NEXCOM XPPC 10-200 Wide Screen Touch Computer User Manual

NEXCOM International Co., Ltd.
Intelligent Platform & Services Business Unit
Wide Screen Touch Computer
XPPC 10-200
User Manual
NEXCOM International Co., Ltd.
Published November 2021
www.nexcom.com

PrefaCe

Copyright
This publication, including all photographs, illustrations and software, is protected under international copyright laws, with all rights reserved. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written consent from NEXCOM International Co., Ltd.
Disclaimer
The information in this document is subject to change without prior notice and does not represent commitment from NEXCOM International Co., Ltd. However, users may update their knowledge of any product in use by constantly checking its manual posted on our website: http://www.nexcom.com. NEXCOM shall not be liable for direct, indirect, special, incidental, or consequential damages arising out of the use of any product, nor for any infringements upon the rights of third parties, which may result from such use. Any implied warranties of merchantability or fitness for any particular purpose is also disclaimed.
Acknowledgements
XPPC 10-200 is a trademark of NEXCOM International Co., Ltd. All other product names mentioned herein are registered trademarks of their respective owners.
Regulatory Compliance Statements
This section provides the FCC compliance statement for Class A devices and describes how to keep the system CE compliant.
Declaration of Conformity
FCC
This equipment has been tested and verified to comply with the limits for a Class A digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area (domestic environment) is likely to cause harmful interference, in which case the user will be required to correct the interference (take adequate measures) at their own expense.
CE
The product(s) described in this manual complies with all applicable European Union (CE) directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant parts may be used. Maintaining CE compliance also requires proper cable and cabling techniques.
RoHS Compliance
NEXCOM RoHS Environmental Policy and Status Update
NEXCOM is a global citizen for building the digital infrastructure. We are committed to providing green products and services, which are compliant with European Union RoHS (Restriction on Use of Hazardous Substance in Electronic Equipment) directive 2011/65/EU, to be your trusted green partner and to protect our environment.
RoHS restricts the use of Lead (Pb) < 0.1% or 1,000ppm, Mercury (Hg) < 0.1% or 1,000ppm, Cadmium (Cd) < 0.01% or 100ppm, Hexavalent Chromium (Cr6+) < 0.1% or 1,000ppm, Polybrominated biphenyls (PBB) < 0.1% or 1,000ppm, and Polybrominated diphenyl Ethers (PBDE) < 0.1% or 1,000ppm. In order to meet the RoHS compliant directives, NEXCOM has established an engineering and manufacturing task force to implement the introduction of green products. The task force will ensure that we follow the standard NEXCOM development procedure and that all the new RoHS components and new manufacturing processes maintain the highest industry quality levels for which NEXCOM are renowned.
The model selection criteria will be based on market demand. Vendors and suppliers will ensure that all designed components will be RoHS compliant.
How to recognize NEXCOM RoHS Products?
For existing products where there are non-RoHS and RoHS versions, the suffix “(LF)” will be added to the compliant product name.
All new product models launched after January 2013 will be RoHS compliant.
They will use the usual NEXCOM naming convention.

Warranty and RMA

NEXCOM Warranty Period
NEXCOM manufactures products that are new or equivalent to new in accordance with industry standard. NEXCOM warrants that products will be free from defect in material and workmanship for 2 years, beginning on the date of invoice by NEXCOM.
NEXCOM Return Merchandise Authorization (RMA)

• Customers shall enclose the “NEXCOM RMA Service Form” with the returned packages.
• Customers must collect all the information about the problems encountered and note anything abnormal or, print out any on-screen messages, and describe the problems on the “NEXCOM RMA Service Form” for the RMA number apply process.
• Customers can send back the faulty products with or without accessories (manuals, cable, etc.) and any components from the card, such as CPU and RAM. If the components were suspected as part of the problems, please note clearly which components are included. Otherwise, NEXCOM is not responsible for the devices/parts.
• Customers are responsible for the safe packaging of defective products, making sure it is durable enough to be resistant against further damage and deterioration during transportation. In case of damages occurred during transportation, the repair is treated as “Out of Warranty.”
• Any products returned by NEXCOM to other locations besides the customers’ site will bear an extra charge and will be billed to the customer.

Repair Service Charges for Out-of-Warranty Products
NEXCOM will charge for out-of-warranty products in two categories, one is
basic diagnostic fee and another is component (product) fee.
System Level

• Component fee: NEXCOM will only charge for main components such as SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistor, capacitor.
• Items will be replaced with NEXCOM products if the original one cannot be repaired. Ex: motherboard, power supply, etc.
• Replace with 3rd party products if needed.
• If RMA goods can not be repaired, NEXCOM will return it to the customer without any charge.

Board Level

• Component fee: NEXCOM will only charge for main components, such as SMD chip, BGA chip, etc. Passive components will be repaired for free, ex: resistors, capacitors.
• If RMA goods can not be repaired, NEXCOM will return it to the customer without any charge.

Warnings
Read and adhere to all warnings, cautions, and notices in this guide and the documentation supplied with the chassis, power supply, and accessory modules. If the instructions for the chassis and power supply are inconsistent with these instructions or the instructions for accessory modules, contact the supplier to find out how you can ensure that your computer meets safety and regulatory requirements.
Cautions
Electrostatic discharge (ESD) can damage system components. Do the described procedures only at an ESD workstation. If no such station is available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.
Safety Information
Before installing and using the device, note the following precautions:

• Read all instructions carefully.
• Do not place the unit on an unstable surface, cart, or stand.
• Follow all warnings and cautions in this manual.
• When replacing parts, ensure that your service technician uses parts specified by the manufacturer.
• Avoid using the system near water, in direct sunlight, or near a heating device.
• The load of the system unit does not solely rely for support from the rackmounts located on the sides. Firm support from the bottom is highly necessary in order to provide balance stability.
• The computer is provided with a battery-powered real-time clock circuit. There is a danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions.

Installation Recommendations
Ensure you have a stable, clean working environment. Dust and dirt can get into components and cause a malfunction. Use containers to keep small components separated.
Adequate lighting and proper tools can prevent you from accidentally damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following:

• A Philips screwdriver
• A flat-tipped screwdriver
• A grounding strap
• An anti-static pad

Using your fingers can disconnect most of the connections. It is recommended that you do not use needle-nose pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.
Safety Precautions

1. Read these safety instructions carefully.

2. Keep this User Manual for later reference.

3. Disconnect this equipment from any AC outlet before cleaning. Use a damp cloth. Do not use liquid or spray detergents for cleaning.

4. For plug-in equipment, the power outlet socket must be located near the equipment and must be easily accessible.

5. Keep this equipment away from humidity.

6. Put this equipment on a stable surface during installation. Dropping it or letting it fall may cause damage.

7. The openings on the enclosure are for air convection to protect the equipment from overheating. DO NOT COVER THE OPENINGS.

8. Make sure the voltage of the power source is correct before connecting the equipment to the power outlet.

9. Place the power cord in a way so that people will not step on it. Do not place anything on top of the power cord. Use a power cord that has been approved for use with the product and that it matches the voltage and current marked on the product’s electrical range label. The voltage and current rating of the cord must be greater than the voltage and current rating marked on the product.

10. All cautions and warnings on the equipment should be noted.

11. If the equipment is not used for a long time, disconnect it from the power source to avoid damage by transient overvoltage.

12.  Never pour any liquid into an opening. This may cause fire or electrical shock.

13. Never open the equipment. For safety reasons, the equipment should be opened only by qualified service personnel.

14. If one of the following situations arises, get the equipment checked by service personnel:
    a. The power cord or plug is damaged.
    b. Liquid has penetrated into the equipment.
    c. The equipment has been exposed to moisture.
    d. The equipment does not work well, or you cannot get it to work according to the user’s manual.
    e. The equipment has been dropped and damaged.
    f. The equipment has obvious signs of breakage.

15. Do not place heavy objects on the equipment.

16. The unit uses a three-wire ground cable which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If your outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.

17. CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.

Technical Support and Assistance

1. For the most updated information of NEXCOM products, visit NEXCOM’s website at www.nexcom.com.
2. For technical issues that require contacting our technical support team or sales representative, please have the following information ready before calling:
   – Product name and serial number
   – Detailed information of the peripheral devices
   – Detailed information of the installed software (operating system, version, application software, etc.)
   – A complete description of the problem
   – The exact wordings of the error messages

Warning!

1. Handling the unit: carry the unit with both hands and handle it with care.
2. Maintenance: to keep the unit clean, use only approved cleaning products or clean with a dry cloth.

Conventions Used in this Manual
Warning:
Information about certain situations, which if not observed, can cause personal injury. This will prevent injury to yourself when performing a task.
Caution:
Information to avoid damaging components or losing data.
Note:
Provides additional information to complete a task easily.

Global Service Contact Information

Headquarters
NEXCOM International Co., Ltd.
9F, No. 920, Chung-Cheng Rd.,
ZhongHe District, New Taipei City, 23586,
Taiwan, R.O.C.
Tel: +886-2-8226-7786
Fax: +886-2-8226-7782
www.nexcom.com| Asia
Taiwan
NexAIoT Co., Ltd.
Taipei Office
13F, No.920, Chung-Cheng Rd.,
ZhongHe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: +886-2-8226-7796
Fax: +886-2-8226-7792
Email: sales@nexcom.com.tw
www.nexcom.com.tw
---|---
NexAIoT Co., Ltd.
Taichung Office
16F, No.250, Sec. 2, Chongde Rd.,
Beitun Dist.,
Taichung City 406, R.O.C.
Tel: +886-4-2249-1179
Fax: +886-4-2249-1172
Email: sales@nexcom.com.tw
www.nexcom.com.tw| NexCOBOT Taiwan Co., Ltd.
13F, No.916, Chung-Cheng Rd.,
ZhongHe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: +886-2-8226-7796
Fax: +886-2-8226-7792
Email: sales@nexcom.com.tw
www.nexcom.com.tw
GreenBase Technology Corp.
13F, No.922,Chung-Cheng Rd.,
Zhonghe Dist.,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: +886-2-8226-7786
Fax: +886-2-8226-7900
Email:sales@nexcom.com.tw
www.nexcom.com.tw| China
NEXSEC Incorporated
Floor 5, No.4, No.7 fengxian middle Rd.,
(Beike Industrial Park), Haidian District,
Beijing, 100094, China
Tel: +86-10-5704-2680
Fax: +86-10-5704-2681
Email: sales@nexcom.cn
www.nexcom.cn
NEXCOM
Shanghai
Room 603/604, Huiyinmingzun Plaza Bldg., 1,
No. 609, Yunlin East Rd.,
Shanghai, 200062, China
Tel: +86-21-5278-5868
Fax: +86-21-3251-6358
Email: sales@nexcom.cn
www.nexcom.cn| NEXCOM
United System Service
Room 603/604, Huiyinmingzun Plaza Bldg. 1,
No. 609, Yunlin East Rd.,
Shanghai, 200062, China
Tel: +86-21-5278-5868
Fax: +86-21-3251-6358
Email: renwang@nexcom.com.tw
www.nexcom.cn
NEXCOM
Surveillance Technology Corp.
Floor 5, Building C, ZhenHan Industrial Zone,
GanKeng Community, Buji Street,
LongGang District,
ShenZhen, 518112, China
Tel: +86-755-8364-7768
Fax: +86-755-8364-7738
Email: steveyang@nexcom.com.tw
www.nexcom.cn| NEXGOL
1st Floor, Building B4, Electronic 2nd Area,
(Phoenix Lake Industrial Park), Yongchuan Dist.,
Chongqing City, 402160, China
Tel: +86-23-4960-9080
Fax: +86-23-4966-5855
Email: sales@nexcobot.com
www.nexgol.com/NexGoL
Beijing NexGemo Technology Co.,Ltd.
5th Floor, Gemotech Building, No.1,
Development Rd.,
Changping International
Information Industry Base,
Changping District,
Beijing,102206, China
Tel: +86-10-8190-9399
Fax:+86-10-8190-9456| Japan
NEXCOM Japan
9F, Tamachi Hara Bldg.,
4-11-5, Shiba Minato-ku,
Tokyo, 108-0014, Japan
Tel: +81-3-5419-7830
Fax: +81-3-5419-7832
Email: sales@nexcom-jp.com
www.nexcom-jp.com
Europe
United Kingdom
NEXCOM EUROPE
10 Vincent Avenue,
Crownhill Business Centre,
Milton Keynes, Buckinghamshire
MK8 0AB, United Kingdom
Tel: +44-1908-267121
Fax: +44-1908-262042
Email: sales.uk@nexcom.eu
www.nexcom.eu| America
USA
NEXCOM USA
46665 Fremont Blvd.,
Fremont CA 94538, USA
Tel: +1-510-656-2248
Fax: +1-510-656-2158
Email: sales@nexcom.com
www.nexcomusa.com

Package Contents
Before continuing, verify that the XPPC 10-200 package that you received is complete. Your package should have all the items listed in the following table.

Optional Accessories 1

Optional Accessories 2

Ordering Information
The following below provides ordering information for XPPC 10-200.
XPPC 10-200-i3 (P/N:10W30XPPC19X0)
10.1” WXGA LED P-CAP touch computer, Intel® Tiger Lake Core i3-1115G4E
XPPC 10-200-i5 (P/N:10W30XPPC20X0 )
10.1” WXGA LED P-CAP touch computer, Intel® Tiger Lake Core i5-1145G7E
Panel Mount Kit (P/N: 88W30XPPC02X0)
Open Frame Kit (P/N: 88W30XPPC03X0)

ChaPter 1: ProduCt IntroduCtIon

XPPC 10-200
Overview

Key Features

• 10.1” TFT WXGA 16:10 panel
• 10 points P-Cap multi-touch with slim bezel design
• IP65 protection on the front
• Support: VESA/panel/open frame mount
• 11th Generation Intel® Tiger Lake-UP3 Core™ processor SoC
• 1 x 260-pin DDR4 SO-DIMM up to 32G
• Onboard M.2 2280 Key M with PCIe x4 signal for storage module
• Onboard M.2 2230 Key E for optional Wi-Fi modules
• Support power input 12 VDC

Hardware Specifications
Panel

• LCD size: AUO G-series 10.1”, 16:10 “
• Resolution: WXGA 1280 x 800
• Luminance – LCD panel: 400cd/m2 – XPPC PCAP touch: 360cd/m 2
• Contrast ratio: 800
• LCD color: 16.7M
• Viewing angle: 89 (U), 89 (D), 89 (L), 89 (R)

Touch Screen

• 10 points P-Cap (projected capacitive touch)
• Optical bonding
• Glass surface treatment: AS (Anti-Smudge Coating for easy cleaning)

System

• Onboard 11th Generation Intel®  Core™ i3-1115G4E processor, dual core, 2.2 GHz base frequency, 6M cache (formerly Tiger Lake-UP3 )
• Intel® UHD graphics 630 on i3 processor
• Core™ i5-1145G7E processor, dual core, 1.5 GHz base frequency, 8M cache (by request) Onboard 11th Generation Intel®
• Intel® Iris®eX graphics on i5 processor

Main Memory

• 1 x 260-pin DDR4 SO-DIMM, supports non-ECC, un-buffered memory up to 32G

Storage Device

• 1 x M.2 M key 2280 (support PCIe x4)

Expansion

• 1 x M.2 2230 Key E, support optional Wi-Fi modules

Rear I/O

• 1 x RS232/422/485
• 1 x 12V DC Jack
• 2 x RJ45 Intel® Gigabit LAN port
• 1 x HDMI 2.0
• 4 x USB 3.0
• 1 x Line-out
• LED for power on/off
• Power switch

Front I/O

• 2 x Antenna holes

Mechanical

• Color/material: black silver/metal sheet
• Support
  – VESA mount 100mm x 100mm
  – Panel mount
  – Open frame

Environment

• Vibration
  – IEC 68 2-64
  – 2Grms @ sine, 5~500Hz, 1hr/axis
  – 2.2Grms @ random condition, 5~500Hz, 0.5hr/axis (non-operating)

• Shock
  – IEC 68 2-27
  – 50g peak acceleration (11 msec. duration)

• Temperature
  – Operating temperature: 0°C~50°C
  – Storage temperature: -20°C~60°C

• Operating humidity: 10%~90% relative humidity, non-condensing limits  to be at 90%

Dimensions

• System: 260.3mm x 178.3mm x 50.4mm
• System weight: 2.0kg
• Package: 335mm x 302mm x 160mm
• Package weight: 3kg

Power Supply

• 1 x External 60W AC/DC power adapter with lock (power adapter is included in accessory)
• Input: 100VAC to 240VAC
• Output: DC+12VDC

Certification

• CE (EN55035 + EN55032)
• FCC Class A (EMI part 15B)
• LVD (EN62368-1)

Operating System Support

• Windows 10 64-bit
• Linux

Knowing Your XPPC 10-200 Antenna Holes
The external antenna mounting holes are used to mount and connect optional Wi- Fi antennas.
Power LED
Used to indicate the power status of the system.
Power Switch
Press to power-on or power-off the system.
12V DC Input
Used to plug a DC power cord.
LAN1 & LAN2
Used to connect the system to a local area network.
HDMI 2.0
Used to connect an HDMI interface monitor.
USB 3.0
Used to connect USB 3.0/2.0 devices.
Line-out
Used to connect a headphone or a speaker.
COM
DB9 port used to connect RS232/422/485 compatible devices.
Mechanical Dimensions

ChaPter 2: JumPers and ConneCtors

This chapter describes how to set the jumpers and connectors on the XPPC 10-200 motherboard.
Before You Begin

• Ensure you have a stable, clean working environment. Dust and dirt can get into components and cause a malfunction. Use containers to keep small components separated.

• Adequate lighting and proper tools can prevent you from accidentally damaging the internal components. Most of the procedures that follow require only a few simple tools, including the following:
  – A Philips screwdriver
  – A flat-tipped screwdriver
  – A set of jewelers screwdrivers
  – A grounding strap
  – An anti-static pad

• Using your fingers can disconnect most of the connections. It is recommended that you do not use needle-nosed pliers to disconnect connections as these can damage the soft metal or plastic parts of the connectors.

• Before working on internal components, make sure that the power is off. Ground yourself before touching any internal components, by touching a metal object. Static electricity can damage many of the electronic components. Humid environments tend to have less static electricity than dry environments. A grounding strap is warranted whenever danger of static electricity exists.

Precautions
Computer components and electronic circuit boards can be damaged by discharges of static electricity. Working on computers that are still connected to a power supply can be extremely dangerous.
Follow the guidelines below to avoid damage to your computer or yourself:

• Always disconnect the unit from the power outlet whenever you are working inside the case.
• If possible, wear a grounded wrist strap when you are working inside the computer case. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.
• Hold electronic circuit boards by the edges only. Do not touch the components on the board unless it is necessary to do so. Don’t flex or stress the circuit board.
• Leave all components inside the static-proof packaging that they shipped with until they are ready for installation.
• Use correct screws and do not over tighten screws.

Jumper Settings
A jumper is the simplest kind of electric switch. It consists of two metal pins and a cap. When setting the jumpers, ensure that the jumper caps are placed on the correct pins. When the jumper cap is placed on both pins, the jumper is short. If you remove the jumper cap, or place the jumper cap on just one pin, the jumper is open.
Refer to the illustrations below for examples of what the 2-pin and 3-pin jumpers look like when they are short (on) and open (off).
Two-Pin Jumpers: Open (Left) and Short (Right) Three-Pin Jumpers: Pins 1 and 2 are Short

Locations of the Jumpers and Connectors for XPPC 10-200
The figure below is the top and bottom view of the mainboard used in XPPC 10-200. It shows the locations of the jumpers and connectors.

Jumpers
LCD Panel Voltage Select
Connector type: 1×3 3-pin header, 2.54mm pitch  Connector location: LCD_PWR

Pin|

Settings

---|---
1-2 On| 3.3V
2-3 On| 5V

1-2 On: default
Clear CMOS
Connector type: 1×3 3-pin header, 2.0mm pitch Connector location: CLRCMOS

Pin|

Settings

---|---
1-2 On| Normal
2-3 On| Clear CMOS

1-2 On: default
ATX/AT Mode Select
Connector type: 1×3 3-pin header, 2.0mm pitch Connector location: AT_ATX

Pin|

Settings

---|---
1-2 On| AT
2-3 On| ATX

2-3 On: defaul
Connector Pin Definitions
External I/O Interfaces
MIC and Line Out Connector
Connector location: MIC_LOUT1

Pin| Definition| Pin|

Definition

---|---|---|---
1| LOUT_R| 2| LOUT_JD
3| GND| 4| LOUT_L
5| GND| 6| MIC_R
7| MIC_JD| 8| MIC_L
9| GND| |

Speaker Connector
Connector location: SPK1

Pin| Definition| Pin|

Definition

---|---|---|---
1| OUT_L+| 2| OUT_L-
3| OUT_R+| 4| OUT_R-

System Power Button
Connector type: 1×2 2-pin header Connector location: J2

Pin|

Settings

---|---
1| GND
2| PWRBTN#

Fan Connector
Connector type: 1×4 4-pin header, 1.25mm pitch Connector location: FAN1

Pin| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| +12V
3| FAN SPEED DETECT| 4| FAN SPEED CONTROL

COM Port Connector
Connector type: 1×9 9-pin header, 1.0mm pitch Connector location: COM1 & COM2

Pin| Definition| Pin|

Definition

---|---|---|---
1| RI| 2| CTS
3| RTS| 4| DSR
5| GND| 6| DTR
7| TXD| 8| RXD
9| DCD| |

DC Power Input Jack (+12V only)
Connector location: DCIN2

Pin| Definition| Pin|

Definition

---|---|---|---
1| +12VSUS| 2| +12VSUS
3| GND| 4| GND
5| CGND| |

SATA Connector
Connector location: SATA

Pin| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| SATA_TXP
3| SATA_TXN| 4| GND
5| SATA_RXN| 6| SATA_RXP
7| GND| |

HDMI
Connector type: HDMI port Connector location: HDMI

Pin| Definition| Pin|

Definition

---|---|---|---
1| TX2P| 2| GND
3| TX2N| 4| TX1P
5| GND| 6| TX1N
7| TX0P| 8| GND
9| TX0N| 10| CLKP
11| GND| 12| CLKN
13| NC| 14| NC
15| SCL| 16| SDA
17| GND| 18| +5V
19| HPD| |

LAN Connector
Connector type: RJ45 port with LEDs Connector location: LAN1

Pin| Definition| Pin|

Definition

---|---|---|---
1| MDI_0P| 2| MDI_0N
3| MDI_1P| 4| MDI_1N
5| MDI_2P| 6| MDI_2N
7| MDI_3P| 8| MDI_3N
9| CT| 10| GND
11| LINK1000#| 12| LINK100#
13| ACTLED#| 14| +3VSB

USB 3.0 Connector
Connector type: Dual USB 3.0 ports Connector location: USB3_1 & USB3_2

Pin| Definition| Pin|

Definition

---|---|---|---
1| +5V| 2| USB2_1N
3| USB2_1P| 4| GND
5| USB3_RX1N| 6| USB3_RX1P
7| GND| 8| USB3_TX1N
9| USB3_TX1P| 10| +5V
11| USB2_2N| 12| USB2_2P
13| GND| 14| USB3_RX2N
15| USB3_RX2P| 16| GND
17| USB3_TX2N| 18| USB3_TX2P

Internal Connectors
System Reset Button
Connector type: 1×2 2-pin header, 2.0mm pitch Connector location: JP3

Pin|

Settings

---|---
1| GND
2| RESET#

HDD LED Connector
Connector type: 1×2 2-pin header, 2.0mm pitch Connector location: JP2

Pin

|

Settings

---|---
1| HDD_LED+
2| HDD_LED-

Power LED Connector
Connector type: 1×2 2-pin header, 2.0mm pitch Connector location: JP1

Pin|

Settings

---|---
1| PWR_LED-
2| PWR_LED+

RI Connector
Connector type: 1×5 5-pin header, 2.0mm pitch Connector location: JP5

Pin| Definition| Pin|

Definition

---|---|---|---
1| RI1| 2| COM1_RI
3| +5V| 4| COM1_RI
5| +12V| |

Battery Connector
Connector type: 1×2 2-pin header, 1.25mm pitch Connector location: J1

Pin|

Settings

---|---
1| GND
2| BAT

12V Header
Connector type: 1×2 2-pin header, 2.0mm pitch Connector location: JP4

Pin

|

Settings

---|---
1| 12V
2| GND

USB 2.0
Connector type: Internal dual USB 2.0 ports Connector location: USB2_78P1 & USB2_910P1

Pin| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| USB2N
3| USB2P| 4| USB1N
5| USB1P| 6| +5V

GPIO Connector
Connector location: GPIO1

Pin| Definition| Pin|

Definition

---|---|---|---
1| +5V| 2| GND
3| 12C_CLK| 4| I2C_DATA
5| GPIO_PIN5| 6| GPIO_PIN6
7| GPIO_PIN7| 8| GPIO_PIN8
9| GPIO_PIN9| 10| GPIO_PIN10

SATA Power Connector
Connector type: 1×2 2-pin header, 2.5mm pitch Connector location: PWR1

Pin

|

Definition

---|---
1| +5V
2| GND

80 Debug Port Connector
Connector type: 1×10 10-pin header, 1.0mm pitch

Pin| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| PLTRST#
3| EPSI_CLK| 4| ESPI_CS#
5| ESPI_IO3| 6| ESPI_IO2
7| ESPI_IO2| 8| ESPI_IO0
9| ESPI_RST#| 10| 3.3V

eDP Connector
Connector location: EDP1

Pin

| Definition| Pin|

Definition

---|---|---|---
1| EDP_D3-| 2| EDP_D3+
3| GND| 4| EDP_D2-
5| EDP_D2+| 6| GND
7| EDP_D1-| 8| EDP_D1+
9| GND| 10| EDP_D0-
11| EDP_D0+| 12| GND
13| NC| 14| NC
15| NC| 16| NC
17| GND| 18| +V_PANEL (3.3V or 5V)
19| +V_PANEL (3.3V or 5V)| 20| +V_PANEL (3.3V or 5V)
21| GND| 22| NC
23| GND| 24| GND
25| GND| 26| EDP_AUXP
27| EDP_AUXN| 28| GND
29| GND| 30| GND
31| HPD| 32| EDP_BKLT_EN
33| EDP_BKLT_CTRL| 34| NC
---|---|---|---
35| NC| 36| +12V
37| +12V| 38| +12V
39| +12V| 40| NC

M.2 2280/2242 M-key
Connector location: M2M1

Pin

| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| +3VSB
3| GND| 4| +3VSB
5| PCIE4_RXN| 6| NC
7| PCIE4_RXP| 8| NC
9| GND| 10| M2M_LED#
11| PCIE4_RXN| 12| +3VSB
13| PCIE4_RXP| 14| +3VSB
15| GND| 16| +3VSB
17| PCIE3_RXN| 18| +3VSB
19| PCIE3_RXP| 20| NC
21| GND| 22| NC
23| PCIE3_RXN| 24| NC
25| PCIE3_RXP| 26| NC
27| GND| 28| NC
29| PCIE2_RXN| 30| NC
31| PCIE2_RXP| 32| NC
33| GND| 34| NC
---|---|---|---
35| PCIE2_RXN| 36| NC
37| PCIE2_RXP| 38| DEVSLP
39| GND| 40| NC
41| PCIE1_RXP| 42| NC
43| PCIE1_RXN| 44| NC
45| GND| 46| NC
47| PCIE1_TXN| 48| NC
49| PCIE1_TXP| 50| RESET#
51| GND| 52| CLKREQ#
53| CLK_PCIEN| 54| WAKE#
55| CLK_PCIEP| 56| NC
57| GND| 58| NC
| | |
67| NC| 68|
69| M2M_PEDET| 70| +3VSB
71| GND| 72| +3VSB
73| GND| 74| +3VSB
75| GND| |

M.2 2230 E-key
Connector location: M2E1

Pin

| Definition| Pin|

Definition

---|---|---|---
1| GND| 2| 3VSB
3| USBP| 4| 3VSB
5| USBN| 6| NC
7| GND| 8| NC
9| NC| 10| NC
11| NC| 12| NC
13| NC| 14| NC
15| NC| 16| NC
17| NC| 18| NC
19| NC| 20| NC
21| NC| 22| NC
23| NC| |
| | |
| | 32| NC
33| GND| 34| NC
35| PCIE_TXP| 36| NC
37| PCIE_TXN| 38| NC
---|---|---|---
39| GND| 40| NC
41| PCIE_RXP| 42| NC
43| PCIE_RXN| 44| NC
45| GND| 46| NC
47| CLK_PCIEP| 48| NC
49| CLK_PCIEN| 50| SUSCLK
51| GND| 52| PLTRST#
53| CLKREQ#| 54| BT_DISABLE#
55| WAKE#| 56| WIFI_DISABLE#
57| GND| 58| NC
59| NC| 60| NC
61| NC| 62| NC
63| GND| 64| NC
65| NC| 66| NC
67| NC| 68| NC
69| GND| 70| NC
71| NC| 72| 3VSB
73| NC| 74| 3VSB
75| GND| 76|

Block Diagram

ChaPter 3: system setup

Removing the Top Cover from the Chassis
1. Remove the 7 screws from the top cover, then lift up the system chassis box to access the mainboard.
**** Prior to removing the top cover, make sure the unit’s power is off and disconnected from the power sources to prevent electric shock or system damage.
Installing DDR, SSD, WiFi module
1. With the top cover removed, install DDR, SSD. Installing VESA Mount Kit
1. Align the mounting holes on the VESA mount bracket to the VESA mounting holes on the back of the panel PC, then secure the VESA mount bracket with screws. *** Recommended screws for the VESA mount kit: 4 M4x8 screws.

Installing Open Frame Kit
1. Turn to the rear side of the panel PC and align the mounting holes on the open frame bracket to the open frame mounting holes on the panel PC, then secure the open frame bracket with screws. System Dimensions with Open Frame Kit

Panel Mounting

1. Select a place on the panel where you will mount the panel PC.

2. Cut out a shape on the panel that corresponds to the panel PC’s rear dimensions.
   The thickness of the panel (e.g. steel board, plank, acrylic board, wall, etc.) where you will mount the panel PC must not exceed 9.5mm. If the distance between the front bezel and panel mount hole is too wide, it will not fit the panel mount kit.

3. Slide the panel PC through the hole until it is properly fitted against the panel.

4. Position the mounting clamps along the rear edges of the panel PC. The first and second clamps must be positioned and secured diagonally prior to mounting the rest of the clamps.

5. Tighten the clamp’s screw until it touches the panel.
   

**** Do not overtighten the screws to prevent damaging the Panel PC.

ChaPter 4: BIos setup

This chapter describes how to use the BIOS setup program for XPPC 10-200.
The BIOS screens provided in this chapter are for reference only and may change if the BIOS is updated in the future.
To check for the latest updates and revisions, visit the NEXCOM website at www.nexcom.com.tw.
About BIOS Setup
The BIOS (Basic Input and Output System) Setup program is a menu driven utility that enables you to make changes to the system configuration and tailor your system to suit your individual work needs. It is a ROM-based configuration utility that displays the system’s configuration status and provides you with a tool to set system parameters.
These parameters are stored in non-volatile battery-backed-up CMOS RAM that saves this information even when the power is turned off. When the system is turned back on, the system is configured with the values found in CMOS.
With easy-to-use pull down menus, you can configure such items as:

• Hard drives, diskette drives, and peripherals
• Video display type and display options
• Password protection from unauthorized use
• Power management features

The settings made in the setup program affect how the computer performs. It is important, therefore, first to try to understand all the setup options, and second, to make settings appropriate for the way you use the computer.
When to Configure the BIOS

• This program should be executed under the following conditions:
• When changing the system configuration
• When a configuration error is detected by the system and you are prompted to make changes to the setup program
• When resetting the system clock
• When redefining the communication ports to prevent any conflicts
• When making changes to the Power Management configuration
• When changing the password or making other changes to the security setup

Normally, CMOS setup is needed when the system hardware is not consistent with the information contained in the CMOS RAM, whenever the CMOS RAM has lost power, or the system features need to be changed.
Default Configuration
Most of the configuration settings are either predefined according to the Load Optimal Defaults settings which are stored in the BIOS or are automatically detected and  configured without requiring any actions. There are a few settings that you may need to change depending on your system configuration.
Entering Setup
When the system is powered on, the BIOS will enter the Power-On Self Test (POST) routines. These routines perform various diagnostic checks; if an error is encountered, the error will be reported in one of two different ways:

• If the error occurs before the display device is initialized, a series of beeps will be transmitted.
• If the error occurs after the display device is initialized, the screen will display the error message.

Powering on the computer and immediately pressing allows you to enter Setup.
Press the key to enter Setup:
Legends

Scroll Bar
When a scroll bar appears to the right of the setup screen, it indicates that there are more available fields not shown on the screen. Use the up and down arrow keys to scroll through all the available fields.
Submenu When “ **” appears on the left of a particular field, it indicates that a submenu which contains additional options are available for that field. To display the submenu, move the highlight to that field and press .
BIOS Setup Utility
Once you enter the AMI BIOS Setup Utility, the Main Menu will appear on the screen. The main menu allows you to select from several setup functions and one exit. Use arrow keys to select among the items and press to accept or enter the submenu.
Main
The Main menu is the first screen that you will see when you enter the BIOS Setup Utility. System Date
The date format is , , , . Day displays a day, from Monday to Sunday. Month displays the month, from January to December. Date displays the date, from 1 to 31. Year displays the year, from 2005 to 2099.
System Time
The time format is , , . The time is based on the 24-hour military-time clock. For example, 1 p.m. is 13:00:00. Hour displays hours from 00 to 23. Minute displays minutes from 00 to 59. Second displays seconds from 00 to 59.
Advanced
The Advanced menu allows you to configure your system for basic operation. Some entries are defaults required by the system board, while others, if enabled, will improve the performance of your system or let you set some features according to your preference.
** Setting incorrect field values may cause the system to malfunction. State after G3
Configures which state to enter when power is re-applied after a power failure (G3 state).
Wake on LAN Enable
Enables or disables integrated LAN to wake the system.
CPU Configuration
This section is used to view CPU status and configure CPU parameters. Intel® Virtualization Technology
When this field is set to Enabled, the VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.
Intel® SpeedStepTM
Enables or disables Intel SpeedStep.
Turbo Mode
Enables or disables turbo mode.
C States
Enables or disables CPU power management. Allows CPU to go to C states when it’s not 100% utilized.
RaceConditionResponse Policy
Enables or disables race condition response discovered.
Trusted Computing
This section is used to configure Trusted Platform Module (TPM) settings. Security Device Support
Enables or disables BIOS support for security device. O.S will not show Security Device. TCG EFI protocol and INT1A interface will not be available.
SHA-1 PCR Bank
Enables or disables SHA-1 PCR Bank.
SHA256 PCR Bank
Enables or disables SHA256 PCR Bank
Pending operation
Schedules an operation for the security device.
Platform Hierarchy
Enables or disables Platform Hierarchy.
Storage Hierarchy
Enables or disables Storage Hierarchy.
Endorsement Hierarchy
Enables or disables Endorsement Hierarchy.
Disable Block Sid
Override to allow SID authentication in TCG storage device.
SATA Configuration
This section is used to configure . SATA Controller(s)
Enables or disables the SATA controller.
SATA Mode Selection
Configures the SATA as AHCI mode.
AHCI
This option configures the Serial ATA drives to use AHCI  (Advanced Host Controller Interface). AHCI allows the storage driver to enable the advanced Serial ATA features  which will increase storage performance.
SATA Test Mode
Enables or disables SATA test mode.
F81804 Super IO Configuration
This section is used to configure the serial ports.
Super IO Chip
Displays the Super I/O chip used on the board.
Serial Port 1 Configuration
Serial Port
Enables or disables the serial COM port.
Device Settings
Displays the IO address and IRQ of the serial COM port.
Onboard Serial Port Mode
Select this to change the serial port mode to RS232, RS422, RS485.
Serial Port 2 Configuration
Serial Port
Enables or disables the serial COM port.
Device Settings
Displays the IO address and IRQ of the serial COM port.
Hardware Monitor
This section is used to monitor hardware status such as temperature, fan speed and voltages.
CPU Temperature
Detects and displays the current CPU temperature.
System Temperature
Detects and displays the current system temperature.
Fan1 Speed
Detects and displays the current fan speed.
Vcore
Detects and displays the Vcore voltage
+5V
Detects and displays 5V voltage

AMI Graphic Output Protocol Policy
This section is used to configure the graphics controller settings. Output Select
Configures which display output to use upon boot.
Network Stack Configuration
This section is used to configure the network stack settings.
Network Stack
Enables or disables UEFI network stack.
NVMe Configuration
This section is used to display information on the NVMe devices installed.
Output Select
Configures which display output to use upon boot.
NVMe Device
Self Test Option
Configures the method used for self test.
Short
Short option will take couple of minutes to complete.
Extended
Extended option will take several minutes to complete.
Self Test Action
Configures the items used for self test. Controller Only Test and Controller and NameSpace Test options are available. Selecting Controller and NameSpace Test will take longer to complete.
Run Device Self Test
Run the device self test according to the self test option and action selected. Pressing the Esc key will abort the test.
Security Administrator Password
Select this to reconfigure the administrator’s password.
Secure Boot Secure Boot
Select this to enable or disable Secure Boot. Secure Boot only works when the system runs in user mode.
Secure Boot Mode
Select this to configure the Secure Boot mode.
Standard Custom
Fixed secure boot policy.
Secure boot policy variables can be configured by a physically present user without full authentication.
Boot Bootup NumLock State
This allows you to determine the default state of the numeric keypad. By default, the system boots up with NumLock on wherein the function of the numeric keypad is the number keys. When set to Off, the function of the numeric keypad is the arrow keys
Boot Option Priorities
Adjust the boot sequence of the system. Boot Option #1 is the first boot device that the system will boot from, next will be #2 and so forth.
Save & Exit
Save Changes and Reset
To save the changes and reset, select this field then press . A dialog box will appear. Confirm by selecting Yes.
Discard Changes and Reset
To exit the Setup utility and reboot the system without saving the changes, select this field then press . You may be prompted to confirm again before exiting.
Restore Defaults
To restore the BIOS to default settings, select this field then press .
A dialog box will appear. Confirm by selecting Yes.

Copyright © 2021 NEXCOM International Co., Ltd.
All Rights Reserved.
XPPC 10-200 User Manual

References

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• NEXCOM International Co., LTD.
• NEXCOM - IoT, Robot, Smart Manufacturing, Smart Business, ITS, Network Security
• nexgol.com/NexGoL

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