FDK HY0020 Bluetooth Low Energy Module Instruction Manual

: August 30, 2024
: FDK

Table of Contents

HY0020 Bluetooth Low Energy Module
Specifications
Product Overview
Block Diagram
Pin Definitions
Reference Circuits
Product Usage Instructions
FAQ
Q: What is the size of the HY0020 module?
Q: What is the RAM capacity of the HY0020 module?
Q: How much power does the HY0020 module require in System ON
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HY0020 Bluetooth Low Energy Module

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Specifications

Slot Antenna on Shielded Package
Size: 3.5 x 10 x 1 mm
RAM: 64KB
16 pin GPIO configurable
Power: 1.9 A at 3 V in System ON mode
Weight: 0.08 g (Typ.)

Product Overview

The HY0020 is an ultra-compact module with a slot antenna
designed on the shield, providing the world’s smallest occupied
area for printed circuit boards. It features a RAM of 64KB,
configurable 16 pin GPIO, and requires 1.9 A at 3V in System ON
mode. The product is lightweight, weighing only 0.08 g.

Block Diagram

The block diagram consists of ANT, RFIO, Filter, nRF52832, and
various pins for different functions as outlined in the Pin
Definitions section.

Pin Definitions

The pinout diagram shows the different pins and their
corresponding functions, such as digital I/O, power supply, NFC
antenna connection, and more. Each pin serves a specific purpose in
the functionality of the module.

Reference Circuits

When connecting the RFIO and ANT terminals, it is recommended to
use the shortest possible length of 50 transmission line.
Additionally, proper connection of DCC and DEC4 pins is crucial
when using the built-in LDO or DC/DC converter. Software
configuration is necessary regardless of the circuit connection
status.

Product Usage Instructions

Connecting RFIO and ANT Terminals: Ensure a
short 50 transmission line connection.
Connecting DCC and DEC4 Pins: Follow the
circuit examples provided in the manual based on LDO or DC/DC
converter usage.
Software Configuration: Configure the product
settings using the software as required for proper
functionality.

FAQ

Q: What is the size of the HY0020 module?

A: The HY0020 module has dimensions of 3.5 x 10 x 1 mm.

Q: What is the RAM capacity of the HY0020 module?

A: The HY0020 module has a RAM capacity of 64KB.

Q: How much power does the HY0020 module require in System ON

mode?

A: The HY0020 module requires 1.9 A at 3V in System ON mode.

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
HY0020
Bluetooth® low energy module
with Slot Antenna Built into Shielded Package

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by FDK CORPORATION is under license. Other trademarks and trade names are those of their respective owners.
Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
FDK Corporation is granted a license to use Slot Antenna on Shielded Package Technology patented by Toshiba Corporation.

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Version 0.3

Date Feb.09, 2024

Description First edition issued

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
1 Product Overview and Features 1.1 Product Overview
Bluetooth® low energy module with “Slot Antenna on Shielded Package Technology” is a 2.4GHz wireless communication (Bluetooth®) blank radio module with Nordic Semiconductor nRF52832. A basic protocol stack can be installed via Flash mounted on the IC, and various applications can be developed with this module alone. In addition, the module has acquired various radio and SIG certifications on its own, which simplifies various certifications for customers.
1.2 Features
Slot Antenna on Shielded Package Ultra-compact module with antenna pattern designed on the shield. Size: 3.5 x 10 x 1 mm Large keep out areas are not required. World’s smallest occupied area for printed circuit boards. (As of September 1, 2023. According to our research.)
Bluetooth® ver.5.4 low energy conformity Low energy 2 Mbps Output power: +4 dBm to -20 dBm (4 dB step) Sensitivity: -94 dBm (1 Mbps)
Integrated Processor System Arm® Cortex®-M4 32-bit processor with FPU, 64MHz Flash 512 KB Soft Device (protocol stack) is offered Serial wire debug (SWD)
RAM 64KB Configurable 16 pin GPIO
UART, SPI, TWI (I2C), QDEC Wake-up function for sleep and deep sleep 4-channel PWM output for LED and buzzer control PDM input for microphone 12-bit, 200 ksps ADC – 6 configurable channels Flexible power management, fully automatic LDO and DC/DC regulator system 1.7 V3.6 V supply voltage range Low power mode
1.9 A at 3 V in System ON mode, no RAM retention, wake on RTC Weight: 0.08 g (Typ.)

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2 Outline

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

Figure 2-1 Outline

unit mm

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3 Block Diagram

HY0020

ANT

RFIO

Filter

nRF52832

32MHz

32.768 kHz

HY0020 Datasheet Ver. 0.3 Feb.09, 2024
VDD DCC DEC4 16 GPIO 2 SWD

4 Pin Definitions

Figure 3-1 Block Diagram

Figure 4-1 Pinout Diagram (Bottom View)

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Name

J4

P0.21/nRESET

B3

RFIO

A3

ANT

K4

P0.20

L4

P0.18

M4 P0.16

L1

P0.12

J1

P0.08

K1

P0.07

H1

P0.06

A1

P0.30/AIN6

C3

P0.28/AIN4

G1

P0.05/AIN3

F1

P0.04/AIN2

C1

P0.03/AIN1

B1

P0.02/AIN0

N3

NFC2/P0.10

N2

NFC1/P0.09

G4

SWDCLK

H4

SWDIO

D1

VDD

M1 DCC

N1

DEC4

E1

VSS6

N4

VSS5

F4

VSS4

E4

VSS3

D3

VSS2

A2

VSS1

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

Table 4-1 Pinout

Type Digital I/O
Digital I/O

Description General purpose I/O Configurable as pin reset
RF I/O pin. It should be connected to Pin A3.
Internal antenna I/O pin. It should be connected to Pin B3. This product has a built-in 50 matching circuit and antenna, so no additional external elements are required.
General purpose I/O

Digital I/O General purpose I/O Analog input SAADC/COMP/LPCOMP input

NFC input Digital I/O Digital input Digital I/O
Power Power Power
Power

NFC antenna connection General purpose I/O Serial wire debug clock input for debug and programming Serial wire debug I/O for debug and programming Power supply DC/DC converter output 1.3 V regulator supply decoupling. Input from
DC/DC converter. Output from 1.3 V LDO.
Ground

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024

5 Reference Circuits
Connect the RFIO and ANT terminals with the shortest possible length of 50 transmission line. Connect the DCC and DEC4 pins as shown in Figure 5-1 when using the built-in LDO and Figure 5-2 when using the built-in DC/DC converter. Regardless of the circuit connection status, a register setting by software is required.

HY0020

0.1uF

VDD GND

B3 RFIO
A3 ANT
D1 VDD
M1 DCC
N1 DEC4
E1 VSS6 N4 VSS5 F4 VSS4 E4 VSS3 D3 VSS2 A2 VSS1

GND

P0.21/nRESET J4 P0.20 K4 P0.18 L4 P0.16 M4 P0.12 L1 P0.08 J1 P0.07 K1 P0.06 H1
P0.30/AIN6 A1 P0.28/AIN4 C3 P0.05/AIN3 G1 P0.04/AIN2 F1 P0.03/AIN1 C1 P0.02/AIN0 B1 NFC2/P0.10 N3 NFC1/P0.09 N2
SWDCLK G4 SWDIO H4

Figure 5-1 Built-in LDO regulator circuit example

HY0020

0.1uF

VDD GND

B3 RFIO
A3 ANT
D1 VDD
M1 DCC
N1 DEC4
E1 VSS6 N4 VSS5 F4 VSS4 E4 VSS3 D3 VSS2 A2 VSS1

GND

P0.21/nRESET J4 P0.20 K4 P0.18 L4 P0.16 M4 P0.12 L1 P0.08 J1 P0.07 K1 P0.06 H1
P0.30/AIN6 A1 P0.28/AIN4 C3 P0.05/AIN3 G1 P0.04/AIN2 F1 P0.03/AIN1 C1 P0.02/AIN0 B1 NFC2/P0.10 N3 NFC1/P0.09 N2
SWDCLK G4 SWDIO H4

Figure 5-2 Built-in DC/DC converter circuit example

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024

6 Electrical specification

6.1 Absolute maximum ratings

Absolute maximum ratings are standards that must not be exceeded even momentarily. Exceeding the absolute maximum ratings may cause deterioration or damage to internal components and may also destroy, damage, or degrade external circuits other than the module. The application equipment should be designed to ensure that the absolute maximum ratings are not exceeded under any operating conditions.

Table 6-1 Absolute maximum ratings

Parameter Supply voltage I/O pin voltage
RF input level Storage temperature *1. VSS = GND = 0V

Symbol VDD VI/O
RFIO Tstg

Condition
VDD3.6V VDD>3.6V

Min.

Max.

Unit

-0.3

+3.9

V

-0.3

VDD+0.3

V

-0.3

+3.9

V

–

+10

dBm

-40

+85

°C

6.2 Recommended operating conditions

Recommended operating conditions refer to the conditions under which this product operates normally with a certain level of quality. If any one of the operating conditions is not met, the product may malfunction. Therefore, please ensure design of the applied equipment is such that the operating conditions of this product do not exceed the specified range of the operating conditions.

Table 6-2 Recommended operating conditions

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Supply voltage

VDD

1.7

3.0

+3.6

V

Supply rise time

tR_VDD 0V to 1.7V

–

60

ms

Oparating temperature

Ta

-40

+25

+85

°C

*1. VSS = GND = 0V

*2. Be sure to connect a bypass capacitor near the module for use.

*3. The on-chip power-on reset circuitry may not function properly for rise times longer than the specified

maximum.

*4. After power off, it must start up from below 0.3V.

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024

6.3 DC Specifications

The DC electrical characteristics at ambient operating temperature (Ta) = 25°C, VDD = 3.0 V, and DC/DC = ON are shown in Table 6-3.

Table 6-3 DC Specifications

Parameter

Symbol

Input high voltage

VIH

Input low voltage

VIL

Output high voltage

VOH

Output low voltage

VOL

Pull-up resistance

RPU

Pull-down resistance

RPD

TX only run current

ITX1

ITX2

ITX3

ITX4

RX only run current

IRX1

IRX2

*1. VSS = GND = 0V

Condition
IOH = 5mA IOL = 5mA
DC/DC, PRF = +4dBm DC/DC, PRF = 0dBm LDO, PRF = +4dBm LDO, PRF = 0dBm DC/DC, 1Mbps BLE LDO, 1Mbps BLE

Min. 0.7 x VDD
VDD 0.4
11 11 –

Typ. 13 13
7.5 5.3 16.6 11.6 5.4 11.7

Max.

Unit

–

V

0.3 x VDD

V

–

V

0.4

V

16

k

16

k

–

mA

–

mA

–

mA

–

mA

–

mA

–

mA

6.4 RF Specifications

The RF electrical characteristics at ambient operating temperature (Ta) = 25°C, VDD = 3.0 V, and DC/DC = ON are shown in Table 6-4.

Table 6-4 RF Specifications

Parameter

Symbol

Operating frequencies

fOP

Frequency deviation

fDELTA_1M

fDELTA_2M

Maximum output power

PRF

RF power control range

PRFC

1st Adjacent Channel Transmit Power 2MHz

PRF1

2nd Adjacent Channel Transmit Power 4MHz

PRF2

Receiver sensitivity 1Mbps BLE ideal transmitter

PSENS_1M_DCDC PSENS_1M_LDO

Receiver sensitivity 2Mbps BLE ideal transmitter

PSENS_2M_DCDC PSENS_2M_LDO

*1. VSS = GND = 0V

Condition BLE 1Mbps BLE 2Mbps
2Mbps BLE mode 2Mbps BLE mode DC/DC LDO DC/DC LDO

Min. 2402
–
–
–
–

Typ.
±250 ±500
4 24 -20
-50
-93.5 -94.5 -90 -91

Max. 2480
6 –
–
–
–

Unit MHz kHz kHz dBm dB
dBc
dBc
dBm
dBm
dBm
dBm

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024

7 Packaging

7.1 Packaging specifications

1 Packaging materials

Table 7-1 Packaging materials

Name Embossed carrier tape
Cover tape
Reel Aluminum moisture barrier bag Desiccant Humidity indicator card Label Inner carton Outer carton

Materials Polystyrene Polyethylene terephthalate Polyethylene Polystyrene Polystyrene Polyester Silica gel

Appearance Figure 7-5
Figure 7-6

Note Conductivity
Antistatic
Conductivity Antistatic

Corrugated paper Corrugated paper

Figure 7-1 Figure 7-1

2 Packaging style 1. Taping

2. Aluminum moisture barrier bag

Packing quantity: 2,000pcs 3. Inner carton

Packing quantity: 2,000pcs 4. Outer carton

unit = mm Packing quantity: 10,000pcs max. (5 inner cartons max.)
Figure 7-1 Packaging style

unit = mm

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3 Label (1)
(3) (6)

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

(2) (4) (5)
(7)

(1) Product’s number
(2) Packing date (yyyy/mm/dd)
(3) Quantity
(4) Packing NO.
(5) Certification ID Japan: USA (FCC): Canada (ISED):
(6) Manufacturer
(7) Country of origin

HY0020 2024/02/07
2,000pcs 40001
006-001190 2AQ85HY0020 31945-HY0020 FDK CORPORATION MADE IN JAPAN

Figure 7-2 Label 1

Figure 7-3 Label 2

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7.2 Tape specifications

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

Figure 7-4 Tape specifications

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7.3 Dimensions of Embossed carrier tape

HY0020 Datasheet Ver. 0.3 Feb.09, 2024

Figure 7-5 Embossed carrier tape dimensions
7.4 Dimensions of Reel

Figure 7-6 Reel dimensions

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
8 Certification information 8.1 Radio Certification 8.1.1 Japan
This product has obtained construction design certification as a radio station for low-power data communication system based on the Radio Law.
R 006-001190
8.1.2 USA (FCC) 8.1.2.1 FCC Warning
15.19 Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
15.21 Information to user Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device.
8.1.2.2 Limit module procedures
Not applicable
8.1.2.3 Trace antenna designs
Not applicable
8.1.2.4 RF Exposure compliance statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and operated keeping the radiator at least 20cm or more away from person’s body.
8.1.2.5 Labeling instruction for Host product integrator
The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating “Contains Transmitter Module FCC ID: 2AQ85HY0020
8.1.2.6 Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
8.1.2.7 FCC Statement
(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module’s intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated” has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as “Contains FCC ID: 2AQ85HY0020 “Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.” The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device.
8.1.2.8 Module statement
The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply
with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The device is too small and therefore the FCC ID is in the manual in accordance with
2.925(f). Doing this complies with the labeling requirements in 15.212. 7) The module complies with all specific rules applicable to the transmitter, including all the
conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements.
8.1.3 Canada (ISED)
8.1.3.1 ISED Statement
The final host device, into which this RF Module is integrated” has to be labeled with an auxiliary label stating the IC of the RF Module, such as” Contains transmitter module IC: 31945-HY0020
Le périphériquehôte final, danslequelce module RF estintégré “doitêtreétiqueté avec uneétiquetteauxiliaireindiquant le CI du module RF, tel que” Contient le module émetteur IC: 31945-HY0020
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause
undesired operation of the device.

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
L’émetteur/récepteur exempt de licencecontenudans le présentappareilestconforme aux CNR d’Innovation, Sciences et Développementéconomique Canada applicables aux appareils radio exempts de licence. L’exploitationestautorisée aux deux conditions suivantes: (1) L’ appareil ne doit pas produire de brouillage; (2) L’ appareildoit accepter tout brouillageradioélectriquesubi, mêmesi le brouillageest
susceptible d’ encompromettre le fonctionnement.
To maintain compliance with RSS’s RF Exposure guidelines, this equipment should beinstalled and operated with minimum distance between 20cm the radiator your body: Use only the supplied antenna.
Pour rester conforme aux directives d’exposition aux radiofréquences de RSS, cet équipement doit être installé et utilisé à une distance minimale de 20cm du radiateur de votre corps : Utilisez uniquement l’antenne fournie.
8.2 Bluetooth Qualification
QDID: 232479 – Component (Tested)

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HY0020 Datasheet Ver. 0.3 Feb.09, 2024
9 Precautions
The contents of this document, including information on hardware, software, and systems (hereinafter referred to as “Products”), are subject to change without notice due to technological progress or other reasons.
Reproduction or reprinting of this material without our written consent is prohibited. Even if you reproduce or reprint this material with our written consent, please do not change or delete any of the contents.
Although we strive to improve the quality and reliability of our products, semiconductor and memory devices may be subject to malfunctions or failures. When using this product, it is the customer’s responsibility to ensure that the customer’s hardware, software, and systems have the necessary safety design in place to prevent infringement of life, limb, or property due to malfunction or failure of this product. When designing and using this product, please confirm and follow the latest information on this product (this document, specifications, data sheets, application notes, etc.) as well as the instruction manuals and operating manuals of the equipment in which this product is used. In addition, when using information such as product data, diagrams, tables, and other technical content, programs, algorithms, and other application circuit examples shown in the above materials, etc., please fully evaluate your product alone and as a whole system, and determine its applicability under your own responsibility.
This product is not intended or warranted for use in the following equipment (hereinafter referred to as “specific applications”): – equipment that requires a particularly high level of quality and reliability. – equipment whose malfunction could endanger life or body, cause extensive property damage, or have a serious impact on society. Specific applications include nuclear power-related equipment, aerospace equipment, medical equipment, automotive and transportation equipment, train and ship equipment, traffic signal equipment, combustion and explosion control equipment, various safety- related equipment, elevating equipment, electric power equipment, and financial-related equipment, but exclude applications that are individually described in this document. We assume no responsibility for any specific use of the product.
Do not disassemble, analyze, reverse engineer, or duplicate to this product.
Do not use this product for any product whose manufacture, use, or sale is prohibited by domestic or foreign laws, regulations, or orders.
The technical information contained in this document is intended to explain the typical operation and application of the product, and its use does not constitute a guarantee or license to any intellectual property rights or other rights of our company or any third party.
Unless otherwise agreed to in a separate written contract or specification agreed between you and us, we make no warranties of any kind (including, but not limited to, the warranties of functionality, merchantability, fitness for a particular purpose, accuracy of information, and non-infringement of third party rights), either express or implied, with respect to this product and technical information.
Do not use this product or the technical information contained in this document for the purpose of developing weapons of mass destruction, for military use, or for any other military purpose. When exporting, please comply with applicable export laws and regulations such as “Foreign Exchange and Foreign Trade Law” of Japan and “U.S. Export Administration Regulations” and follow the necessary procedures as prescribed by those laws and regulations.

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