Lenovo P14s i Gen 3 Laptop User Guide
- June 3, 2024
- Lenovo
Table of Contents
- Lenovo P14s i Gen 3 Laptop
- Downloads
- SECTION I: Platform Overview
- CPU
- Operating Systems
- Memory
- SECTION II: Platform Detail
- SECTION III: Supported Component Detail
- of Cores| 4 P Core+8 E Core| 4 P Core+8 E Core| 4 P Core+8 E Core| 4 P
- of Threads| 16| 16| 16| 16| 20
- Environmental
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Lenovo P14s i Gen 3 Laptop
Downloads
Hardware Maintenance Manual | P14s i Gen 3 HMM |
---|---|
Drivers & Software | P14s i Gen 3 Drivers & Software |
SECTION I: Platform Overview
Description| ThinkPad P14s i
LENOVO’S LIGHTEST MOBILE WORKSTATION
The ThinkPad® P14s i, Lenovo’s most mobile workstation, combines the latest Intel® Core™ processors and NVIDIA® professional graphics, all in a 14-inch chassis. Perfect for highly-mobile power users, the P14s i strikes the balance between power and mobility–allowing students, architects, and engineers to be creative anytime, anywhere.
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CPU
Processor Support | Alder Lake P28 Series Core i5/i7 |
---|---|
Socket Type | BGA |
Operating Systems
Preloaded| Windows 11 Pro 64 (21H2)
Windows 10 Pro (preinstalled through downgrade rights in Windows 11 Pro)
Windows 11 Home 64 (21H2)
Windows 11 Home Single Language 64(21H2) Windows 11 Home Chinese Language Edition 64(21H2)
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| Windows 11/DG10 CMIT Government Edition Ubuntu (Version20.04)
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Supported| Windows 11 Pro 64 (21H2)
Windows 10 Pro (preinstalled through downgrade rights in Windows 11 Pro)
Windows 11 Home 64 (21H2)
Windows 11 Home Single Language 64(21H2) Windows 11 Home Chinese Language Edition 64(21H2) Windows 11/DG10 CMIT Government Edition
Ubuntu (Version20.04)
Memory
Number of DIMM Slots | 1 soldered-down DIMM + 1 DIMM slot |
---|---|
Channels | Single Channel w/ 1 soldered DIMM |
Dual Channel w/ 1 soldered DIMM + 1 add-in DIMM
Type| DDR4
ECC Support| No
Speed| 3200 MHz
Max DIMM Size| 32GB
Max System Memory| 48GB
Min System Memory| 8GB
Soldered Memory| 8GB/16GB
Storage
Storage Slots | 1 x PCIe Gen 4 M.2 2280 |
---|---|
SATA | / |
PCIe | Solid State Drive, OPAL2 PCIe-NVMe Gen 4 M.2 2280- TLC |
SAS | None |
Interface | Yes–>PCIe Gen 4 |
Security | PCIE |
Optional Hard Disk Drive Controllers | OPAL2 for NVMe SSD |
Integrated Graphics | Processor Graphics Intel® Iris Xe (dual RAM channel |
required)
Discrete Graphics| NVIDIA T550
Adapter| None
Bus Interface| PEG
Disclaimers| Dual RAM channel required
Display
Resolutions | FHD+ / UHD+ |
---|
Camera
Resolution | FHD 1080p |
---|---|
Frames per Second | 30 fps |
Focus | Fixed 50cm |
Camera Interface | USB 2.0 |
IR Camera | Yes (optional) (with WWAN co-existance), Hybrid Camera |
Keyboard
Number of Keys | US : 84 / UK : 85 / JP : 89 |
---|---|
Numpad | No |
Size | 100% ISO |
Function Key Features | Yes |
Backlit | Yes |
Keyboard size | CS20 KYB |
Key stroke | 1.5mm |
Key pitch | 19.05mm |
Keyboard backlight | Optional |
Keyboard thickness | Standard |
Touchpad / Fingerprint Reader
TrackPoint Details | COMO TrackPoint module (t5.5mm) |
---|---|
Finger Print Reader Model | Synaprics Metallica 8 × 8 FPR, MoC |
Multi-Touch | Yes |
Resolution | 1000 ppi |
TouchPad/Trackpad thickness | 3.3mm |
TouchPad/Trackpad type | 3 BCP |
Trackpad size | 115mm x 61 mm |
Trackpad material/finish | Mylar surface |
Ports and Connectors
USB | 2x USB-A 3.2 (Gen 1) (1 powered) |
---|---|
Thunderbolt | 2x Thunderbolt 4 (USB 4/USB-C 3.2 Gen 2/DP2.0/PD) |
HDMI | 1x HDMI 2.0b |
Audio Combo Jack | 1x Microphone & Headphone Combo Jack (3.5mm) |
Media Card Reader | N/A |
Smart Card Reader | Yes (optional) |
Power Connector | DC-In |
Docking Port | Docking Via Thunderbolt 4 |
VirtualLink | None |
Network adapter | Gigabit Ethernet (RJ45) |
Power Connector
Main | DC-In |
---|---|
USB-C | 1x Thunderbolt 4 (USB-C/DP/PD) |
Ethernet
Vendor | Intel |
---|---|
Count | x1 |
EEPROM | SPI ROM (Merge with BIOS/MEFW) |
Speeds | 10/100/1000 Mbps |
Functions | Wake On LAN |
MAC Address Pass Through PXE Boot
Flash Over LAN
Connectors| RJ45
WWAN
Model | optional: CAT16/CAT4 with eSIM |
---|
Near Field Communications
Model | Yes, optional |
---|
Audio
Vendor | Realtek |
---|---|
Type | High Definition Audio Codec |
Internal Speaker | Yes, dual speakers |
Connectors | Microphone & Headphone Combo Jack (3.5mm) |
Chipset | ALC3287 |
Number of Channels | 4-channel DAC, 4-channel ADC |
Number of Bits/Audio Resolution | 16/20/24-bit PCM format |
Sampling Rate (Recording/Playback) | n |
Signal to Noise Ratio | 90dB Signal-to-Noise Ratio (A-weighting) for ADC input. |
100dB Signal-to-Noise Ratio (A-weighting) for DAC output
Analog Audio| None
Dolby Digital| Yes
Digital Out (S/PDIF)| No
Speaker Power Rating| 2W@4ohm/ch
Power adapter
Type | 100W AC Adapter | 65W AC Slim Adapter | 65W AC Adapter |
---|---|---|---|
Dimensions | 142cc (28.5 x 46 x 108 mm) 65W (*0) | 142cc (28.5 x 46 x 108 mm) | |
65W (*0) | 142cc (28.5 x 46 x 108 mm) 65W (*0) | ||
Input Voltage | 100-240V | 100-240V | 100-240V |
Security
TPM | Yes, TPM2.0 |
---|---|
Asset ID | Yes |
vPro | Yes on vPro model |
Chassis Information
Color | Black/Storm Grey |
---|---|
Thermal Solutions | Internal Single FAN, Intelligent Cooling |
Dimensions | Length |
12.95 inches 329 millimeters Width
8.94 inches
| 227 millimeters Height
0.70 inches (Thickest 0.74 inches, Thinnest 0.52 inches)
17.9 millimeters (Thickest 18.9mm, Thinnest 13.14mm)
---|---
Packaging Parameters
Height (mm) | 300 |
---|---|
Height (inch) | 11.8 |
Width (mm) | 446 |
Width (inch) | 17.6 |
Depth (mm) | 81 |
Depth (inch) | 3.1 |
Weight (kgs) | 0.32kg |
Weight (lbs) | 0.71lbs |
Security & Serviceability
Self Healing BIOS | No |
---|---|
Access Panel | Removeable bottom cover |
Number of Screws | 6 |
Swappable Components | Base cover assembly, TrackPoint pointing stick, Lenovo |
factory recovery USB key, Power cord, ac power adapter (65W)
Storage Slots| 1 storage slot
Memory| 1 soldered down RAM + 1 SODIMM slot
System Board| 1190 System Board. No self-service CRU.
Restore CD/DVD/USB Set| None. Purchase via Lenovo Customer Support Center
Cable Lock Support| Security-lock slot
Power-On Password| Yes
Hard Disk Password| Yes; User and Master hard disk password
Supervisor Password| Yes
NIC LEDs (integrated)| Yes (if it means the LED for Ethernet)
Security Chip| Yes (for TPM 2.0)
Access Panel Key Lock| Bottom Cover Tamper Detection
Boot Sequence Control| Yes
Operating Environment
Operating – Air Temperature| At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)
---|---
Non Operating – Air Temperature| At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)
Humidity| Operating: 8% to 95% at wet-bulb temperature 23°C (73°F) Storage: 5%
to 95% at wet-bulb temperature 27°C (81°F)
Corrosive Gas| G1
Particulates| P1
SECTION II: Platform Detail
Supported Components
Processor| Intel® Core™ i5-1240P (4+8C) Intel® Core™ i5-1250P (4+8C), vPro Intel® Core™ i7-1260P (4+8C)
Intel® Core™ i7-1270P (4+8C), vPro Intel® Core™ i7-1280P (6+8C), vPro
---|---
Memory Support| DDR4 3200MHz SO-DIMM
Chipset (PCH)| Integrated Soc
Size of BIOS Flash| 16 MB
Super I/O| N/A
Clock| Crystal
Audio| Realtek High Definition Audio
Ethernet| Non-vPro model: Intel® Ethernet Connection I219-V (Jacksonville)
vPro model: Intel® Ethernet Connection I219-LM (Jacksonville)
Memory
System Capacity Options| i5 non-vPro & vPro: 8/16GB soldered-down + 8/16/32GB
i7 non-vPro & vPro: 8/16GB soldered-down + 8/16/32GB
---|---
non-ECC| 8GB DDR4 3200 SDRAM/SoDIMM
16GB DDR4 3200 SDRAM/SoDIMM
32GB DDR4 3200 SoDIMM
Brand of non-ECC Memory| Samsung SK Hynix Micron Ramaxel
ECC| None
Brand of ECC Memory| N/A
Memory clock frequency(MHz)| 3200 MHz
Storage
2.5 ″ SAS Hard Disk Drive (HDD) | None |
---|---|
2.5 ″ SATA Hard Disk Drive (HDD) | None |
2.5 ″ SATA Solid State Drive (SSD) | None |
M.2 (NGFF) PCIe Solid State Drive (SSD) | 256GB Opal 2 PCIe G4 NVMe M.2 2280 |
512GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G4 NVMe Performance M.2 2280 1TB Opal 2 PCIe G4 NVMe M.2 2280
1TB Opal 2 PCIe G4 NVMe Performance M.2 2280 2TB Opal 2 PCIe Gen4 Performance NVMe M.2 2280
2.5 ″ PCIe Solid State Drive (SSD)| None
Brand of Drive| Samsung UnionMem WD
Hynix Kioxia SSSTC
Intel Optane Storage Technology| Yes
RAID| Not Supported
Removeable Media
Media Card Reader Specifications | N/A |
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SECTION III: Supported Component Detail
CPU Specifications
CPU| Intel® Core™ i5-1240P (4+8C)| Intel® Core™ i5-1250P (4+8C)| Intel® Core™
i7-1260P (4+8C)| Intel® Core™ i7-1270P (4+8C)| Intel® Core™ i7-1280P (4+8C)
---|---|---|---|---|---
Integrated Graphics| Intel Iris Xe Graphics| Intel iGPU Iris Xe| Intel iGPU
Iris Xe| Intel iGPU Iris Xe| Intel iGPU Iris Xe
of Cores| 4 P Core+8 E Core| 4 P Core+8 E Core| 4 P Core+8 E Core| 4 P
Core+8 E Core| 6 P Core+8 E Core
of Threads| 16| 16| 16| 16| 20
Processor Base Frequency| 1.7GHz| 1.7GHz| 2.1GHz| 2.2GHz| 1.8GHz
Max Turbo Frequency| 4.4GHz| 4.4GHz| 4.7GHz| 4.8GHz| 4.8GHz
---|---|---|---|---|---
Cache| 12MB| 12MB| 18MB| 18MB| 20MB
TDP| 20W-28W| 20W-28W| 20W-28W| 20W-28W| 20W-28W
Disclaimers| Dual RAM channel required| Dual RAM channel required| Dual RAM
channel required| Dual RAM channel required| Dual RAM channel required
Display Specifications
Model| WUXGA| WUXGA
oncell touch
| WUXGA
low power
| WUXGA
ePrivacy
| 2.2K| WQUXGA
+AOFT
---|---|---|---|---|---|---
Resolution| 1920 x
1200
| 1920 x
1200
| 1920 x
1200
| 1920 x
1200
| 2240 x
1400
| 3840 x
2400
Diagonal| 14 ″| 14 ″| 14 ″| 14 ″| 14 ″| 14 ″
Aspect Ratio| Ratio 16:10| Ratio 16:10| Ratio 16:10| Ratio 16:10| Ratio 16:10|
Ratio 16:10
Backlight| LED| LED| LED| LED| LED| LED
PPI| 162| 162| 162| 162| 189| 323
Active Area| 302 x 188| 302 x 188| 302 x 188| 302 x 188| 302 x 188| 302 x 188
Refresh Rate| 48 / 60
Hz
| 48 / 60
Hz
| 48 / 60
Hz
| 60Hz| 48 / 60
Hz
| 48 / 60
Hz
Contrast Ratio| 700:1 (TYP)| 700:1 (TYP)| 800:1 (TYP)| 1000:1 (TYP)| 1500:1
(TYP)| 1500:1 (TYP)
Viewing Angle| 85/85/85
/85 degree
| 85/85/85
/85 degree
| 85/85/85
/85 degree
| 85/85/85
/85 degree
| 85/85/85
/85 degree
| 85/85/85
/85 degree
Color gamut| 45% NTSC| 45% NTSC| 100% sRGB| 100% sRGB| 100% sRGB| 100% DCI- P3
Brightness| 300nit| 300nit| 400nit| 500nit| 300nit| 500nit, HDR 400
Contrast| Ratio 700:1| Ratio 700:1| Ratio 800:1| Ratio 1000:1| Ratio 1500:1|
Ratio 1500:1
Color Depth| 16M| 16M| 16M| 16M| 16M| 1B
Interface| eDP 1.2| eDP 1.2| eDP 1.4| eDP 1.4| eDP 1.4| eDP 1.4
Panel ID Recognition| EDID in BIOS
Table
| EDID in BIOS
Table
| EDID in BIOS
Table
| EDID in BIOS
Table
| EDID in BIOS
Table
| EDID in BIOS
Table
Weight| 305g max| 310g max| 240g max| 312g max| 235g max| 265g max
Color Calibrator| None| None| Adaptive ICC
profile
| None| ICC
profile
| X-Rite Factory Color Calibratio n, Dolvy Vision
Panel Technology| IPS, Anti- Glare| IPS, Anti- Glare| IPS, Anti- Glare, LBL,
TUV| IPS, Anti- Glare| IPS, Anti- Glare, LBL, TUV| IPS, Anti- Glare, LBL, TUV
Touch Panel| None| YES| None| YES| None| YES
2.5 ″ SAS Hard Disk Drive| N/A
(HDD)|
---|---
2.5 ″ SATA Hard Disk Drive (HDD)| N/A
Connector| N/A
Transfer Rate (Gb/sec)| N/A
Spindle Speed(RPM)| N/A
Power off to Spindle Stop(sec)| N/A
DC Power to Drive Ready(sec)| N/A
Receipt of Start Unit Command to Drive Ready(sec)| N/A
Average Latency(msec)| N/A
Input (VDC)| N/A
Typical (Watts)| N/A
Idle (Watts)| N/A
Height (mm – Max)| N/A
Width (mm)| N/A
Depth (mm – Max)| N/A
Weight (grams)| N/A
Operating(C) Ambient| N/A
Operating(C) Base Casting| N/A
Non-Operating(C) Ambient| N/A
Gradient(C per Hour)| N/A
Operating(Gs @ 2ms)| N/A
Non-Operating(Gs @ 2ms)| N/A
SSD Specifications
2.5 ″ SATA Solid State Drive (SSD) | N/A |
---|---|
M.2 (NGFF) PCIe Solid State Drive (SSD) | 1x M.2 2280 PCIe Gen4 |
2.5 ″ PCIe Solid State Drive (SSD) | N/A |
Intel Optane Storage Technology | N/A |
Solid State Storage Devices
Supported Types | M.2 |
---|---|
Dimensions inches/centimeters (W x D x H) | 22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 |
(max)
---|---
Size| M.2 2280S3
Interface Type| PCIe NVMe Gen4
Read/Write IOPS Specifications| Read: 250K (2TB, 1TB, 512GB), 200K (256GB)
Write: 240K (2TB, 1TB, 512GB), 190K (256GB)
Burst 4K Random IOPS , Measured by Crystal Disk Mark (QD32T1, Data size set 1GB)
Bandwidth Performance| PCIe Gen3x4 (8Gb/S) PCIe Gen4x4 (16Gb/S)
Power Consumption (Max)| 3.0A (duration for 10 us)
Active(AVG)| 5W
Idle| 5mW (L1.2)
Min MTBF| 2,000,000 (h)
Min Sequential Read| 3000MB/s (2TB, 1TB, 512GB), 2900MB/s (256GB)
Min Sequential Write| 1600MB/s (2TB, 1TB/512GB), 900MB/s (256GB)
Hardware Encryption| Yes
Discrete Graphics Adapter
|
---|---
|
|
Discrete Graphics Adapter| Discrete Graphics Adapter
|
|
|
Discrete Graphics Adapter| Discrete Graphics Adapter
|
|
|
Discrete Graphics Adapter| Discrete Graphics Adapter
|
|
|
Discrete Graphics Adapter| Discrete Graphics Adapter
|
|
|
WLAN
Model | INTEL WIFI 6E_AX211 CNVi_2X2AX+BT5.2 | Qualcomm NFA-725A |
---|---|---|
Connector: Main, Aux/GNSS, GNSS | ANT1:AUX WiFi + BT; ANT2: Main WiFi | |
Antenna Diversity | Supported | |
MIMO | Supported | |
GNSS Bian | N/A | |
Radio ON/OFF Control | Supported | |
Connector interface | CNVi | |
Operating Temperature (Adapter Shield) | 0c to +80c | |
Humidity Non-Operating | 50% ~ 90% Rh non condensing (at temperatures of 25c |
to 35c)
Operating Systems| Microsoft Windows 7, Microsoft Windows 8.1, Microsoft
Windows 10, Linux (limited feature support), Android
Wi-Fi Alliance| Wi-Fi CERTIFIED a/b/g/n/ac, WMM, WMM-PS, WPA, WPA2,
WPS2, Protected Management Frames, Wi-Fi Direct for peer to peer device
connections, Wi-Fi Miracast as Source.
IEEE WLAN Standard| IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i,
802.11w; 802.11r,
802.11k, 802.11v pending OS support; Fine Timing Measurement based on 802.11REVmc
Roaming| Support seamless roaming between access points
Bluetooth| Dual Mode Bluetooth® 5.0, BLE
Authentication| WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST),
EAP-SIM, EAP-AKA, EAP-AKA
Authentication Protocols| PAP, CHAP, TLS, MS-CHAP, MS-CHAPv2
Encryption| 64-bit and 128-bit WEP, 128-bit AES-CCMP
Regulatory| For a list of country approvals, please contact your local Intel
representatives.
US Government| FIPS10, FISMA
Product Safety| UL,C-UL,CB (IEC 60950-1)
Disclaimers| 6GHz channel of Wi-Fi 6E is only available with Windows 11
Battery
Dimension | 270 mm x 68.5 mm x 6.16 mm | 270 mm x 68.5 mm x 6.16 mm |
---|---|---|
Weight | 173g | 212g |
Type (Chemistry and Cell) | Li-ion Polymer | Li-ion Polymer |
Voltage | 11.58V ~ 11.61V | 15.44V ~ 15.48V |
Battery Life | Up to 9.7hrs (MM18) | Up to 9.7hrs (MM18) |
--- | --- | --- |
Battery Capacity | Integrated 3-cell 39.3Wh battery | Integrated 4-cell 52.5Wh |
battery
Charging Time| 0% to 100% 0% to 80%
Battery Charging Time (in- operation) 2.06 hr
Battery Charging Time (off) 1.89 hr
0.92 hr
| 0% to 100% 0% to 80%
Battery Charging Time (in- operation) 2.39hr
Battery Charging Time (off) 1.98 hr
0.99 hr
Operating Temperature Range| between 10°C (50°F) and 35°C (95°F)| between 10°C
(50°F) and 35°C (95°F)
Warranty| 1 Year / 3 Year Available| 1 Year / 3 Year Available
Coin Cell Battery (Model)| CR2016| CR2016
Environmental
BIOS Specifications
WMI Support | Yes, if it is BIOS Setup change by WMI. |
---|---|
ROM-Based Setup Utility (F1) | Yes |
Bootblock Recovery | N/A |
Replicated Setup | Yes, it supported with SRSETUP tool. |
Boot Control | Yes, it means Boot order change. |
Memory Change Alert | N/A |
Thermal Alert | N/A |
Asset Tag | Yes |
System/Emergency ROM Flash Recovery with Video | N/A |
Remote Wakeup/Remote Shutdown | Yes, if Remote wakeup is Wake on LAN from |
S4/S5.
Keyboard-less Operation| N/A
Per-port Control| Yes, if it is I/O port enable/disable by BIOS Setup.
Adaptive Cooling| Yes, if it is thermal & fan control.
Security| Yes, BIOS password / Hard disk password / Finger print
Intel(R) AMT (includes ASF 2.0)| Yes. If you select vPro model
Intel(R) TXT| Yes. If you select vPro model
Memory Modes| N/A
EMC & Safety
EMC| Published, Certified Existing Reports EMC – Australia
EMC – Belarus EMC – Canada EMC – China EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan EMC – New Zealand EMC – Russia
EMC – South Korea EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required EMC – Israel
EMC – Moldova EMC – Serbia EMC – Turkey EMC – Uzbekistan EMC – Vietnam
---|---
Safety| To access the latest User Guide and Safety and Warranty Guide, go to:
https: / support.lenovo.com
Low Halogen Declaration of Conformance TNOT-2017-0040
Section 9 – Low Halogen Scorecard Izod Test – EPEAT Compliant Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho
Environmentals
Energy Star| ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to: https: / www.energystar.gov
---|---
EPEAT| EPEAT Declaration of Conformance For Machine Types: 20S4, 20S5
IT ECO declaration| The latest environmental information about Lenovo products
is available at:
https: / www.lenovo.com/ecodeclaration
Hazardous Substances| The latest environmental information about Lenovo products is available at:
https: / www.lenovo.com/ecodeclaration European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
| 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https: / www.lenovo.com/rohs-communication
---|---
Manageability
Industry Standard Specifications| This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT
---|---
Remote Manageability Software Solutions| Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo))
System Software Manager| Lenovo ThinkPad supports software management tools from the Lenovo Vantage System Update suite:
System Update Update Retriever
Service, Support, and Warranty| On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
Environmentals
Energy Star | ENERGY STAR® 8.0 |
---|---|
EPEAT | EPEAT® Gold |
RoHS Compliant | RoHS Compliant |
TCO | TCO 9.0 |
Sustainability | 97% PCC recycled plastic: Speaker enclosure 97% recycled |
plastic: 52.5WHr Battery
95% PCC recycled plastic: 65W PSU 90% recycled/sustainable packaging Low- temperature solder
Disclaimers| Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material.
References
- LANDESK: An IT systems management trailblazer | Ivanti
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
- Homepage | ENERGY STAR
- Homepage | ENERGY STAR
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