fax: +86-020-28065338
Website: www.bdecomm.com Email:
info@bdecomm.com
BDE Technology Inc.
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>