Microsemi SmartFusion2 MSS DDR Controller Configuration User Guide
- June 10, 2024
- Microsemi
Table of Contents
SmartFusion2 MSS
DDR Controller Configuration
Libero SoC v11.6 and later
Introduction
The SmartFusion2 MSS has an embedded DDR controller. This DDR controller is
intended to control an off-chip DDR memory. The MDDR controller can be
accessed from the MSS as well as from the FPGA fabric. In addition, the DDR
controller can also be bypassed, providing an additional interface to the FPGA
fabric (Soft Controller Mode (SMC)).
To fully configure the MSS DDR controller, you must:
- Select the datapath using the MDDR Configurator.
- Set the register values for the DDR controller registers.
- Select the DDR memory clock frequencies and FPGA fabric to MDDR clock ratio (if needed) using the MSS CCC Configurator.
- Connect the controller’s APB configuration interface as defined by the Peripheral Initialization solution. For the MDDR Initialization circuitry built by System Builder, refer to the “MSS DDR Configuration Path” on page 13 and Figure 2-7.
You can also build your own initialization circuitry using standalone (not by System Builder) Peripheral Initialization. Refer to the SmartFusion2 Standalone Peripheral Initialization User Guide.
MDDR Configurator
The MDDR Configurator is used to configure the overall datapath and the external DDR Memory Parameters for the MSS DDR controller.
The General tab sets your Memory and Fabric Interface settings (Figure 1-1).
Memory Settings
Enter the DDR Memory Settling Time. This is the time the DDR memory requires
to initialize. The default value is 200 us. Refer to your DDR Memory Data
Sheet for the correct value to enter.
Use Memory Settings to configure your memory options in the MDDR.
- Memory Type – LPDDR, DDR2, or DDR3
- Data Width – 32-bit, 16-bit or 8-bit
- SECDED Enabled ECC – ON or OFF
- Arbitration Scheme – Type-0, Type -1, Type-2,Type-3
- Highest Priority ID – Valid values are from 0 through 15
- Address Width (bits) – Refer to your DDR Memory Data Sheet for the number of row, bank, and column address bits for the LPDDR/DDR2/DDR3 memory you use. select the pull-down menu to choose the correct value for rows/banks/columns as per the data sheet of the LPDDR/DDR2/DDR3 memory.
Note: The number in the pull-down list refers to the number of Address bits, not the absolute number of rows/banks/columns. For example, if your DDR memory has 4 banks, select 2 (2 ²=4) for banks. If your DDR memory has 8 banks, select 3 (2³ =8) for banks.
Fabric Interface Settings
By default, the hard Cortex-M3 processor is set up to access the DDR
Controller. You can also allow a fabric Master to access the DDR Controller by
enabling the Fabric Interface Setting checkbox. In this case, you can choose
one of the following options:
- Use an AXI Interface – The fabric Master accesses the DDR Controller through a 64-bit AXI interface.
- Use a Single AHBLite Interface – The fabric Master accesses the DDR Controller through a single 32-bit AHB interface.
- Use two AHBLite Interfaces – Two fabric Masters access the DDR Controller using two 32-bit AHB interfaces.
The configuration view (Figure 1-1) updates according to your Fabric Interface selection.
I/O Drive Strength (DDR2 and DDR3 only)
Select one of the following drive strengths for your DDR I/Os:
- Half Drive Strength
- Full Drive Strength
Libero SoC sets the DDR I/O Standard for your MDDR system based on your DDR
Memory type and I/O Drive Strength (as shown in Tab le 1-1).
Table 1-1 • I/O Drive Strength and DDR Memory Type
| DDR Memory Type | Half Strength Drive | Full Strength Drive |
|---|---|---|
| DDR3 | SSTL15I | SSTL15II |
| DDR2 | SSTL18I | SSTL18II |
| LPDDR | LPDRI | LPDRII |
IO Standard (LPDDR only)
Select one of the following options:
- LVCMOS18 (Lowest Power) for LVCMOS 1.8V IO standard. Used in typical LPDDR1 applications.
- LPDDRI Note: Before you choose this standard, make sure that your board supports this standard. You must use this option when targeting the M2S-EVAL-KIT or the SF2-STARTER-KIT boards. LPDDRI IO standards require that a IMP_CALIB resistor is installed on the board.
IO Calibration (LPDDR only)
Choose one of the following options when using LVCMOS18 IO standard:
- On
- Off (Typical)
Calibration ON and OFF optionally controls the use of an IO calibration block
that calibrates the IO drivers to an external resistor. When OFF, the device
uses a preset IO driver adjustment.
When ON, this requires a 150-ohm IMP_CALIB resistor to be installed on the
PCB.
This is used to calibrate the IO to the PCB characteristics. However, when set
to ON, a resistor needs to be installed or the memory controller will not
initialize.
For more information, refer to AC393-SmartFusion2 and IGLOO2 Board Design
Guidelines Application
Note and the SmartFusion2 SoC FPGA High Speed DDR Interfaces User Guide.
MDDR Controller Configuration
When you use the MSS DDR Controller to access an external DDR Memory, the DDR Controller must be configured at runtime. This is done by writing configuration data to dedicated DDR controller configuration registers. This configuration data is dependent on the characteristics of the external DDR memory and your application. This section describes how to enter these configuration parameters in the MSS DDR controller configurator and how the configuration data is managed as part of the overall Peripheral Initialization solution.
MSS DDR Control Registers
The MSS DDR Controller has a set of registers that need to be configured at
runtime. The configuration values for these registers represent different
parameters, such as DDR mode, PHY width, burst mode, and ECC. For complete
details about the DDR controller configuration registers, refer to the
SmartFusion2 SoC FPGA High Speed DDR Interfaces User’s Guide.
MDDR Registers Configuration
Use the Memory Initialization (Figure 2-1, Figure 2-2, and Figure 2-3) and
Memory Timing (Figure 2-4) tabs to enter parameters that correspond to your
DDR Memory and application. Values you enter in these tabs are automatically
translated to the appropriate register values. When you click a specific
parameter, its corresponding register is described in the Register Description
pane (lower portion in Figure 1-1 on page 4).
Memory Initialization
The Memory Initialization tab allows you to configure the ways you want your
LPDDR/DDR2/DDR3 memories initialized. The menu and options available in the
Memory Initialization tab vary with the type of DDR memory (LPDDR/DDR2/DDR3)
you use. Refer to your DDR Memory Data Sheet when you configure the options.
When you change or enter a value, the Register Description pane gives you the
register name and register value that is updated. Invalid values are flagged
as warnings. Figure 2-1, Figure 2-2, and Figure 2-3 show the Initialization
tab for LPDDR, DDR2 and DDR3, respectively.
- Timing Mode – Select 1T or 2T Timing mode. In 1T (the default mode), the DDR controller can issue a new command on every clock cycle. In 2T timing mode, the DDR controller holds the address and command bus valid for two clock cycles. This reduces the efficiency of the bus to one command per two clocks, but it doubles the amount of setup and hold time.
- Partial-Array Self Refresh (LPDDR only). This feature is for power saving for the LPDDR.
Select one of the following for the controller to refresh the amount of memory during a self refresh:
– Full array: Banks 0, 1,2, and 3
– Half array: Banks 0 and 1
– Quarter array: Bank 0
– One-eighth array: Bank 0 with row address MSB=0
– One-sixteenth array: Bank 0 with row address MSB and MSB-1 both equal to 0.
For all other options, refer to your DDR Memory Data Sheet when you configure the options.
Memory Timing
This tab allows you to configure the Memory Timing parameters. Refer to the
Data Sheet of your LPDDR/ DDR2/DDR3 memory when configuring the Memory Timing
parameters.
When you change or enter a value, the Register Description pane gives you the
register name and register value that is updated. Invalid values are flagged
as warnings.
Importing DDR Configuration Files
In addition to entering DDR Memory parameters using the Memory Initialization
and Timing tabs, you can import DDR register values from a file. To do so,
click the Import Configuration button and navigate to the text file containing
DDR register names and values. Figure 2-5 shows the import configuration
syntax.
Note: If you choose to import register values rather than entering them using the GUI, you must specify all necessary register values. Refer to the SmartFusion2 SoC FPGA High Speed DDR Interfaces User’s Guide for details.
Exporting DDR Configuration Files
You can also export the current register configuration data into a text file.
This file will contain register values that you imported (if any) as well as
those that were computed from GUI parameters you entered in this dialog.
If you want to undo changes you have made to the DDR register configuration,
you can do so with Restore Default. Note that this deletes all register
configuration data and you must either re-import or reenter this data. The
data is reset to the hardware reset values.
Generated Data
Click OK to generate the configuration. Based on your input in the General,
Memory Timing and Memory Initialization tabs, the MDDR Configurator computes
values for all DDR configuration registers and exports these values into your
firmware project and simulation files. The exported file syntax is shown in
Figure 2-6.
Firmware
When you generate the SmartDesign, the following files are generated in the
- sys_config.c
- sys_config.h
- sys_config_mddr_define.h – MDDR configuration data.
- Sys_config_fddr_define.h – FDDR configuration data.
- sys_config_mss_clocks.h – MSS clocks configuration
Simulation
When you generate the SmartDesign associated with your MSS, the following
simulation files are generated in the
- test.bfm – Top-level BFM file that is first “executed” during any simulation that exercises the SmartFusion2 MSS’ Cortex-M3 processor. It executes peripheral_init.bfm and user.bfm, in that order.
- peripheral_init.bfm – Contains the BFM procedure that emulates the CMSIS::SystemInit() function run on the Cortex-M3 before you enter the main() procedure. It essentially copies the configuration data for any peripheral used in the design to the correct peripheral configuration registers and then waits for all the peripherals to be ready before asserting that the user can use these peripherals.
- MDDR_init.bfm – Contains BFM write commands that simulate writes of the MSS DDR configuration register data you entered (using the Edit Registers dialog above) into the DDR Controller registers.
- user.bfm – Intended for user commands. You can simulate the datapath by adding your own BFM commands in this file. Commands in this file will be “executed” after peripheral_init.bfm has completed.
Using the files above, the configuration path is simulated automatically. You only need to edit the user.bfm file to simulate the datapath. Do not edit the test.bfm, peripheral_init.bfm, or MDDR_init.bfm files as these files are re- created every time your root design is re-generated.
MSS DDR Configuration Path
The Peripheral Initialization solution requires that, in addition to
specifying MSS DDR configuration register values, you configure the APB
configuration data path in the MSS (FIC_2). The SystemInit() function writes
the data to the MDDR configuration registers via the FIC_2 APB interface.
Note: If you are using System Builder the configuration path is set and
connected automatically.
To configure the FIC_2 interface:
- Open the FIC_2 configurator dialog (Figure 2-7) from the MSS configurator.
- Select the Initialize peripherals using Cortex-M3 option.
- Make sure that the MSS DDR is checked, as are the Fabric DDR/SERDES blocks if you are using them.
- Click OK to save your settings. This will expose the FIC_2 configuration ports (Clock, Reset, and APB bus interfaces), as shown in Figure 2-8.
- Generate the MSS. The FIC_2 ports (FIC_2_APB_MASTER, FIC_2_APB_M_PCLK and FIC_2_APB_M_RESET_N) are now exposed at the MSS interface and can be connected to the CoreConfigP and CoreResetP as per the Peripheral Initialization solution specification.
For complete details on configuring and connecting the CoreConfigP and CoreResetP cores, refer to the Peripheral Initialization User Guide.
Port Description
DDR PHY Interface
Table 3-1 • DDR PHY Interface
| Port Name | Direction | Description |
|---|---|---|
| MDDR_CAS_N | OUT | DRAM CASN |
| MDDR_CKE | OUT | DRAM CKE |
| MDDR_CLK | OUT | Clock, P side |
| MDDR_CLK_N | OUT | Clock, N side |
| MDDR_CS_N | OUT | DRAM CSN |
| MDDR_ODT | OUT | DRAM ODT |
| MDDR_RAS_N | OUT | DRAM RASN |
| MDDR_RESET_N | OUT | DRAM Reset for DDR3. Ignore this signal for LPDDR and DDR2 |
Interfaces. Mark it unused for LPDDR and DDR2 Interfaces.
MDDR_WE_N| OUT| DRAM WEN
MDDR_ADDR[15:0]| OUT| Dram Address bits
MDDR_BA[2:0]| OUT| Dram Bank Address
MDDR_DM_RDQS ([3:0]/[1:0]/[0])| INOUT| Dram Data Mask
MDDR_DQS ([3:0]/[1:0]/[0])| INOUT| Dram Data Strobe Input/Output – P Side
MDDR_DQS_N ([3:0]/[1:0]/[0])| INOUT| Dram Data Strobe Input/Output – N Side
MDDR_DQ ([31:0]/[15:0]/[7:0])| INOUT| DRAM Data Input/Output
MDDR_DQS_TMATCH_0_IN| IN| FIFO in signal
MDDR_DQS_TMATCH_0_OUT| OUT| FIFO out signal
MDDR_DQS_TMATCH_1_IN| IN| FIFO in signal (32-bit only)
MDDR_DQS_TMATCH_1_OUT| OUT| FIFO out signal (32-bit only)
MDDR_DM_RDQS_ECC| INOUT| Dram ECC Data Mask
MDDR_DQS_ECC| INOUT| Dram ECC Data Strobe Input/Output – P Side
MDDR_DQS_ECC_N| INOUT| Dram ECC Data Strobe Input/Output – N Side
MDDR_DQ_ECC ([3:0]/[1:0]/[0])| INOUT| DRAM ECC Data Input/Output
MDDR_DQS_TMATCH_ECC_IN| IN| ECC FIFO in signal
MDDR_DQS_TMATCH_ECC_OUT| OUT| ECC FIFO out signal (32-bit only)
Note: Port widths for some ports change depending on the selection of the PHY width. The notation “[a:0]/ [b:0]/[c:0]” is used to denote such ports, where “[a:0]” refers to the port width when a 32-bit PHY width is selected, “[b:0]” corresponds to a 16-bit PHY width, and “[c:0]” corresponds to an 8-bit PHY width.
Fabric Master AXI Bus Interface
Table 3-2 • Fabric Master AXI Bus Interface
| Port Name | Direction | Description |
|---|---|---|
| DDR_AXI_S_AWREADY | OUT | Write address ready |
| DDR_AXI_S_WREADY | OUT | Write address ready |
| DDR_AXI_S_BID[3:0] | OUT | Response ID |
| DDR_AXI_S_BRESP[1:0] | OUT | Write response |
| DDR_AXI_S_BVALID | OUT | Write response valid |
| DDR_AXI_S_ARREADY | OUT | Read address ready |
| DDR_AXI_S_RID[3:0] | OUT | Read ID Tag |
| DDR_AXI_S_RRESP[1:0] | OUT | Read Response |
| DDR_AXI_S_RDATA[63:0] | OUT | Read data |
| DDR_AXI_S_RLAST | OUT | Read Last This signal indicates the last transfer in a |
read burst
DDR_AXI_S_RVALID| OUT| Read address valid
DDR_AXI_S_AWID[3:0]| IN| Write Address ID
DDR_AXI_S_AWADDR[31:0]| IN| Write address
DDR_AXI_S_AWLEN[3:0]| IN| Burst length
DDR_AXI_S_AWSIZE[1:0]| IN| Burst size
DDR_AXI_S_AWBURST[1:0]| IN| Burst type
DDR_AXI_S_AWLOCK[1:0]| IN| Lock type This signal provides additional
information about the atomic characteristics of the transfer
DDR_AXI_S_AWVALID| IN| Write address valid
DDR_AXI_S_WID[3:0]| IN| Write Data ID tag
DDR_AXI_S_WDATA[63:0]| IN| Write data
DDR_AXI_S_WSTRB[7:0]| IN| Write strobes
DDR_AXI_S_WLAST| IN| Write last
DDR_AXI_S_WVALID| IN| Write valid
DDR_AXI_S_BREADY| IN| Write ready
DDR_AXI_S_ARID[3:0]| IN| Read Address ID
DDR_AXI_S_ARADDR[31:0]| IN| Read address
DDR_AXI_S_ARLEN[3:0]| IN| Burst length
DDR_AXI_S_ARSIZE[1:0]| IN| Burst size
DDR_AXI_S_ARBURST[1:0]| IN| Burst type
DDR_AXI_S_ARLOCK[1:0]| IN| Lock Type
DDR_AXI_S_ARVALID| IN| Read address valid
DDR_AXI_S_RREADY| IN| Read address ready
Table 3-2 • Fabric Master AXI Bus Interface (continued)
| Port Name | Direction | Description |
|---|---|---|
| DDR_AXI_S_CORE_RESET_N | IN | MDDR Global Reset |
| DDR_AXI_S_RMW | IN | Indicates whether all bytes of a 64 bit lane are valid for |
all beats of an AXI transfer.
0: Indicates that all bytes in all beats are valid in the burst and the
controller should default to write commands
1: Indicates that some bytes are invalid and the controller should default to
RMW commands
This is classed as an AXI write address channel sideband signal and is valid
with the AWVALID signal.
Only used when ECC is enabled.
Fabric Master AHB0 Bus Interface
Table 3-3 • Fabric Master AHB0 Bus Interface
| Port Name | Direction | Description |
|---|---|---|
| DDR_AHB0_SHREADYOUT | OUT | AHBL slave ready – When high for a write indicates |
the MDDR is ready to accept data and when high for a read indicates that data
is valid
DDR_AHB0_SHRESP| OUT| AHBL response status – When driven high at the end of a
transaction indicates that the transaction has completed with errors. When
driven low at the end of a transaction indicates that the transaction has
completed successfully.
DDR_AHB0_SHRDATA[31:0]| OUT| AHBL read data – Read data from the MDDR slave to
the fabric master
DDR_AHB0_SHSEL| IN| AHBL slave select – When asserted, the MDDR is the
currently selected AHBL slave on the fabric AHB bus
DDR_AHB0_SHADDR[31:0]| IN| AHBL address – byte address on the AHBL interface
DDR_AHB0_SHBURST[2:0]| IN| AHBL Burst Length
DDR_AHB0_SHSIZE[1:0]| IN| AHBL transfer size – Indicates the size of the
current transfer (8/16/32 byte transactions only)
DDR_AHB0_SHTRANS[1:0]| IN| AHBL transfer type – Indicates the transfer type of
the current transaction
DDR_AHB0_SHMASTLOCK| IN| AHBL lock – When asserted the current transfer is
part of a locked transaction
DDR_AHB0_SHWRITE| IN| AHBL write – When high indicates that the current
transaction is a write. When low indicates that the current transaction is a
read
DDR_AHB0_S_HREADY| IN| AHBL ready – When high, indicates that the MDDR is
ready to accept a new transaction
DDR_AHB0_S_HWDATA[31:0]| IN| AHBL write data – Write data from the fabric
master to the MDDR
Fabric Master AHB1 Bus Interface
Table 3-4 • Fabric Master AHB1 Bus Interface
| Port Name | Direction | Description |
|---|---|---|
| DDR_AHB1_SHREADYOUT | OUT | AHBL slave ready – When high for a write indicates |
the MDDR is ready to accept data and when high for a read indicates that data
is valid
DDR_AHB1_SHRESP| OUT| AHBL response status – When driven high at the end of a
transaction indicates that the transaction has completed with errors. When
driven low at the end of a transaction indicates that the transaction has
completed successfully.
DDR_AHB1_SHRDATA[31:0]| OUT| AHBL read data – Read data from the MDDR slave to
the fabric master
DDR_AHB1_SHSEL| IN| AHBL slave select – When asserted, the MDDR is the
currently selected AHBL slave on the fabric AHB bus
DDR_AHB1_SHADDR[31:0]| IN| AHBL address – byte address on the AHBL interface
DDR_AHB1_SHBURST[2:0]| IN| AHBL Burst Length
DDR_AHB1_SHSIZE[1:0]| IN| AHBL transfer size – Indicates the size of the
current transfer (8/16/32 byte transactions only)
DDR_AHB1_SHTRANS[1:0]| IN| AHBL transfer type – Indicates the transfer type of
the current transaction
DDR_AHB1_SHMASTLOCK| IN| AHBL lock – When asserted the current transfer is
part of a locked transaction
DDR_AHB1_SHWRITE| IN| AHBL write – When high indicates that the current
transaction is a write. When low indicates that the current transaction is a
read.
DDR_AHB1_SHREADY| IN| AHBL ready – When high, indicates that the MDDR is ready
to accept a new transaction
DDR_AHB1_SHWDATA[31:0]| IN| AHBL write data – Write data from the fabric
master to the MDDR
Soft Memory Controller Mode AXI Bus Interface
Table 3-5 • Soft Memory Controller Mode AXI Bus Interface
| Port Name | Direction | Description |
|---|---|---|
| SMC_AXI_M_WLAST | OUT | Write last |
| SMC_AXI_M_WVALID | OUT | Write valid |
| SMC_AXI_M_AWLEN[3:0] | OUT | Burst length |
| SMC_AXI_M_AWBURST[1:0] | OUT | Burst type |
| SMC_AXI_M_BREADY | OUT | Response ready |
| SMC_AXI_M_AWVALID | OUT | Write Address Valid |
| SMC_AXI_M_AWID[3:0] | OUT | Write Address ID |
| SMC_AXI_M_WDATA[63:0] | OUT | Write Data |
| SMC_AXI_M_ARVALID | OUT | Read address valid |
| SMC_AXI_M_WID[3:0] | OUT | Write Data ID tag |
| SMC_AXI_M_WSTRB[7:0] | OUT | Write strobes |
| SMC_AXI_M_ARID[3:0] | OUT | Read Address ID |
| SMC_AXI_M_ARADDR[31:0] | OUT | Read address |
| SMC_AXI_M_ARLEN[3:0] | OUT | Burst length |
| SMC_AXI_M_ARSIZE[1:0] | OUT | Burst size |
| SMC_AXI_M_ARBURST[1:0] | OUT | Burst type |
| SMC_AXI_M_AWADDR[31:0] | OUT | Write Address |
| SMC_AXI_M_RREADY | OUT | Read address ready |
| SMC_AXI_M_AWSIZE[1:0] | OUT | Burst size |
| SMC_AXI_M_AWLOCK[1:0] | OUT | Lock type This signal provides additional |
information about the atomic characteristics of the transfer
SMC_AXI_M_ARLOCK[1:0]| OUT| Lock Type
SMC_AXI_M_BID[3:0]| IN| Response ID
SMC_AXI_M_RID[3:0]| IN| Read ID Tag
SMC_AXI_M_RRESP[1:0]| IN| Read Response
SMC_AXI_M_BRESP[1:0]| IN| Write response
SMC_AXI_M_AWREADY| IN| Write address ready
SMC_AXI_M_RDATA[63:0]| IN| Read Data
SMC_AXI_M_WREADY| IN| Write ready
SMC_AXI_M_BVALID| IN| Write response valid
SMC_AXI_M_ARREADY| IN| Read address ready
SMC_AXI_M_RLAST| IN| Read Last This signal indicates the last transfer in a
read burst
SMC_AXI_M_RVALID| IN| Read Valid
Soft Memory Controller Mode AHB0 Bus Interface
Table 3-6 • Soft Memory Controller Mode AHB0 Bus Interface
| Port Name | Direction | Description |
|---|---|---|
| SMC_AHB_M_HBURST[1:0] | OUT | AHBL Burst Length |
| SMC_AHB_M_HTRANS[1:0] | OUT | AHBL transfer type – Indicates the transfer type |
of the current transaction.
SMC_AHB_M_HMASTLOCK| OUT| AHBL lock – When asserted the current transfer is
part of a locked transaction
SMC_AHB_M_HWRITE| OUT| AHBL write — When high indicates that the current
transaction is a write. When low indicates that the current transaction is a
read
SMC_AHB_M_HSIZE[1:0]| OUT| AHBL transfer size – Indicates the size of the
current transfer (8/16/32 byte transactions only)
SMC_AHB_M_HWDATA[31:0]| OUT| AHBL write data – Write data from the MSS master
to the fabric Soft Memory Controller
SMC_AHB_M_HADDR[31:0]| OUT| AHBL address – byte address on the AHBL interface
SMC_AHB_M_HRESP| IN| AHBL response status – When driven high at the end of a
transaction indicates that the transaction has completed with errors. When
driven low at the end of a transaction indicates that the transaction has
completed successfully
SMC_AHB_M_HRDATA[31:0]| IN| AHBL read data – Read data from the fabric Soft
Memory Controller to the MSS master
SMC_AHB_M_HREADY| IN| AHBL ready – High indicates that the AHBL bus is ready
to accept a new transaction
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reliable but are not verified, and Buyer must conduct and complete all
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installed in, any end-products. Buyer shall not rely on any data and
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hereunder is provided “as is, where is” and with all faults, and the entire
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5-02-00377-5/11.16
References
- Microsemi | Semiconductor & System Solutions | Power Matters
- Corporate Contacts | Company
- microsemi.com/index.php?option=com_docman&task=doc_download&gid=129979
- Downloads | SoC | Internal Documents | Microsemi
- Microsemi | Semiconductor & System Solutions | Power Matters
- FPGAs & SoCs Support | Microsemi
- Global Sales and Distribution | Microchip Technology
- Libero® SoC Design Suite Versions 2023.2 to 12.0 | Microchip Technology
- Libero® SoC Design Suite Versions 2023.2 to 12.0 | Microchip Technology
- Libero® SoC Design Suite Versions 2023.2 to 12.0 | Microchip Technology
- Libero® SoC Design Suite Versions 2023.2 to 12.0 | Microchip Technology
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