BDE-BLEM203P Bluetooth 5.0 Low Energy Module User Manual

June 12, 2024
BDE

BDE-BLEM203P Bluetooth 5.0 Low Energy Module User Manual

Key Features

  • Bluetooth 5.0 Single-Mode Compliant

  • Powerful ARM Cortex-M3

    • Up to 48-MHz Clock Speed
    • 275KB of Nonvolatile Memory including 128KB of In-System Programmable Flash
    • Up to 28KB of System SRAM, of Which 20KB is Ultra-Low Leakage SRAM
    • 8KB of SRAM for Cache or System RAM use
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-The-Air Upgrade (OTA)
    • Ultra-Low Power Sensor Controller
    • 10 GPIOs
    • All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
    • 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX
    • Continuous Time Comparator
    • Ultra-Low-Power Analog Comparator
    • Programmable Current Source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • Support for Eight Capacitive-Sensing Buttons
    • Integrated Temperature Sensor
  • RF Performance

    • TX Power: up to 2dBm
    • RX Sensitivity: up to -96dBm
  • Communication Range: 60 meters (LOS)

  • Antenna: Integrated PCB antenna

  • Size: 16.55mm x 10.8mm x 1.5mm (Without Shielding)
    16.55mm x 10.88 mm x 2.3mm (With Shielding)

  • Ultra Low Power Consumption:

    • Shutdown: 100nA (Wake up on External Events)
    • Standby: 1.1uA (RTC Running and RAM/CPU Retention)
    • RX Current: 5.9mA
    • TX Current @ 0dBm: 6.1mA
  • BQB, FCC, CE, RoHS compliant

Descriptions

BDE-BLEM203P is a Bluetooth 5.0 single-mode compliant Bluetooth low energy module targeted at low power sensors and PC/Phone accessories. It supports BLE 5.0 futures, including 2Mbits and PHY coded.

BDE-BLEM203P highly integrates Bluetooth Low Energy radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application.

It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

Block Diagram

Block Diagram

Applications

  • Home and Building Automation
  • Industrial
  • Retail
  • Health and Medical
  • Sports and Fitness
  • HID

Electrical Characteristics

  • Absolute maximum rating

Absolute maximum rating

  • Recommended operating conditions

Recommended operating conditions

Pin Out

Table 1

Table 1 Continued

Overall Dimensions

Fig. 1 shows the overall dimensions of BDE-BLEM203P. The module measures 16.55mm long by 10.88mm wide by 2.3mm high with the shield.

Figure 3

Module Location for Reference

In order to get a fine performance when integrate the module to your product, it is advised to use the recommended module location to the respective PCB.

  • Location in X-Y plane

Figure 4-5

  • Location in Z plane

Figure 6

Figure 7

Typical Solder Reflow Profile

Package Information

Contacts

BDE Technology Inc.

Address: Originality Building B2-403, 162 Science Ave, Huangpu District, Guangzhou, 510663, China
494 E Thornhill Ln, Palatine, IL 60074, USA
Tel: +86-020-28065335 Fax: +86-020-28065338
Website: www.bdecomm.com Email: info@bdecomm.com

BDE Technology Inc.

References

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