infineon EVAL-IHW65R62EDS06J Evaluation Board User Guide

Infineon EVAL-IHW65R62EDS06J Evaluation Board

Product Information

• The EVAL-IHW65R62EDS06J is an evaluation board designed for induction heating applications using the new 650 V reverse-conducting R6 family of IGBTs. This board features Infineon’s level-shift EiceDRIVERTM ICs based on Infineon SOI technology and is capable of resonant switching applications up to 100 kHz.
• The design of the evaluation board was performed with respect to the environmental conditions described in the user guide, but it was not qualified in terms of manufacturing, lifetime, or over the full range of ambient operating conditions. The boards provided by Infineon are not subject to full production tests. Evaluation boards are intended to be used under laboratory conditions and by trained specialists only.
• The intended audience for this board includes engineers who want to learn how to use the Infineon reverse-conducting IGBTs in combination with EiceDRIVERTM 2ED2x families, experienced design engineers who design circuits with Infineon EiceDRIVERTM and IGBTs, and design engineers who develop power electronic devices such as inverters.

Product Usage Instructions

• Before using the EVAL-IHW65R62EDS06J, please read the Important Notice, Safety Precautions, and Warnings provided in the user guide available on the Infineon website.
• This board is designed for evaluation and measurement of characteristics and proof of data sheet specifications during design-in. The PCB and auxiliary circuits are not optimized for the final customer design.
• When using the board, it is important to note that Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions.
• Therefore, it is recommended to use this board under laboratory conditions and by trained specialists only.
• For more information on the functionality and key features of the R6 IGBTs in combination with the Infineon level-shift EiceDRIVERTM ICs, please refer to the user guide available on the Infineon website.

EVAL-IHW65R62EDS06J

• Evaluation board of 650 V reverse conduting IGBT for induction heating
  application

IHW40N65R6, 2ED21824S06J, 2ED21844S06J, 2ED2181S06F, 2ED2504S06F

About this document

Scope and purpose

• The induction heating, half-bridge evaluation board EVAL-IHW65R62EDS06J features the new 650 V reverse-conducting R6 family of IGBTs, specifically designed for induction heating and resonant switching applications up to 100 kHz. This user guide demonstrates the functionality and key features of the R6 IGBTs in combination with the Infineon level-shift EiceDRIVER™ ICs based on the Infineon SOI technology.
• The design of the evaluation board EVAL-IHW65R62EDS06J was performed with respect to the environmental conditions described in this document. The design was tested as described in this document, but not qualified in terms of manufacturing, lifetime or over the full range of ambient operating conditions. The boards provided by
• Infineon are not subject to full production tests.
• Evaluation boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD). Evaluation boards are intended to be used under laboratory conditions, and by trained specialists only.

Intended audience

• Engineers who want to learn how to use the Infineon reverse-conducting IGBTs in combination with EiceDRIVER™ 2ED2x families
• Experienced design engineers who design circuits with Infineon EiceDRIVER™ and IGBTs
• Design engineers who develop power electronic devices, such as inverters

Evaluation board

• This board will be used during design-in, for evaluation and measurement of characteristics, and proof of data sheet specifications.

Note: PCB and auxiliary circuits are NOT optimized for final customer design.

Important notice

• Evaluation Boards and Reference Boards” shall mean products embedded on a printed circuit board (PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration, reference and evaluation boards, kits and design (collectively referred to as “Reference Board”).

• Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards provided by Infineon Technologies. The design of the

• Evaluation Boards and Reference Boards has been tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime.

• The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD).

• Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for evaluation and testing purposes. In particular, they shall not be used for reliability testing or production. The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards
  (including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the country in which they are operated by the customer. The customer shall ensure that all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant requirements and standards of the country in which they are operated.

• The Evaluation Boards and Reference Boards as well as the information provided in this document are addressed only to qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the terms and conditions set forth in this document and in other related documentation supplied with the respective

Evaluation Board or Reference Board.

• It is the responsibility of the customer’s technical departments to evaluate the suitability of the Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness and correctness of the information provided in this document with respect to such application.
• The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not cause any harm to persons or third party property.
• The Evaluation Boards and Reference Boards and any information in this document is provided “as is” and Infineon Technologies disclaims any warranties, express or implied, including but not limited to warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or for merchantability.
• Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation Boards and Reference Boards and/or from any information provided in this document. The customer is obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or damages arising out of or resulting from any use thereof.
• Infineon Technologies reserves the right to modify this document and/or any information provided herein at any time without further notice.

Safety precautions

Note: Please note the following warnings regarding the hazards associated with development systems.

Table 1 Safety precautions

| Warning: The DC link potential of this board is up to 600 VDC. When measuring voltage waveforms by oscilloscope, high voltage differential probes must be used. Failure to do so may result in personal injury or death.
---|---
**| Warning** : The evaluation or reference board contains DC bus capacitors which take time to discharge after removal of the main supply. Before working on the drive system, wait five minutes for capacitors to discharge to safe voltage levels. Failure to do so may result in personal injury or death. Darkened display LEDs are not an

indication that capacitors have discharged to safe voltage levels.

**| Caution: The heat sink and device surfaces of the evaluation or reference board may become hot during testing. Hence, necessary precautions are required while handling the board. Failure to comply may cause injury.
**| Caution: Only personnel familiar with the drive, power electronics and associated machinery should plan, install, commission and subsequently service the system. Failure to comply may result in personal injury and/or equipment damage.
**| Caution:** The evaluation or reference board contains parts and assemblies sensitive to electrostatic discharge (ESD). Electrostatic control precautions are required when installing, testing, servicing or repairing the assembly. Component damage may result if ESD control procedures are not followed. If you are not familiar with electrostatic

control procedures, refer to the applicable ESD protection handbooks and guidelines.

**| Caution:** The evaluation or reference board is shipped with packing materials that need to be removed prior to installation. Failure to remove all packing materials that are unnecessary for system installation may result in overheating or abnormal operating conditions.

The board at a glance

• This user guide (UG-2021-26) describes the evaluation board EVAL-IHW65R62EDS06J that is intended for the product feature evaluation of the Infineon 650 V reverse-conducting R6 in an application circuit. The key elements of the board and the product are listed here.
• Evaluation board in half-bridge configuration with two 650 V R6 IGBTs and one half-bridge gate driver IC

The board at a glance

The board at a glance

• This board is suited for double-pulse testing as well as continuous operation mode. The board has been designed and the components selected to reflect a typical, state-of-the-art induction cooking system based on a half-bridge topology. The main difference with respect to a complete system is the absence of a rectifier, filter stage and auxiliary power supply regulator stage. For this reason the inverter must be supplied with a DC voltage, and an additional low DC voltage (up to 20 V) must be provided to supply the driver IC and the fan.
• The control interface has been designed so that it can be easily connected to the Infineon Boot Kit XMC1300 Microcontroller Unit (MCU) board1,2. Alternatively, it can also be connected to a pulse generator or to other digital circuits.
• The board has been tested with input power up to 3000 W, with an input DC voltage of 250 V and an auxiliary voltage supply of 20 V. Users should note that the auxiliary supply voltage determines the cooling performance of the heat sink and fan assembly, i.e., the output power may be lower in case the axuliary power supply voltage is lower than 20 V.

Delivery content

• The evaluation board EVAL-IHW65R62EDS06J contains the printed circuit board. This board is designed to offer the best layout guidance for incorporating the
• IHW40N65R6 into a half-bridge resonant inverter. The gate driver stage is implemented on four separate daughter cards, each featuring a different driver IC model. Even though this approach is not the most common for typical induction cooking designs, particular care has been taken to optimize the gate driving loops, and therefore to minimize parasitic inductances. Thus the layout of the daughter cards can still be considered as a guideline for implementing the gate driving stage in a real application design.
• The assembled gate resistors are selected for use with IHW40N65R6 and with a gate supply of up to 20 V in the IGBT on-state.
• The evaluation board kit also contains the resonant coil that must be connected to the board. The users can connect different coils to the board to test different load variants. The electrical characterization of the evaluation board was done using the coil that comes with the evaluation board.

Block diagram

Board parameters and technical data

The selected components on the evaluation boards, as well as the gate driver ICs, have maximum ratings and operating conditions to avoid damage to the individual parts and the evaluation board overall.

Table 2 Absolute maximum ratings

Pin/parameter name| Connector| Min| Typ| Max| Unit| Note
---|---|---|---|---|---|---
VCC1| X1+| -0.2| 20

80

| 20

1000

| V

mA

| Auxiliary supply connector/gate driver IC

supply voltage

LIN , HIN| X4.3, X4.8| -0.2| 5| VCC1 + 0.5| V| Input, digital signal
V-HV| X3+| 180| 250| 270| V| Input, high-voltage supply. For voltages above 42 V, a special high-voltage lab environment is strongly

recommended

f sw| | 25| 30| 50| kHz| Maximum switching frequency for continuous operation; careful consideration of power dissipation required for power transistor and

EiceDRIVER™ IC

The PCB assembly is optimized for a VCC1 supply voltage of up to 20 V. Higher supply voltages should be avoided to not damage the IGBTs.

System and functional description

Commissioning

Follow the steps below to set up and power up the board, and to perform initial evaluations.

Prerequisites

• Have isolated low-voltage power supplies ready for input support and logic supply (VCC1) with a current capability of at least 2.5 A for VCC1
• Have a high-voltage power supply ready for HV-DC between X3+ (V-HV) and X3- (HV_GND)
• Have the load coil (~65 µH) ready, or any other coil that is suitable for induction cooking application
• Have the XMC 1300 Boot Kit board ready and programmed (or, as an alternative, a dual-channel pulse-width modulation (PWM) generator for half-bridge PWM input)
• To adapt the circuit to application requirements, resistor or capacitor values can be changed to optimize the performance.
• Attention: Before operating the board, make sure that a gate driver daughter card is properly inserted in the connector X2.

Power-up sequence

1. Connect supply GND to connector X1- and supply VCC1 to connector X1+ with +20 V.
2. The VCC_LED will turn on.
3. Connect the JP104 of the Boot Kit XMC1300 to the connector X4 of the evaluation board, as indicated in Figure 31.
4. Connect the negative terminal of the high-voltage power to connector X3- and the positive terminal to connector X3+.
5. Connect one end of the coil to L1 and the other end to L2.
6. Turn on the power supply with up to 270 V.
7. The HV_LED will turn on.

Safe power-down sequence

1. Turn-off the high-voltage power supply and verify that the HV_LED is off.
2. Check the DC-link voltage with e.g. a digital multimeter or an oscilloscope.
3. Turn-off the other supply voltages (VCC1) and verify that the VCC_LED is off.
4. Alternatively, connect the first output of the signal generator to the digital interface connectors X4.3 (low-side input) and X4.2 (GND) and the second output between X4.8 (high-side input) and X4.2 (GND). Make sure that the outputs of the PWM generator are disabled.

Connection of measurement probes

• The evaluation board offers dedicated measurement points for the IGBT’s gate and collector terminal voltages with respect to the related emitter terminal. The test points are marked with the following labels:
• VCE_LS: c ollector-to-emitter voltage of low-side IGBT
• VGE_LS: gate-to-emitter-voltage of low-side IGBT
• VCE_HS: collector-to-emitter voltage of high-side IGBT
• VGE_HS: gate-to-emitter voltage of high-side IGBT
• Assuming that the oscilloscope ground is connected to the ground of the digital interface (either the Boot Kit XMC1300 or the signal generator), the different voltages can be measured by means of the following probes:
• VCE_LS: “high-voltage” passive probe (with attenuation of 100X or more)
• VGE_LS: “low-voltage” passive probe (with attenuation of 10X or more)
• VCE_HS: differential voltage probe (with attenuation of 100X or more and a a maximum common mode voltage >400 Vdc)
• VGE_HS: differential voltage probe (with attenuation of 10X or more and a a maximum common mode voltage >400 Vdc)
• In addition to the voltage measurements, the evaluation board comes with jumpers to measure directly the current of the IGBT flowing from/to the emitter terminal. The two jumpers, one for the high-side and one for the low-side IGBT, are placed on the bottom side of the board and are suitable to be used with Rogowski coil current probes, as shown in Figure 4.

System design

Schematics

The complete schematics are available on the download section of the Infineon homepage. A log-in is required to download this material.

System design

Layout

Bill of material

The complete bill of material is available on the download section of the Infineon homepage. A log-in is required to download this material.

Table 3: BOM of the most important/critical parts of the evaluation or reference board

S. No.| Ref Designator| Description| Manufacturer| Manufacturer P/N
---|---|---|---|---

8

| C1, C2, C12, C13, C15, C16,

C18, C20

| CAP / CERA / 10uF / 25V / 10% / X7R (EIA) / -55°C to

125°C / 1206(3216) / SMD / –

| TDK

Corporation

| 810-C3216X7R1E106K
2| C3, C9| Capacitor Unpolarized| EPCOS/TDK| 871-B32642B0223J
2| C4, C7| Capacitor Unpolarized| EPCOS/TDK, [NoParam]| 871-B32674D8474K
1| C6| Capacitor Unpolarized| EPCOS/TDK| 871-B32774X4505K000

1

| **** C10| CAP / ELCO / 47uF / 35V /

20% / Aluminium electrolytic

/ -55°C to 105°C / 2.00mm C X

0.50mm W 5.25mm Dia X

12.50mm H / – / –

| Rubycon| 35PX47MEFC5X11
4| C11, C14, C17, C19| Surface Mount Multilayer Ceramic Chip Capacitor| Kemet| C1206C105K3RACTU
8| D1, D2, D3, D4, D5, D6, D7, D8| Standard Diode| Comchip Technology| 1N4148W-7-F
1| FAN1| Fan| | FD4015B4H-AP00
1| H1| Heatsinks for PCB mounting| heatsink| FL38-015
S. No.| Ref Designator| Description| Manufacturer| Manufacturer P/N
---|---|---|---|---
2| HV_LED, VCC_LED| Resistor| Wurth Electronic| 710-150080GS75000
2| L1, L2| Snap In PC Mount-Heavy Duty Screw Terminal, 15 A| Mouser| 534-8174

8

| MP1, MP2, MP3, MP4, MP5, MP6,

MP7, MP8

| Spacer Hexagonal M3| |
1| R1| Resistor/2.2k/1W/2512| | No special

10

| R2, R3, R4, R6,

R7, R8, R9,

R10, R11, R14

| Resistor/3.48k/1W/2512| | No special
2| R5, R15| Resistor/10K/0.25W/1%/1206| | No special
2| R12, R13| Resistor/0R/0805| | No special

8

| R17, R20, R22, R25, R27, R29,

R31, R33

| Resistor/10R/0.25W/1%| | No special

2

| ****

R18, R23

| RES / STD / 51k / 125mW / 1% / 100ppm/K / -55°C to

155°C / 0805 / SMD / –

| 51k| CRCW080551K0FK

2

| ****

T1, T2

| Reverse-conducting IGBT with monolithic body diode, VCE 650V, IC 40A; qualified for industrial applications according to the relevant

tests

| Infineon Technologies| IHW40N65R6

12

| TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11,

TP12

| Testing Point| KEYSTONE,

Wurth Elektronik

|

1

| ****

U1

| Half-bridge, high-voltage, high-speed power MOSFET

and IGBT driver

| Infineon Technologies| 2ED21824S06J

1

| ****

U2

| Half-bridge, high-voltage, high-speed power MOSFET

and IGBT driver

| Infineon Technologies| 2ED21844S06J

1

| ****

U3

| A high-voltage, high-speed power MOSFET and IGBT driver with independent high and low side referenced output channels. The output drivers feature a high-pulse

current buffer stage

| Infineon Technologies| 2ED2304S06F
S. No.| Ref Designator| Description| Manufacturer| Manufacturer P/N
---|---|---|---|---
| | designed for minimum driver

cross-conduction

| |

1

| ****

U4

| A high-voltage, high-speed power MOSFET and IGBT driver with independent high and low side referenced output channels. The output drivers feature a high-pulse current buffer stage designed for minimum driver

cross-conduction

| Infineon Technologies| 2ED2181S06F

2

| ****

X1, X5

| Series 2109 – 2.54mm Horizontal Entry With Rising Clamp Cage Clamp – 0.8mm²

Wires WR-TBL

| Wurth Elektronik| 691 210 910 002

1

| ****

X2

| 1mm Mini-Edge Card Assembly, 16Pins, 8Pins Per

Row, 5.6 Pins Polarized

| Samtec| MEC1-108-02-L-D-A
1| X3| Terminal block, 2 Contacts| Molex| WM23228-ND
1| X4| Female Header, 2×5 Contacts| Samtec| 200-SSM105FDVPTR

Connector details

Table 4: Connectors and pin assignment

–

| VCC1 GND| Positive terminal for auxiliary power supply voltage

Ground/negative terminal for auxiliary power supply voltage

X2| /| –| Connector for gate driver daughter card board
X3| +

–

| V-HV GND| Positive terminal for DC high-voltage supply voltage

Ground/negative terminal for DC high-voltage supply voltage

X4| 1

2

3

4

5

6

7

8

9

10

| NC GND LIN NC NC NC NC HIN NC

NC

| –

Ground

Digital input signal for low-side IGBT

–

–

–

–

Digital input signal for high-side IGBT

–

–

X5| +| FAN| Positive terminal for fan supply
Connector| Pin| Marking/ function| Note
---|---|---|---
| –| GND| Ground/negative terminal for fan supply
L1| /| Coil 1| Coil terminal
L2| /| Coil 2| Coil terminal
VCE_LS| /| /| Measurement points for the VCE of the low-side IGBT
VCE_LS| /| /| Measurement points for the VGE of the low-side IGBT
VCE_HS| /| /| Measurement points for the VCE of the high-side IGBT
VGE_HS| /| /| Measurement points for the VGE of the high-side IGBT

System performance

This section shows examples of switching waveforms using EVAL-IHW65R62EDS06J. The waveforms in Figure 7 represent the low-side IGBT VCE, VGE and IC waveforms, where the system operates at an input power of 3.1 kW, with the provided coil and cooking vessel, suitable for induction cooking. The specification of the coil and vessel assembly are provided in Section 5.2. With an input voltage of 250 V, the switching frequency to achieve 3.1 kW is shown in Figure 7. Finally, EVAl-IHW65R62EDS96J shows a thermal picture of the board operating at the same conditions as in Figure 8.

Appendices

Abbreviations and definitions

Table 5 Abbreviations

Resonant load specification

• The experiment results presented in this document were conducted with the coil provided with the evaluation board, and with cookware suitable for induction cooking systems. As known, the behavior of the power converter is largely dependent on the particular coil and cooking vessel that is used. In particular, the coil inductance, diameter, and distance to the vessel are important factors to consider in the design of an induction cooking system. The design of the resonant coil is not included in the scope of this document. However, in order to provide a reference for the results presented, the details of the resonant coil are shown below. Figure 9 depicts a coil with the dimensions and distance to the vessel that should be maintained when the latter is placed on the coil. Finally, Figure 10 depicts the frequency dependence of the series resistance and inductance values of the coil, without the vessel, and with the vessel positioned on top.

application

Usage of external software to control the XMC

• The EVAL-IHW65R62EDS06J evaluation board does not include any microcontroller. The signals to control the gate driver, and consequently the IGBTs, can be either provided by means of a signal generator or of a microcontroller unit.
• In order to set up and implement the evaluation board more quickly, firmware and a user-interface (UI) have been developed1 that can be used in combination with the Infineon Boot Kit XMC1300 [1] MCU board.
• This chapter provides information on how to program, connect and control the MCU board.

Programming the Boot Kit XMC1300 board

• The firmware on the XMC1300 MCU can be programmed by using the Infineon XMC™ Flasher tool [7]. The user must install the software and connect the Boot Kit XMC1300 board to the computer. Once the connection is established, the file with the firmware (provided as .hex) can be selected and loaded in the MCU by using the button “Program.”
• Connecting the BootKit XMC1300 board
• The connector X4 on the board has been designed to provide an easy connection to the Infineon Boot Kit XMC1300 [1]. A standard 10-wire ribbon cable can be used to connect the evaluation board to the boot kit, as shown in Figure 11. Please ensure that pin X4.1 of the evaluation board is connected to pin 0.8 of the JP104 port
  on the MCU board.

Controlling the BootKit XMC1300 board

• Once the XMC microcontroller on the BootKit XMC1300 is programmed with the provided firmware, it can be controlled by means of a graphical user interface (GUI). The GUI has been developed to provide an easy way to:
• Select the right PWM configuration for each of the gate driver IC models that are provided with the board
• Select and configure the switching frequency, the duty cycle and the dead time between the driving signals of the two IGBTs on the board1.
• The main window of the user interface is shown in Figure 12. It consists of different sections, each dedicated to a specific function.
• Note that for the 2ED21824S06J and the 2ED21844S06J, the minimum dead time is to be set by means of an external resistor. In this case, the software can force a dead-time value only if this is higher than the one set by the hardware. Please refer to the specific gate driver datasheet for further information ([3], [4]).
• Once the BootKit XMC1300 is connected to the computer, the serial communication between the computer and the board can be performed as following (refer to Figure 13):

1. Press “Get Port List” button
   • a. the available COMs are displayed in the drop-down menu
2. Select the “JLink port”
3. Press the “CONNECT” button and check that the bar turns green, and the text “Connected to Port xyz” appears

The user interface provides an easy way to select the right gate driver IC model to configure properly the driving PWM signals generated by the MCU. The model of gate driver must be selected in accordance to the specific daughter card used. To select a gate driver model, the procedure is shown in Figure 14. Changing the gate driver model in the software is allowed only when the system is not running.
Attention: Selecting a gate driver model that does not match the model mounted on the board is likely to result in incorrect signal generation, and consequently in a high risk of IGBT failure

The software also allows for an easy change of PWM signals parameters (e.g. frequency, duty cycle, dead time), as shown in Figure 15. The MCU, once programmed for the first time, contains default values that can be retrieved using the button “Read Data.” Any modification of the default parameters can be temporarily set in the MCU by using the button “Set Data.” The temporary setting is valid until the MCU is powered on. In case the MCU is turned off, the values of the parameters return to the default values. The user can always save new default values in the MCU flash memory by using the button “Write Data.

Table 6 lists and describes the PWM parameters that can be configured. Note that some parameters are related to each other (e.g. switching frequency is the reciprocal of the switching period), so they cannot be changed independently.
Table 6 Explanation of PWM parameters

• At any time, the given parameter configuration of the GUI can also be saved in the computer and loaded later.
• This may be particularly convenient if a given test configuration has to be reused multiple times. To save and load the configuration, refer to Figure 16. This figure also shows how to set the limits for the PWM parameters, which is particularly useful to prevent entering unwanted values accidentally.

• Once the MCU has been properly set, the generation of the PWM signals can be enabled or disabled by pressing the START and STOP buttons.
• Additionally, the user interfaces provide an additional control section that is used for:
• Providing visual feedback on whether the PWM signals are being generated
• Setting the PWM signals to be operated only for a limited number of pulses (e.g. to perform a start-up test of the system)
• Enabling/disabling the MCU to output the signals (this option can be useful to verify the idle states of the IGBT driving signals)

References

1. https://www.infineon.com/cms/en/product/evaluation-boards/kit_xmc13_boot_001/
2. https://www.infineon.com/dgdl/Infineon-IHW40N65R6-DataSheet-v01_20-EN.pdf?fileId=5546d46277fc7439017826e19dad7275
3. https://www.infineon.com/dgdl/Infineon-2ED2182-4-S06F-J-DataSheet-v02_21-EN.pdf?fileId=5546d4626cb27db2016cb8d7368a29e3
4. https://www.infineon.com/dgdl/Infineon-2ED2184-4-S06F-J-DataSheet-v02_21-EN.pdf?fileId=5546d4626cb27db2016cb8d76cf229fb
5. https://www.infineon.com/dgdl/Infineon-2ED2304S06F-DataSheet-v02_07-EN.pdf?fileId=5546d46264a8de7e0164d5356ddb3158
6. https://www.infineon.com/dgdl/Infineon-2ED2181-4-S06F-J-DataSheet-v02_21-EN.pdf?fileId=5546d4626cb27db2016cb8d75bd229f3
7. https://softwaretools.infineon.com/tools/com.ifx.tb.tool.xmcflasher2

Revision history

Trademarks
All referenced product or service names and trademarks are the property of their respective owners.

• Edition 2021-10-04 Published by
• Infineon Technologies AG 81726 Munich, Germany
• © 2021 Infineon Technologies AG. All Rights Reserved.
• Do you have a question about this document?
• Email:erratum@infineon.com
• Document reference UG-2021-26
• For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( www.infineon.com ).

WARNINGS

• Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon
• Technologies office.
• Except as otherwise explicitly approved by Infineon
• Technologies in a written document signed by authorized representatives of Infineon
• Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.

References

• Semiconductor & System Solutions - Infineon Technologies
• Semiconductor & System Solutions - Infineon Technologies

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